KR101064689B1 - conveying apparatus for semi-conductor chip tray - Google Patents

conveying apparatus for semi-conductor chip tray Download PDF

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Publication number
KR101064689B1
KR101064689B1 KR1020090075353A KR20090075353A KR101064689B1 KR 101064689 B1 KR101064689 B1 KR 101064689B1 KR 1020090075353 A KR1020090075353 A KR 1020090075353A KR 20090075353 A KR20090075353 A KR 20090075353A KR 101064689 B1 KR101064689 B1 KR 101064689B1
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KR
South Korea
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semiconductor chip
conveyor
conveyor belt
chip tray
adhesive tape
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KR1020090075353A
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Korean (ko)
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KR20110017734A (en
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정희찬
윤재원
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주식회사 에스.제이테크
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Priority to KR1020090075353A priority Critical patent/KR101064689B1/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G45/00Lubricating, cleaning, or clearing devices
    • B65G45/10Cleaning devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773Conveying cassettes, containers or carriers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736Loading to or unloading from a conveyor

Abstract

본 발명은 반도체칩 트레이를 이송하는 컨베이어 장치의 후단에 스티키 롤러를 장착하여 컨베이어 벨트의 표면에 묻어있는 미세 찌꺼기나 부유성 이물질을 점착시켜 제거할 수 있도록 한 반도체칩 트레이 이송용 컨베이어 장치에 관한 것이다.The present invention relates to a conveyor device for transporting semiconductor chip trays by attaching a sticky roller to a rear end of a conveyor device for transporting semiconductor chip trays so that fine debris or floating foreign substances adhering to the surface of the conveyor belt can be adhered to and removed. .
본 발명의 반도체칩 트레이 이송용 컨베이어 장치는 반도체칩 트레이가 적재되어 이송되는 컨베이어 벨트; 상기 컨베이어 벨트의 후단의 양측에 수직으로 설치되는 축받침대 및 상기 축받침대에 자유 회전이 가능하도록 장착된 채로 상기 컨베이어 벨트에 접촉되는 점착성 테이프 롤을 구비하여 상기 컨베이어 벨트의 구동에 따라 회전하여 상기 컨베이어 벨트의 표면에 묻은 미세 찌꺼기나 부유성 이물질을 점착시켜 제거하는 스티키 롤러를 포함하여 이루어진다.The conveyor apparatus for conveying a semiconductor chip tray of the present invention comprises: a conveyor belt on which a semiconductor chip tray is loaded and conveyed; A conveyor having vertically installed on both sides of the rear end of the conveyor belt and an adhesive tape roll which is in contact with the conveyor belt while being mounted to be freely rotatable on the bearing support and rotated according to the driving of the conveyor belt to rotate the conveyor. It comprises a sticky roller to adhere by removing fine debris or floating foreign matter on the surface of the belt.
반도체칩, 트레이, 이송, 컨베이어, 스티키, 점착, 롤러 Semiconductor Chip, Tray, Transfer, Conveyor, Sticky, Adhesive, Roller

Description

반도체칩 트레이 이송용 컨베이어 장치{conveying apparatus for semi-conductor chip tray}Conveying device for semi-conductor chip tray
본 발명은 반도체칩 트레이 이송용 컨베이어 장치에 장치에 관한 것으로, 특히 반도체칩 트레이를 이송하는 컨베이어 장치의 후단에 스티키 롤러를 장착하여 컨베이어 벨트의 표면에 묻어있는 사출품의 미세 찌꺼기나 부유성 이물질을 점착시켜 제거하는 반도체칩 트레이 이송용 컨베이어 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for a conveyor for conveying semiconductor chip trays. In particular, a sticky roller is mounted on a rear end of a conveyor device for transporting a semiconductor chip tray to remove fine debris or floating foreign matters from the surface of the conveyor belt. The present invention relates to a conveyor device for conveying a semiconductor chip tray which is adhered and removed.
