KR101085133B1 - Method of Fabricating Color Filter Array Substrate - Google Patents

Abstract

The present invention relates to a method of manufacturing a color filter array substrate that can simplify the process and can planarize the surface of the overcoat layer.

A method of manufacturing a color filter array substrate according to the present invention includes the steps of forming a black matrix on a substrate; Forming red, green, and blue color filters on the substrate on which the black matrix is formed; Forming an overcoat layer including a white color filter on the substrate on which the red, green, and blue color filters are formed; Aligning a flat soft mold on the overcoat layer; Planarizing the overcoat layer using the flat plate soft mold, wherein forming the black matrix comprises: forming an opaque layer and an etch resist on the substrate; Pressing a first soft mold having a groove corresponding to the black matrix on the etch resist to form an etch resist pattern; Etching the opaque layer using the etch resist pattern as a mask.

Description

Manufacturing method of color filter array substrate {Method of Fabricating Color Filter Array Substrate}             

1 is a perspective view illustrating a conventional liquid crystal display panel.

2 is a cross-sectional view illustrating in detail a color filter array substrate including a conventional white color filter.

3A to 3L are cross-sectional views illustrating a method of manufacturing the color filter array substrate illustrated in FIG. 2.

4 is a plan view illustrating a color filter array substrate of a liquid crystal display panel according to a first exemplary embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating the color filter array substrate illustrated in FIG. 4.

6A and 6M are cross-sectional views illustrating a method of manufacturing the color filter array substrate illustrated in FIG. 5.

7 is a cross-sectional view illustrating a color filter array substrate of a liquid crystal display panel according to a second exemplary embodiment of the present invention.

8A to 8D are cross-sectional views illustrating a method of manufacturing the color filter array substrate illustrated in FIG. 7.                 

9 is a cross-sectional view illustrating a color filter array substrate of a liquid crystal display panel according to a third exemplary embodiment of the present invention.

10A through 10D are cross-sectional views illustrating a method of manufacturing the color filter array substrate illustrated in FIG. 9.

11 is a cross-sectional view illustrating a color filter array substrate of a liquid crystal display panel according to a fourth exemplary embodiment of the present invention.

12A to 12F are cross-sectional views illustrating a method of manufacturing the color filter array substrate illustrated in FIG. 11.

Description of the Related Art

1,11,21,101: Substrate 2,102: Black Matrix

4,104 color filter 6 common electrode

8: liquid crystal 10: color filter array substrate

12 gate line 14 pixel electrode

16: thin film transistor 18: data line

20: thin film transistor array substrate 22,122: overcoat layer

24,124: spacer

The present invention relates to a method for manufacturing a color filter array substrate, and more particularly, to a method for manufacturing a color filter array substrate that can simplify the process and can planarize the surface of the overcoat layer.

In general, a liquid crystal display (LCD) displays an image by adjusting the light transmittance of the liquid crystal using an electric field. To this end, the liquid crystal display device includes a liquid crystal display panel in which liquid crystal cells are arranged in a matrix, and a driving circuit for driving the liquid crystal display panel. The liquid crystal display panel is provided with pixel electrodes and a reference electrode, that is, a common electrode, for applying an electric field to each of the liquid crystal cells. In general, the pixel electrode is formed for each liquid crystal cell on the lower substrate, while the common electrode is integrally formed on the front surface of the upper substrate. Each of the pixel electrodes is connected to a thin film transistor (TFT) used as a switching element. The liquid crystal cell is driven along with the common electrode in accordance with the data signal supplied through the TFT.

Referring to FIG. 1, a conventional liquid crystal display panel includes a color filter array substrate 10 and a thin film transistor array substrate 20 bonded together with a liquid crystal 8 interposed therebetween.

The liquid crystal 8 is rotated in response to an electric field applied to the liquid crystal 8 to adjust the amount of light transmitted through the thin film transistor array substrate 20.

The color filter array substrate 10 includes a color filter 4, a black matrix 2, and a common electrode 6 formed on the rear surface of the upper substrate 1. The color filter 4 includes color filters of red (R), green (G), and blue (B) colors to allow color display by transmitting light of a specific wavelength band. A black matrix 2 is formed between the color filters 4 of adjacent colors to absorb the light incident from the adjacent cells, thereby preventing the lowering of the contrast.

The thin film transistor array substrate 20 is formed such that the data line 18 and the gate line 12 cross each other with a gate insulating film interposed therebetween on the front side of the lower substrate 21, and a TFT 16 is formed at the intersection thereof. do. The TFT 16 is composed of a drain electrode facing the source electrode with the channel portion including the gate electrode connected to the gate line 12, the source electrode connected to the data line 18, the active layer and the ohmic contact layer interposed therebetween. This TFT 16 is electrically connected to the pixel electrode 14. The TFT 16 selectively supplies the data signal from the data line 18 to the pixel electrode 14 in response to the gate signal from the gate line 12.

The pixel electrode 14 is positioned in a cell region divided by the data line 18 and the gate line 12 and is made of a transparent conductive material having high light transmittance. The pixel electrode 14 generates a potential difference from the common electrode 6 by the data signal supplied via the drain electrode. Due to this potential difference, the liquid crystal 8 located between the lower substrate 21 and the upper substrate 1 is rotated by the dielectric anisotropy. Accordingly, light supplied from the light source via the pixel electrode 14 is transmitted toward the upper substrate 1.

