KR101016215B1 - Method for Imprinting with Remained Photoresist - Google Patents

Abstract

The present invention provides a method of imprinting in a method of imprinting using a mold, without requiring a residual image photoresist removing process. Moreover, it is about the method of forming a fine pattern on the printing roll surface. Flat panel or flexible display field such as LCD, PDP, OLED, solar cell, transistor, RFID, etc. are manufactured by roll printing method. In this roll printing method, a pattern is formed on a roll mold and manufactured using the roll mold on which the pattern is formed. A method of imprinting in more detail, comprising: coating a sacrificial layer that does not react to light on a substrate; Soft baking to fix the sacrificial layer; Forming an image photoresist by coating a photoresist that is cured by light on the sacrificial layer; Pressing the sacrificial layer and the image photoresist with an imprinting mold; Curing the image photosensitive film by scanning light while pressing the mold to form a pattern shape; A developing step of removing the sacrificial layer exposed to the outside with a developing solution; Hard baking to align the image photoresist and the sacrificial layer; Depositing a metal on the substrate; Soft baking to fix the metal deposited on the substrate; and removing the sacrificial layer to form a fine metallization on the substrate; first coating the sacrificial layer to remove the residual image photoresist film It is about how to imprint without.

Sacrificial layer, imprinting, photoresist, UV laser beam, micropattern

Description

Imprinting method without residual photoresist {Method for Imprinting with Remained Photoresist}

The present invention provides a method for imprinting using a mold without requiring a residual photoresist film removing step. Moreover, it is about the method of forming a fine pattern on the printing roll surface. Flat panel or flexible display field such as LCD, PDP, OLED, solar cell, transistor, RFID, etc. are manufactured by roll printing method. In this roll printing method, a pattern is formed on a roll mold and manufactured using the roll mold on which the pattern is formed. The present invention relates to a method of forming a fine pattern on a roll surface.

Recently, there is a need for a new manufacturing process that can increase the size of flat panel displays and produce next-generation flexible displays. Since the conventional paper printing method is not able to form a fine pattern, the roll printing process during the process that can cope with this trend has recently attracted attention.

The roll mold method and the stamp method are mainly used as imprint methods capable of forming fine patterns. The roll mold method forms a roll surface pattern and imprints using the roll mold in which the pattern is formed. The stamp method is also a method of forming a pattern on the surface and imprinting by stamping the surface on which the pattern is formed.

In this method, it is important to form a fine pattern on the surface of the mold in order to fabricate an electronic device or a metal wiring. The method of forming a pattern usually includes etching, e-beam processing, diamond turning, laser processing, and the like. In the etching method, since the metal and the photoresist are coated and the photolithography process is performed, the metal is etched and etched to form a pattern, thereby limiting the depth. In the case of e-beam processing, it is possible to form an ultra fine pattern, but there is a problem in that a micro pattern cannot be formed in a large area due to a long processing time and a limited amount of processing. In the case of diamond lathe machining, the two-dimensional free-form machining is difficult due to the processing characteristics. In addition, laser processing also has a problem that it is difficult to form a high quality pattern.

Therefore, there is a need for a method capable of forming a fine pattern on a large area, without requiring an etching process, and forming a fine pattern on a roll surface in which a photosensitive film body can be directly used as a pattern using a UV laser beam. .

In addition, there is a need for a process of removing a residual photoresist film that inevitably occurs during the imprinting process by such a mold. Typically, depending on the type of photoresist film, it is removed by a method such as reactive ion etching (RIE) or chemical mechanical polishing (CMP). There is a need for a method of imprinting without the need to remove such residual photoresist.

Accordingly, the present invention has been made to solve the above problems, an object of the present invention is to first coat the photosensitive film and the sacrificial layer of different properties before coating the photosensitive film in the imprinting method of forming a pattern using a mold . Therefore, the sacrificial layer is removed from the substrate after the pattern is formed with the mold and subjected to the developing step, so that the residual image photoresist film is not formed. It is to provide an imprinting method that does not require a separate process of removing the residual image photoresist film.

In addition, another object of the present invention is to form a fine pattern on the surface of the roll by using a photosensitive film directly as a pattern without forming a fine pattern on the roll mold without any other machining process such as vacuum deposition, etching, fabrication of a pattern mask, etc. To provide a way.

This two-dimensional micropattern can be formed in a large area can overcome the disadvantages of the existing pattern formation method.

