KR101011076B1 - 관측 시스템 - Google Patents
관측 시스템 Download PDFInfo
- Publication number
- KR101011076B1 KR101011076B1 KR1020047016803A KR20047016803A KR101011076B1 KR 101011076 B1 KR101011076 B1 KR 101011076B1 KR 1020047016803 A KR1020047016803 A KR 1020047016803A KR 20047016803 A KR20047016803 A KR 20047016803A KR 101011076 B1 KR101011076 B1 KR 101011076B1
- Authority
- KR
- South Korea
- Prior art keywords
- delete delete
- camera
- plate
- robot
- processing system
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
- B25J9/1697—Vision controlled systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
Description
Claims (82)
- 반도체 처리 시스템을 위한 관측(vision) 시스템으로서,반도체 처리 시스템에 사용하기 위해 구성된 적어도 하나의 로봇;상기 로봇에 연결된 엔드 이펙터(end effector);상기 로봇에 의해 선택적으로 위치되는 카메라;상기 카메라에 연결된 송신기(transmitter); 및상기 엔드 이펙터에 의해 전달(carry)되지 않을 때 상기 반도체 처리 시스템에서 상기 카메라를 지지하기 위한 도킹 스테이션(docking station)을 포함하는 반도체 처리 시스템을 위한 관측 시스템.
- 삭제
- 제 1 항에 있어서,상기 로봇에 의해 상기 반도체 처리 시스템을 통하여 이송되도록 구성된 플레이트(plate)를 더 포함하고,상기 플레이트는 상기 플레이트의 제 2 측면으로부터 연장하여 다른 물체에 대해 상기 플레이트를 배치하도록 구성된 적어도 두 개의 핀(fin)들을 포함하는,반도체 처리 시스템을 위한 관측 시스템.
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 제 1 항에 있어서,상기 카메라는 적어도 제 1 축을 중심으로 회전(swivel)할 수 있는, 반도체 처리 시스템을 위한 관측 시스템.
- 삭제
- 삭제
- 삭제
- 제 1 항에 있어서,상기 로봇은 진공 챔버 내에 하우징(house)되는, 반도체 처리 시스템을 위한 관측 시스템.
- 삭제
- 삭제
- 제 1 항에 있어서,상기 로봇의 엔드 이펙터는 상기 로봇의 엔드 이펙트를 통하여 형성된 홀(hole)을 더 포함하며, 상기 홀은 상기 카메라가 상기 홀을 통하여 관측할 수 있도록 구성되는, 반도체 처리 시스템을 위한 관측 시스템.
- 제 3 항에 있어서,상기 플레이트는 상기 플레이트로부터 연장되며 상기 엔드 이펙트 내에 형성된 홀에 수용되는 적어도 하나의 로케이팅 핀(locating pin)을 더 포함하는, 반도체 처리 시스템을 위한 관측 시스템.
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 제 3 항에 있어서,상기 도킹 스테이션은 배터리를 재충전하기 위한 장치를 더 포함하는, 반도체 처리 시스템을 위한 관측 시스템.
- 제 28 항에 있어서,상기 도킹 스테이션은 상기 플레이트 또는 상기 배터리에 형성된 전기적 콘택에 접촉하게(against) 배치된 적어도 하나의 전기적 콘택을 더 포함하며, 상기 전기적 콘택들은 상기 배터리를 재충전하기 위한 전류 경로를 제공하는, 반도체 처리 시스템을 위한 관측 시스템.
- 제 3 항에 있어서,상기 송신기를 동작시키기 위해 상기 플레이트에 연결된 스위치를 더 포함하는, 반도체 처리 시스템을 위한 관측 시스템.
- 제 30 항에 있어서,상기 스위치는 상기 로봇의 엔드 이펙터의 접근에 응답하여 동작되는(activated), 반도체 처리 시스템을 위한 관측 시스템.
- 제 30 항에 있어서,상기 스위치는 사용되지 않을 때 상기 플레이트를 지지하는 도킹 스테이션의 접근에 응답하여 동작해제되는(deactivated), 반도체 처리 시스템을 위한 관측 시스템.
- 제 3 항에 있어서,상기 카메라의 시야(field of view) 바깥쪽의 이미지들을 상기 카메라가 관측할 수 있도록 하기 위해 상기 플레이트에 연결된 반사기(reflector)를 더 포함하는, 반도체 처리 시스템을 위한 관측 시스템.