Each pixel of the liquid crystal display panel illustrated in FIG. 1 includes a subpixel implementing red (R), a subpixel implementing green (G), and a subpixel implementing blue (B). In this case, the pixel consisting of the R, G, and B sub-pixels emits only about 27 to 33% of the light emitted through the color filter 4 to the upper substrate 1 when the light emitted from the backlight is 100%. Therefore, the brightness is lowered.

In order to solve this problem, a color filter array substrate of the liquid crystal display panel shown in FIG. 2 has been proposed.

The color filter array substrate of the liquid crystal display panel illustrated in FIG. 2 implements subpixels implementing red (R), subpixels implementing green (G), subpixels implementing blue (B), and white (W). A subpixel constitutes one pixel. In this case, when the amount of light emitted from the backlight unit is 100%, the amount of light emitted to the upper substrate 1 through the color filter 4 is higher than 85%. As a result, the average value of the light output amount of each pixel consisting of the R, G, B, and W sub-pixels is relatively high, and the luminance is improved.

3A to 3L are cross-sectional views illustrating a method of manufacturing a color filter array substrate of the liquid crystal display panel illustrated in FIG. 2.

First, an opaque layer 54 is formed on the upper substrate 1 as shown in FIG. 3A through a coating method such as sputtering, spin coating or spinless. As the opaque layer 54, an opaque metal or opaque resin containing chromium (Cr) is used. Subsequently, the photoresist pattern 52 is formed on the opaque layer 54 by a photolithography process using the first mask 50 defining the exposure area S1 and the blocking area S2. As the opaque layer 54 is patterned by an etching process using the photoresist pattern 52, a black matrix 2 is formed on the upper substrate 1 as shown in FIG. 3B.

On the upper substrate 1 on which the black matrix 2 is formed, a red resin 58 is applied on the entire surface as shown in FIG. 3C. Subsequently, the red resin 58 is patterned by a photolithography process using the second mask 56 defining the exposure area S1 and the blocking area S2, thereby red color filter 4R as shown in FIG. 3D. ) Is formed.

On the upper substrate 1 on which the red color filter 4R is formed, the green resin 60 is entirely coated as shown in FIG. 3E. Subsequently, the green resin 60 is patterned by a photolithography process using the third mask 62 defining the exposure area S1 and the blocking area S2, thereby showing the green color filter 4G as shown in FIG. 3F. ) Is formed.

On the upper substrate 1 on which the green color filter 4G is formed, a blue resin 64 is applied on the entire surface as shown in Fig. 3G. Subsequently, the blue resin 64 is patterned by a photolithography process using the fourth mask 66 defining the exposure area S1 and the blocking area S2, so that the blue color filter 4B as shown in FIG. 3H. ) Is formed.

On the upper substrate 1 on which the blue color filter 4B is formed, a white resin 68 is entirely coated as shown in FIG. 3I. As the white resin 68, an organic insulating material containing an acrylic resin or the like is used. Subsequently, the white resin 68 is patterned by a photolithography process using the fifth mask 70 defining the exposure area S1 and the blocking area S2, so that the white color filter 4W as shown in FIG. 3J. ) Is formed.

The organic insulating material is entirely coated on the upper substrate 1 on which the white color filter 4W is formed, so that the planarization layer 22 is formed as shown in FIG. 3K.

The organic material 76 is entirely coated on the upper substrate 1 on which the planarization layer 22 is formed. Next, the photoresist pattern 74 is formed by a photolithography process using the sixth mask 72 defining the exposure area S1 and the blocking area S2. The organic material 76 is patterned by the photoresist pattern 74 to form a spacer 24 as shown in FIG. 3J.

As such, six mask processes are required to form the color filter array substrate illustrated in FIG. 2. In this case, since the manufacturing process is complicated and there is a limit in cost reduction, a method of reducing manufacturing cost by simplifying the manufacturing process is required.

Accordingly, an object of the present invention is to provide a method of manufacturing a color filter array substrate which can simplify the process.

In addition, another object of the present invention is to provide a method of manufacturing a color filter array substrate that can planarize the surface of the overcoat layer.

In order to achieve the above object, a method of manufacturing a color filter array substrate according to the present invention comprises the steps of forming a black matrix on the substrate; Forming red, green, and blue color filters on the substrate on which the black matrix is formed; Forming an overcoat layer including a white color filter on the substrate on which the red, green, and blue color filters are formed; Aligning a flat soft mold on the overcoat layer; And planarizing the overcoat layer using the flat soft mold.

Forming the black matrix comprises forming an opaque layer and an etch resist on the substrate; Pressing a first soft mold having a groove corresponding to the black matrix on the etch resist to form an etch resist pattern; And etching the opaque layer using the etch resist pattern as a mask.

The forming of the etch resist pattern may include pressurizing the etch resist while baking the etch resist at a temperature of 130 ° C. or less for about 10 minutes to 2 hours or by irradiating ultraviolet rays with the weight of the weight of the first soft mold. Characterized in that it comprises a.

