KR101035882B1 - Laminated ceramic electronic component - Google Patents

Laminated ceramic electronic component Download PDF

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KR101035882B1
KR101035882B1 KR1020080050233A KR20080050233A KR101035882B1 KR 101035882 B1 KR101035882 B1 KR 101035882B1 KR 1020080050233 A KR1020080050233 A KR 1020080050233A KR 20080050233 A KR20080050233 A KR 20080050233A KR 101035882 B1 KR101035882 B1 KR 101035882B1
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ceramic
mg
sintered body
ceramic sintered
side
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KR1020080050233A
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Korean (ko)
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KR20080108012A (en
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코지 스즈키
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가부시키가이샤 무라타 세이사쿠쇼
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Priority to JPJP-P-2007-00153110 priority Critical
Priority to JP2007153110 priority
Priority to JP2008114310A priority patent/JP4591537B2/en
Priority to JPJP-P-2008-00114310 priority
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Abstract

An object of the present invention is to provide a multilayer ceramic electronic component having high reliability against moisture resistance even when miniaturized.
To this end, between the side of the first internal electrode 1 and the second internal electrode 2 of the ceramic sintered body 10 and the first and second side surfaces 21 and 22 of the ceramic sintered body and the side of the effective layer part 3a And Mg having a higher Mg concentration than the effective layer portion of a region adjacent to at least the first and second internal electrodes 1 and 2 among the side gap portions G S existing between the first and second side surfaces of the ceramic sintered body. Let it be the rich region M R.
In addition, the whole side-side gap part is made into Mg rich area | region.
The Mg-rich region is a region adjacent to at least the first and second internal electrodes among the end face gap portions G E existing between the end of the effective layer portion and the first or second end faces 11 and 12 of the ceramic sintered body. It is done.
The Mg rich region contains more Mg at a ratio of 0.5 to 1.0 mol% than the effective layer portion.
Laminated ceramic electronic components

Description

Multilayer Ceramic Electronic Components {LAMINATED CERAMIC ELECTRONIC COMPONENT}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to ceramic electronic components, and more particularly, to a multilayer ceramic electronic component formed by laminating a ceramic layer and internal electrodes for capacitance formation.

In recent years, with the miniaturization of electronic devices such as mobile phones and cellular phone music players, miniaturization of electronic components to be mounted is rapidly progressing. For example, in the chip type multilayer ceramic electronic components represented by the chip type multilayer ceramic capacitors, thinning of the ceramic layer is progressing in order to reduce the chip size while securing predetermined characteristics.

As the ceramic layer is thinned, the number of laminated layers of the ceramic layer also tends to increase. In general, a multilayer ceramic electronic component has a structure in which a ceramic layer and an internal electrode are alternately stacked, but the internal electrode does not cover the entire ceramic layer so that the internal electrode is not exposed from the side of the chip, but slightly from the peripheral edge of the ceramic layer. Since only the inner position of the recessed side is formed, a step is generated between the internal electrode and the ceramic layer. In addition, when the number of laminated layers of the ceramic layer is increased, structural defects such as delamination caused by this step are likely to occur.

As a solution to this problem, for example, a method of printing an internal electrode pattern on a ceramic green sheet, then printing a ceramic paste on a portion where the internal electrode is not printed, and absorbing the step by the ceramic paste, It is proposed (refer patent document 1).

However, in the above method, even though the step between the ceramic layer and the internal electrode can be absorbed, a minute gap is generated between the inner electrode end and the ceramic layer due to the difference in the sintering shrinkage behavior of the internal electrode and the ceramic layer during firing. Therefore, there is a problem that moisture such as moisture penetrates into this gap and causes poor moisture resistance.

In addition, it is a method of reducing the difference in sintering shrinkage behavior of the addition of SiO 2 in the ceramic paste for the absorption step, the ceramic and the internal electrodes proposed as a technology related to the above-described Patent Document 1 (see Patent Document 2).

However, even in the method of this patent document 2, it is very difficult to completely match the sintering shrinkage behavior of both a ceramic and an internal electrode, and the situation of the moisture resistance defect resulting from the said gap is not necessarily fully solved.

In addition, since the step absorbing portion is close to the outer surface of the original chip, heat is easily transferred in the firing process, is easy to sinter, and the sintering temperature is further lowered by the addition of SiO 2 , and the side gap portion is under-sintered, There is a problem that it is easy to cause structural defects and a decrease in strength of the main body.

In addition, as a method of solving the problem of step difference, a method of adding Cu to the step absorbing ceramic paste and alloying Ni as the internal electrode material and Cu in the ceramic paste to improve the bonding between the internal electrode and the step absorbing layer is proposed. (Refer patent document 3).

However, in the method of this Patent Document 3, since the alloy of Ni and Cu easily generates a redox reaction by a firing atmosphere or the like, a volume reduction caused by the reduction reaction occurs after the volume expansion caused by the oxidation reaction, resulting in a gap in the stepped portion. Since this is generated, it is difficult to secure enough reliability for moisture resistance.

[Patent Document 1] Japanese Patent Application Laid-open No. 56-94719

[Patent Document 2] Japanese Patent Application Laid-Open No. 2004-96010

[Patent Document 3] Japanese Patent Laid-Open No. 2005-101301

This invention solves the said subject and an object of this invention is to provide the laminated ceramic electronic component with high reliability with respect to moisture resistance, even if it miniaturized.

In order to solve the above problems, the multilayer ceramic electronic component of the present invention (claim 1),

A ceramic sintered body formed by stacking a plurality of ceramic layers and having a first side surface and a second side surface facing each other, and a first cross section and a second cross section facing each other;

A first internal electrode formed in the ceramic sintered body and containing Ni drawn out in the first end surface;

A second internal electrode which is formed inside the ceramic sintered body and faces the first internal electrode via the specific ceramic layer and contains Ni drawn out in the second end surface;

A first external terminal electrode formed on the first end surface of the ceramic sintered body and electrically connected to the first internal electrode;

A multilayer ceramic electronic component having a second external terminal electrode formed on said second end face of said ceramic sintered body and electrically connected to said second internal electrode and connected to a potential different from said first external terminal electrode.

The ceramic sintered body,

An effective layer portion interposed between the first internal electrode and the second internal electrode and contributing to the formation of a capacitance among the ceramic layers;

A side-side gap portion existing between the side portions of the first and second internal electrodes and the first and second side surfaces of the ceramic sintered body and between the side portions of the effective layer portion and the first and second side surfaces of the ceramic sintered body,

At least the region adjacent to the first and second internal electrodes in the side gap portion is an Mg rich region having a higher Mg concentration than the effective layer portion.

Moreover, in this invention, it is preferable that the area | region located in the same height as each of the said 1st, 2nd internal electrode among the said side gap part becomes the said Mg rich area | region.

Moreover, in this invention, it is also possible to make whole the said side side gap part into the said Mg rich area | region.

In the present invention, the ceramic sintered body is formed between the end portions of the first and second internal electrodes and the first and second end faces of the ceramic sintered body, and between the end portions of the effective layer portion and the first or second end faces of the ceramic sintered body. Including a cross-sectional side gap portion present in,

It is preferable that at least the area | region adjacent to the said 1st, 2nd internal electrode among the said cross-sectional side gap parts becomes an Mg rich area | region where Mg density | concentration is high compared with the said effective layer part.

