KR101037507B1 - Led package, led package array and backlight unit - Google Patents

Led package, led package array and backlight unit Download PDF

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Publication number
KR101037507B1
KR101037507B1 KR1020100002844A KR20100002844A KR101037507B1 KR 101037507 B1 KR101037507 B1 KR 101037507B1 KR 1020100002844 A KR1020100002844 A KR 1020100002844A KR 20100002844 A KR20100002844 A KR 20100002844A KR 101037507 B1 KR101037507 B1 KR 101037507B1
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KR
South Korea
Prior art keywords
light
led chip
reflector
led package
led
Prior art date
Application number
KR1020100002844A
Other languages
Korean (ko)
Inventor
유희종
Original Assignee
희성전자 주식회사
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Publication date
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Priority to KR1020100002844A priority Critical patent/KR101037507B1/en
Application granted granted Critical
Publication of KR101037507B1 publication Critical patent/KR101037507B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

The present invention provides a light emitting diode package that can be efficiently applied to an edge type backlight unit by using a molding to improve the optical characteristics and productivity of the light emitting diode while narrowing the direction angle in a short axis direction and widening the direction angle in a long axis direction. A light emitting diode array and a backlight unit, the LED package of the present invention for achieving the above object is a substrate to which the LED chip is bonded; A reflector forming a partition wall shape surrounding the LED chip, the reflector including a main window for transmitting the light from the LED chip to the front and a sub window opening one side of the main window to transmit a part of the light laterally; And a molding part filled in the reflector to encapsulate the LED chip.
The present invention having the above-described configuration exhibits an excellent effect in terms of manufacturing cost by mass production using a molding method, and has a narrow orientation angle in the vertical direction and a wide orientation angle in the horizontal direction, so that the light efficiency is applied to the edge type backlight unit. It also shows an excellent effect.

Description

Light emitting diode package, light emitting diode array and backlight unit using the same {LED package, LED package array and backlight unit}

The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package by using molding to improve the optical characteristics and productivity of the light emitting diode, and to narrow the direction angle in the short axis direction and to widen the direction angle in the long axis direction to the edge type backlight unit. A light emitting diode package that can be efficiently applied, and a light emitting diode array and a backlight unit using the same.

Since the liquid crystal display itself is non-luminescent, a backlight unit for irradiating light uniformly to the information display panel is required.

In general, a backlight unit employed in a flat panel display such as a liquid crystal display is classified into an edge type and an direct type backlight unit according to the position of the light source. Light emitting diodes (hereinafter referred to as 'LEDs'), which have the advantage of not requiring an inverter, are often used in place of CCFLs.

The edge type backlight unit has a structure in which an LED package as a light source is installed at the side of the light guide plate to irradiate light into the light guide plate, and the direct type backlight unit arranges the LED packages as a light source in the lower part of the diffuser plate in a line to provide a flat display device. It is a structure that irradiates light all over.

The backlight unit using the LED is packaged and used to package a plurality of LEDs in order to secure the luminance required once, and is packaged and arranged to show the optimum light efficiency with the minimum number of LEDs in consideration of economical efficiency. That is, the LED package can improve the distribution of light incident into the light guide plate according to its structure, because the light efficiency and directivity of the LED can be adjusted according to the shape and material of the package.

In relation to the light directing angle of the LED package, in the case of the direct type backlight unit, since the LED package as a light source is disposed under the diffuser plate, a wide directing angle is required.

In the case of the edge type backlight unit, as shown in FIG. 1, since the LED package 100, which is a light source, is disposed in the form of an array 110 on at least one side of the light guide plate 200, light is incident on the side of the light guide plate 200. A narrow directing angle is required in the vertical direction (x direction) with respect to the end face of the light guide plate 200, and a wide directing angle is required in the horizontal direction (y direction).

This is because the light emitted from the LED package 100 of the edge type backlight unit has a high directivity in the vertical direction, and a hot spot that shines brightly at a specific portion occurs in the light guide plate, and the direct angle in the horizontal direction is narrow. This is because dark spots that darken between the LED packages 100 occur.