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 반도체 처리 시스템을 위한 관측 시스템으로서,기판 이송 로봇에 의해 반도체 처리 시스템 주위에 이송되도록 구성된 웨이퍼-크기의 플레이트;상기 플레이트에 연결된 카메라 ― 상기 카메라는 적어도 제 1 축을 중심으로 상기 플레이트에 대하여 회전할 수 있음 ―;상기 카메라에 관측된 물체들을 나타내는 신호를 생성하기 위해 상기 플레이트의 제 1 측면에 연결된 송신기; 및상기 송신기에 전력을 공급하기 위해 상기 플레이트에 연결된 배터리를 포함하는 반도체 처리 시스템을 위한 관측 시스템.
- 제 80 항에 있어서,상기 카메라는 제 2 축을 중심으로 상기 플레이트에 대하여 회전하도록 구성되는, 반도체 처리 시스템을 위한 관측 시스템.
- 반도체 처리 시스템을 위한 관측 시스템으로서,기판 이송 로봇에 의해 반도체 처리 시스템 주위에 이송되도록 구성된 웨이퍼-크기의 플레이트;상기 플레이트에 연결된 카메라;상기 카메라에 관측된 물체들을 나타내는 신호를 생성하기 위해 상기 플레이트의 제 1 측면에 연결된 송신기;상기 송신기에 전력을 공급하기 위해 상기 플레이트에 연결된 배터리; 및상기 카메라의 시야 바깥쪽의 이미지들을 상기 카메라가 관측할 수 있도록 하기 위해 상기 플레이트에 연결된 반사기를 포함하는 반도체 처리 시스템을 위한 관측 시스템.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/126,493 | 2002-04-19 | ||
US10/126,493 US7085622B2 (en) | 2002-04-19 | 2002-04-19 | Vision system |
PCT/US2003/012288 WO2004017387A2 (en) | 2002-04-19 | 2003-04-18 | Vision system |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040101540A KR20040101540A (ko) | 2004-12-02 |
KR101011076B1 true KR101011076B1 (ko) | 2011-01-25 |
Family
ID=29215040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020047016803A KR101011076B1 (ko) | 2002-04-19 | 2003-04-18 | 관측 시스템 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7085622B2 (ko) |
EP (1) | EP1514094B1 (ko) |
JP (1) | JP4703187B2 (ko) |
KR (1) | KR101011076B1 (ko) |
CN (1) | CN1653326B (ko) |
AU (1) | AU2003285810A1 (ko) |
DE (1) | DE60309467T2 (ko) |
WO (1) | WO2004017387A2 (ko) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6244121B1 (en) * | 1998-03-06 | 2001-06-12 | Applied Materials, Inc. | Sensor device for non-intrusive diagnosis of a semiconductor processing system |
US7085622B2 (en) * | 2002-04-19 | 2006-08-01 | Applied Material, Inc. | Vision system |
US7233841B2 (en) * | 2002-04-19 | 2007-06-19 | Applied Materials, Inc. | Vision system |
US6952255B2 (en) * | 2003-08-06 | 2005-10-04 | Lam Research Corporation | System and method for integrated multi-use optical alignment |
US7107125B2 (en) * | 2003-10-29 | 2006-09-12 | Applied Materials, Inc. | Method and apparatus for monitoring the position of a semiconductor processing robot |
US8111904B2 (en) | 2005-10-07 | 2012-02-07 | Cognex Technology And Investment Corp. | Methods and apparatus for practical 3D vision system |
US7549204B1 (en) * | 2005-11-30 | 2009-06-23 | Western Digital Technologies, Inc. | Methods for picking and placing workpieces into small form factor hard disk drives |
US8744624B1 (en) * | 2006-05-11 | 2014-06-03 | Kla-Tencor Corporation | Substrate alignment system |
WO2007149183A2 (en) * | 2006-05-25 | 2007-12-27 | Braintech Canada, Inc. | System and method of robotically engaging an object |
US7695232B2 (en) * | 2006-06-15 | 2010-04-13 | Applied Materials, Inc. | Multi-level load lock chamber, transfer chamber, and robot suitable for interfacing with same |
US20080013823A1 (en) * | 2006-06-30 | 2008-01-17 | Behnke Merlin E | Overhead traveling camera inspection system |
WO2008036354A1 (en) | 2006-09-19 | 2008-03-27 | Braintech Canada, Inc. | System and method of determining object pose |
KR20090085576A (ko) * | 2006-10-23 | 2009-08-07 | 싸이버옵틱스 쎄미콘덕터 인코퍼레이티드 | 기판 핸들링 로봇의 교정 방법 |
US20080276867A1 (en) | 2007-05-09 | 2008-11-13 | Jason Schaller | Transfer chamber with vacuum extension for shutter disks |