Further, in the present invention, at least one of the vertical projection area of the side gap portion and the vertical projection area of the cross section side gap portion of the ceramic layer that is outside of the inner electrode of the outermost layer among the first and second internal electrodes is the effective layer part. It is also possible to set it as Mg rich area | region which has a high Mg density compared with.

In addition, in this invention, 0.5-1.0 mol of Mg addition ratio with respect to 100 mol% of main components of the ceramic material which comprises the said Mg rich area | region is compared with Mg addition ratio with respect to 100 mol% of the main components of the ceramic material which comprises the said effective layer part. It is preferable to increase the%.

Moreover, in this invention, it is also possible to set it as the structure which has the density | concentration gradient which Mg density | concentration falls to the inside from the outer side of a ceramic sintered compact in the said Mg rich area | region.

(Effects of the Invention)

As described above, the multilayer ceramic electronic component of the present invention (claim 1) includes a ceramic sintered body, first and second internal electrodes formed inside the ceramic sintered body, and a first external terminal electrode electrically connected to the first internal electrode; A multilayer ceramic electronic component having a second external terminal electrode electrically connected to a second internal electrode, comprising: a side between a first internal electrode and a second internal electrode of the ceramic sintered body and a first and second side surface of the ceramic sintered body And a region adjacent to at least the first and second internal electrodes among the side gap portions existing between the side portions of the effective layer portion and the first and second side surfaces of the ceramic sintered body as Mg rich regions having a higher Mg concentration than the effective layer portion. Therefore, an oxidizing compound of Ni, which is a metal constituting the internal electrode, and Mg, which is a metal element derived from ceramic, is formed at the boundary between the internal electrode and the side gap portion, and the internal electrode and the side are formed. As soon side filling gap is the gap of the boundary portion by the screen oxide compound as well, the internal electrodes and the side surface side gap portion is improved in moisture resistance are bonded by an oxide compound. In addition, since the filling effect of the gap between the boundary between the inner electrode and the side gap portion is increased by the volume expansion caused by the formation of the oxidizing compound, a significant improvement in moisture resistance is also expected from this point.

In the present invention, the Mg rich region means that "the Mg concentration is higher than the effective layer portion" means that the Mg rich region contains Mg at a higher ratio than the Mg content of the effective layer portion when the effective layer portion contains Mg. When the effective layer part does not contain Mg, it is a concept which means that it contains Mg of the grade which is significant enough to produce | generate the oxidation compound of Ni and Mg which are metals which comprise an internal electrode.

In addition, when using MgO added to BaTiO 3 etc. as a reducing-resistant ceramic material, it is a requirement that Mg rich area | region contains Mg with the content rate moderately higher than Mg derived from Mg0 of this effective layer part.

In the multilayer ceramic electronic component of the present invention, the side portion of the side gap portion, which is located at the same height as each of the first and second internal electrodes, that is, the side edge portion of the internal electrode is set to the Mg rich region, so that the peripheral portion and the side surface of the internal electrode are different. It is possible to produce an oxidized compound of Ni, which is a metal constituting the internal electrode, and Mg, which is a metal element derived from a ceramic, at the boundary portion of the gap to improve moisture resistance.

Moreover, when the said side gap part whole is made into Mg rich area | region, it becomes possible to prevent the deterioration of moisture resistance resulting from the clearance of an internal electrode and a side gap part, and to obtain the laminated ceramic electronic component which was excellent in moisture resistance more reliably.

In addition, the penetration of moisture from the cross section by setting the region adjacent to at least the first and second internal electrodes as the Mg rich region among the cross section side gap portions existing between the end of the effective layer portion and the first or second cross section of the ceramic sintered body. Suppression and prevention can further improve moisture resistance.

In addition, since the external terminal electrode is formed in the cross section, the effect of suppressing the ingress of moisture is obtained by the external terminal electrode. Therefore, it is not necessary to form the Mg rich region in particular on the cross section side. Can be further increased.

In the present invention, at least one of the vertical projection area of the side-side gap portion and the vertical projection area of the cross-sectional side gap portion of the ceramic layer that is outside of the internal electrodes disposed on the outermost layers of the first and second internal electrodes is larger than the effective layer portion. It is also possible to set it as Mg rich region with high Mg concentration, and in that case, the laminated ceramic electronic component excellent in moisture resistance can be obtained reliably.

In addition, the moisture content can be reliably increased by increasing the amount of Mg added to 100 mol% of the main component of the ceramic material constituting the Mg rich region by 0.5 to 1.0 mol% as compared to the amount of Mg added to 100 mol% of the main component of the ceramic material constituting the effective layer portion. It is possible to improve the reliability and to make the present invention more effective.

Moreover, in this invention, even when it is set as the structure which has the density | concentration gradient which Mg concentration falls from the outer side of the ceramic sintered compact in the Mg rich area | region, the laminated ceramic electronic component excellent in moisture resistance can be obtained.

As a method of having a concentration gradient in which the Mg concentration decreases from the outside to the inside of the ceramic sintered body, a method of immersing the raw chips before firing in a binder containing Mg, impregnating Mg, and then firing the raw chips Is illustrated.

EMBODIMENT OF THE INVENTION Below, embodiment of this invention is shown, and the feature of this invention is demonstrated in detail.

Embodiment 1

1 is a perspective view showing the structure of a multilayer ceramic electronic component (in this embodiment, a multilayer ceramic capacitor) according to one embodiment of the present invention, FIG. 2 is a sectional view taken along the line AA of FIG. 1, and FIG. 4 is a view for explaining the configuration of a multilayer ceramic capacitor according to Embodiment 1 of the present invention.

As shown in FIGS. 1-4, the multilayer ceramic capacitor of this Embodiment 1 is the ceramic sintered compact 10 in which the several ceramic layer 3 was laminated | stacked, and the 1st and 1st arrange | positioned so that it may take out to the other side alternately in the inside. 2 Internal electrodes 1 and 2 and conductive parts of the first and second internal electrodes 1 and 2 are connected to the first end face 11 and the second end face 12 of the ceramic sintered body 10 facing each other. And first and second external terminal electrodes 31 and 32 arranged so as to be disposed.

In more detail, the ceramic sintered body 10 includes a first side face 21 and a second side face 22 (FIGS. 1 and 3) facing each other, and a first end face 11 and a second end face facing each other ( 12) (FIG. 1, FIG. 2), and as shown in FIG. 2, FIG. 3 inside, the 1st internal electrode 1 containing Ni drawn out to the 1st end surface 11, and predetermined | prescribed ceramic A layer (which is a dielectric layer that contributes to capacitance formation) 3 is disposed inside the ceramic sintered body 10 so as to face the first internal electrode 1 and contains Ni drawn out in the second end surface 12. The second internal electrode 2 is arranged.

Moreover, as shown to FIG. 1, FIG. 2, the 1st external terminal electrode 31 electrically connected to the 1st internal electrode 1 is arrange | positioned at the 1st end surface 11 of the ceramic sintered compact 10, On the second end face 12 of the ceramic sintered body 10, a second external terminal electrode 32 is arranged which is electrically connected to the second internal electrode 2 and connected to a potential different from that of the first external terminal electrode 31. It is.