     The present invention provides a method for forming a photoresist film by coating a photoresist that can be cured or decomposed by UV light or UV laser, and by scanning a UV laser beam having a small diameter to the photoresist film to use the photoresist itself as a fine pattern. By using a large-area roll mold having such a fine pattern, fine electronic metal wiring and imprinting capable of forming a fine pattern are possible.

Other objects, specific advantages and novel features of the invention will become more apparent from the following detailed description and the preferred embodiments described in conjunction with the accompanying drawings.

An object of the present invention as described above, in the method of imprinting, coating a sacrificial layer (110) that does not respond to light on the substrate (100); Soft baking to fix the sacrificial layer 110; Coating the photosensitive agent cured by light on the sacrificial layer 110 to form an image photoresist film 120; Pressing the sacrificial layer 110 and the image photosensitive film 120 with an imprinting mold having a fine wiring pattern formed thereon; Hardening the image photosensitive film 120 by scanning light while pressing the mold to form a fine wiring pattern; A developing step of removing the sacrificial layer 140 exposed to the outside with a developer; Hard baking to align the image photoresist layer 120 and the sacrificial layer 110; Depositing a metal film 300 on the substrate 100; Soft baking to fix the metal film 300 deposited on the substrate 100; and removing the sacrificial layer 110 to form a fine metal wiring on the substrate 100; It can be achieved by an imprinting method without a residual photoresist film.

The imprinting mold may be a roll mold 200.

       The photosensitive agent is cured by UV light, and may be characterized in that the image photosensitive film 120 is cured by injecting the UV light 400 to the entire substrate 100.

The developer may react with the sacrificial layer 110 but not with the cured image photoresist 130.

Coating the sacrificial layer 110 or the image photosensitive film 120 may be a slit coating, a spray coating, a coating using an anilox roll or a roll-to-roll printing coating.

The roll mold 200 in which the micropattern 210 is formed may include forming a photoresist film 620 by coating a photoresist that is cured or decomposed by UV light on a roll surface; Soft baking to fix the photoresist film 620; Scanning the UV laser beam 700 on the photosensitive film 620; A development step of selectively removing the photosensitive film 620 scanned by the UV laser beam 700; and hard baking to align the photosensitive film 620 after development; It may be characterized by forming a pattern.

The UV laser beam 700 may be characterized by forming a fine pattern 210 by scanning through a UV laser scanning device capable of three-axis ultra-precision stage transfer.

In the case of the photosensitive film 620 which is decomposed by the UV laser in the developing step of selectively removing the photosensitive film 620 in which the UV laser beam 700 is scanned, the portion where the UV laser beam 700 is scanned is removed by a developer. The developer does not react with the photosensitive film 620 that is not decomposed, but may react with the photosensitive film 620 that is decomposed.

In the case of the photoresist film 620 which is cured by the UV laser in the development step of selectively removing the photoresist film 620 in which the UV laser beam 700 is scanned, the portion which does not scan the UV laser beam 700 is removed by the developer. The developer may not be reacted with the cured photoresist 620.

The width 220 of the fine pattern 210 formed on the roll surface 510 may be 0.5 to 10 μm.

The surface on which the micropattern 210 is formed on the roll surface 510 may be relatively wider than the surface on which the micropattern 210 is not formed.

The UV laser scanning apparatus includes rotating means for rotating the printing roll 500 about the axis 880 of the roll 500; An axis 870 provided parallel to the axis 880 at regular intervals from the roll surface 510; And a UV laser beam forming means 800 that moves along the axis 870 to scan the UV laser beam 700 on the roll surface 510.

The rotating means includes a drive motor 820 capable of speed control; and a gear shaft 840 connected to the drive motor 820 and installed in the direction of the axis 880; and a bearing 850 for supporting the gear shaft 840. It may be characterized in that it comprises a; support 860 provided.

The UV laser beam forming means 800 includes a UV laser diode 720 for generating UV light; and a lens 740 for forming a focal point 750 while UV light is transmitted. Projecting to 740 may be characterized in that forming a UV laser beam 700 that is focused to focus.

The diameter 710 of the UV laser beam 700 may be determined according to the wavelength of the UV laser diode 720 and the distance to the focal point 750 of the lens 740.

Diameter 710 of the UV laser beam 700 may be characterized in that 0.2 ~ 10㎛.

The UV laser beam forming means 800 performs one-dimensional motion in parallel with the axis 880 and the roll 500 rotates to form the two-dimensional fine pattern 210 by the UV laser beam 700. It may be characterized by.