TWI326353B (en) * | 2007-05-29 | 2010-06-21 | Ind Tech Res Inst | Anomaly detection system and method |
US8126260B2 (en) | 2007-05-29 | 2012-02-28 | Cognex Corporation | System and method for locating a three-dimensional object using machine vision |
US8224607B2 (en) * | 2007-08-30 | 2012-07-17 | Applied Materials, Inc. | Method and apparatus for robot calibrations with a calibrating device |
US8260461B2 (en) * | 2007-08-30 | 2012-09-04 | Applied Materials, Inc. | Method and system for robot calibrations with a camera |
DK2190530T3 (en) * | 2007-09-13 | 2018-02-19 | Toby D Henderson | PATIENT POSITIONING SYSTEM |
US8923602B2 (en) * | 2008-07-22 | 2014-12-30 | Comau, Inc. | Automated guidance and recognition system and method of the same |
CN102112274B (zh) * | 2008-08-01 | 2014-11-19 | 爱发科股份有限公司 | 搬运机器人的示教方法 |
US8559699B2 (en) | 2008-10-10 | 2013-10-15 | Roboticvisiontech Llc | Methods and apparatus to facilitate operations in image based systems |
US8341593B2 (en) * | 2008-10-23 | 2012-12-25 | Sap Ag | Integrated development framework for composite applications |
US9734419B1 (en) | 2008-12-30 | 2017-08-15 | Cognex Corporation | System and method for validating camera calibration in a vision system |
US8712571B2 (en) * | 2009-08-07 | 2014-04-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for wireless transmission of diagnostic information |
US11699247B2 (en) * | 2009-12-24 | 2023-07-11 | Cognex Corporation | System and method for runtime determination of camera miscalibration |
US9393694B2 (en) | 2010-05-14 | 2016-07-19 | Cognex Corporation | System and method for robust calibration between a machine vision system and a robot |
JP6111065B2 (ja) * | 2012-12-28 | 2017-04-05 | 川崎重工業株式会社 | 自動教示システム及び教示方法 |
JP2014188617A (ja) * | 2013-03-27 | 2014-10-06 | Seiko Epson Corp | ロボット制御システム、ロボット、ロボット制御方法及びプログラム |
US9442482B2 (en) * | 2013-04-29 | 2016-09-13 | GlobalFoundries, Inc. | System and method for monitoring wafer handling and a wafer handling machine |
US9111979B2 (en) * | 2013-05-16 | 2015-08-18 | Kevin P Fairbairn | System and method for real time positioning of a substrate in a vacuum processing system |
US10203683B2 (en) | 2013-07-16 | 2019-02-12 | Seagate Technology Llc | Coordinating end effector and vision controls |
US9555549B2 (en) * | 2013-10-31 | 2017-01-31 | Seiko Epson Corporation | Control device, robot, robot system, and control method |
US9464938B2 (en) | 2014-02-06 | 2016-10-11 | The Boeing Company | Systems and methods for measuring polarization of light in images |
JP2015168012A (ja) * | 2014-03-04 | 2015-09-28 | 株式会社安川電機 | 教示ジグ、教示システムおよび教示方法 |
RS56492B1 (sr) | 2014-10-23 | 2018-01-31 | Comau Spa | Sistem za nadzor i upravljanje industrijskim postrojenjem |
WO2016077387A1 (en) | 2014-11-10 | 2016-05-19 | Brooks Automation, Inc. | Tool auto-teach method and apparatus |
CN107324041B (zh) | 2016-04-29 | 2019-11-26 | 上海微电子装备(集团)股份有限公司 | 用于片盒夹持的机械手及自动片盒搬运装置 |
WO2017192250A1 (en) * | 2016-05-05 | 2017-11-09 | Applied Materials, Inc | Robot subassemblies, end effector assemblies, and methods with reduced cracking |
US10090188B2 (en) | 2016-05-05 | 2018-10-02 | Applied Materials, Inc. | Robot subassemblies, end effector assemblies, and methods with reduced cracking |
