KR101063733B1 - Interposer assembly for reducing impedance between circuits connected with the same - Google Patents

Interposer assembly for reducing impedance between circuits connected with the same Download PDF

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Publication number
KR101063733B1
KR101063733B1 KR1020080109160A KR20080109160A KR101063733B1 KR 101063733 B1 KR101063733 B1 KR 101063733B1 KR 1020080109160 A KR1020080109160 A KR 1020080109160A KR 20080109160 A KR20080109160 A KR 20080109160A KR 101063733 B1 KR101063733 B1 KR 101063733B1
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KR
South Korea
Prior art keywords
circuit member
member
contact
upper
lower
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KR1020080109160A
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Korean (ko)
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KR20100050057A (en
Inventor
이우섭
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세미텍 주식회사
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Publication of KR20100050057A publication Critical patent/KR20100050057A/en
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Abstract

The present invention relates to an interposer assembly for reducing impedance between connecting circuit members. The interposer according to the present invention is positioned between the upper circuit member and the lower circuit member so that each is electrically connected through a specific position of the upper circuit member and the lower circuit member, and the upper circuit member and the lower circuit member are interposer. A contact member of the conductor component electrically connecting between the contact pad of the upper circuit member and the contact pad of the lower circuit member when contacting the assembly; An insulating member electrically insulating the portion other than the contact pad of the upper circuit member and the portion other than the contact pad of the lower circuit member when the upper circuit member and the lower circuit member contact the interposer assembly; At least one dummy pattern electrically connecting a first connection part, which is an electrical connection point between the contact member and the lower circuit member, and a second connection part, which is an electrical connection point between the contact member and the upper circuit member, to the inside of the insulating member. dummy pattern).
Interposer, dummy pattern

Description

Interposer assembly for reducing impedance between connecting circuit members {INTERPOSER ASSEMBLY FOR REDUCING IMPEDANCE BETWEEN CIRCUITS CONNECTED WITH THE SAME}

The present invention relates to an interposer assembly used to form an electrical connection between spaced contact pads on a circuit member.

Rapid growth in semiconductor packages such as Ball Grid Arrays (BGAs), Chip Scale Packages (CSPs) and System In Packages (SIPs) is driving the need for improved performance on substrates and interposers surrounding them. The substrate provides a mechanical basis for the package and provides an electrical interface that can be externally connected to the internal package. The interposer is an intermediate layer that serves as a connection path between circuit members in a package composed of a plurality of layers, and may provide a ground or power source and a connection path. In some cases, the terms 'substrate' and 'interposer' refer to the same object in terms of providing a mechanical / electrical auxiliary role for the rest of the circuit pattern. However, hereinafter, the substrate is a layer including a circuit pattern, and the interposer is understood as a concept of a layer connecting between substrates including a circuit pattern.

That is, the interposer assembly is used to form electrical connections between closely spaced contact pads on adjacent circuit members. In general, the circuit member is a ceramic plate holding the circuit board and the integrated circuit, and the contact pads on the circuit member are arranged in the same pattern.

The interposer assembly includes an insulating plate and a plurality of through contact members held in the plate and arranged in the same baton as the pads on the circuit member. The interposer assembly is also interposed between the upper and lower circuit members to form an electrical connection between the contact pads of the upper and lower circuit members.

The interposer assembly can be configured in various forms. However, in the electrical connection between the specific connection portion of the upper circuit board and the specific connection portion of the lower circuit board using the connection member of the interposer, there is a problem that the power is wasted because the impedance increases between the two substrates. Accordingly, there is an effort to improve the material of the connection portion of the interposer, but there is a limit to the impedance reduction due to the improvement of the material of the connection portion of the interposer. In addition, a method of increasing the width of the connection member may be considered, but the increase in the width of the connection member is also limited due to the mechanical connection surrounding the connection member in the interposer.

In order to solve the above problems, in the present invention, in the interposer assembly that electrically connects the upper and lower substrates through specific points of the upper and lower circuit boards, the number of connection paths of the specific points is increased, so that the two circuit boards are connected. To provide a technique for reducing the impedance of.