In order to prevent such black spot phenomenon, the interval of the LED package 100 should be narrowly arranged. In this case, a large amount of the LED package 100 is required, which increases the manufacturing cost of the backlight unit.

On the other hand, the manufacturing of such an LED package is used a method such as injection or molding.

Although the LED package by the injection method has an advantage of excellent light efficiency, the productivity is low, and the thickness control of the LED package is difficult due to the limitation of the injection mold technology. On the other hand, the LED package by the molding method has the advantage of low production cost because it can be mass-produced, but it is applied to the edge type backlight unit requiring straightness because the light emitted from the front is reduced by the wide radiation angle. There is a disadvantage that the light efficiency is low.

In the LED package 100 according to the related art, as shown in FIG. 2, the reflector 20 is formed in the vertical (x) and horizontal (y) directions in a partition shape on the substrate 1 so that a part of the light is external. It is not emitted to the surface, but is totally reflected inside the package, which is disadvantageous to realize high brightness, and is emitted at a narrow orientation angle in the horizontal (y) direction. For this reason, when applied to a medium-large backlight, a large number of LED packages 100 are used, which increases the manufacturing cost. In addition, due to the limitations of the manufacturing process and injection mold technology, a lot of manufacturing time is required, which causes a drop in productivity.

Therefore, the present invention has been proposed to solve the above problems, and has an excellent advantage in terms of manufacturing cost by mass production using a molding method, narrowing the direction angle in the vertical direction, widen the direction angle in the horizontal direction An object of the present invention is to provide an LED package and a method of manufacturing the same, which are excellent in light efficiency and can be efficiently applied to an edge type backlight unit.

LED package of the present invention for achieving the above object is a substrate to which the LED chip is bonded; A reflector forming a partition wall shape surrounding the LED chip, the reflector including a main window for transmitting the light from the LED chip to the front and a sub window opening one side of the main window to transmit a part of the light laterally; And a molding part filled in the reflector to encapsulate the LED chip.

In the above-described configuration, the sub-window is formed in the edge of the main window or the contact edge with the substrate in a pair facing the partition wall of the reflector.

In addition, the LED array according to an embodiment of the present invention includes a substrate to which the LED chip is bonded;

A reflector forming a partition wall shape surrounding the LED chip, the reflector including a main window for transmitting the light from the LED chip to the front and a sub window opening one side of the main window to transmit a part of the light laterally; And a molding part filled in the reflector to encapsulate the LED chip. A plurality of light emitting diode packages may be coupled to a substrate.

In addition, the backlight unit according to the embodiment of the present invention; The LED array disposed on at least one side of the light guide plate to allow light to enter the light guide plate; And an optical film disposed on an upper side of the light guide plate.

The LED package according to the present invention exhibits an excellent effect in terms of manufacturing cost by mass production using a molding method, and has a narrow angle of orientation in the vertical direction and a wide angle of orientation in the horizontal direction, so that when applied to an edge type backlight unit, the light efficiency is increased. Also shows excellent effect.

In addition, when applied to a large backlight device by a wide orientation angle can reduce the number of LED packages can reduce the manufacturing cost.

1 is a perspective view illustrating a light source arrangement of an edge type backlight unit;
Figure 2 is a perspective view showing the structure of a LED package according to the prior art,
3 is a perspective view showing the structure of an LED package according to an embodiment of the present invention;
4 is a sectional view showing an AA structure of the LED package according to the embodiment of FIG.
5 is a view showing a manufacturing process of the LED package according to the embodiment of FIG.
6 is a perspective view showing the structure of an LED package according to another embodiment of the present invention;
7 is a cross-sectional view illustrating an AA structure of the LED package according to the embodiment of FIG. 6;
8 is a view showing a manufacturing process of the LED package according to the embodiment of FIG.
9 is a view showing a light directing angle of the LED package according to the embodiment of the present invention.