WO2017196540A1 (en) | 2016-05-13 | 2017-11-16 | Applied Materials, Inc. | Sensor based auto-calibration wafer |
KR20170140963A (ko) * | 2016-06-14 | 2017-12-22 | (주)제이티 | 무선이동모듈, 그가 설치된 소자핸들러 |
JP6923344B2 (ja) | 2017-04-13 | 2021-08-18 | 株式会社Screenホールディングス | 周縁処理装置および周縁処理方法 |
JP7021877B2 (ja) | 2017-08-08 | 2022-02-17 | 株式会社Screenホールディングス | 基板処理装置、位置合わせ装置および位置合わせ方法 |
IT201800005091A1 (it) | 2018-05-04 | 2019-11-04 | "Procedimento per monitorare lo stato di funzionamento di una stazione di lavorazione, relativo sistema di monitoraggio e prodotto informatico" | |
JP2019216152A (ja) * | 2018-06-12 | 2019-12-19 | 株式会社荏原製作所 | 基板搬送システムのためのティーチング装置およびティーチング方法 |
JP7103910B2 (ja) * | 2018-10-15 | 2022-07-20 | 東京エレクトロン株式会社 | 組付け状態提示装置および組付け状態提示方法 |
WO2020091846A1 (en) | 2018-10-30 | 2020-05-07 | Mujin, Inc. | Automated package registration systems, devices, and methods |
US10369701B1 (en) | 2018-10-30 | 2019-08-06 | Mujin, Inc. | Automated package registration systems, devices, and methods |
CN111230858B (zh) * | 2019-03-06 | 2022-11-22 | 南昌工程学院 | 基于增强学习的视觉机器人运动控制方法 |
JP2022542946A (ja) * | 2019-07-29 | 2022-10-07 | ラム リサーチ コーポレーション | 基板処理システムの自律的な制御及び検査のためのハードウェア・ソフトウェア統合型コンピュータビジョンシステム |
US11164769B2 (en) * | 2019-07-30 | 2021-11-02 | Brooks Automation, Inc. | Robot embedded vision apparatus |
CN111239139B (zh) * | 2020-01-21 | 2020-11-03 | 珠海锐翔智能科技有限公司 | 双工位fpc补材偏移、重贴/漏贴检查机 |
US11676845B2 (en) | 2020-06-30 | 2023-06-13 | Brooks Automation Us, Llc | Automated teach apparatus for robotic systems and method therefor |
JP2022060712A (ja) * | 2020-10-05 | 2022-04-15 | キオクシア株式会社 | 半導体製造装置 |
JP7121787B2 (ja) * | 2020-10-29 | 2022-08-18 | 日本発條株式会社 | ロボットハンド |
CN113295704B (zh) * | 2021-05-21 | 2024-02-09 | 内蒙古汇栋科技有限公司 | 机器人打磨视觉在线检测系统 |
KR20230033129A (ko) | 2021-08-27 | 2023-03-08 | 삼성전자주식회사 | 티칭 장치 및 이를 이용한 기판 정렬 장치 |
CN117664862B (zh) * | 2024-01-31 | 2024-06-18 | 宁德时代新能源科技股份有限公司 | 极耳检测系统和极耳检测方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010030320A (ko) * | 1999-09-07 | 2001-04-16 | 조셉 제이. 스위니 | 기판 검사 장치 및 방법 |
WO2002029393A2 (en) | 2000-10-06 | 2002-04-11 | Applied Materials, Inc. | Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques |
KR20040012667A (ko) * | 2000-10-06 | 2004-02-11 | 어플라이드 머티어리얼스, 인코포레이티드 | 자동 프로세스 검증 및 계층적 기판 검사를 위한 방법 및장치 |
Family Cites Families (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4119381A (en) * | 1976-12-17 | 1978-10-10 | Eastman Kodak Company | Incubator and radiometric scanner |
US5012574A (en) * | 1981-02-27 | 1991-05-07 | Diffracto Ltd. | Controlled machining of combustion chambers gears and other surfaces |
US4819167A (en) * | 1987-04-20 | 1989-04-04 | Applied Materials, Inc. | System and method for detecting the center of an integrated circuit wafer |
US5435682A (en) * | 1987-10-15 | 1995-07-25 | Advanced Semiconductor Materials America, Inc. | Chemical vapor desposition system |
US5717785A (en) * | 1992-01-30 | 1998-02-10 | Cognex Corporation | Method and apparatus for locating patterns in an optical image |
US5446584A (en) * | 1989-09-11 | 1995-08-29 | Kensington Laboratories, Inc. | Compact specimen processing station |
IL99823A0 (en) * | 1990-11-16 | 1992-08-18 | Orbot Instr Ltd | Optical inspection method and apparatus |