The forming of the red, green, and blue color filters on the substrate on which the black matrix is formed may include forming a resin corresponding to any one of the red, green, and blue color filters on the substrate; And pressing the second soft mold having a groove corresponding to the color filter on the resin corresponding to any one of the red, green, and blue color filters to form the color filter.

Pressing the second soft mold having a groove corresponding to the color filter to form the color filter may be carried out at 130 ° C. for about 10 minutes to 2 hours at a weight of about 2 weight of the second soft mold. Pressing the resin while baking at a temperature below or irradiating with ultraviolet rays.

The overcoat layer including the white color filter may be formed of a hydrophilic material.

The overcoat layer including the white color filter may be formed of any one of a liquid polymer precursor and a liquefied polymer.

The first and second soft molds are formed of a hydrophobic material.

The first and second soft molds are characterized by comprising any one of polydimethylsiloxane, polyurethane and cross linked novolac resin.

In order to achieve the above object, a method of manufacturing a color filter array substrate according to the present invention comprises the steps of forming a black matrix on the substrate; Forming red, green, and blue color filters on the substrate on which the black matrix is formed; Coating a transparent resin on the substrate on which the red, green, and blue color filters are formed; Arranging a soft mold having grooves and protrusions on the substrate on which the transparent resin is formed; And simultaneously forming at least two of the white color filter, the overcoat layer, and the spacer using the soft mold.

Simultaneously forming a white color filter, an overcoat layer and a spacer using the soft mold may include pressing a soft mold having a groove corresponding to the spacer on the transparent resin; The transparent resin is moved into the groove to form a spacer, and the surface of the soft mold and the transparent resin in contact with the transparent resin comprising a step of forming an overcoat layer comprising a white color filter.                     

Pressing the soft mold having a groove corresponding to the spacer on the transparent resin may be performed by baking the transparent resin at a temperature of 130 ° C. or lower for about 10 minutes to 2 hours by weight of the soft weight of the soft mold. Pressing the transparent resin while irradiating, characterized in that it comprises.

The transparent resin is characterized in that it is formed of any one of a liquid polymer precursor and a liquefied polymer.

The first and second soft molds are characterized by comprising any one of polydimethylsiloxane, polyurethane and cross linked novolac resin.

Other objects and features of the present invention in addition to the above objects will be apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 4 to 12F.

4 and 5 are a plan view and a cross-sectional view showing a color filter array substrate according to a first embodiment of the present invention.

4 and 5, the color filter array substrate according to the first embodiment of the present invention includes a black matrix 102, red, green, and blue color filters 104R, 104G, formed on the upper substrate 101. 104B), an overcoat layer 122 including a white color filter 104W, and a spacer 124 formed on the overcoat layer 122.

The black matrix 102 is formed in a matrix form on the upper substrate 101 to divide the color filters 104 into a plurality of cell regions in which the color filters 104 are to be formed and to prevent optical interference between adjacent cells. The black matrix 102 is formed so as to overlap an area of the thin film transistor array substrate except for the pixel electrode, that is, the gate line, the data line, and the thin film transistor.

The color filter 104 is formed in the cell region separated by the black matrix 102. The color filter 104 includes a red color filter 104R that implements red (R), a green color filter 104G that implements green (G), a blue color filter 104B that implements blue (B), and white. It is formed for each of the white color filters 104W for implementing (W) to implement R, G, B, and W colors.

The overcoat layer 122 is formed to include the white color filter 104W. That is, the overcoat layer 122 is formed to have the same height as the same material as the white color filter 104W.

The spacer 124 maintains a cell gap between the color filter array substrate and the thin film transistor array substrate.

6A through 6K are cross-sectional views illustrating a method of manufacturing the color filter array substrate illustrated in FIG. 5.

First, an opaque layer 154 is formed as shown in FIG. 6A by applying an opaque metal or an opaque resin including chromium (Cr) on the upper substrate 101. The first etch resist solution 156 is formed on the opaque layer 154 by a coating process such as nozzle spraying, spinless coating or spin coating. Here, the etch resist solution 156 is a material having heat resistance and chemical resistance, for example, a solution in which about 5 to 30 wt% of Novolac resin is added to an ethanol solution.

Subsequently, the first soft mold 150 having the grooves 152a and the protrusions 152b on the etch resist solution 156 is aligned. The groove 152a of the first soft mold corresponds to the region where the black matrix is to be formed. The first soft mold 150 may be made of a highly elastic rubber material such as polydimethylsiloxane (PDMS), polyurethane, cross-linked Novolac Resin, or the like. .

The first soft mold 150 is pressed against the etch resist solution 156 for a predetermined time, for example, about 10 minutes to 2 hours so that the surface of the protrusion 152b and the opaque layer 154 are in contact with each other. At this time, when the substrate 101 is baked at a temperature of about 130 ° C. or lower or ultraviolet rays are irradiated to the etch resist solution 156, the etch resist solution 156 is soft-cured. Then, the capillary force generated by the pressure between the first soft mold 150 and the substrate 101 and the repulsive force between the first soft mold 150 and the etch resist solution 156 may be used. 156 moves into the groove 152a of the first soft mold. As a result, as shown in FIG. 6B, the groove 152a of the first soft mold and the first etch resist pattern 148 in the form of inverted transfer pattern are formed.