In this multilayer ceramic capacitor, as shown in FIGS. 3 and 4, the ceramic sintered body 10 is sandwiched between the first internal electrodes 1 and the second internal electrodes 2 in the ceramic layer 3. Between the effective layer portion 3a contributing to the formation of the capacitance, the sides of the first internal electrode 1 and the second internal electrode 2 and the first and second side surfaces 21 and 22 of the ceramic sintered body 10 and the effective The side gap portion G S existing between the side of the layer portion 3a and the first and second side surfaces 21 and 22 of the ceramic sintered body 10, the first internal electrode 1 and the second internal electrode ( Between the end of 2) and the first and second end faces 11 and 12 of the ceramic sintered body 10 and between the end of the effective layer portion 3a and the first or second end faces 11 and 12 of the ceramic sintered body 10. The cross-sectional side gap part G E which exists in is included.

In addition, as shown in FIG. 3, the ceramic sintered body 10 is an outer layer which is a ceramic layer which does not contribute to the formation of a capacitance outside the innermost electrode 1 (2) of the uppermost layer and the inner electrode {1 (2) of the lowermost layer. (3b) is provided.

The region GS1 (FIGS. 3 and 4) and G E1 (which are adjacent to the first and second internal electrodes 1 and 2 of the side gap portion G S and the end surface side gap portion G E ). Fig. 4) is an Mg rich region M R having a higher Mg concentration than the effective layer portion 3a, and Mg is distributed almost uniformly throughout the gap portion.

In addition, in this Embodiment 1, although Mg is distributed substantially uniformly over the whole gap part, Mg does not necessarily need to be distributed uniformly over the whole gap part, and Mg should just exist in the vicinity of the internal electrode of a gap part. . As in the case of the first embodiment, Mg may be distributed throughout the gap portion so as to reach the side surface of the ceramic sintered body, or may be distributed so as to segregate in the vicinity of the internal electrode of the gap portion.

Further, in the present embodiment the first ceramic constituting the effective layer portion (3a) and is used materials which do not contain Mg, as the material constituting the Mg-rich region (M R) as the ceramic material constituting the effective layer portion (3a) As a material, the ceramic material which added Mg in 0.5-1.0 mol% with respect to 100 mol% of main components is used.

In the multilayer ceramic capacitor according to the first embodiment, as described above, the region G adjacent to the first and second internal electrodes 1 and 2 among the side gap portions G S and the end face gap portions G E. Since S1 and G E1 are Mg rich regions M R having a higher Mg concentration than the effective layer portion 3a, the regions G S1 made of the first and second internal electrodes 1 and 2 and ceramics adjacent thereto are provided. And an oxidizing compound of Ni, which is a metal constituting the internal electrodes 1, 2, and Mg, which is a metal element derived from ceramic, is formed at the boundary of G E1 , and the internal electrodes 1, 2 and the regions G S1 and G are formed. The gap C (see FIG. 5) at the boundary of E1 is filled by this oxidizing compound, and the internal electrodes 1 and 2 and the regions G S1 and G E1 are joined by this oxidizing compound, so that In the case of having a moisture resistance and miniaturization, a multilayer ceramic capacitor having high reliability against moisture resistance can be obtained.

Next, the manufacturing method of this multilayer ceramic capacitor is demonstrated.

(1) First, a ceramic green sheet containing a dielectric ceramic as a main component, a conductive paste for an internal electrode containing Ni powder as a conductive material, and a conductive paste for an external terminal electrode are prepared.

Although a binder and a solvent are contained in a ceramic green sheet and various electroconductive pastes, a well-known organic binder and an organic solvent can be used.

(2) Then, as shown in Fig. 6A, the conductive paste 42 is printed on the ceramic green sheet 41 in an island shape by, for example, screen printing and the internal electrode pattern 42p. ).

(3) And as shown in FIG.6 (b), the side side gap part G S and the cross section side gap part G E in the part in which the internal electrode pattern 42p on the ceramic green sheet 41 is not formed. ) Is printed.

As the ceramic material constituting the ceramic paste, a ceramic material having a high Mg content is used as compared with the ceramic material constituting the underlying ceramic green sheet 41.

In addition, when dispersing Mg in a gap part and distributing it, it is possible to use the method of preparing several types of ceramic paste from which the content rate of Mg differs, and printing sequentially and adjacently, for example.

(4) Next, the ceramic green sheet 41 shown in FIG. 6B is laminated while being alternately displaced by a predetermined distance in the longitudinal direction to produce a mother block. In addition, the outermost green sheet which does not have an internal electrode pattern is laminated | stacked on the outermost layer.

In addition, a mother block is crimped | bonded to a lamination direction by means, such as a hydrostatic press, as needed.

(5) Next, the mother block is cut to a predetermined size along a predetermined cutting line L to cut raw chips (see FIG. 6C). 6C, one ceramic green sheet is taken out and the cutting line L is shown for convenience. If necessary, the raw chips may be polished by a method such as barrel polishing to round the ridges and corners of the raw chips.

(6) Next, the raw chip (raw ceramic laminate) is fired. It is preferable that baking temperature is 900-1300 degreeC. The firing atmosphere is appropriately divided into atmospheres such as air and N 2 .

(7) Next, conductive paste is applied to both end faces of the fired ceramic laminate, and baked to form external terminal electrodes. It is preferable that baking temperature is 700-900 degreeC. Baking atmosphere is appropriately divided into the atmosphere, such as atmosphere, N 2 .

If necessary, a plating film is formed on the surface of the external terminal electrode for the purpose of improving the electrical connection reliability or the solderability.

Thereby, the multilayer ceramic capacitor which has a structure as shown to FIGS. 1-4 is obtained.

In the case of the multilayer ceramic capacitor of the first embodiment, a material having a higher Mg content than that of the material constituting the ceramic green sheet 1 is used as the ceramic paste for the side gap portion G S and the cross section side gap portion G E. As shown in FIG.3 and FIG.4, of Mg contained in the area | region located at the same height position as the 1st and 2nd internal electrodes 1 and 2 among the side gap part G S and the cross section side gap part G E. The concentration is higher than the concentration of Mg contained in other ceramic portions (such as the active layer portion 3a), and the Ni constituting the internal electrodes 1, 2, and the oxidized compound of Mg, When the gap C (see FIG. 5) of the boundary of the regions G S1 and G E1 is filled, and the internal electrodes 1, 2 and the regions G S1 and G E1 are joined by this oxidizing compound, A multilayer ceramic capacitor having high moisture resistance to the door is obtained.

Further, since some diffusion of the constituents may occur between the ceramic layers, the regions G S1 , which are the Mg rich regions M R in the side gap portion G S and the cross section side gap portion G E , are separated from each other. The portion sandwiched by G E1 ) may also be slightly higher in Mg concentration.

In addition, Mg in the ceramic may exist in the form of Mg0 or the like, but may also exist in the form of compounds such as other Mg oxides. However, Mg as a glass component is not preferable. This side-side gap (G S), after increasing the amount of glass in the cross-section-side gap (G E) the sintering temperature of the side-side gap (G S), cross-section-side gap (G E) is lowered, the outer surface of the original chip side-side gap portion positioned in the vicinity (G S), cross-section-side gap (G E), since heat tends to be passed to the side-side gap (G S), cross-section-side gap (G E), and under-condensation, the structure of the capacitor body It may cause a defect or a fall in strength.

As described above, the Mg content rate of the Mg rich region M R is preferably 0.5 to 1.0 mol% more than the effective layer portion 3a as the Mg addition ratio to 100 mol% of the main component of the ceramic material. Do.