DE69329269T2 (de) * | 1992-11-12 | 2000-12-28 | Applied Materials, Inc. | System und Verfahren für automatische Positionierung eines Substrats in einem Prozessraum |
US5479252A (en) * | 1993-06-17 | 1995-12-26 | Ultrapointe Corporation | Laser imaging system for inspection and analysis of sub-micron particles |
JP3261841B2 (ja) * | 1993-12-27 | 2002-03-04 | 株式会社日立製作所 | マルチ式ウエ−ハ処理装置 |
US5452521A (en) * | 1994-03-09 | 1995-09-26 | Niewmierzycki; Leszek | Workpiece alignment structure and method |
US5563798A (en) * | 1994-04-05 | 1996-10-08 | Applied Materials, Inc. | Wafer positioning system |
US6712577B2 (en) * | 1994-04-28 | 2004-03-30 | Semitool, Inc. | Automated semiconductor processing system |
US5552891A (en) * | 1994-10-31 | 1996-09-03 | International Business Machines Corporation | Automated mask alignment for UV projection expose system |
US5738574A (en) * | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
SG54995A1 (en) * | 1996-01-31 | 1998-12-21 | Texas Instr Singapore Pet Ltd | Method and apparatus for aligning the position of die on a wafer table |
JP3454400B2 (ja) * | 1996-02-16 | 2003-10-06 | 三井金属鉱業株式会社 | 繰返しパターンの検査方法 |
GB2310716A (en) * | 1996-02-28 | 1997-09-03 | Daewoo Electronics Co Ltd | Recognition of a fiducial mark on a printed circuit board |
US5844683A (en) * | 1996-05-22 | 1998-12-01 | Applied Materials, Inc. | Position sensor system for substrate holders |
US5980194A (en) * | 1996-07-15 | 1999-11-09 | Applied Materials, Inc. | Wafer position error detection and correction system |
US5946083A (en) * | 1997-10-01 | 1999-08-31 | Texas Instruments Incorporated | Fixed optic sensor system and distributed sensor network |
TW350115B (en) * | 1996-12-02 | 1999-01-11 | Toyota Automatic Loom Co Ltd | Misregistration detection device and method thereof |
US5889593A (en) * | 1997-02-26 | 1999-03-30 | Kla Instruments Corporation | Optical system and method for angle-dependent reflection or transmission measurement |
US6757645B2 (en) * | 1997-09-17 | 2004-06-29 | Numerical Technologies, Inc. | Visual inspection and verification system |
US6002840A (en) * | 1997-09-30 | 1999-12-14 | Brooks Automation Inc. | Substrate transport apparatus |
US6012965A (en) * | 1997-10-07 | 2000-01-11 | Micro Optics Design Corp. | Manufacturing ophthalmic lenses using lens structure cognition and spatial positioning system |
AU1351199A (en) * | 1997-12-03 | 1999-06-16 | Nikon Corporation | Substrate transferring device and method |
JPH11207611A (ja) * | 1998-01-21 | 1999-08-03 | Shin Etsu Handotai Co Ltd | 両面研磨装置におけるワークの自動搬送装置 |
US6198976B1 (en) * | 1998-03-04 | 2001-03-06 | Applied Materials, Inc. | On the fly center-finding during substrate handling in a processing system |
US6244121B1 (en) * | 1998-03-06 | 2001-06-12 | Applied Materials, Inc. | Sensor device for non-intrusive diagnosis of a semiconductor processing system |
US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
US6051113A (en) * | 1998-04-27 | 2000-04-18 | Cvc Products, Inc. | Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure using target indexing |
JP3507330B2 (ja) * | 1998-05-18 | 2004-03-15 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2937244B1 (ja) * | 1998-05-20 | 1999-08-23 | 株式会社東京精密 | ウェーハのパターン撮像装置 |
US6352466B1 (en) * | 1998-08-31 | 2002-03-05 | Micron Technology, Inc. | Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