Then, after the first soft mold 150 and the substrate 101 are separated, the opaque layer 154 is patterned by an etching process using the first etch resist pattern 148 as a mask, and thus black as shown in FIG. 6C. Matrix 102 is formed.

Subsequently, the etch resist pattern 148 remaining on the black matrix 102 is removed by a strip process using an environmentally friendly alcohol-based strip liquid.                     

The red resin 158 is applied to the entire surface of the upper substrate 101 on which the black matrix 102 is formed, as shown in FIG. 6D. This red resin 158 contains a hydrophilic polymer. Hydrophilic polymers include, for example, hydrophilic liquid prepolymers, liquefied polymers, or highly permeable acrylic or epoxy polymer chains. A polymer having a structure in which a substance having a substituent is substituted is used.

Subsequently, the second soft mold 160 having the groove 162a and the protrusion 162b on the red resin 158 is aligned. The groove 162a of the second soft mold corresponds to the region where the red color filter is to be formed. The second soft mold 160 is formed of a rubber material having high hydrophobic elasticity to prevent contamination with the hydrophilic red resin 158. The second soft mold 160 may be made of, for example, polydimethylsiloxane (PDMS), polyurethane, cross-linked Novolac Resin, or the like.

The second soft mold 160 is in contact with the red resin 158 for a predetermined time such as about 10 minutes to 2 hours so that the surface of the protrusion 162b and the substrate 101 and / or the black matrix 102 come into contact with each other. While pressurized. At this time, the substrate 101 is baked at a temperature of about 130 ° C. or less, or the red resin 158 is soft-cured by irradiating ultraviolet rays to the red resin 158. The amount of ultraviolet light varies depending on at least one of the base material and photoinitiator included in the red resin 158. For example, when the base material included in the red resin 158 is epoxy series, the ultraviolet light amount is 2000 to 2500 mJ / cm 2, and when the acrylic material is acrylic, the ultraviolet light amount is 500 to 1000 mJ / cm 2.

Then, the red resin 158 is caused by the capillary force generated by the pressure between the second soft mold 160 and the substrate 101 and the repulsive force between the second soft mold 160 and the red resin 158. ) Moves into the groove 162a of the second soft mold. As a result, as illustrated in FIG. 6E, the red color filter 104R having the pattern shape inverted and transferred with the groove 162a of the second soft mold is formed.

On the upper substrate 101 on which the red color filter 104R is formed, the green resin 164 is applied to the entire surface as shown in FIG. 6F. The green resin 164 contains the above-mentioned hydrophilic polymer. Subsequently, the third soft mold 166 having the groove 168a and the protrusion 168b on the green resin 164 is aligned. The groove 168a of the third soft mold corresponds to the region where the green color filter is to be formed. As described above, the third soft mold 166 is formed of a rubber material having high hydrophobic elasticity. This third soft mold 166 includes a surface of the protrusion 168b; The green resin 164 is pressed for a predetermined time, for example, for about 10 minutes to 2 hours so as to be in contact with at least one of the substrate 101, the red color filter 104R, and the black matrix 102. At this time, the substrate 101 is baked at a temperature of about 130 ° C. or less, or the green resin 164 is soft-cured by irradiating ultraviolet rays to the green resin 164. The amount of ultraviolet light varies depending on at least one of the base material and the photoinitiator included in the green resin 164. For example, when the base material included in the green resin 164 is epoxy series, the ultraviolet light amount is 2000 to 2500 mJ / cm 2, and when the acrylic material is acrylic, the ultraviolet light amount is 500 to 1000 mJ / cm 2. The green resin 164 then moves into the grooves 168a of the third soft mold. As a result, as shown in Fig. 6G, the groove 168a of the third soft mold and the green color filter 104G in the form of an inverted transfer pattern are formed.

On the upper substrate 101 on which the green color filter 104G is formed, the blue resin 146 is coated on the entire surface as shown in FIG. 6H. This blue resin 146 contains the above-mentioned hydrophilic polymer. Subsequently, the fourth soft mold 170 having the grooves 172a and the protrusions 172b on the blue resin 146 is aligned. The groove 172a of the fourth soft mold corresponds to the region where the blue color filter is to be formed. As described above, the fourth soft mold 170 is formed of a rubber material having a high hydrophobic elasticity. The fourth soft mold 170 is in contact with the blue resin 146 for a predetermined time such that the fourth soft mold 170 is in contact with the surface of the protrusion 172b and the substrate 101, the red color filter 104R, and the black matrix 102. For example, pressurized for about 10 minutes to 2 hours. At this time, the substrate 101 is baked at a temperature of about 130 ° C. or less, or the blue resin 146 is soft-cured by irradiating ultraviolet rays to the blue resin 146. The amount of ultraviolet light varies depending on at least one of the base material and the photoinitiator included in the blue resin 146. For example, when the base material included in the blue resin 146 is an epoxy series, the ultraviolet light amount is 2000 to 2500 mJ / cm 2, and when the acrylic material is an acrylic light, the ultraviolet light amount is 500 to 1000 mJ / cm 2. The blue resin 146 then moves into the grooves 172a of the fourth soft mold. As a result, as shown in FIG. 6I, the blue color filter 104B having a pattern shape inverted and transferred with the groove 172a of the third soft mold is formed.