잘 알려진 바와 같이, 반도체칩 트레이는 다수의 미세 반도체 회로소자들이 집적된 장방형의 반도체칩의 다수를 상면에 가지런히 보관하는 용기로서, 다수의 반도체칩을 적재한 반도체칩 트레이는 다단으로 적층되어 보관 또는 운송되게 된다.As is well known, a semiconductor chip tray is a container for storing a large number of rectangular semiconductor chips in which a plurality of fine semiconductor circuit elements are integrated on the top surface, and a semiconductor chip tray in which a plurality of semiconductor chips are stacked is stacked and stored in multiple stages. Or be transported.
이러한 반도체칩 트레이는 내열, 절전 및 정전기 방지를 위해 PVC 또는 PS 시트를 진공 성형 또는 프레스 성형하거나 사출 성형하여 제조된다. 도 1은 종래의 반도체칩 트레이를 개략적으로 도시한 평면도이다. 도시된 바와 같이, 종래의 반도체칩 트레이(100)는 상면에 반도체칩이 수납되는 다수의 포켓(110)이 1열 이상을 이루면서 가지런히 형성되어 있으며, 하단에는 반도체칩 트레이가 적층될 수 있도 록 적층홈(미도시)이 형성된다. 각각의 포켓(110)은 장방형의 수납홈을 형성하도록 격벽으로 구분되어 있어서, 이렇게 형성된 수납홈에 절단 가공된 개개의 반도체칩이 수납된다.Such a semiconductor chip tray is manufactured by vacuum molding, press molding or injection molding of PVC or PS sheets for heat resistance, power saving and antistatic. 1 is a plan view schematically showing a conventional semiconductor chip tray. As shown, the conventional semiconductor chip tray 100 has a plurality of pockets 110 in which the semiconductor chip is accommodated on the upper surface is formed neatly forming one row or more, so that the semiconductor chip tray can be stacked on the bottom Laminated grooves (not shown) are formed. Each pocket 110 is divided into a partition wall to form a rectangular accommodating groove, and thus the individual semiconductor chips cut into the accommodating grooves are accommodated.
또한, 반도체칩 트레이(110)의 상면에는 걸림턱(120)이 형성되어 다른 반도체칩 트레이 하단의 적층홈(미도시)과 결합하여 다단으로 적층될 수 있게 함으로써 보관 및 운송의 편의성을 제공할 수 있도록 되어 있다.In addition, the locking jaw 120 is formed on the upper surface of the semiconductor chip tray 110 to be combined with a stacking groove (not shown) at the bottom of the other semiconductor chip tray to be stacked in multiple stages to provide convenience of storage and transportation. It is supposed to be.
도 2는 종래 반도체칩 트레이 이송용 컨베이어 장치의 개략적인 구조를 보인 사시도이다. 도 2에 도시한 바와 같이, 반도체칩 트레이(100)는 클린룸에서 사출 성형으로 제조된 후에 자동 로봇에 의해 취출되어 정지중인 컨베이어 장치(200)의 컨베이어 벨트(210) 위에 차곡차곡 적층되고, 소정 분량의 반도체칩 트레이(100)의 적층이 완료되면 컨베이어 벨트(210)가 전진 구동되어 반도체칩 트레이(100)를 정해진 위치까지 이송하게 된다.2 is a perspective view showing a schematic structure of a conventional conveyor for conveying semiconductor chip trays. As shown in FIG. 2, the semiconductor chip tray 100 is stacked on the conveyor belt 210 of the conveyor apparatus 200 which is taken out and stopped by an automatic robot after being manufactured by injection molding in a clean room, and is predetermined. When the stacking of the amount of the semiconductor chip tray 100 is completed, the conveyor belt 210 is driven forward to transfer the semiconductor chip tray 100 to a predetermined position.
그러나 전술한 바와 같은 종래의 반도체칩 트레이 이송용 컨베이어 장치에 따르면, 비록 반도체칩의 제조를 클린룸에서 수행한다고는 하나 반도체칩 트레이의 사출 과정에서 생성된 미세한 찌꺼기나 부유성 이물질이 컨베이어 벨트를 통한 이송 과정에서 컨베이어 벨트 상에 달라붙게 되는데, 이 경우에 이러한 미세 찌꺼기나 부유성 이물질이 향후 반도체칩 트레이의 포켓에 수납되는 반도체칩으로 전이되어 반도체칩의 오동작을 유발하는 문제점이 있었다.However, according to the conventional semiconductor chip tray conveying conveyor apparatus as described above, although the manufacturing of the semiconductor chip is carried out in a clean room, fine debris or floating foreign substances generated during the injection process of the semiconductor chip tray are transferred through the conveyor belt. In the transfer process, they are stuck on the conveyor belt. In this case, such fine debris or floating foreign matters are transferred to the semiconductor chips that are stored in the pockets of the semiconductor chip trays, thereby causing a malfunction of the semiconductor chips.