In an embodiment of the present invention for solving the above problems, it is located between the upper circuit member and the lower circuit member, the inter so that each is electrically connected through a specific position of the upper circuit member and the lower circuit member A fuser assembly comprising: a contact member of a conductor component for electrically connecting between a contact pad of the upper circuit member and a contact pad of the lower circuit member when the upper circuit member and the lower circuit member contact the interposer assembly; An insulating member that electrically insulates portions other than the contact pads of the upper circuit member from portions other than the contact pads of the lower circuit member when the upper circuit member and the lower circuit member contact the interposer assembly; At least one dummy pattern electrically connecting a first connection part, which is an electrical connection point between the contact member and the lower circuit member, and a second connection part, which is an electrical connection point between the contact member and the upper circuit member, to the inside of the insulating member. It proposes an interposer assembly comprising a dummy pattern. Here, the "dummy pattern" can be thought of as a pattern set in a substrate or interposer that serves to increase the path through which current flows for impedance reduction, but does not perform any other function. However, the dummy pattern according to the present embodiment may perform other functions as long as the dummy pattern does not affect the impedance reduction caused by the above-described interposer assembly.

On the other hand, the dummy pattern is preferably provided so as to be insulated from portions other than the contact pads of the upper circuit member and portions other than the contact pads of the lower circuit member on the upper and lower surfaces of the insulating member.

The dummy pattern may be electrically connected to the connection member regardless of whether the upper circuit member and the lower circuit member are in contact with the interposer assembly.

In addition, the interposer assembly may include a plurality of dummy patterns in the insulating member, and the interposer assembly may be configured as a flexible PCB (F-PCB) or may be configured in various forms.

According to the present invention as described above, it is possible to solve the problem of impedance increase due to the interposer between the upper and lower circuit board and the lower circuit board.

In addition, when the dummy pattern is added in a state of being pre-connected with the connection member, no additional work for connecting the dummy pattern with the connection pads of the upper and lower circuit members is required.

In addition, the dummy pattern is insulated from the upper and lower circuit members in portions other than the connection pads so that unwanted connections are not made with other circuit portions on the surface of the upper and lower circuit members, so that unwanted connection does not occur.

In addition, when generating the interposer assembly according to the present embodiment in the form of F-PCB, a more flexible circuit configuration is possible.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The following detailed description, together with the accompanying drawings, is intended to illustrate exemplary embodiments of the invention and is not intended to represent the only embodiments in which the invention may be practiced.

The following detailed description includes specific details in order to provide a thorough understanding of the present invention. However, one of ordinary skill in the art appreciates that the present invention may be practiced without these specific details. In some instances, well-known structures and devices are omitted or shown in block diagram form, centering on the core functions of each structure and device, in order to avoid obscuring the concepts of the present invention. In addition, like reference numerals refer to like elements throughout the specification.

As described above, the present invention provides an interposer assembly that electrically connects the upper and lower substrates through specific points of the upper and lower circuit boards, and increases the number of connection paths at the specific points, thereby reducing the impedance between both circuit boards. To provide. To this end, first, the structure in which the upper and lower circuit boards are connected by the interposer according to an embodiment of the present invention will be described in detail, and in this structure, a method of reducing impedance through the insertion of a dummy pattern will be described. Shall be.

1 is a view for explaining the configuration of the interposer assembly according to an embodiment of the present invention.

In FIG. 1, the interposer assembly 10 is interposed between an upper circuit board (not shown) and a lower circuit board 20 so as to provide a connection between a connection pad of the upper circuit board and a connection pad 21 of the lower circuit board 20. A function of electrically connecting through the connection member 11 is performed. FIG. 1 illustrates a process of connecting the interposer assembly 10 to the lower circuit board 20. When the interposer assembly 10 is connected to the lower circuit board 20, the intermediate circuit as an intermediate assembly is shown. It can be used in the same way for connection with.

Meanwhile, when the upper circuit board and the lower circuit board 20 contact the interposer assembly, the interposer assembly 10 may contact portions of the lower circuit board 20 and portions other than the contact pads of the upper circuit board 20. It may include an insulating member 12 for electrically insulating other portions. The insulating member 12 also serves to mechanically support the upper circuit board (not shown) and the lower circuit board 20.