UV laser beam forming means 800 may be characterized in that the uniaxial ultra-precision stage of 100nm or less precision.

The UV laser beam forming means 800 may be characterized by moving in a direction perpendicular to the axis 880 of the roll 500.

Therefore, according to one embodiment of the present invention as described above, the residual image photoresist film 120 is not generated in the imprinting process for manufacturing the metal wiring, etc. in which the fine pattern 210 is formed using the roll mold 200. . Therefore, it is not necessary to remove the residual image photoresist film 120 in the post-treatment process, so that the process may be quick. In addition, the finer the pattern 210 to be formed, the more difficult the removal of the residual image photoresist film 120 and the higher the cost, but the present invention has the advantage that the cost can be reduced because the residual image photoresist film 120 does not occur. .

In addition, in the case of the roll mold 200 used for imprinting, according to an embodiment of the present invention, a photoresist 620 is coated by coating a photoresist that is cured or decomposed by a UV laser or UV light on a large surface of the roll surface 510. And partially irradiate the UV laser beam 700 to the photoresist 620 to form the photoresist 620 itself as a pattern 210.

In addition, by curing the image photosensitive agent by scanning UV light before the metal deposition process, it is possible to cure the photosensitive agent without obscuring the metal film. And when the UV light source is located above the substrate there is an interference phenomenon by the roll surface, but the present invention has the advantage that it can be cured without interference phenomenon by placing the light source under the substrate.

Thus, apart from the photoresist on the roll, there is no need to first deposit or sputter the material to form the pattern as conventionally. In addition, by scanning the laser beam 700 itself through a three-axis ultra-precision stage moving device, it is not necessary to manufacture a mask in which a pattern is formed separately. After the UV laser beam 700 is scanned, the uncured portion of the UV curing photosensitive agent is removed, and in the case of the UV decomposed photosensitive agent, the portion where the UV laser beam 700 is scanned is removed, so a separate etching process is required after development. There is no advantage. Since the deposition, etching, and pattern mask fabrication process of the metal film 300 are not required, there is an effect of quickly forming a fine pattern on a large area.

In addition, since the photosensitive film 620 itself forms a pattern, there is no need for a post-processing step such as removing the photosensitive film 620 later. Therefore, there is an effect that can quickly form the fine pattern 210 on the roll surface 510. The UV laser beam 700 may change the diameter 710 according to the distance between the focal point 750 and the photoresist layer 620, so that the width 220 of the fine pattern 210 to be formed may be easily adjusted. . In addition to the photoresist layer 620, there is no need to deposit or coat a material, thereby enabling economical and rapid fabrication.

Although the present invention has been described in connection with the above-mentioned preferred embodiments, it will be readily apparent to those skilled in the art that various other modifications and variations are possible without departing from the spirit and scope of the invention. Are all within the scope of the appended claims.

(How to imprint without the remaining photoresist)

Hereinafter, a method of performing imprinting without a residual image photoresist film 120 according to an embodiment of the present invention will be described with reference to the accompanying drawings. First, FIG. 1 shows a flowchart of a method for imprinting without removing a residual image photoresist film 120 according to the present invention. The sacrificial layer 110 is coated on the substrate 100, and a UV (curable) photosensitive agent that is cured by UV light is coated on the coated sacrificial layer 110. After coating, soft baking is performed to fix the image photoresist layer 120.

The substrate 100 coated with the image photosensitive film 120 is pressed by the roll mold 200 in which the micropattern 210 is formed. By pressing the UV light is scanned on the entire substrate 100 on which the pattern 210 is formed to cure the image photosensitive film 120. The sacrificial layer 110 exposed to the outside is removed by developing the substrate 100 on which the pattern 210 is formed. The metal film 300 is deposited on the substrate 100 on which the pattern 210 is formed and fixed by a soft baking process. By depositing the metal film 300 and removing the sacrificial layer 110, the metal film 300 having the micropattern 210 formed on the substrate 100 without the residual image photosensitive film 120 remains. Hereinafter, each step will be described in detail.

2A to 2H show side views of the substrate 100 in the critical step of imprinting without removing the residual image photoresist 120.

The sacrificial layer 110 is uniformly coated on the substrate 100. The sacrificial layer 110 should be a material that is not cured by the UV light 400. In addition, it should be a material that does not leave a residual material when removed from the substrate 100. A soft baking process is performed to coat the sacrificial layer 110 and to fix the sacrificial layer 110 to the substrate 100. 2A illustrates a side view of the substrate 100 on which the sacrificial layer 110 is uniformly coated.