The technical problem achieved by the present invention and the practice of the present invention will be apparent from the preferred embodiments described below. The following examples are merely illustrated to illustrate the present invention and are not intended to limit the scope of the present invention. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a perspective view showing the structure of the LED package according to an embodiment of the present invention, Figure 4 is a cross-sectional view showing the AA structure of the LED package according to the embodiment of Figure 3, Figure 5 is an LED according to the embodiment of Figure 3 A diagram illustrating a manufacturing process of a package.

3 and 4, in the LED package 100 of the present invention, the LED chip 10 is seated on the substrate 1, and the partition 20 reflector 20 is formed to surround the LED chip 10. The molding unit 30 is filled in the reflector 20 to seal the LED chip 10. In particular, the reflector 20 of the LED package 100 according to the embodiment of the present invention is the main window 21 and the main window 21 for emitting light from the LED chip 10 to the front (z direction) One side is opened to form a sub window 22 that emits a part of the light in a horizontal direction (y direction).

Looking at this in detail, the above-described substrate 1 is a configuration for mounting the LED chip 10 on the upper side, connected to the PCB (not shown) to apply power to the LED chip 10.

The LED chip 10 described above serves as a light source of the backlight unit, and is a semiconductor device that converts electrical energy into light energy using a potential difference. To this end, since a power source having a relatively different potential must be applied to the LED chip 10, the substrate 1 is provided with a pair of lead plates having different potentials, and the LED chip 10 has a pair of lead plates. Are respectively connected by wire bonding 11.

In addition, although only one LED chip 10 is seated in the embodiment of the present invention, in order to improve the degree of integration, a pair of LED chips 10 may be seated and connected to lead plates having different potentials.

The above-described reflector 20 prevents light emitted from the LED chip 10 from being emitted in a vertical direction (x direction) with respect to the light guide plate (see 200 in FIG. 1), thereby improving luminance in a straight direction (z direction). It is a structure for improving. That is, the light is formed in a partition shape along the edge of the LED chip 10 to reflect the light emitted to the outside to increase the brightness. The reflector 20 is formed by a molding method using a resin material having excellent reflectivity. For example, the reflector 20 may be formed by a transfer molding method using white silicon.

In particular, the reflector 20 according to the embodiment of the present invention is configured such that a part of the light emitted from the LED chip 10 is emitted in the horizontal direction (y direction), that is, in the long axis direction of the LED package 100, It is emitted at a high directivity angle with respect to the optical surface horizontal direction. As a result, since the distance between the LED packages 100 arranged in the horizontal direction in the LED array 110 can be widened, the number of LED packages consumed can be reduced.

Specifically, the reflector 20 forms a partition wall shape surrounding the LED chip 10, and in front of the main window for improving luminance by emitting light from the LED chip 10 to the front (z direction). 21 is formed, and both sides of the main window 21 are formed with a sub window 22 for improving the directivity angle in the horizontal direction with respect to the light from the LED chip 10.

Here, the sub-windows 22 in the reflector 20 according to the embodiment of FIGS. 3 and 4 are arranged in pairs facing each other along the longitudinal direction of the long axis of the reflector 20 as shown in FIG. Is formed at the contact edge with That is, the sub window 22 is formed in such a manner that the lower side of the reflector 20 is opened in the horizontal direction, and the reflector 20 is formed on the upper portion of the sub window 22.

The above-described molding part 30 is for expressing light according to wavelengths of various regions generated in the LED chip 10, and is configured of a resin for displaying white light in order to be applied to a backlight unit according to an exemplary embodiment of the present invention. Preferably, it may be formed by a transfer molding method using a resin in which phosphors of white light are mixed. The molding part 30 covers and encapsulates both the LED chip 10 and the wire bonding 11 inside the reflector 20.

Due to the structure of the reflector 20 and the molding part 30, the light is reflected inside by the reflector 20 in the vertical direction of the LED package 100, and thus the light emitted from the front of the main window 21 is emitted. The brightness is improved, and a part of the light is emitted through the sub-window 22 in the horizontal direction, thereby improving the directivity angle in the long axis direction of the LED package 100.