The connecting member 11 of the interposer 10 is provided in a slot provided in the insulating member 12 to connect the connection pad (not shown) of the upper circuit board and the connection pad 21 of the lower circuit board 20. Can be connected. The connection between the connection pad 21 and the connection member 11 of the upper substrate or the lower substrate may be permanently connected through soldering or simply mechanically connected.

2 and 3 illustrate a form in which an interposer assembly according to an embodiment of the present invention is connected to a lower circuit board and an upper circuit board.

Specifically, FIG. 2 illustrates a structure in which the interposer assembly 10 and the lower substrate 20 illustrated in FIG. 1 are connected by soldering, and FIG. 3 illustrates the interposer assembly 10 and the lower substrate illustrated in FIG. 2. The upper substrate 30 is connected to the intermediate structure to which the 20 is connected.

The interposer assembly can take various forms. As one of various types of interposers, the lower circuit board 20 is set to be permanently held with respect to the bottom of the interposer 10 before the upper circuit board 30 is pressed against the upper plate of the interposer 10. There is a form. That is, the contact pad 21 on the lower circuit board 20 has a form soldered to the contact portion 11 of the interposer. In this case, FIG. 2 corresponds to a case in which the lower substrate 20 is manufactured to have a shape as shown in FIG. 2 in advance.

Hereinafter, the connection portion between the contact portion 11 of the interposer and the connection pad 21 of the lower substrate 20 will be referred to as a first connection portion 22 hereinafter. However, if the first connection 22 includes a connection between the contact portion 11 of the interposer and the connection pad 21 of the lower substrate 20, the connection between the two is soldered or other connection. It is a concept that includes all of them, regardless of the connection of the method.

Meanwhile, the interposer 10 having completed the connection with the lower substrate 20 may be connected in the same manner as the upper substrate 30 as shown in FIG. 3. In this case, a connection point between the connection member 11 of the interposer 10 and the connection pad 31 of the upper substrate 30 will be referred to as a second connection portion 32 hereinafter. Like the first connector 22, the second connector 32 is not limited to a connection method between the connection member 11 of the interposer 10 and the connection pad 31 of the upper substrate 30.

4 illustrates a structure in which a dummy pattern is inserted into the interposer assembly in order to reduce impedance due to the interposer assembly according to one embodiment of the present invention.

That is, the interposer assembly 10 'according to the present embodiment is located between the upper circuit board 30 and the lower circuit board 20 so that the upper circuit board 30 and the lower circuit board 20 are formed of the conductor component. The first connection part 22 and the contact member, which are configured to be electrically connected by the contact member 11 and are electrically connected to the contact member 11 and the lower circuit board 20, are formed inside the insulating member 12. 11) and a dummy pattern 13 for electrically connecting the second connection portion 32, which is an electrical connection point of the upper circuit board 30. As the dummy pattern 13 has a smaller self impedance, the overall impedance reduction performance may be improved.

The "dummy pattern" can be thought of as a pattern that only serves to increase the path through which current flows for impedance reduction as described above, but does not affect other functions unless it affects the impedance reduction function caused by the interposer assembly described above. It is also possible to carry out.

The dummy pattern 13 according to the present exemplary embodiment may connect the first connecting portion 22 and the second connecting portion 32 in a situation where the upper substrate 30 and the lower substrate 20 are pressed by the interposer assembly 10. There is no need to limit its specific structure as long as it exists. However, the dummy pattern 13 may have a portion other than the contact pads 31 of the upper circuit board 30 and portions other than the contact pads 21 of the lower circuit board 20 on the upper and lower surfaces of the insulating member. It is desirable to be insulated so as to prevent unwanted electrical connection between the two substrates. In FIG. 4, an example of a structure in which the dummy pattern 13 is installed so as not to be exposed to the surface near the top and bottom surfaces of the interposer assembly 10 is illustrated, but is not limited thereto.

4 illustrates a structure in which the dummy pattern 13 is connected to the connection pad 31 of the upper circuit board 30 and the connection pad 21 of the lower circuit board 20. The dummy pattern 13 may be connected to the connection member 11 in advance regardless of whether the upper circuit board 30 and / or the lower circuit board 20 are in contact with the interposer connector 10. Can be. If the dummy pattern 13 is not always connected to the connecting member 11, the connection with the dummy pattern is also considered in the process of connecting the interposer assembly 10 and the upper and lower circuit boards 20 and 30. This is because the manufacturing process can be tricky.