본 발명은 전술한 문제점을 해결하기 위해 안출된 것으로서, 반도체칩 트레이를 이송하는 컨베이어 장치의 후단에 스티키 롤러를 장착하여 컨베이어 벨트의 표면에 묻어있는 미세 찌꺼기나 부유성 이물질을 점착시켜 제거할 수 있도록 한 반도체칩 트레이 이송용 컨베이어 장치를 제공함을 목적으로 한다.The present invention has been made to solve the above-described problems, by attaching a sticky roller to the rear end of the conveyor device for transporting the semiconductor chip tray to be removed by sticking the fine debris or floating foreign matter on the surface of the conveyor belt An object of the present invention is to provide a conveyor device for transferring a semiconductor chip tray.
전술한 목적을 달성하기 위한 본 발명의 반도체칩 트레이 이송용 컨베이어 장치는 반도체칩 트레이가 적재되어 이송되는 컨베이어 벨트; 상기 컨베이어 벨트의 후단의 양측에 수직으로 설치되는 축받침대 및 상기 축받침대에 자유 회전이 가능하도록 장착된 채로 상기 컨베이어 벨트에 접촉되는 점착성 테이프 롤을 구비하여 상기 컨베이어 벨트의 구동에 따라 회전하여 상기 컨베이어 벨트의 표면에 묻은 미세 찌꺼기나 부유성 이물질을 점착시켜 제거하는 스티키 롤러를 포함하여 이루어진다.Conveying apparatus for a semiconductor chip tray transfer of the present invention for achieving the above object is a conveyor belt that is loaded with a semiconductor chip tray transported; A conveyor having vertically installed on both sides of the rear end of the conveyor belt and an adhesive tape roll which is in contact with the conveyor belt while being mounted to be freely rotatable on the bearing support and rotated according to the driving of the conveyor belt to rotate the conveyor. It comprises a sticky roller to adhere by removing fine debris or floating foreign matter on the surface of the belt.
전술한 구성에서, 상기 스티키 롤러의 상기 점착성 테이프 롤은 자중에 의해 상기 컨베이어 벨트에 접촉되는 것을 특징으로 한다.In the above-described configuration, the sticky tape roll of the sticky roller is characterized in that it is in contact with the conveyor belt by its own weight.
한편, 각각의 상기 축받침대에는 상단에서 깊이 방향으로 축지홈이 형성되어 있고, 상기 스티키 롤러는 양단에 상기 축지홈에 삽입되는 회전축이 형성되어 있는 원형 드럼 및 상기 원형 드럼에 권취되어 있는 상기 점착성 테이프 롤을 포함하여 이루어진다.On the other hand, each of the bearing support is formed with a groove groove in the depth direction from the top, the sticky roller is a circular drum formed with a rotary shaft inserted into the bearing groove at both ends and the adhesive tape wound on the circular drum It consists of a roll.
본 발명의 반도체칩 트레이 이송용 컨베이어 장치에 따르면, 컨베이어 벨트 의 표면에 묻어 있는 미세 찌꺼기나 부유성 이물질을 점착시켜 제거함으로써 미세 찌꺼기나 부유성 이물질이 반도체칩 트레이를 거쳐 반도체칩으로 전이됨으로써 발생할 수 있는 반도체칩의 불량이나 오동작을 미연에 방지할 수가 있다.According to the conveyor device for conveying the semiconductor chip tray of the present invention, by adhering and removing the fine debris or floating foreign matter adhering to the surface of the conveyor belt may be generated by the transfer of fine debris or floating foreign matter to the semiconductor chip through the semiconductor chip tray. It is possible to prevent defects or malfunctions of existing semiconductor chips.