As regards the configuration of the present invention, it is also considered to increase the Mg concentration contained in the entire ceramic constituting the capacitor body, but there is a possibility that the desired capacitor characteristics (dielectric constant, temperature characteristic, etc.) may not be obtained if the effective layer portion is changed in composition. In view of the present invention, it is preferable to contain a large amount of Mg by the side gap portion G S and the end surface gap portion G E.

Further, in the multilayer ceramic electronic device of the present invention as the ceramic layer BaTiO 3, CaTiO 3, SrTiO 3 , can use the dielectric ceramics as a main component, such as CaZrO 3. Moreover, you may use what added subcomponents, such as a Mn compound, a Fe compound, a Cr compound, a Co compound, and a Ni compound, to these main components.

In the multilayer ceramic electronic component of the present invention, the thickness of the ceramic layer is preferably 1 to 10 µm.

In addition, in this invention, it is a requirement that an internal electrode contains Ni. Specifically, it is required to contain Ni compounds such as Ni, NiO, or Ni alloys as metals. It is preferable that the thickness of an internal electrode is 1-10 micrometers.

In addition, in this invention, it is preferable to make an external terminal electrode into the multiple layer structure provided with a base electrode and the plating layer formed on it. The external terminal electrode is usually formed so as to enter the main surface and the side surface from the end face, but may be formed at least in the end face.

Metals, such as Cu, Ni, Ag, Ag-Pd, can be used as a base electrode which comprises an external terminal electrode. It is preferable that a base electrode contains glass.

As the plating layer of the external terminal electrode, when the multilayer ceramic electronic component is solder mounted, it is preferable to adopt a two-layer structure of a Ni plating layer and a Sn plating layer. In the case of a multilayer ceramic electronic component mounted by a conductive adhesive or wire bonding, it is preferable to adopt a two-layer structure of a Ni plating layer and an Au plating layer. In addition, when a capacitor is embed | buried in a resin substrate, it is preferable to comprise an outermost layer by a Cu plating layer. The plating layer does not necessarily need to be two layers, but may be one layer or three or more layers. Moreover, it is preferable that the thickness per layer of a plating layer is 1-10 micrometers. Moreover, the resin layer for stress relaxation may be formed between the base electrode and the plating layer.

In addition, the present invention focuses on the reaction between Ni contained in the internal electrode and Mg contained in the ceramic, and the present invention can be configured as a unique structure of the present invention. The present invention can also be applied to multilayer thermistors, multilayer inductors, and the like.

Embodiment 2

FIG. 7 is a cross-sectional view showing a main part structure of a multilayer ceramic electronic component (lamination ceramic capacitor in this embodiment) according to another embodiment (second embodiment) of the present invention, which corresponds to the sectional view taken along line BB of FIG. 8 is a diagram for explaining the configuration of a multilayer ceramic capacitor according to Embodiment 2 of the present invention.

In the multilayer ceramic capacitor according to the second embodiment, as shown in Figs. 7 and 8, the side gap portion G S is an Mg rich region M R , and the outer side of the inner electrode of the outermost layer of the inner electrodes is located outside. The vertical projection region 13b of the side gap portion G S of the ceramic layer (outer layer) 3b also becomes Mg rich region M R.

In the multilayer ceramic capacitor of the second embodiment, the Mg rich region M R has a concentration gradient in which the Mg concentration decreases from the outside to the inside of the ceramic sintered body.

That is, the multilayer ceramic capacitor of the second embodiment has the Mg rich region (also referred to as the vertical projection region 13b of the side gap portion G S of the ceramic layer (outer layer) 3b of the outermost layer of the inner electrode). At the point where M R ) is formed, the Mg rich region is not formed at the cross-sectional side gap portion G E , and the Mg rich region M R , the concentration at which the Mg concentration decreases from the outside to the inside of the ceramic sintered body. In the case of having a gradient, the configuration is different from that of the first embodiment.

In addition, the other structure is the same as that of the said Embodiment 1.

For the configuration of the second embodiment of the side-side gap to (G S) and the side-side gap (G S) perpendicular to the projection area (13b) is Mg, and is a rich region, the gap between the side and the ceramic layers of the internal electrodes of Ni It is filled with the oxidized compound of Mg and Mg, and since the side of the internal electrode and the ceramic layer are more reliably bonded to the oxidized compound of Ni and Mg, it has high moisture resistance and miniaturization as in the case of the first embodiment. Even in this case, a multilayer ceramic capacitor having high reliability against moisture resistance can be obtained.

Next, the manufacturing method of this multilayer ceramic capacitor is demonstrated.

In manufacturing the multilayer ceramic capacitor of the second embodiment, in the step (3) in the method of manufacturing the multilayer ceramic capacitor of the first embodiment, the peripheral region of the internal electrode pattern on the ceramic green sheet (the internal electrode pattern is not formed) The ceramic paste using the same ceramic material as the ceramic material which comprises the ceramic green sheet used as the base) is apply | coated to the part).

In the same manner as in the first embodiment, the ceramic green sheet is laminated while being alternately displaced by a predetermined distance in the longitudinal direction to produce a mother block. In addition, the outermost green sheet which does not have an internal electrode pattern is laminated | stacked on the outermost layer.

And a mother block is crimped | bonded to a lamination direction by means, such as a hydrostatic press as needed.

Thereafter, the mother chip is cut to a predetermined size along a predetermined cutting line in the same manner as in the first embodiment, and the raw chips are cut out. If necessary, the raw chips may be polished by a method such as barrel polishing to round the ridges and corners of the raw chips.

And both sides of the obtained raw chip are immersed in the organic binder solution containing MgO in 1 mol / L ratio, and the raw chip is impregnated with Mg component, and it dries.

Thereafter, firing and formation of the external terminal electrode are performed in the same manner as in the first embodiment, so that the Mg concentration in the Mg rich region M R of the ceramic sintered body 10 as shown in Figs. 7 and 8 is shown. A multilayer ceramic capacitor having a concentration gradient lowering from the outside of the ceramic sintered body 10 toward the inside is obtained.

In the second embodiment, the pair of side surfaces of the raw chips are immersed in the organic binder solution containing MgO, but in some cases, the whole chips may be immersed in the organic binder solution containing Mg0.

Embodiment 3

FIG. 9 is a cross-sectional view showing the configuration of main parts of a multilayer ceramic electronic component (multilayer ceramic capacitor in this embodiment) according to another embodiment (Embodiment 3) of the present invention, which corresponds to the sectional view taken along line BB of FIG. 10 is a diagram for explaining the configuration of a multilayer ceramic capacitor according to Embodiment 3 of the present invention.

In the multilayer ceramic capacitor according to the third embodiment, as shown in Figs. 9 and 10, the Mg rich region M R is formed in the side gap portion G S , and the outer side of the inner electrode of the outermost layer of the internal electrodes is formed. The Mg rich region M R is also formed in the vertical projection region 13b of the side gap portion G S of the ceramic layer (outer layer) 3b of the ceramic layer.

On the other hand, as shown in FIG. 10, the Mg rich region is not formed in the cross-sectional side gap portion G E.

That is, the multilayer ceramic capacitor according to the third embodiment has the Mg rich region (also referred to as the vertical projection region 13b of the side gap portion G S of the ceramic layer (outer layer) 3b of the outermost layer among the inner electrodes). In the point where M R ) is formed and the Mg rich region is not formed in the cross section side gap portion G E , the configuration is different from that in the first embodiment.