Meanwhile, in the interposer assembly according to the present embodiment, the dummy pattern 13 may not necessarily be one, and a plurality of dummy patterns may be inserted into the interposer assembly.

FIG. 5 illustrates a structure of an interposer assembly including a plurality of dummy patterns according to an embodiment of the present invention.

Specifically, the interposer assembly 10 ″ shown in FIG. 5 illustrates a structure including two dummy patterns 13 and 14 connecting the first connecting portion 21 and the second connecting portion 32. Impedance may decrease as the number of dummy patterns added together increases. However, the addition of dummy patterns may be limited due to the insertion of other elements in the interposer assembly 10, 10 ′, and 10 ″.

On the other hand, there is no particular limitation on the material of the interposer in the interposer assembly 10, 10 ', 10 "according to the above-described embodiments. For example, as long as the interposer assembly performs the same function as described above It is also possible to implement in the form of a sub-PCB (F-PCB).

In general, the 'substrate' can be classified into various forms, but can be largely classified into a rigid type and a tape type. As can be seen in both of these terms, they differ in mechanical characteristics. That is, the 'rigid type' may have a fixed shape, while the 'typed type' may have a thin and flexible shape. Conventionally, most substrates have the above-described rigid type, but recently, a type-type substrate is widely used by using an organic substrate or the like.

F-PCB can be thought of similarly to a recessed type substrate. That is, it can set so that the structure demonstrated with respect to embodiment mentioned above may be included in the organic substrate which has a thin flexible structure.

In addition, the interposer structure 10, 10 ′, 10 ″ according to the above-described embodiments may be manufactured in a form that is previously coupled with the lower circuit board 20 or the upper circuit board 30. As shown.

In addition, in the above description, the upper circuit portion and the lower circuit portion are referred to as 'substrates' in order to emphasize that the function of the interposer performs the function of electrically connecting the 'substrates' constituting the layer. However, in the terms of the upper circuit board 30 and the lower circuit board 20, the term 'substrate' may be used interchangeably with the 'interposer' as described above. It may also be referred to as a circuit member 20.

The detailed description of the preferred embodiments of the invention disclosed as described above is provided to enable any person skilled in the art to make and practice the invention. Although the above has been described with reference to the preferred embodiments of the present invention, those skilled in the art will variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. I can understand that you can. Accordingly, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

As described above, the interposer structure according to each embodiment of the present invention can reduce the impedance due to the interposer in the circuit package, and thus can be applied to various technical fields using an integrated circuit having a plurality of layer structures. In addition, the interposer according to the present embodiment may be implemented as the interposer assembly itself due to the above-described function, or may be implemented in combination with other integrated circuit packages.

1 is a view for explaining the configuration of the interposer assembly according to an embodiment of the present invention.

2 and 3 illustrate a form in which an interposer assembly according to an embodiment of the present invention is connected to a lower circuit board and an upper circuit board.

4 illustrates a structure in which a dummy pattern is inserted into the interposer assembly in order to reduce impedance due to the interposer assembly according to one embodiment of the present invention.

FIG. 5 illustrates a structure of an interposer assembly including a plurality of dummy patterns according to an embodiment of the present invention.

** Description of the main parts of the drawing **

10, 10 ', 10 ": interposer assembly

11 connection member 12 insulation member

20: lower circuit board

21: connection pad of lower circuit board 22: first connection point

30: upper circuit board

31 connection pad of upper circuit board 32 second connection point

Claims (5)