As the organic insulating material is entirely printed on the substrate on which the blue color filter 104B is formed, as shown in FIG. 6J, the white color filter 104W and the overcoat layer 122 including the white color filter 104W are formed. .

The organic insulating material 174 is entirely coated on the upper substrate 101 on which the white color filter 104W and the overcoat layer 122 are formed, as shown in FIG. 6K. The second etch resist solution 142 is formed on the organic insulating material 174 by a coating process such as nozzle spraying, spinless coating or spin coating. Subsequently, the fifth soft mold 176 having the groove 178a and the protrusion 178b on the second etch resist solution 142 is aligned. The groove 178a of the fifth soft mold corresponds to the region where the spacer is to be formed. The fifth soft mold 176 is pressed against the second etch resist solution 142 such that the surface of the protrusion 178b and the overcoat layer 122 contact each other. At this time, the substrate 101 is baked at a temperature of about 130 ° C. or less, or the second etch resist solution 142 is soft-cured by irradiating ultraviolet rays to the second etch resist solution 142. The second etch resist solution 142 then moves into the grooves 178a of the fifth soft mold. As a result, as shown in FIG. 6L, the groove 178a of the fifth soft mold and the second etch resist pattern 144 having a pattern inverted and transferred are formed.

Then, after the fifth soft mold 176 and the substrate 101 are separated, the organic insulating material 174 is patterned by an etching process using the second etch resist pattern 144 as a mask, as shown in FIG. 6M. Spacers 124 are formed.

Subsequently, the second etch resist pattern 144 remaining on the spacer 124 is removed by a strip process using an environmentally friendly alcohol-based strip liquid.

As described above, in the method of manufacturing the color filter array substrate according to the first exemplary embodiment, the thin film of the color filter array substrate may be patterned using a soft mold and an etch resist without using a photolithography process. As a result, expensive exposure equipment is not required, and the process is simple and the precision is high, so that the processing time can be shortened and the manufacturing yield is improved.

Meanwhile, in the color filter array substrate according to the first exemplary embodiment, a step d having a predetermined width is formed between the white color filter 104W and the overcoat layer 122 as shown in FIG. 5. By this step, the cell gap of the region corresponding to the white color filter 104 and the cell gap of the region corresponding to the overcoat layer 122 are different. Accordingly, since the electric field between the pixel electrode and the common electrode is applied to the liquid crystal differently for each position, the rotation angle of the liquid crystal varies for each position, resulting in deterioration in image quality.

7 is a cross-sectional view illustrating a color filter array substrate according to a second embodiment of the present invention.

Referring to FIG. 7, the color filter array substrate according to the second embodiment of the present invention has the same configuration except that the overcoat layer is formed to be planarized over the entire upper substrate as compared to the color filter array substrate illustrated in FIG. 5. With elements. Accordingly, detailed description of the same components will be omitted.

The overcoat layer 122 is formed to planarize the substrate on which the red, green, and blue color filters 104R, 104G, and 104B are formed. This overcoat layer 122 is formed to include a white color filter 104W. As the overcoat layer 122 formed to include the white color filter 104W, a hydrophilic polymer or the like is used. Hydrophilic polymers are, for example, liquid pre-polymers, liquefied polymers, or materials having hydrophilic groups in an acrylic or epoxy-based polymer chain having a high permeability. The polymer of this substituted structure, etc. are used. Here, the liquid polymer precursor includes an organic material, a binder, a photoinitiator and the like. The organic material has a resilience when it comes into contact with the soft mold and has a good transparency having a coloration of 20 or less, for example, polyethylene ethylene glycol (PEG). As the binder, a styrene-acrylic comonomer to which an styrene co-monomer having good adhesion to an acrylic monomer is added is used.

As such, the color filter array substrate according to the second embodiment of the present invention includes a white color filter 104W and an overcoat layer 122 having a flat surface. By the overcoat layer 122, since the cell gap is the same throughout the liquid crystal panel, deterioration of image quality such as spots can be prevented.

8A to 8D are cross-sectional views illustrating a method of manufacturing an overcoat layer including the white color filter illustrated in FIG. 7.

As shown in FIG. 8A, the black matrix 102, the red, green, and blue color filters 104R, 104G, and 104B are sequentially formed on the upper substrate 101. As shown in FIG. 8B, the hydrophilic polymer 182 is completely printed on the upper substrate 101. The flat soft mold 180 is aligned as shown in FIG. 8C on the upper substrate 101 on which the hydrophilic polymer 182 is formed. The flat plate soft mold 180 is pressed by the hydrophilic polymer 182. At this time, the substrate 101 is baked at a temperature of about 130 ° C. or less, or ultraviolet rays are irradiated onto the hydrophilic polymer 182 to soften the hydrophilic polymer 182. The amount of ultraviolet light varies depending on at least one of the base material and the photoinitiator included in the high hydrophilic polymer 182. For example, when the base material included in the hydrophilic polymer 182 is epoxy series, the ultraviolet light amount is 2000-2500 mJ / cm 2, and in the acrylic series, the ultraviolet light amount is 500-1000 mJ / cm 2. Then, as shown in FIG. 8D, the stepped portion of the hydrophilic polymer 182 is planarized to form an overcoat layer 122 having a flat surface. Then, after the flat plate soft mold 180 and the substrate 101 are separated, the substrate 101 is cured at about 200 ° C. or more.