The other configuration is the same as that of the first embodiment. In addition, in this Embodiment 3, although Mg is distributed substantially uniformly over the whole gap part, Mg does not need to be distributed uniformly over the whole gap part, and Mg should just exist in the inner electrode vicinity of a gap part. In addition, as in the case of Embodiment 3, Mg may be distributed in the whole gap part so that it may reach to the side surface of a ceramic sintered compact, and may exist in the form which segregates in the internal electrode vicinity part of a gap part.

Even in the case of the configuration of the third embodiment, a multilayer ceramic capacitor having high moisture resistance and high reliability against moisture resistance can be obtained even when downsized.

Next, the manufacturing method of this multilayer ceramic capacitor is demonstrated.

As shown in Fig. 11A, the conductive paste 42 is printed on the ceramic green sheet 41 in a band shape by, for example, screen printing to form an internal electrode pattern 42p.

Next, the ceramic green sheet 41 shown in Fig. 11A is laminated while being alternately displaced by a predetermined distance in the width direction to produce a mother block. In addition, the outermost green sheet which does not have an internal electrode pattern is laminated | stacked on the outermost layer.

In addition, a mother block is crimped | bonded to a lamination direction by means, such as a hydrostatic press, as needed.

Then, the mother block is cut to a predetermined size along a predetermined cutting line L to cut raw chips (see FIG. 11B). In addition, in FIG.11 (b), one ceramic green sheet is taken out and the cutting line L is shown for convenience.

This raw chip has a different structure from the raw chips of Embodiments 1 and 2 in that the internal electrode pattern is exposed not only on one end face but also on both sides.

Next, on both sides of the raw chip, a ceramic paste using a ceramic having a higher Mg content than that of the ceramic constituting the ceramic green sheet is applied to a predetermined thickness and dried.

In addition, when distributing Mg in a gap part and distributing it, for example, it is possible to use the method of preparing several types of ceramic paste from which Mg content rate differs, and apply | coating sequentially, drying, and apply | coating over and over.

As a result, Mg rich regions corresponding to the side gap portions are formed on both sides of the raw chip (see FIG. 9).

In the case of this method, the Mg rich region is also formed in the vertical projection region of the cross-sectional side gap portion of the ceramic layer that is outside the inner electrode of the outermost layer among the inner electrodes.

Thereafter, if necessary, the raw chips may be polished by a method such as barrel polishing to round the ridges and corners of the raw chips. However, in the case of using the dip method in which the side of the raw chip is immersed in the ceramic paste bath when the ceramic paste is applied, barrel grinding may be unnecessary because the ridge portion and the corner portion of the raw chip are rounded depending on the application shape of the ceramic paste.

Other processes are the same as those in the first embodiment.

(Example)

Example 1

First, a rectangular ceramic green sheet having a thickness of 2.0 µm was molded using a ceramic slurry mainly composed of reducing barium titanate-based ceramic powder. The redox-resistant barium titanate-based ceramic powder, that is, the ceramic material for the effective layer part, which in Example 1 contains 99 mol% of BaTiO 3 and 1 mol% of Y 2 O 3 and does not contain Mg0 ( Mg0 addition amount: 0 mol% material) was used.

The conductive paste containing 100 parts by weight of nickel powder having an average particle diameter of 0.3 μm and 3.0 parts by weight of an organic binder as the conductive paste for forming internal electrodes on the ceramic green sheet was screen printed so as to have a width of a short side of 800 μm to form an internal electrode pattern. Formed.

And a ceramic material in which MgO is added in an amount of 0.5 mol% as an additive with respect to 100 mol% of the main component containing 99 mol% of BaTiO 3 and 1 mol% of Y 2 O 3 (the ceramic material constituting the gap portion, which is effective A ceramic paste blended with 100 parts by weight of MgO and 0.5 parts by weight of the organic binder) and 3.0 parts by weight of the organic binder was screen-printed around the inner electrode pattern so that the step between the inner electrode pattern and the surrounding step was eliminated. .

Then, 240 ceramic green sheets on which the conductive paste and the ceramic paste are printed are laminated, and ceramic green sheets (outer layer ceramic green) which are molded as described above on the upper and lower surfaces of both sides and have no internal electrode pattern formed thereon. 70 sheets each were laminated | stacked, and it pressed and cut in the thickness direction, and obtained the raw chip (micro ceramic sintered compact) of length 2.0mm x width 1.0mm x thickness 1.0mm.

This raw chip was baked at a temperature of 1300 ° C. to obtain a ceramic sintered body having a length of 1.6 mm, a width of 0.8 mm, and a thickness of 0.8 mm.

The electrically conductive paste was apply | coated to the both end surfaces which are the exposed surfaces of the internal electrode of the obtained ceramic sintered compact, and the external terminal electrode was formed by baking, and the multilayer ceramic capacitor A (sample A) was obtained.

A ceramic material comprising MgO in an amount of 0.75 mol% as an additive to 100 mol% of a main component containing 99 mol% of BaTiO 3 and 1 mol% of Y 2 O 3 as a ceramic material constituting the gap portion (the effective layer A multilayer ceramic capacitor B (sample B) was produced under the same conditions as in the case of the multilayer ceramic capacitor A, except that the MgO addition ratio was 0.75 mol% more than that of the bouillon ceramic material.

A ceramic material containing MgO in an amount of 1 mol% as an additive to 100 mol% of a main component containing 99 mol% of BaTiO 3 and 1 mol% of Y 2 O 3 as a ceramic material constituting the gap portion (for the effective layer portion) A multilayer ceramic capacitor C (sample C) was produced under the same conditions as in the multilayer ceramic capacitor A, except that the Mg0 addition ratio was 1 mol% higher than that of the ceramic material.

A ceramic material containing MgO in an amount of 1.5 mol% as an additive to 100 mol% of a main component containing 99 mol% of BaTiO 3 and 1 mol% of Y 2 O 3 as a ceramic material constituting the gap portion (the effective layer The MgO addition ratio was 1.5 mol% more than that of the bouillon ceramic material, and a multilayer ceramic capacitor D (sample D) was produced under the same conditions as in the case of the multilayer ceramic capacitor A.

Incidentally, for comparison, the ceramic paste using the same ceramic powder as the ceramic green sheet to which Mg0 was not added as the ceramic paste was screen-printed around the internal electrode pattern, and similarly laminated as Comparative Example 1 Ceramic capacitor E (sample E) was produced.

Then, a test was performed to apply a DC voltage of 0.5V to the multilayer ceramic capacitors (samples) A, B, C, D of Example 1 and the multilayer ceramic capacitors (samples) E of Comparative Example 1, and the electrical resistance value was 1.0. A multilayer ceramic capacitor having a size of 10 E6 or less was selected as a defective product and others as a good product.

And the moisture resistance test was done about the good quality after screening, and the moisture resistance was confirmed.

The test conditions were made into temperature 125 degreeC, humidity 95% RH, DC voltage 5V application, holding time 144 hours, and after the test, DC voltage 10V was applied at normal temperature, and it judged that it was the resistance value 1.0x10E6 ohms or less.

To each of the multilayer ceramic capacitors (samples) A, B, C, D of Example 1, and the multilayer ceramic capacitors (samples) E of Comparative Example 1, the screening failure rate before the moisture resistance test examined for each of the 500 and 100 articles for screening after screening Table 1 shows the measurement results of the moisture resistance test failure rate investigated.