As shown in FIG. 2A, the sacrificial layer 110 is uniformly coated with a UV cured photosensitive agent that is cured by the UV light 400 on the coated substrate 100. As a UV hardening material, a carbonyl compound, a sulfur compound, an azo compound, a carbonyl compound, etc. are used according to a UV wavelength.

The method of coating the sacrificial layer 110 and the UV curing photosensitive agent is to use a slit coating using a slit nozzle, a coating method using a spray coating or an anilox roll, a roll-to-roll printing method, or the like.

The UV curing photosensitive agent is coated to form an image photoresist layer 120, and a soft baking process is performed to fix the image photoresist layer 120 to the sacrificial layer 110. This is to fix the UV-cured image photosensitive film 120 coated at a constant temperature without moving. 2B shows a side view of the substrate 100 forming the image photosensitive film 120.

The microcavity 210 is formed on the substrate 100 on which the sacrificial layer 110 and the image photoresist layer 120 are formed to be pressed by the roll mold 200. FIG. 2C illustrates a side view of the roll mold 200 in which the micropattern 210 is formed on the substrate 100 before pressing in parallel at regular intervals. The micro pattern 210 is pressed by the roll mold 200 to form a pattern on the image photosensitive film 120 and the sacrificial layer 110 coated on the substrate 100.

Figure 2d shows a side view of the state pressed in the roll mode. As shown in FIG. 2D, when the roll mold 200 is pressed, the depth of the micropattern 210 of the roll mold 200 is greater than the thickness of the image photoresist layer 120 and the image photoresist layer 120 and the sacrificial layer 110. ) Must be less than the combined thickness. As shown in FIG. 2D, the substrate 100 is scanned with the UV light 400 while being pressed by the roll mold 200. When the UV light 400 is scanned, the image photosensitive film 120 is cured in a state where a pattern is formed. However, the sacrificial layer 110 is not cured by the UV light 400. The UV light 400 is scanned until the image photoresist 120 is cured. When the image photoresist 120 is completely cured, the roll mold 200 is separated from the substrate 100.

2E illustrates a side view of the substrate 100 in which a pattern is formed on the image photosensitive film 120 by the roll mold 200. As shown in FIG. 2E, the shape of the pattern formed on the image photosensitive film 120 is opposite to the pattern shape of the roll mold 200. The sacrificial layer 110 is exposed to the outside by the convex portion of the roll mold 200 pattern, and the remaining portion is coated with the image photoresist layer 120 on the sacrificial layer 110.

The sacrificial layer 140 exposed to the outside by the developer is removed. The developer does not react with the cured image photoresist 130 but uses a material that reacts with the sacrificial layer 110. Therefore, the sacrificial layer 140 exposed to the outside is removed. After the developing process, a hard baking process may be performed to align the image photosensitive layer 120 and the sacrificial layer 110.

After development, the metal film 300 to form a pattern is deposited on the substrate 100. 2G shows a side view of the substrate 100 on which the metal film 300 is deposited. As shown in FIG. 2G, the metal film 300 is coated on the image photosensitive film 120 and the substrate 100.

After removing all of the sacrificial layer 110 coated on the substrate 100, the metal film 300 deposited on the substrate 100 remains. Therefore, the metal wiring of the micropattern 210 is formed on the substrate 100, and the imprinting process without the residual image photoresist film 120 is finished. FIG. 2H illustrates a side view of the substrate 100 removing the sacrificial layer 110 to form the metallization of the micropattern 210. The developer does not react with the deposited metal film 300 but removes the sacrificial layer 110 with a material that reacts with the sacrificial layer 110. Since the sacrificial layer 110 does not form a residual material, the imprinting process may be completed after the sacrificial layer 110 is removed without the need of separately removing the image photoresist layer 120.

(Roll mold manufacturing method in which a fine pattern is formed in large area by UV laser beam)

The roll mold 200 in which the micropattern 210 is formed by coating the sacrificial layer 110 first to be imprinted without removing the residual image photoresist film 120 is manufactured by the following method.

FIG. 3 shows a flowchart of a method for scanning the roll surface 510 and forming the micropattern 210 in a large area by scanning the UV laser beam 700. The step is accomplished by the following steps.

As shown in FIG. 3, first, a UV laser or UV light is injected onto a large surface of the roll surface 510 to be coated with a hardened material (UV curing photosensitive agent). Alternatively, when the UV laser or UV light is injected, the photosensitive film 620 is formed by coating with a substance (UV decomposition photosensitive agent) to which the tissue is degraded (S100). After coating, a soft baking process for stably fixing the photosensitive film 620 is performed (S200).