In other words, by narrowing the directing angle in the vertical direction with respect to the light incident surface of the light guide plate to prevent hot spots and widening the horizontal angle to prevent dark spots and at the same time the gap between the LED package 100 It can be widened to reduce the number of LED packages required.

Looking at the manufacturing process of the LED package according to the embodiment of the present invention as described above with reference to Figure 5, as shown in Figure 5a, a method such as die bonding M x N LED chip 10 on the substrate (1) Arrange as

Thereafter, as illustrated in FIG. 5B, the molding part 30 is formed by primary molding the white light resin by a transfer molding method, wherein the step part forming a step at a boundary in the long axis direction based on the LED chip 10 ( 30a) is formed, and molding is performed such that the boundary portion 30b is formed by the interval in the short axis direction.

As illustrated in FIG. 5C, the white silicon is second-molded by a transfer molding method on the short axis direction boundary portion 30b of the molding portion 30 of the white light resin and the upper surface of the step portion 30a in the long axis direction to reflector. 20).

Each LED chip 10 encapsulated by primary and secondary molding is diced along the center of the stepped portion 30a and the boundary portion 30b to finally separate the individual LED package 100 as shown in FIG. 5D. Separate.

Here, the injection molding method, the compression molding molding method, or the like may be used as a method of molding the white light resin and the white silicon, and in order to improve productivity, it is preferable to use a transfer molding method.

3 and 4, the LED package manufactured as described above has molding portions 30 formed at the same height as the reflector 20 at both end portions of the short axis direction, and lower sides at both end portions of the long axis direction. The molding unit 30 is formed on the reflector 20, and the main window 21 is formed in front of the LED package 100, and the sub window 22 is formed at the edge of the substrate 1 in the long axis direction. Are respectively formed and light is emitted.

6 is a perspective view showing the structure of the LED package according to another embodiment of the present invention, Figure 7 is a cross-sectional view showing the AA structure of the LED package according to the embodiment of Figure 6, Figure 8 is according to the embodiment of Figure 6 A diagram illustrating a manufacturing process of an LED package.

As shown in FIGS. 6 and 7, in the LED package according to another exemplary embodiment, the reflector 20 and the molding part 30 in the vertical direction (x direction) and the LED chip 10 form the same structure. However, the end portion of the horizontal direction (y direction) forms a structure in which the reflector 20 is molded on the lower side and the molding part 30 is molded on the upper side. That is, the sub-window 22 for emitting light in the horizontal direction is formed at the edge of the main window 21.

Even in the above structure, the light emitted in the vertical direction is reflected inwardly by the reflector 20 to increase the luminance by a narrow angle of directivity toward the front (z direction) of the LED package 100, and the sub-window in the horizontal direction. Light is emitted through (22), indicating a wide angle of inclination.

Referring to FIG. 8, a process of manufacturing the LED package having the above structure is illustrated. Referring to FIG. 8A, M × N LED chips 10 are arranged on the substrate 1 by die bonding or the like.

Thereafter, as shown in FIG. 8B, the reflector 20 is formed by primary molding white silicon by a transfer molding method, wherein the stepped portion 20a forms a step at the boundary of the long axis direction with respect to the LED chip 10. ) Is formed and molded so that the connecting portion 20b is formed in the short axis direction.

As shown in FIG. 8C, the molding unit 30 is formed by secondary molding of a white light resin by a transfer molding method on the inside of the reflector 30 of the white silicon and the upper surface of the stepped portion 20a in the long axis direction.

Each LED chip 10 encapsulated by the primary and secondary molding is diced along the center of the step portion 20a and the connection portion 20b to finally separate the individual LED packages as shown in FIG. 8D.

As shown in FIGS. 6 and 7, the LED package manufactured by the above process has reflectors 20 formed at the same height as the molding part 30 at both end portions of the short axis direction, and at the lower ends at both end portions of the long axis direction. The reflector 20 is formed in the upper part, and the molding part 20 is formed on the upper side thereof. Thus, the main window 21 is formed in front of the LED package 100, and the sub window 22 is connected to the main window 21 in the long axis direction. Are respectively formed and light is emitted.