As described above, in the method of manufacturing the color filter array substrate according to the second embodiment of the present invention, the thin film of the color filter array substrate is patterned using a soft mold and an etch resist without using a photolithography process, and an overcoat layer and a white color The filter is formed at the same time. As a result, expensive exposure equipment is not required, and the process is simple and the precision is high, so that the processing time can be shortened and the manufacturing yield is improved. In addition, in the method of manufacturing the color filter array substrate according to the second embodiment of the present invention, the overcoat layer may be flattened using a flat plate soft mold to prevent deterioration of image quality such as spots.

9 is a cross-sectional view illustrating a color filter array substrate according to a third exemplary embodiment of the present invention.                     

Referring to FIG. 9, the color filter array substrate according to the third embodiment of the present invention has the same components except that the overcoat layer and the spacer are integrally formed as compared to the color filter array substrate illustrated in FIG. 7. do. Accordingly, detailed description of the same components will be omitted.

The overcoat layer 122 is formed to planarize the substrate on which the red, green, and blue color filters 104R, 104G, and 104B are formed. This overcoat layer 122 is formed to include a white color filter 104W. In the overcoat layer 122 formed to include the white color filter 104W, a hydrophilic polymer or the like is used to prevent contamination generated when contacting the soft mold having high hydrophobicity. Hydrophilic polymers are, for example, liquid pre-polymers, liquefied polymers, or materials having hydrophilic groups in an acrylic or epoxy-based polymer chain having a high permeability. The polymer of this substituted structure, etc. are used. Here, the liquid polymer precursor includes an organic material, a binder, a photoinitiator and the like. The organic material has a resilience when it comes into contact with the soft mold and has a good transparency having a coloration of 20 or less, for example, polyethylene ethylene glycol (PEG). As the binder, a styrene-acrylic comonomer to which an styrene co-monomer having good adhesion to an acrylic monomer is added is used.

The spacer 124 maintains a cell gap between the color filter array substrate and the thin film transistor array substrate. The spacer 124 is formed of the same material as the overcoat layer 122 and overlaps the black matrix 102.                     

As described above, the color filter array substrate according to the third embodiment of the present invention includes a white color filter, an overcoat layer having a flat surface, and a spacer formed of the same material as the overcoat layer. By this overcoat layer, since the cell gap is the same throughout the liquid crystal panel, deterioration of image quality such as spots can be prevented.

10A to 10D are cross-sectional views illustrating a method of manufacturing an overcoat layer including the white color filter illustrated in FIG. 9.

As shown in FIG. 10A, the black matrix 102, the red, green, and blue color filters 104R, 104G, and 104B are sequentially formed on the upper substrate 101. The hydrophilic polymer 182 is completely printed on the upper substrate 101 as shown in FIG. 10B. The soft mold 184 having the groove 186a and the protrusion 186b is aligned on the upper substrate 101 on which the hydrophilic polymer 182 is formed, as shown in FIG. 10C. The groove 186a of the soft mold corresponds to the region where the spacer is to be formed. The soft mold 184 is pressurized by the high hydrophilic polymer 182. At this time, the substrate 101 is baked at a temperature of about 130 ° C. or less, or ultraviolet rays are irradiated onto the hydrophilic polymer 182 to soften the hydrophilic polymer 182. The amount of ultraviolet light varies depending on at least one of the base material and the photoinitiator included in the high hydrophilic polymer 182. For example, when the base material included in the high hydrophilic polymer 182 is epoxy series, the ultraviolet light amount is 2000-2500 mJ / cm 2, and in the acrylic series, the ultraviolet light amount is 500-1000 mJ / cm 2. Then, the hydrophilic polymer 182 moves into the groove 186a of the soft mold. As a result, as shown in FIG. 10D, the overcoat includes a groove 186a of the soft mold, a spacer 124 in the form of inverted transfer, and a white color filter 104W in contact with the protrusion 186a of the soft mold. Layer 122 is formed. Then, after the soft mold 184 and the substrate 101 are separated, the substrate 101 is cured at about 200 ° C. or more.

As described above, in the method of manufacturing the color filter array substrate according to the third embodiment of the present invention, the overcoat layer and the white color filter are patterned by patterning a thin film of the color filter array substrate using a soft mold and an etch resist without using a photolithography process. And spacers at the same time. As a result, expensive exposure equipment is not required, and the process is simple and the precision is high, so that the processing time can be shortened and the manufacturing yield is improved.

11 is a cross-sectional view illustrating a color filter array substrate according to a fourth embodiment of the present invention.

Referring to FIG. 11, the color filter array substrate according to the fourth embodiment of the present invention is an overcoat layer having an opening exposing white pixel regions in contrast to the color filter array substrate illustrated in FIG. 9, and white formed of the same material. It has the same components except having a color filter and a spacer.

The overcoat layer 122 is formed in the remaining regions except for the region where the white color filter 104W is formed. The overcoat layer 122 serves to compensate for the step difference between the red, green and blue color filters. The height from the front surface of the upper substrate 101 to the overcoat layer 122 is similar to the height of the white color filter 104W so that the surface of the color filter array substrate is flattened.                     

The spacer 124 maintains a cell gap between the color filter array substrate and the thin film transistor array substrate. The spacer 124 overlaps the black matrix 102 and is simultaneously formed of the same material as the white color filter 104W.