이하에는 첨부한 도면을 참조하여 본 발명의 반도체칩 트레이 이송용 컨베이어 장치의 바람직한 실시예에 대해 상세하게 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the conveyor apparatus for transferring a semiconductor chip tray of the present invention.
도 3은 본 발명의 반도체칩 트레이 이송용 컨베이어 장치의 구조를 개략적으로 보인 사시도이고, 도 4a 및 도 4b는 도 3에서 스티키 롤러 부분을 종으로 절취하여 본 단면도로서 점착성 테이프 롤의 대소 상태틀 각각 보이고 있다. 도 3 및 도 4에 도시한 바와 같이, 본 발명의 반도체칩 트레이 이송용 컨베이어 장치(200')에 따르면, 컨베이어 벨트(210)의 후단의 양측에 스티키 롤러(230)를 축회전이 가능하도록 지지하는 한 쌍의 축받침대(220)가 수직으로 설치되어 있는데, 이러한 축받침대(220)에는 그 상면으로부터 일정 깊이까지 축지홈(222)이 형성되어 있다. 그리고 이러한 축지홈(222)에는 스티키 롤러(230)의 회전축이 자유롭게 삽입되게 된다.3 is a perspective view schematically showing a structure of a conveyor device for conveying a semiconductor chip tray of the present invention, and FIGS. 4A and 4B are cross-sectional views taken along the sticky roller part of FIG. 3, respectively. It is showing. 3 and 4, according to the semiconductor device tray transfer conveyor apparatus 200 'of the present invention, the sticky roller 230 is supported on both sides of the rear end of the conveyor belt 210 so as to enable axial rotation. A pair of bearing support 220 is installed vertically, the bearing support 220 is formed in the bearing support 222 to a predetermined depth from the upper surface. And the rotation shaft of the sticky roller 230 is freely inserted into the bearing groove 222.
전술한 구성에서, 스티키 롤러(230)는 양단에 회전축(232a)이 형성되어 있는 원형 드럼(232)과 여기에 권취된 점착성 테이프 롤(234)로 이루어진다. 점착성 테이프 롤(234)의 테이프 표면에는 점착성 물질(점착제)이 도포되어 있는데, 롤이 쉽게 해체되지 않도록 테이프의 이면에도 점착성 물질(점착제)이 도포될 수 있다.In the above-described configuration, the sticky roller 230 is composed of a circular drum 232 having a rotating shaft 232a formed at both ends thereof, and an adhesive tape roll 234 wound thereon. An adhesive material (adhesive) is applied to the tape surface of the adhesive tape roll 234. An adhesive material (adhesive) may also be applied to the back surface of the tape so that the roll is not easily disassembled.
한편, 축받침대(220)의 축지홈(222)의 폭은 원형 드럼의 양단에 형성된 회전 축(232a)의 직경과 같거나 약간 크게 이루어질 수 있으며, 그 깊이는 점착성 테이프 롤(234)이 소진되더라도 회전축(232a)과 접촉되지 않을 정도로 충분히 깊게 형성될 수 있다. 결과적으로, 축지홈(222)은 단지 원형 드럼(232)의 회전축(232a)이 옆으로 이탈되거나 좌우로 과도하게 유동되는 것만을 방지할 뿐이고 스티키 롤러(230)는 점착성 테이프 롤(234)이 컨베이어 벨트(210)와 접촉함으로써 컨베이어 벨트(210)에 의해 지지되게 된다.Meanwhile, the width of the bearing groove 222 of the bearing support 220 may be equal to or slightly larger than the diameter of the rotating shaft 232a formed at both ends of the circular drum, and the depth thereof may be exhausted even if the adhesive tape roll 234 is exhausted. It may be formed deep enough so that it does not contact the rotating shaft 232a. As a result, the retaining groove 222 merely prevents the rotational shaft 232a of the circular drum 232 from deviating laterally or excessively flowing from side to side, and the sticky roller 230 may be used to prevent the adhesive tape roll 234 from being conveyed. In contact with the belt 210, it is supported by the conveyor belt 210.