The UV laser diode 720 emitting a light source having a UV wavelength is projected onto the lens 740 to make the UV laser beam 700. The UV laser beam 700 is scanned on the photosensitive film 620 to cure or decompose the scanned portion (S300).

After scanning the UV laser beam 700, a developing process of selectively removing the photosensitive film 620 using a developer (S400). At this time, in the case of coating with a UV curing photosensitive agent, a portion where the UV laser beam 700 is not scanned is removed. On the other hand, in the case of coating with a UV degradation photosensitizer, the portion where the UV laser beam 700 is scanned is removed.

In order to align the tissues after development, the micro pattern 210 is largely formed on the roll surface 510 through a hard baking process S500 (S600).

4A-4C show partial enlarged views of the roll surface 510 in critical steps in the method of forming the micropattern 210 on the roll surface 510 using the UV laser beam 700.

First, when a UV laser or UV light is injected to the roll surface 510, a UV cured material that is cured after a predetermined time is coated with a photosensitive agent. As a UV hardening material, a carbonyl compound, a sulfur compound, an azo compound, a carbonyl compound, etc. are used according to a UV wavelength.

Alternatively, when the UV laser or UV light is injected onto the roll surface 510, the UV decomposing material, which absorbs UV light and decomposes after a predetermined time, is coated with a photosensitive agent. As the UV decomposer, hydroxy benzophenone, hydroxy phenyl benzotriazole, aryl ester or oxanilides are used depending on the UV wavelength. 4A is an enlarged view of the roll surface 510, showing the UV cured photosensitive agent coated.

The coating method may be a slit coating using a slit nozzle, a coating method using a spray coating or an anilox roll, or a roll-to-roll printing method.

The UV curing or UV degrading photoresist is coated to form the photoresist film 620, and a soft baking process is performed to fix the photoresist 620 to the roll surface 510. This is to fix the UV decomposition or curing photosensitive film 620 coated at a constant temperature without moving.

Next, the UV laser beam 700 is scanned in the shape of the micropattern 210 to be formed on the soft-baked UV curing or UV decomposition photosensitive film 620 to cure or decompose the photosensitive film 620. 4B illustrates a state in which the UV laser beam 700 is scanned on the UV cured photosensitive film 600 to cure the photosensitive film 610 of the scanned portion.

The UV laser beam 700 is scanned on the photosensitive film 620 using a UV laser scanning device. The printing roll 500 coated with the photosensitive film 620 is fixed to the gear shaft 840 and the driving motor 820 is operated in consideration of the scanning time of the UV laser beam 700 so that the roll 500 rotates. do. The UV laser beam forming means 800 is suspended from the axis 870 to move in parallel with the axis 880 of the roll 500. In addition, when the width 220 of the micropattern 210 is to be changed, the UV laser beam forming means 800 may move in a direction perpendicular to the axis 880 of the roll 500.

After the UV-curing photosensitive film 600 is cured or the UV decomposition photosensitive film 620 is decomposed by scanning the UV laser beam 700 in the shape of a fine pattern 210 to form, the development process of selectively removing the photosensitive film 620 is performed. Will perform.

Specifically, in the case of coating with a UV curing photosensitive agent and scanning the UV laser beam 700, the photosensitive film 620 will be cured portion of the injection of the UV laser beam 700 will be cured photosensitive film 610 after the development step All portions of the photoresist film 600 to which the UV laser beam 700 has not been scanned except the portion will be removed. Therefore, the fine pattern 210 will be formed in the scanned shape of the UV laser beam 700. FIG. 4C illustrates a state in which the micropattern 210 is formed by removing and leaving a portion hardened by the UV laser beam 700 through a developing step.

The developer used to remove the photoresist layer 620 of the portion that does not scan the UV laser beam 700 does not react with the cured photoresist 620, but is a material capable of reacting with the uncured photoresist layer 620. do. As the developing solution, xyline or n-butyl acetone may be used.

In addition, when the UV decomposition photosensitive agent is coated, the micro pattern 210 is formed by removing the photosensitive film 620 decomposed by the UV laser beam 700. Therefore, the developer does not react with the photosensitive film 620 to which the UV laser beam 700 has not been scanned, but a material capable of reacting with and removing the photosensitive film 620 decomposed by the UV laser beam 700 should be used. This developer is developed using sodium hydroxide, potassium hydroxide or organic bases (H ₂ O).