At least one of the overcoat layer 122, the spacer 124, and the white color filter 104W may be a hydrophilic polymer or the like, in order to prevent contamination caused by contact with the soft mold having high hydrophobicity. Hydrophilic polymers are, for example, liquid pre-polymers, liquefied polymers, or materials having hydrophilic groups in an acrylic or epoxy-based polymer chain having a high permeability. The polymer of this substituted structure, etc. are used. Here, the liquid polymer precursor includes an organic material, a binder, a photoinitiator and the like. The organic material has a resilience when it comes into contact with the soft mold and has a good transparency having a coloration of 20 or less, for example, polyethylene ethylene glycol (PEG). As the binder, a styrene-acrylic comonomer to which an styrene co-monomer having good adhesion to an acrylic monomer is added is used.

As described above, the color filter array substrate according to the fourth embodiment of the present invention includes a white color filter having a height similar to the height from the front surface of the substrate to the overcoat layer, and a spacer formed of the same material as the white color filter. The white color filter and the overcoat layer make the cell gap the same throughout the liquid crystal panel, thereby preventing deterioration of image quality such as unevenness.

12A to 12F are cross-sectional views illustrating a method of manufacturing the color filter array substrate illustrated in FIG. 11.

As shown in FIG. 12A, the black matrix 102, the red, green, and blue color filters 104R, 104G, and 104B are sequentially formed on the upper substrate 101. As shown in FIG. 12B, the first polymer 198 having strong hydrophilicity is printed on the upper substrate 101. As shown in FIG. 12C, the soft mold 188 having the groove 190a and the protrusion 190b is aligned on the upper substrate 101 on which the hydrophilic first polymer 198 is formed. The groove 190a of the soft mold 188 corresponds to the region where the overcoat layer is to be formed. The soft mold 188 is pressed by the first polymer 198 having strong hydrophilicity. At this time, the substrate 101 is baked at a temperature of about 130 ° C. or less, or the ultraviolet light is irradiated onto the hydrophilic strong first polymer 198 so that the hydrophilic strong first polymer 198 is soft cured. The amount of ultraviolet light varies depending on at least one of the base material and the photoinitiator included in the hydrophilic strong first polymer 198. For example, when the base material included in the hydrophilic strong first polymer 198 is epoxy series, the ultraviolet light amount is 2000-2500 mJ / cm 2, and in the acrylic series, the ultraviolet light amount is 500-1000 mJ / cm 2. Then, the hydrophilic first polymer 198 moves into the groove 190a of the soft mold. As a result, as shown in FIG. 12D, the groove 190a of the soft mold and the overcoat layer 122 having a pattern shape reversely transferred are formed. Then, after the soft mold 188 and the substrate 101 are separated, the substrate 101 is cured at about 200 ° C. or more.

On the upper substrate 101 on which the overcoat layer 122 is formed, the second polymer 192 having strong hydrophilicity is printed on the entire surface as shown in FIG. 12E. The soft mold 194 having the groove 196a and the protrusion 196b is aligned on the upper substrate 101 on which the hydrophilic second polymer 192 is formed. The groove 196a of the soft mold 194 corresponds to the region where the spacer is to be formed. The soft mold 194 is pressed by the second polymer 192 having strong hydrophilicity. At this time, when the substrate 101 is baked at a temperature of about 130 ° C. or less or ultraviolet rays are irradiated onto the hydrophilic strong second polymer 192, the hydrophilic strong second polymer 192 is soft-cured. The amount of ultraviolet light is changed depending on at least one of the base material and the photoinitiator included in the hydrophilic strong second polymer 192. For example, when the base material included in the hydrophilic strong second polymer 192 is epoxy series, the ultraviolet light amount is 2000-2500 mJ / cm 2, and in the acrylic series, the ultraviolet light amount is 500-1000 mJ / cm 2. Then, the second hydrophilic polymer 192 is moved into the groove 196a of the soft mold. As a result, as shown in FIG. 12F, a white color filter 104W is formed in the grooves 196a of the soft mold, the spacers 122 having the patterns inverted and transferred, and the openings 130 of the overcoat layer 122. . Then, after the soft mold 194 and the substrate 101 are separated, the substrate 101 is cured at about 200 ° C. or more.

As described above, in the method of manufacturing the color filter array substrate according to the fourth embodiment of the present invention, a white color filter and a spacer are formed by patterning a thin film of the color filter array substrate using a soft mold and an etch resist without using a photolithography process. At the same time. As a result, expensive exposure equipment is not required, and the process is simple and the precision is high, so that the processing time can be shortened and the manufacturing yield is improved.

In addition, the liquid crystal display panel according to the present invention is not only applied to the IPS mode in which the common electrode and the pixel electrode are formed on the lower substrate to form a horizontal electric field, but also the pixel electrode formed on the lower substrate by forming the common electrode on the upper substrate. It can also be applied to the TN mode forming a vertical electric field with.

On the other hand, the method for manufacturing a color filter array substrate according to the present invention can form a white color filter, a spacer and an overcoat layer using a soft mold in a vacuum state. In this case, bubbles may be prevented when the hydrophilic polymer, which is a material of the white color filter, the spacer, and the overcoat layer, is in contact with the soft mold.