Figure 112008038571815-pat00001

As shown in Table 1, the defective rates before the moisture resistance test of the multilayer ceramic capacitors (samples) A, B, C, D of Example 1 and the multilayer ceramic capacitors (samples) E of Comparative Example 1 are equivalent, but the moisture resistance test failure rates are performed. It was confirmed that Samples A, B, C, and D of Example 1 were significantly lower than Sample E of Comparative Example 1. In particular, in samples B and C, the moisture-proof test defective rate was 0%.

Moreover, in the sample E of the comparative example 1, even if it was judged good quality after a moisture proof test, it was confirmed that the resistance value after a test fell compared with before a test.

In addition, in Samples B and C of Example 1, no gap could be detected at the end of the internal electrode, and only a slight gap was observed at the end of the internal electrode in the center of the stacking direction in Samples A and D, too. From this, in the multilayer ceramic capacitor of Example 1, intrusion of moisture into the gap between the end of the internal electrode and the surrounding ceramic is suppressed, and it is considered that generation of defects in the moisture resistance test is suppressed.

Example 2

First, a rectangular ceramic green sheet having a thickness of 2.0 µm was molded using a ceramic slurry mainly composed of reducing barium titanate-based ceramic powder. Specifically, the reducing-resistant barium titanate-based ceramic powder contained a material containing 99 mol% of BaTiO 3 and 1 mol% of Y 2 O 3 , and containing no MgO (amount of MgO added: 0 mol%).

The conductive paste containing 100 parts by weight of nickel powder having an average particle diameter of 0.3 μm and 3.0 parts by weight of an organic binder as the conductive paste for forming internal electrodes on the ceramic green sheet was screen printed so as to have a width of a short side of 800 μm to form an internal electrode pattern. Formed.

Then, a ceramic paste containing 100 parts by weight of the same ceramic powder (Mg0 is not added) and 3.0 parts by weight of the organic binder as the ceramic powder contained in the ceramic slurry used for molding the ceramic green sheet was prepared. Screen printing was performed around the internal electrode pattern so that the step difference was eliminated.

Then, 240 ceramic green sheets on which the conductive paste and the ceramic paste are printed are laminated, and ceramic green sheets (outer layer ceramic green) which are molded as described above on the upper and lower surfaces of both sides and have no internal electrode pattern formed thereon. 70 sheets each were laminated | stacked, and it pressed and cut in the thickness direction, and obtained the raw chip (micro ceramic sintered compact) of length 2.0mm x width 1.0mm x thickness 1.0mm.

Then, one side of the obtained raw chip was immersed in an organic binder solution containing MgO at a rate of 1 mol / L, and dried, and then the other side was also immersed, and Mg was impregnated on both sides.

After drying this raw chip, it baked at the temperature of 1300 degreeC, and obtained the ceramic sintered compact of length 1.6mm x width 0.8mm x thickness 0.8mm.

Then, an electrically conductive paste was applied to both exposed surfaces of the internal electrodes of the obtained ceramic sintered body and baked to form external terminal electrodes to obtain a multilayer ceramic capacitor F (sample F).

The multilayer ceramic capacitor F (sample F) is a multilayer ceramic capacitor corresponding to the multilayer ceramic capacitor having the structure described in Embodiment 2 described above, and both side surfaces of the ceramic sintered body are Mg rich regions, and Mg rich regions. In the region, the multilayer ceramic capacitor (see FIGS. 7 and 8) has a concentration gradient in which the Mg concentration decreases from the outside to the inside of the ceramic sintered body.

Similarly, multilayer ceramic capacitor G (sample G) was obtained by the same process using an organic binder solution containing MgO at a rate of 3.0 mol / L.

In addition, the laminated ceramic capacitor H (sample H) as the comparative example 2 was produced by the same method as the case of the comparative example 1 demonstrated in the said Example 1 for the comparison. In addition, although the sample H of this comparative example 2 was manufactured by the same method as the said comparative example 1, it is a sample from which manufacture lot differs from the comparative example 1.

And the laminated ceramic capacitors F and G of Example 2 and the laminated ceramic capacitor H of Comparative Example 2 were subjected to the moisture resistance test for the selection before the moisture resistance test and the good after the selection by the same method as in the case of Example 1.

The results are shown in Table 2.

Figure 112008038571815-pat00002

As shown in Table 2, the multilayer ceramic capacitors F and G of Example 2 and the multilayer ceramic capacitor H of Comparative Example 2 are also shown in Table 2, and the evaluation results are almost the same as those of Example 1 and Comparative Example 1. Was obtained.

That is, as shown in Table 2, although the defective rate before the moisture resistance test of the multilayer ceramic capacitors F and G of Example 2 and the multilayer ceramic capacitor H of the comparative example 2 is the same, the multilayer ceramic capacitor which is a sample of Example 2 regarding the moisture resistance test defect rate is equivalent. It was confirmed that F and G were significantly lower than the multilayer ceramic capacitor H of Comparative Example 2. In particular, in sample G, the moisture-proof test defective rate was 0%.

Moreover, in the multilayer ceramic capacitor H of the comparative example 2, even if it was judged good quality after a moisture proof test, it was confirmed that the resistance value after a test fell compared with before a test.

In addition, no gap was detected at the end of the internal electrode from the multilayer ceramic capacitor G of Example 2, and even in the multilayer ceramic capacitor H of Comparative Example 2, only a slight gap was observed at the end of the internal electrode in the center of the stacking direction.

Example 3

First, a rectangular ceramic green sheet having a thickness of 2.0 µm was molded using a ceramic slurry mainly composed of reducing barium titanate-based ceramic powder.

The reduction-resistant barium titanate-based ceramic powder, that is, the ceramic material for the effective layer portion, in this Example 3, Mg0 was added as an additive to 100 mol% of the main component containing 99 mol% of BaTiO 3 and 1 mol% of Y 2 O 3 . The material mix | blended in the ratio of 1 mol% was used.

The conductive paste containing 100 parts by weight of nickel powder having an average particle diameter of 0.3 μm and 3.0 parts by weight of an organic binder as the conductive paste for forming internal electrodes on the ceramic green sheet was screen printed so as to have a width of a short side of 800 μm to form an internal electrode pattern. Formed.

And a ceramic material in which MgO is added in an amount of 1.5 mol% as an additive with respect to 100 mol% of the main component containing 99 mol% of BaTiO 3 and 1 mol% of Y 2 O 3 (the ceramic material constituting the gap portion, which is effective A ceramic paste containing 100 parts by weight of a MgO addition ratio (more than 0.5 mol% of a ceramic material) and 3.0 parts by weight of an organic binder was screen-printed around the inner electrode pattern so that there was no step between the inner electrode pattern and the surrounding portion.

Then, 240 ceramic green sheets on which the conductive paste and the ceramic paste are printed are laminated, and ceramic green sheets (outer layer ceramic green) which are molded as described above on the upper and lower surfaces of both sides and have no internal electrode pattern formed thereon. 70 sheets each were laminated | stacked, and it pressed and cut in the thickness direction, and obtained the raw chip (micro ceramic sintered compact) of length 2.0mm x width 1.0mm x thickness 1.0mm.

This raw chip was baked at a temperature of 1300 ° C. to obtain a ceramic sintered body having a length of 1.6 mm, a width of 0.8 mm, and a thickness of 0.8 mm.

The electrically conductive paste was apply | coated to the both end surfaces which are the exposed surfaces of the internal electrode of the obtained ceramic sintered compact, and the external terminal electrode was formed by baking, and the multilayer ceramic capacitor I (sample I) was obtained.