이러한 구조에 의해 점착성 테이프 롤(234)이 권취된 스티키 롤러(230)의 회전축(232a)을 축받침대(220)의 축지홈(222)을 향해 위에서 아래로 삽입하게 되면, 스티키 롤러(230)의 자중에 의해 점착성 테이프 롤(234)이 컨베이어 벨트(210)의 표면에 접촉하여 지지되게 된다. 이 상태에서, 컨베이어 벨트(210) 위에 반도체칩 트레이(100)의 적재가 완료되어 컨베이어 벨트(210)가 전진 구동되면 그 마찰력에 의해 스티키 롤러(230)의 점착성 테이프 롤(234)이 반대 방향으로 회전하면서 컨베이어 벨트(210)의 표면에 묻어 있는 미세 찌꺼기나 부유성 이물질을 점착시켜 제거하게 된다. 한편, 이와 같이 하여 점착성 테이프 롤(234)의 표면에 미세 찌꺼기나 부유성 이물질이 많이 점착된 경우에는 주기적으로 해당 부분을 잘라내어 사용하게 된다. 나아가, 점착성 테이프 롤(234)이 소진되면 이를 축지홈(222)을 따라 위로 빼낸 후에 새로운 스티키 롤러(230)를 삽입하여 사용하면 된다.By such a structure, when the rotary shaft 232a of the sticky roller 230 in which the adhesive tape roll 234 is wound is inserted downward from the top toward the storage groove 222 of the shaft support 220, the sticky roller 230 The self-weight causes the adhesive tape roll 234 to be in contact with the surface of the conveyor belt 210 to be supported. In this state, when the loading of the semiconductor chip tray 100 on the conveyor belt 210 is completed and the conveyor belt 210 is driven forward, the adhesive tape roll 234 of the sticky roller 230 is moved in the opposite direction by the frictional force. While rotating, the fine particles or floating foreign matters on the surface of the conveyor belt 210 are adhered and removed. On the other hand, when a lot of fine debris or floating foreign matter adhered to the surface of the adhesive tape roll 234 in this way it is used to cut out the portion periodically. In addition, when the adhesive tape roll 234 is exhausted, the adhesive tape roll 234 may be pulled out along the axial groove 222 and then inserted and used with a new sticky roller 230.
본 발명에 의해 컨베이어 벨트의 표면에 묻어 있는 미세 찌꺼기나 부유성 이물질이 제거되기 때문에 반도체칩 트레이에 이들이 들러붙지 않게 되고, 이에 따라 반도체칩 트레이의 포켓에 수납되는 반도체칩에도 미세 찌꺼기나 부유성 이물질이 들러붙지 않게 됨으로써 반도체칩의 불량이나 오동작의 가능성을 사전에 차단할 수 있게 된다.According to the present invention, since the fine debris and floating foreign matters on the surface of the conveyor belt are removed, they do not stick to the semiconductor chip tray, and thus, the fine chips or floating foreign matters are also contained in the semiconductor chips stored in the pockets of the semiconductor chip tray. By not sticking, the possibility of defects or malfunctions of the semiconductor chip can be blocked in advance.
본 발명의 반도체칩 트레이 이송용 컨베이어 장치는 전술한 실시예에 국한되지 않고 본 발명의 기술 사상이 허용하는 범위 내에서 다양하게 변형하여 실시할 수가 있다. 예를 들어 원형 드럼을 양측에 날개가 있는 원형 보빈 형태로 변형이 가능하며, 이외에도 축지홈의 구조 등도 다양하게 변형할 수 있을 것이다.The conveyor apparatus for conveying a semiconductor chip tray of the present invention is not limited to the above-described embodiments and can be modified in various ways within the scope of the technical idea of the present invention. For example, the circular drum can be modified in the form of a circular bobbin with wings on both sides, in addition to the structure of the bearing groove may be variously modified.
도 1은 종래의 반도체칩 트레이를 개략적으로 도시한 평면도,1 is a plan view schematically showing a conventional semiconductor chip tray;
도 2는 종래 반도체칩 트레이 이송용 컨베이어 장치의 개략적인 구조를 보인 사시도,Figure 2 is a perspective view showing a schematic structure of a conveyor device for conveying a conventional semiconductor chip tray,
도 3은 본 발명의 반도체칩 트레이 이송용 컨베이어 장치의 구조를 개략적으로 보인 사시도이고, 도 4a 및 도 4b는 도 3에서 스티키 롤러 부분을 종으로 절취하여 본 단면도로서 점착성 테이프 롤의 대소 상태틀 각각 보이고 있다.3 is a perspective view schematically showing a structure of a conveyor device for conveying a semiconductor chip tray of the present invention, and FIGS. 4A and 4B are cross-sectional views taken along the sticky roller part of FIG. 3, respectively. It is showing.