After development, a hard baking process is performed to align the photosensitive film 620 on which the pattern is formed. Hard baking is necessary to realign the tissues that were released during development.

The micropattern 210 is formed by scanning a UV laser beam 700 having a diameter 710 having a diameter 710 on the photosensitive film 620 itself, instead of placing a mask on which a pattern is formed on the roll surface 510 and scanning with UV light. do. Therefore, it is not necessary to manufacture a mask separately, and it is possible to make the area to form a pattern large. Since the photoresist film 620 itself forms a pattern, there is no need for coating, deposition, etching, or etching of other materials, and no post-processing process such as removing the photoresist film 620 later.

(UV laser scanning device)

5 shows a specific apparatus for scanning a UV laser beam 700. As shown in Figure 5, the gear 830 is connected to the drive motor 820, which is adjustable speed. The gear shaft 840 is fixed with the roll 500 by the roll 500 fixing device 810 and the gear shaft 840 is supported by two supports 860. Operation of the drive motor 820 causes the roll 500 along with the gear shaft 840 to rotate about the axis 880. The UV laser beam 700 is scanned by the UV laser beam forming means 800. The UV laser beam forming means 800 is connected to the axis 870 to enable one-dimensional movement in parallel with the axis 880 of the roll 500. Accordingly, the UV laser beam 700 may be scanned on the roll surface 510 by the rotational motion of the roll 500 and the uniaxial ultra-precision stage transfer of the UV laser beam 700 to form a two-dimensional pattern. This single-axis ultra-precision stage feed should have a precision of 100 nm or less.

In addition, the UV laser beam forming means 800 is not only a one-dimensional movement parallel to the axis 880, but also the axis 880 of the roll 500 so that the UV laser beam 700 can adjust the distance to the photosensitive film 620. ) And vertical movement is possible.

The UV laser beam 700 is produced by projecting a UV laser diode 720 emitting a UV wavelength to be used onto a lens 740 having a focal point 750. The UV light projecting the lens 740 becomes a UV laser beam 700 to have a diameter 710 of a fine size. The diameter 710 of the UV laser beam 700 becomes larger as it moves away from the focal point 750. In addition, since the diameter 710 of the UV laser beam 700 is affected by the angle of refraction θ when the lens 740 is projected, the diameter 710 of the UV laser beam 700 may vary depending on the wavelength of the UV light. As a result, the diameter 710 of the laser beam 700 is determined by the wavelength of the UV light and the distance between the lens focal point 750.

As a specific example, Figure 6 shows an enlarged view of the portion where the UV laser is scanned. This shows the effect of the diameter 710 of the laser beam 700, the wavelength of UV light and the distance d of the photoresist 620 and the lens focal 750 on the width 220 of the micropattern 210 to be formed. Can be. The UV light is projected by placing a lens 740 having a focal length 750 of 95 μm on a 405 nm laser diode 720 that emits a wavelength of 405 nm among UV light. When the UV light is projected onto the lens 740, it is collected by the UV laser beam 700, the refractive angle (θ) is tan ^-1 0.5 = 26.565 °. The distance d between the focal point 750 and the photosensitive film 620 to be scanned is 5 μm. Therefore, since the refraction angle is 26.565 ° and the distance d between the focal point 750 and the photoresist film 620 is known, the diameter of the portion where the UV laser beam 700 is scanned on the photoresist film 620 to be scanned by Pythagorean theorem ( 710 becomes 5 micrometers. In the case of the UV-curing photoresist, only a portion where the UV laser beam 700 is scanned is left after the development step, thereby forming a fine pattern 210 having a width 220 of 5 μm.

Therefore, the wavelength of UV light, which is one of the factors that determine the width 220 of the micropattern 210, is 365 nm (l-line), 405 nm (h-line) or 436 nm (g-line). This determines the refractive index and the energy of the light source when the lens 740 is projected.

 If it is desired to form a pattern of constant width 220 when scanning the UV laser beam 700, the UV laser beam forming means 800 makes a one-dimensional movement parallel to the axis 880 of the roll 500. . Then, the two-dimensional fine pattern 210 is formed by the rotational movement of the roll 500.