A ceramic material comprising MgO in an amount of 1.75 mol% as an additive with respect to 100 mol% of a main component containing 99 mol% of BaTiO 3 and 1 mol% of Y 2 O 3 as a ceramic material constituting the gap portion (the effective layer) A material having a MgO addition ratio of 0.75 mol% more than that of the bouillon ceramic material was used, and else a multilayer ceramic capacitor J (sample J) was produced under the same conditions as in the case of the multilayer ceramic capacitor I described above.

A ceramic material containing MgO in an amount of 2 mol% as an additive to 100 mol% of a main component containing 99 mol% of BaTiO 3 and 1 mol% of Y 2 O 3 as a ceramic material constituting the gap portion (for the effective layer portion) A material containing 1 mol% Mg0 more than that of the ceramic material) was used, and a multilayer ceramic capacitor K (sample K) was produced under the same conditions as in the case of the multilayer ceramic capacitor I.

A ceramic material comprising MgO in an amount of 2.5 mol% as an additive to 100 mol% of a main component containing 99 mol% of BaTiO 3 and 1 mol% of Y 2 O 3 as a ceramic material constituting the gap portion (the effective layer A multilayer ceramic capacitor L (sample L) was produced under the same conditions as in the case of the multilayer ceramic capacitor I, except that the MgO addition ratio was 1.5 mol% more than that of the bouillon ceramic material.

Further, for comparison, a material in which Mg0 is added in an amount of 1 mol% as an additive to 100 mol% of a main component containing 99 mol% of BaTiO 3 and 1 mol% of Y 2 O 3 as a ceramic material constituting the gap portion (the above effective A multilayer ceramic capacitor M (sample M) was produced under the same conditions as in the case of the multilayer ceramic capacitor I above, using the same material as the ceramic material for the layer portion).

Then, a test was performed to apply a DC voltage of 0.5V to the multilayer ceramic capacitors (samples) I, J, K, L of this Example 3, and the multilayer ceramic capacitors (samples) M of Comparative Example 3, and the electrical resistance value was 1.0. A multilayer ceramic capacitor having a size of 10 E6 or less was selected as a defective product and others as a good product.

And the moisture resistance test was done about the good quality after screening, and the moisture resistance was confirmed.

The test conditions were made into temperature 125 degreeC, humidity 95% RH, DC voltage 5V application, holding time 144 hours, and after the test, DC voltage 10V was applied at normal temperature, and it judged that it was the resistance value 1.0x10E6Ω or less as moisture resistance failure.

For each of the multilayer ceramic capacitors (samples) I, J, K, L of Example 3, and the multilayer ceramic capacitors (samples) M of Comparative Example 3, the screening failure rate before the moisture resistance test investigated for each of the 500 and 100 articles for screening after screening Table 3 shows the measurement results of the investigated moisture proof failure rate.

Figure 112008038571815-pat00003

As shown in Table 3, the defective rate before the moisture resistance test of the multilayer ceramic capacitors (sample) I, K, L of Example 3 and the multilayer ceramic capacitor (sample) M of Comparative Example 3 was almost equal, but the moisture resistance test failure rate was It was confirmed that Samples I, K and L of 3 were significantly lower than Sample M of Comparative Example 3.

In addition, in the case of the sample J of the Example whose addition amount of MgO is 1.75 mol%, the defective rate before a moisture proof test was 0%, and the defective rate after a moisture proof test was also 0%.

In addition, in the case of sample I of the example in which the addition amount of MgO was 1.5 mol%, the failure rate before the moisture test was 0.20%, but the moisture resistance test failure rate was 0%, and in the case of sample K of the example in which the addition amount of MgO was 2 mol%, The defective rate was 0.40%, but the defective rate after the moisture resistance test was 0%.

On the other hand, in the case of the sample L of the example of the MgO addition amount of 2.5 mol%, the failure rate before the moisture test was 0.40%, but the moisture resistance test failure rate is 8%, significantly lower than the moisture resistance test failure rate of the sample M of Comparative Example 3, but the present invention It was confirmed that the moisture proof test failure rate was high compared with other samples I, J, and K satisfying the requirements of.

Moreover, in the sample M of the comparative example 3, even if it was judged good quality after a moisture proof test, it was confirmed that the resistance value after a test fell compared with before a test.

In each of the above embodiments and Examples 1 and 2, the case where Mg is not contained in the ceramic constituting the effective layer portion is described as an example, and in Example 3, the case where Mg is contained in the ceramic constituting the effective layer portion is used as an example. Although described above, regardless of whether or not Mg is contained in the ceramic constituting the effective layer portion, the basic effect of the present invention can be obtained by making the Mg content of the Mg rich layer higher than the Mg content of the effective layer portion within a predetermined range of the present invention. .

In the above embodiments and examples, the multilayer ceramic capacitor has been described as an example, but the present invention is not limited to the multilayer ceramic capacitor, and the present invention is not limited to the multilayer ceramic capacitor. It is possible to apply widely to multilayer ceramic electronic components.

In addition, the present invention is not limited to the above embodiment in other respects as well, but the stacking form and number of laminations of the ceramic layer and the internal electrodes, the type of ceramic material constituting the effective layer portion, the side surface portion, and the cross section side gap portion, Ni, It relates to the composition of the internal electrode material to contain and the like, and it is possible to add various applications and modifications within the scope of the invention.

 As described above, according to the present invention, it is possible to improve the moisture resistance reliability of the multilayer ceramic electronic component having the structure in which the internal electrodes are arranged in the ceramic sintered body through the ceramic layer, and even in the case of miniaturization, high reliability for moisture resistance It is possible to provide ceramic electronic components.

Therefore, this invention can be used suitably for multilayer ceramic capacitors, such as a multilayer ceramic capacitor, a laminated thermistor, and a laminated inductor used for various uses.

1 is a perspective view showing a multilayer ceramic electronic component (layer ceramic capacitor) according to Embodiment 1 of the present invention.

2 is a cross-sectional view taken along the line A-A of FIG.

3 is a cross-sectional view taken along the line B-B in FIG.

4 is a view for explaining the configuration of the multilayer ceramic capacitor according to the first embodiment of the present invention.

5 is a cross-sectional view of an essential part for explaining the action of the multilayer ceramic capacitor according to the first embodiment of the present invention.

6A, 6B, and 6C are diagrams illustrating a method of manufacturing the multilayer ceramic capacitor of Embodiment 1 of the present invention.

7 is a side sectional view showing a configuration of a multilayer ceramic capacitor of Embodiment 2 of the present invention.

8 is a view for explaining the configuration of the multilayer ceramic capacitor according to the second embodiment of the present invention.

Fig. 9 is a side sectional view showing the structure of a multilayer ceramic capacitor of Embodiment 3 of the present invention.

FIG. 10 is a diagram for explaining the structure of a multilayer ceramic capacitor according to the third embodiment of the present invention. FIG.

11 (a) and 11 (b) are diagrams showing a manufacturing method of the multilayer ceramic capacitor of Embodiment 3 of the present invention.