*** 도면의 주요 부분에 대한 부호의 설명 ****** Explanation of symbols for the main parts of the drawing ***
100: 반도체칩 트레이, 200, 200': 컨베이어 장치,100: semiconductor chip tray, 200, 200 ': conveyor device,
210: 컨베이어 벨트, 220: 축받침대,210: conveyor belt, 220: bearing support,
222: 축지홈, 230: 스티키 롤러,222: paper groove, 230: sticky roller,
232: 원형 드럼, 232a: 회전축,232: circular drum, 232a: rotary shaft,
234: 점착성 테이프 롤234: adhesive tape roll

Claims (3)

  1. 삭제delete
  2. 삭제delete
  3. 반도체칩 트레이가 적재되어 이송되는 컨베이어 벨트;A conveyor belt on which semiconductor chip trays are loaded and transported;
    상기 컨베이어 벨트의 후단의 양측에 수직으로 설치되는 축받침대 및A bearing support vertically installed at both sides of the rear end of the conveyor belt;
    회전축이 상기 축받침대에 자유 회전이 가능하도록 장착된 채로 상기 컨베이어 벨트에 접촉되는 점착성 테이프 롤을 구비하여 상기 컨베이어 벨트의 구동에 따라 회전하여 상기 컨베이어 벨트의 표면에 묻은 미세 찌꺼기나 부유성 이물질을 점착시켜 제거하는 스티키 롤러를 포함하여 이루어지되,It is provided with an adhesive tape roll which contacts the conveyor belt while the rotating shaft is mounted on the shaft support so as to be freely rotated, and rotates according to the driving of the conveyor belt to adhere fine debris or floating foreign matter on the surface of the conveyor belt. Including sticky roller to remove the
    상기 스티키 롤러는 양단에 회전축이 형성되어 있는 원형 드럼 및 상기 원형 드럼에 권취되어 있는 상기 점착성 테이프 롤을 포함하여 이루어지고,The sticky roller comprises a circular drum having a rotating shaft formed at both ends and the adhesive tape roll wound on the circular drum,
    각각의 상기 축받침대에는 상기 점착성 테이프 롤이 소진되더라도 상기 회전축과 접촉되지 않는 깊이를 갖는 축지홈이 상단에서 깊이 방향으로 형성되어 있어서 상기 점착성 테이프 롤이 자중에 의해 상기 컨베이어 벨트에 접촉되는 것을 특징으로 하는 반도체칩 트레이 이송용 컨베이어 장치.Each bearing support has a bearing groove having a depth that is not in contact with the rotating shaft even when the adhesive tape roll is exhausted in the depth direction from the top, so that the adhesive tape roll contacts the conveyor belt by its own weight. Conveyor device for conveying semiconductor chip trays.
KR1020090075353A 2009-08-14 2009-08-14 conveying apparatus for semi-conductor chip tray KR101064689B1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101292317B1 (en) * 2012-12-04 2013-07-31 주식회사 쓰리디플러스 Sheet tray moving apparatus
CN105151423A (en) * 2015-08-11 2015-12-16 安徽远鸿机械自动化有限公司 Dust adhering method used in thin film packaging process

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KR200387549Y1 (en) 2005-03-15 2005-06-20 에스인포텍(주) Conveyor cleaner
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KR930006258Y1 (en) * 1991-04-04 1993-09-17 삼성전관 주식회사 Cleaning device
JP2002361185A (en) 2001-06-12 2002-12-17 Hitachi Chem Co Ltd Dust removing method for feed reticulated belt and apparatus therefor
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Publication number Priority date Publication date Assignee Title
KR101292317B1 (en) * 2012-12-04 2013-07-31 주식회사 쓰리디플러스 Sheet tray moving apparatus
CN105151423A (en) * 2015-08-11 2015-12-16 安徽远鸿机械自动化有限公司 Dust adhering method used in thin film packaging process

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