In the LED package having the above structure according to the embodiment of the present invention, light is emitted at a wide direction angle in the horizontal direction through the sub-window.

That is, as shown in FIG. 9, the directivity angle in the horizontal direction of the LED package according to the related art is less than about 120 °, but the directivity angle in the horizontal direction of the LED package according to the embodiment of the present invention is 130 ° or more. Indicates.

As shown in FIG. 1, the LED package 100 having the above structure is disposed on at least one side of the light guide plate 20 in the form of an LED array 110 coupled to a plurality of PCBs, and a reflecting plate is disposed below the light guide plate. Not shown), and various optical films (not shown) are disposed above the light guide plate 20 to form a side-illumination backlight unit.

As described above, when the LED package according to the embodiment of the present invention is employed in a large backlight unit, a relatively small number of LED packages are used as compared to the conventional technology while maintaining the appearance quality, thereby reducing manufacturing costs. In addition, since the reflecting and molding parts are formed by the transfer molding method, the productivity can be improved.

Although the embodiments of the present invention have been described with reference to the present invention, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

1: substrate
10: LED chip
11: wire bonding
20: reflector
30: molding part
100: LED package

Claims (4)

A substrate on which the LED chip is bonded;
A reflector forming a partition wall shape surrounding the LED chip, the reflector including a main window for transmitting the light from the LED chip to the front and a sub window opening one side of the main window to transmit a part of the light laterally; And
And a molding part filled in the reflector to encapsulate the LED chip.
The method of claim 1,
The sub-window package is formed in the edge of the main window or the contact edge of the substrate in a pair facing the partition wall of the reflector.
A substrate on which the LED chip is bonded;
A reflector forming a partition wall shape surrounding the LED chip, the reflector including a main window for transmitting the light from the LED chip to the front and a sub window opening one side of the main window to transmit a part of the light laterally; And
And a molding unit filled in the reflector to encapsulate the LED chip, wherein the plurality of light emitting diode packages are coupled to the substrate.
Light guide plate;
A light emitting diode array of claim 3, disposed on at least one side of the light guide plate to inject light into the light guide plate; And
And an optical film disposed on an upper side of the light guide plate.
KR1020100002844A 2010-01-12 2010-01-12 Led package, led package array and backlight unit KR101037507B1 (en)

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Application Number Priority Date Filing Date Title
KR1020100002844A KR101037507B1 (en) 2010-01-12 2010-01-12 Led package, led package array and backlight unit

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190040946A (en) * 2019-04-08 2019-04-19 엘지디스플레이 주식회사 Method of fabricating led package and liquid crystal display device having the same
KR20210132267A (en) 2020-04-24 2021-11-04 희성전자 주식회사 Backlight device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100638868B1 (en) 2005-06-20 2006-10-27 삼성전기주식회사 Led package with metal reflection layer and method of manufacturing the same
KR20060125023A (en) * 2005-06-01 2006-12-06 삼성전기주식회사 Side emitting led package and method of manufacturing the same
KR20080061763A (en) * 2006-12-28 2008-07-03 주식회사 우영 Led back light unit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060125023A (en) * 2005-06-01 2006-12-06 삼성전기주식회사 Side emitting led package and method of manufacturing the same
KR100638868B1 (en) 2005-06-20 2006-10-27 삼성전기주식회사 Led package with metal reflection layer and method of manufacturing the same
KR20080061763A (en) * 2006-12-28 2008-07-03 주식회사 우영 Led back light unit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190040946A (en) * 2019-04-08 2019-04-19 엘지디스플레이 주식회사 Method of fabricating led package and liquid crystal display device having the same
KR102071206B1 (en) * 2019-04-08 2020-01-30 엘지디스플레이 주식회사 Method of fabricating led package and liquid crystal display device having the same
KR20210132267A (en) 2020-04-24 2021-11-04 희성전자 주식회사 Backlight device

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