(Explanation of symbols for the main parts of the drawing)

1: first internal electrode 2: second internal electrode

3: ceramic layer 3a: effective layer portion

3b: outer layer 10: ceramic sintered body

11: first cross section of ceramic sintered body 12: second cross section of ceramic sintered body

13b: vertical projection area 21: first side of ceramic sintered body

22: second side face of ceramic sintered body 31: first external terminal electrode

32: second external terminal electrode 41: ceramic green sheet

42: conductive paste 42p: internal electrode pattern

43 ceramic paste G E

G E1 : region adjacent to the first and second internal electrodes of the cross-sectional side gap portion

G S : side gap

G S1 : region adjacent to the first and second internal electrodes of the side gap portion

L: Cutting Line M R : Mg Rich Area

Claims (21)

  1. A ceramic sintered body formed by stacking a plurality of ceramic layers, the ceramic sintered body having first and second side surfaces opposed to each other, and first and second cross sections facing each other;
    A first internal electrode formed inside the ceramic sintered body and containing Ni extracted in the first end surface;
    A second internal electrode formed in the ceramic sintered body so as to face the first internal electrode through the specific ceramic layer and containing Ni drawn out in the second end surface;
    A first external terminal electrode formed on the first end surface of the ceramic sintered body and electrically connected to the first internal electrode; And
    A multilayer ceramic electronic component having a second external terminal electrode formed on said second end face of said ceramic sintered body and electrically connected to said second internal electrode and connected to a potential different from said first external terminal electrode:
    The ceramic sintered body,
    An effective layer portion interposed between the first internal electrode and the second internal electrode in the ceramic layer and contributing to the formation of a capacitance; and
    A side-side gap portion existing between the side portions of the first and second internal electrodes and the first and second side surfaces of the ceramic sintered body and between the side portions of the effective layer portion and the first and second side surfaces of the ceramic sintered body;
    In the side-side gap portion, at least a region from the region adjacent to the first and second internal electrodes to the side surface of the ceramic sintered body is an Mg rich region having a higher Mg concentration than the effective layer portion. Ceramic electronic components.
  2. The multilayer ceramic electronic component according to claim 1, wherein a region located at the same height of each of the first and second internal electrodes as the Mg rich region is formed among the side gaps.
  3. The multilayer ceramic electronic component according to claim 1, wherein the entire side surface gap portion is the Mg rich region.
  4. The ceramic sintered body according to any one of claims 1 to 3, wherein the ceramic sintered body is between an end of the first and second internal electrodes and first and second end faces of the ceramic sintered body, and an end of the effective layer part and the ceramic sintered body. A cross-sectional side gap portion existing between the first or second cross-section of the cross section;
    At least a region adjacent to the first and second internal electrodes in the cross-sectional side gap portion is an Mg rich region having a higher Mg concentration than the effective layer portion.
  5. delete
  6. The Mg with respect to 100 mol% of the main component of the ceramic material which comprises the said Mg rich area | region compared with the addition ratio of Mg with respect to 100 mol% of the main component of the ceramic material which comprises the said effective layer part. Multilayer ceramic electronic component, characterized in that the addition ratio of 0.5 to 1.0 mol% is increased.
  7. The multilayer ceramic electronic component according to any one of claims 1 to 3, wherein the Mg concentration in the Mg rich region has a concentration gradient that decreases from the outside to the inside of the ceramic sintered body.
  8. 5. The effective layer portion according to claim 4, wherein at least one of the vertical projection area of the side gap portion and the vertical projection area of the cross section side gap portion of the ceramic layer that is outside of the inner electrode of the outermost layer among the first and second internal electrodes is the effective layer portion. A multilayer ceramic electronic component comprising an Mg rich region having a higher Mg concentration as compared to the above.
  9. The amount of Mg added to 100 mol% of the main component of the ceramic material constituting the Mg rich region is 0.5 to 1.0 mol, as compared with the addition ratio of Mg to 100 mol% of the main component of the ceramic material constituting the effective layer portion. Laminated ceramic electronic component, characterized in that a lot.
  10. delete
  11. 9. The amount of Mg added to 100 mol% of the main component of the ceramic material constituting the Mg rich region is 0.5 to 1.0 mol, compared to the ratio of Mg to 100 mol% of the main component of the ceramic material constituting the effective layer portion. Laminated ceramic electronic component, characterized in that a lot.
  12. The multilayer ceramic electronic component according to claim 4, wherein the Mg concentration in the Mg rich region has a concentration gradient that decreases from the outside to the inside of the ceramic sintered body.
  13. delete
  14. The multilayer ceramic electronic component according to claim 8, wherein the Mg concentration in the Mg rich region has a concentration gradient that decreases from the outside to the inside of the ceramic sintered body.
  15. A ceramic sintered body formed by stacking a plurality of ceramic layers, the ceramic sintered body having first and second side surfaces opposed to each other, and first and second cross sections facing each other;
    A first internal electrode formed inside the ceramic sintered body and containing Ni extracted in the first end surface;
    A second internal electrode formed in the ceramic sintered body so as to face the first internal electrode through the specific ceramic layer and containing Ni drawn out in the second end surface;
    A first external terminal electrode formed on the first end surface of the ceramic sintered body and electrically connected to the first internal electrode; And
    A multilayer ceramic electronic component having a second external terminal electrode formed on said second end face of said ceramic sintered body and electrically connected to said second internal electrode and connected to a potential different from said first external terminal electrode:
    The ceramic sintered body,
    An effective layer portion interposed between the first internal electrode and the second internal electrode in the ceramic layer and contributing to the formation of a capacitance; and
    A side-side gap portion existing between the side portions of the first and second internal electrodes and the first and second side surfaces of the ceramic sintered body and between the side portions of the effective layer portion and the first and second side surfaces of the ceramic sintered body;
    At least the region adjacent to the first and second internal electrodes in the side gap portion is an Mg rich region having a higher Mg concentration than the effective layer portion,
    The multilayer ceramic electronic component according to claim 1, wherein a region having a higher Mg concentration than the Mg rich region is not present in the effective layer portion.
  16. The multilayer ceramic electronic component according to claim 15, wherein a region located at the same height as each of the first and second internal electrodes among the side gap portions is the Mg rich region.
  17. 16. The multilayer ceramic electronic component according to claim 15, wherein the entire side-side gap portion is the Mg rich region.
  18. 18. The ceramic sintered body according to any one of claims 15 to 17, wherein the ceramic sintered body is between end portions of the first and second internal electrodes, first and second end faces of the ceramic sintered body, and end portions of the effective layer portion and the ceramic sintered body. A cross-sectional side gap portion existing between the first or second cross-section of the cross section;
    At least a region adjacent to the first and second internal electrodes in the cross-sectional side gap portion is an Mg rich region having a higher Mg concentration than the effective layer portion.
  19. 19. The effective layer portion according to claim 18, wherein at least one of the vertical projection area of the side gap portion and the vertical projection area of the cross section side gap portion of the ceramic layer that is outside of the inner electrodes of the outermost layers of the first and second internal electrodes is the effective layer portion. A multilayer ceramic electronic component comprising an Mg rich region having a higher Mg concentration as compared to the above.
  20. 18. The Mg of any one of claims 15 to 17 with respect to 100 mol% of the main component of the ceramic material constituting the Mg rich region as compared to the addition ratio of Mg to 100 mol% of the main component of the ceramic material constituting the effective layer portion. Multilayer ceramic electronic component, characterized in that the addition ratio of 0.5 to 1.0 mol% is increased.
  21. The multilayer ceramic electronic component according to any one of claims 15 to 17, wherein the Mg concentration in the Mg rich region has a concentration gradient that decreases from the outside to the inside of the ceramic sintered body.
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