However, if the width 220 of the micropattern 210 is to be changed, the width 220 of the micropattern 210 may be adjusted by adjusting the distance d between the laser beam 700 and the photosensitive film 620. That is, when the distance d between the focal point 750 and the photosensitive film 620 is close, the diameter 710 of the UV laser beam 700 that is scanned on the photosensitive film 620 is reduced, so that the width 220 of the fine pattern 210 is reduced. ) Will be smaller. On the other hand, as the distance d between the focal point 750 and the photoresist layer 620 increases, the width 220 of the fine pattern 210 will increase. Thus, the UV laser beam forming means 800 must be movable in a direction perpendicular to the axis 880 of the roll 500. That is, the micro-pattern 210 is formed by scanning the laser beam 700 to the photosensitive film 620 by the transfer of the three-axis ultra-precision stage.

In addition, the scanning time of the UV laser beam 700 will scan a part until the UV curing photosensitive agent is cured, and in the case of UV degradation photosensitive agent will scan the UV laser until the photosensitive agent is decomposed. This is controlled by the rotational speed of the roll 500 and the moving speed in the direction of the axis 880 of the roll 500 of the UV laser beam 700.

The curing time or decomposition time of the photosensitizer will also be determined by the focus of the UV laser. The focusing of the UV laser beam 700 means the energy of UV light per unit area. Therefore, the smaller the diameter 710 of the beam 700, the greater the energy per unit area, so the larger the focusing, the shorter the scanning time of the UV laser. Since the diameter 710 of the UV laser beam 700 scanned on the photosensitive film 620 becomes the width 220 of the micropattern 210, the smaller the width 220 of the micropattern 210 to be required, the scanning time of the laser. Will be small.

Therefore, the energy of the light source itself is determined according to the wavelength of the selected UV light, and the focusing will be determined by the distance d between the focal point 750 and the photoresist film 620. Considering the UV wavelength and the distance d between the focal point 750 and the photosensitive film 620, the UV laser scanning time is determined so that the UV laser beam 700 moves in parallel with the roll 500 axis 880. It will be necessary to determine the rotational speed of the roll 500.

1 is a flow chart of a method of first coating a sacrificial layer to imprint without a residual image removal film removal process;

2A is a side view of a substrate coated with a sacrificial layer,

2B is a side view of a substrate on which an image photosensitive film is formed on a sacrificial layer;

2C is a side view of the roll mold and the substrate at regular intervals above the substrate before roll mold pressing;

2D is a side view of a substrate on which UV light is scanned in a state in which a roll mold is pressed onto the image photosensitive film and the sacrificial layer;

2E is a side view of a substrate on which an image photosensitive film forms a pattern;

Figure 2f is a side view of the substrate removed by the development process the sacrificial layer exposed to the outside,

2G is a side view of a metal deposited on a patterned substrate;

2H is a side view of a substrate on which fine metal wirings are formed by removing a sacrificial layer;

3 is a flowchart of a roll mold manufacturing process in which a fine pattern is formed using a UV laser on a printing roll;

4A is a partially enlarged view of a state in which a UV curing photosensitive film is formed on a printing roll;

4B is a partially enlarged view of a state in which the UV photosensitive film is scanned on the UV cured photosensitive film to cure the photosensitive film of the scanned portion;

4C is a partially enlarged view of a state in which a micropattern is formed on a surface of a roll by removing an uncured UV cured photosensitive film with a developer;

5 is a configuration diagram of a UV laser beam scanning device,

6 shows an enlarged view of a portion which scans a UV laser beam.

Description of the Related Art [0002]

100: substrate

110: victim layer

120: an image photosensitive film

130: Cured image photoresist

200: roll mold

210: roll mold fine pattern

220: width of the roll mold fine pattern

300: metal

400: UV light scanned on the substrate

500: Roll

510: roll surface

600: UV cured photosensitive film

610: cured photosensitive film

620: photosensitive film

700: UV laser beam

710: UV laser beam diameter

720: UV laser diode

730: UV light of UV laser diode

740: a lens

750: Focus

800: UV laser beam forming means

810: fixing device

820: drive motor

830: gear

840: gear shaft

850: Bearing

860: support

870: axis

880: axis

Claims (20)