  1. delete
  2. An interposer assembly positioned between an upper circuit member and a lower circuit member such that each is electrically connected through a specific position of the upper circuit member and the lower circuit member.
    A contact member of a conductor component electrically connecting between the contact pad of the upper circuit member and the contact pad of the lower circuit member when the upper circuit member and the lower circuit member contact the interposer assembly;
    An insulating member that electrically insulates portions other than the contact pads of the upper circuit member from portions other than the contact pads of the lower circuit member when the upper circuit member and the lower circuit member contact the interposer assembly; And
    At least one dummy pattern electrically connecting the first connection part, which is an electrical connection point between the contact member and the lower circuit member, and a second connection part, which is an electrical connection point between the contact member and the upper circuit member, inside the insulating member. pattern),
    And the dummy pattern is installed to be insulated from portions other than the contact pads of the upper circuit member and portions other than the contact pads of the lower circuit member, on the upper and lower surfaces of the insulating member.
  3. An interposer assembly positioned between an upper circuit member and a lower circuit member such that each is electrically connected through a specific position of the upper circuit member and the lower circuit member.
    A contact member of a conductor component electrically connecting between the contact pad of the upper circuit member and the contact pad of the lower circuit member when the upper circuit member and the lower circuit member contact the interposer assembly;
    An insulating member that electrically insulates portions other than the contact pads of the upper circuit member from portions other than the contact pads of the lower circuit member when the upper circuit member and the lower circuit member contact the interposer assembly; And
    At least one dummy pattern electrically connecting the first connection part, which is an electrical connection point between the contact member and the lower circuit member, and a second connection part, which is an electrical connection point between the contact member and the upper circuit member, inside the insulating member. pattern),
    And the dummy pattern is electrically connected to the connection member regardless of whether the upper circuit member and the lower circuit member are in contact with the interposer assembly.
  4. An interposer assembly positioned between an upper circuit member and a lower circuit member such that each is electrically connected through a specific position of the upper circuit member and the lower circuit member.
    A contact member of a conductor component electrically connecting between the contact pad of the upper circuit member and the contact pad of the lower circuit member when the upper circuit member and the lower circuit member contact the interposer assembly;
    An insulating member that electrically insulates portions other than the contact pads of the upper circuit member from portions other than the contact pads of the lower circuit member when the upper circuit member and the lower circuit member contact the interposer assembly; And
    At least one dummy pattern electrically connecting the first connection part, which is an electrical connection point between the contact member and the lower circuit member, and a second connection part, which is an electrical connection point between the contact member and the upper circuit member, inside the insulating member. pattern),
    And the interposer assembly includes a plurality of dummy patterns in the insulating member.
  5. An interposer assembly positioned between an upper circuit member and a lower circuit member such that each is electrically connected through a specific position of the upper circuit member and the lower circuit member.
    A contact member of a conductor component electrically connecting between the contact pad of the upper circuit member and the contact pad of the lower circuit member when the upper circuit member and the lower circuit member contact the interposer assembly;
    An insulating member that electrically insulates portions other than the contact pads of the upper circuit member from portions other than the contact pads of the lower circuit member when the upper circuit member and the lower circuit member contact the interposer assembly; And
    At least one dummy pattern electrically connecting the first connection part, which is an electrical connection point between the contact member and the lower circuit member, and a second connection part, which is an electrical connection point between the contact member and the upper circuit member, inside the insulating member. pattern),
    And wherein said interposer assembly is configured as a flexible PCB (F-PCB).
KR1020080109160A 2008-11-05 2008-11-05 Interposer assembly for reducing impedance between circuits connected with the same KR101063733B1 (en)

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Application Number Priority Date Filing Date Title
KR1020080109160A KR101063733B1 (en) 2008-11-05 2008-11-05 Interposer assembly for reducing impedance between circuits connected with the same

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KR101063733B1 true KR101063733B1 (en) 2011-09-15

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6227869B1 (en) 1998-11-24 2001-05-08 Hon Hai Precision Ind. Co., Ltd. Terminal for an LGA socket
US20050164527A1 (en) * 2003-04-11 2005-07-28 Radza Eric M. Method and system for batch forming spring elements in three dimensions
US7090504B2 (en) * 2003-12-09 2006-08-15 Hon Hai Precision Ind. Co., Ltd. Land grid array socket having improved terminals
KR100725542B1 (en) 2005-12-01 2007-05-30 삼성전자주식회사 Interposer assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6227869B1 (en) 1998-11-24 2001-05-08 Hon Hai Precision Ind. Co., Ltd. Terminal for an LGA socket
US20050164527A1 (en) * 2003-04-11 2005-07-28 Radza Eric M. Method and system for batch forming spring elements in three dimensions
US7090504B2 (en) * 2003-12-09 2006-08-15 Hon Hai Precision Ind. Co., Ltd. Land grid array socket having improved terminals
KR100725542B1 (en) 2005-12-01 2007-05-30 삼성전자주식회사 Interposer assembly

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