As described above, the method for manufacturing a color filter array substrate according to the present invention forms a white color filter simultaneously with at least one of a spacer and an overcoat layer using a soft mold and an etch resist without using a photo process. As a result, expensive exposure equipment is not required, and the process is simple and the precision is high, so that the processing time can be shortened and the manufacturing yield is improved. In addition, the color filter array substrate and the method of manufacturing the same according to the present invention can remove the step difference between the white pixel region and the other pixel region to prevent deterioration of image quality such as spots.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

Claims (19)

Forming a black matrix on the substrate; Forming red, green, and blue color filters on the substrate on which the black matrix is formed; Forming an overcoat layer including a white color filter on the substrate on which the red, green, and blue color filters are formed; Aligning a flat soft mold on the overcoat layer; Planarizing the overcoat layer using the flat plate soft mold, Forming the black matrix Forming an opaque layer and an etch resist on the substrate; Pressing a first soft mold having a groove corresponding to the black matrix on the etch resist to form an etch resist pattern; And etching the opaque layer using the etch resist pattern as a mask. delete The method of claim 1, Forming the etch resist pattern And pressing the etch resist at a temperature of 130 ° C. or less for 10 minutes to 2 hours with the first soft mold or irradiating the etch resist with ultraviolet rays. The method of claim 1, Forming a red, green and blue color filter on the substrate on which the black matrix is formed Forming a resin corresponding to any one of the red, green, and blue color filters on the substrate; And pressing the second soft mold having a groove corresponding to the color filter on the resin corresponding to any one of the red, green, and blue color filters to form the color filter. Method of manufacturing a substrate. The method of claim 4, wherein Pressing the second soft mold having a groove corresponding to the color filter to form the color filter And pressing the resin at a temperature of 130 ° C. or less for 10 minutes to 2 hours with the second soft mold, or irradiating the resin with ultraviolet rays. The method of claim 1, The overcoat layer including the white color filter is a method of manufacturing a color filter array substrate, characterized in that formed of a hydrophilic material. The method of claim 6, The overcoat layer including the white color filter is formed of any one of a liquid polymer precursor and a liquefied polymer manufacturing method of a color filter array substrate. The method according to any one of claims 1 and 4, And the first and second soft molds are formed of a hydrophobic material. The method of claim 8, Wherein said first and second soft molds comprise any one of polydimethylsiloxane, polyurethane, and cross linked novolac resin. Forming a black matrix on the substrate; Forming red, green, and blue color filters on the substrate on which the black matrix is formed; Coating a transparent resin on the substrate on which the red, green, and blue color filters are formed; Arranging a soft mold having grooves and protrusions on the substrate on which the transparent resin is formed; And simultaneously forming a white color filter, an overcoat layer, and a spacer using the soft mold. 11. The method of claim 10, Simultaneously forming a white color filter, an overcoat layer and a spacer using the soft mold, Pressing a soft mold having a groove corresponding to the spacer on the transparent resin; And moving the transparent resin into the groove to form a spacer, and forming an overcoat layer having a flat and white color filter by contacting the surface of the soft mold with the transparent resin. Method of manufacturing a substrate. The method of claim 11, Pressing the soft mold having a groove corresponding to the spacer on the transparent resin, And pressing the transparent resin at a temperature of 130 ° C. or less for 10 minutes to 2 hours with the soft mold, or irradiating ultraviolet rays to the transparent resin. 11. The method of claim 10, The transparent resin is a method of manufacturing a color filter array substrate, characterized in that formed of any one of a liquid polymer precursor and a liquefied polymer. 11. The method of claim 10, The soft mold is a method of manufacturing a color filter array substrate, characterized in that it comprises any one of polydimethylsiloxane, polyurethane and cross linked novolac resin. Forming a black matrix on the substrate; Forming red, green, and blue color filters on the substrate on which the black matrix is formed; Coating a first transparent resin on the substrate on which the red, green, and blue color filters are formed; Arranging a first soft mold having grooves and protrusions on the substrate on which the first transparent resin is formed; Pressing the first transparent resin with the first soft mold to form an overcoat layer having an opening; Coating a second transparent resin on the overcoat layer; Aligning a second soft mold on the overcoat layer on which the second transparent resin is formed; And pressing the second transparent resin with the second soft mold to simultaneously form a white color filter and a spacer. The method of claim 15, Pressing the second transparent resin with the second soft mold to simultaneously form the white color filter and the spacer, Coating a second transparent resin on the overcoat layer, and then pressing a second soft mold having a groove corresponding to a region where the spacer is formed on the second transparent resin; And forming a spacer by moving the second transparent resin into the groove and forming a white color filter in the opening of the overcoat layer. The method of claim 15, Pressurizing the first and second transparent resins at a temperature of 130 ° C. or lower for 10 minutes to 2 hours with the first and second soft molds, respectively, or irradiating ultraviolet rays to the first and second transparent resins, respectively. A method of manufacturing a color filter array substrate, characterized in that. The method of claim 15, Wherein the first and second transparent resins are formed of any one of a liquid polymer precursor and a liquefied polymer. The method of claim 15, Wherein the first and second soft molds comprise any one of polydimethylsiloxane, polyurethane, and cross linked novolac resin.

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