In the method of imprinting, Coating a sacrificial layer (110) that does not respond to light on the substrate (100); Soft baking to fix the sacrificial layer (110); Forming an image photoresist film (120) by coating a photoresist cured by the light on the sacrificial layer (110); Pressing the sacrificial layer (110) and the image photoresist layer (120) with a roll mold (200) having a fine pattern (210) formed thereon; Pressing the roll mold 200 to harden the image photoresist film by scanning the light while the fine pattern 210 is formed; A developing step of removing the sacrificial layer 140 exposed to the outside with a developer; Hard baking the alignment of the image photoresist layer 120 and the sacrificial layer 110; Depositing a metal film (300) on the substrate (100); Soft baking to fix the metal film 300 deposited on the substrate 100; And And removing the sacrificial layer 110 to form fine metal wirings on the substrate 100. The roll mold 200, Coating a photosensitive agent, which is cured or decomposed by UV light, on a roll surface to form a photosensitive film 620; Soft baking to fix the photoresist film 620; Scanning a UV laser beam (700) on the photosensitive film (620); A development step of selectively removing the photosensitive film 620 scanned by the UV laser beam 700; and Hard baking to align the photoresist film 620 after development; Imprinting method without a residual photoresist, characterized in that to form the fine pattern 210 on the surface of the printing roll using a UV laser. delete The method of claim 1, The photosensitizer is to be cured by UV light, Imprinting method without a residual photoresist, characterized in that for curing the image photoresist film 120 by scanning the UV light 400 to the entire substrate (100). The method of claim 3, wherein In the step of curing the image photosensitive film, And the light source of the UV light is positioned under the substrate to scan the UV light. The method of claim 1, The developer does not react with the sacrificial layer (110), but does not react with the cured image photoresist (130). The method of claim 1, The coating of the sacrificial layer (110) or the image photosensitive film (120) is a slit coating, a spray coating, an imprinting method without a residual photoresist, characterized in that the coating or roll-to-roll printing coating using anilox roll. delete The method of claim 1, The UV laser beam 700, Imprint method without residual photoresist, characterized in that to form a fine pattern 210 by scanning through a UV laser scanning device capable of three-axis ultra-precision stage transfer. The method of claim 1, In the developing step of selectively removing the photosensitive film 620 scanned by the UV laser beam 700, In the case of the photosensitive film 620 that is decomposed by the UV laser, the portion where the UV laser beam 700 is scanned is removed by a developer. The developer does not react with the photosensitive film (620) that is not decomposed, but the remaining photosensitive film is imprinting method characterized in that the reaction with the decomposed photosensitive film (620). The method of claim 1, In the developing step of selectively removing the photosensitive film 620 scanned by the UV laser beam 700, In the case of the photosensitive film 620 which is cured by the UV laser, a portion which does not scan the UV laser beam 700 is removed by a developer. The developing solution does not have a residual photoresist film, characterized in that the reaction did not react with the cured photoresist film (620). The method of claim 1, The width 220 of the micropattern 210 formed on the roll surface 510 has a residual photoresist film, characterized in that 0.5 ~ 10㎛. The method of claim 1, The surface on which the micropattern 210 is formed on the roll surface 510 is relatively wider than the surface on which the micropattern 210 is not formed. The method of claim 8, The UV laser scanning device, Rotating means for rotating the printing roll (500) about an axis (880) of the roll (500); An axis 870 provided parallel to the axis 880 at regular intervals from the roll surface 510; And a UV laser beam forming means (800) for moving the axis (870) to scan the UV laser beam (700) onto the roll surface (510). The method of claim 13, The rotating means, Drive motor capable of adjusting the speed 820; And A gear shaft 840 connected to the driving motor 820 and installed in the direction of the axis 880; and And a support (860) having a bearing (850) for supporting the gear shaft (840). The method of claim 13, The UV laser beam forming means 800 is a UV laser diode 720 for generating UV light; And The UV light is transmitted through the lens 740 to form a focus 750, including the UV light 730 to the lens 740 to form a UV laser beam 700 that is collected into the focus Imprint method without residual photoresist, characterized in that. The method of claim 15, The diameter 710 of the UV laser beam 700 is determined according to the wavelength of the UV laser diode 720 and the distance to the focal point 750 of the lens 740, there is no residual photoresist imprinting Way. The method of claim 16, The diameter 710 of the UV laser beam 700 is an imprinting method without a residual photoresist, characterized in that 0.2 ~ 10㎛. The method of claim 13, The UV laser beam forming means 800 performs a one-dimensional motion in parallel with the axis 880, the roll 500 is a rotational movement by the UV laser beam 700 in the two-dimensional fine pattern An imprinting method without a residual photoresist film characterized by forming (210). The method of claim 18, The UV laser beam forming means (800) is an imprinting method without a residual photoresist, characterized in that the single axis ultra-precision stage of less than 100nm precision. The method of claim 13, And the UV laser beam forming means (800) moves in a direction perpendicular to the axis (880) of the roll (500).

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