US6477265B1 (en) * | 1998-12-07 | 2002-11-05 | Taiwan Semiconductor Manufacturing Company | System to position defect location on production wafers |
JP4255091B2 (ja) * | 1999-04-07 | 2009-04-15 | 株式会社日立国際電気 | 半導体製造方法 |
US6166509A (en) * | 1999-07-07 | 2000-12-26 | Applied Materials, Inc. | Detection system for substrate clamp |
US6630995B1 (en) * | 1999-09-07 | 2003-10-07 | Applied Materials, Inc. | Method and apparatus for embedded substrate and system status monitoring |
US6882416B1 (en) * | 1999-09-07 | 2005-04-19 | Applied Materials, Inc. | Methods for continuous embedded process monitoring and optical inspection of substrates using specular signature analysis |
US6707545B1 (en) * | 1999-09-07 | 2004-03-16 | Applied Materials, Inc. | Optical signal routing method and apparatus providing multiple inspection collection points on semiconductor manufacturing systems |
US6721045B1 (en) | 1999-09-07 | 2004-04-13 | Applied Materials, Inc. | Method and apparatus to provide embedded substrate process monitoring through consolidation of multiple process inspection techniques |
US6693708B1 (en) * | 1999-09-07 | 2004-02-17 | Applied Materials, Inc. | Method and apparatus for substrate surface inspection using spectral profiling techniques |
JP2001210692A (ja) | 2000-01-26 | 2001-08-03 | Ebara Corp | ティーチングの方法 |
US6532403B2 (en) * | 2000-04-21 | 2003-03-11 | Microtool, Inc | Robot alignment system and method |
US6691068B1 (en) * | 2000-08-22 | 2004-02-10 | Onwafer Technologies, Inc. | Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control |
JP2002100664A (ja) * | 2000-09-25 | 2002-04-05 | Hitachi Kokusai Electric Inc | 基板処理方法および装置 |
US6648730B1 (en) * | 2000-10-30 | 2003-11-18 | Applied Materials, Inc. | Calibration tool |
US6591160B2 (en) | 2000-12-04 | 2003-07-08 | Asyst Technologies, Inc. | Self teaching robot |
WO2002062069A1 (en) * | 2001-01-30 | 2002-08-08 | Greene, Tweed Of Delaware, Inc. | Monitoring system for hostile environment |
US6591161B2 (en) | 2001-01-31 | 2003-07-08 | Wafermasters, Inc. | Method for determining robot alignment |
US6873720B2 (en) * | 2001-03-20 | 2005-03-29 | Synopsys, Inc. | System and method of providing mask defect printability analysis |
JP3694808B2 (ja) | 2001-04-13 | 2005-09-14 | 株式会社安川電機 | ウェハ搬送用ロボットの教示方法および教示用プレート |
US6671660B2 (en) * | 2001-04-19 | 2003-12-30 | Onwafer Technologies, Inc. | Methods and apparatus for power control |
JP4041797B2 (ja) | 2001-06-28 | 2008-01-30 | ポラック ラボラトリーズ インコーポレイテッド | 内蔵型センサ装置 |
US7289230B2 (en) | 2002-02-06 | 2007-10-30 | Cyberoptics Semiconductors, Inc. | Wireless substrate-like sensor |
US20050233770A1 (en) * | 2002-02-06 | 2005-10-20 | Ramsey Craig C | Wireless substrate-like sensor |
US7233841B2 (en) * | 2002-04-19 | 2007-06-19 | Applied Materials, Inc. | Vision system |
US7085622B2 (en) * | 2002-04-19 | 2006-08-01 | Applied Material, Inc. | Vision system |
US6900877B2 (en) * | 2002-06-12 | 2005-05-31 | Asm American, Inc. | Semiconductor wafer position shift measurement and correction |
JP4257570B2 (ja) | 2002-07-17 | 2009-04-22 | 株式会社安川電機 | 搬送用ロボットのティーチング装置および搬送用ロボットのティーチング方法 |
US6890050B2 (en) * | 2002-08-20 | 2005-05-10 | Palo Alto Research Center Incorporated | Method for the printing of homogeneous electronic material with a multi-ejector print head |
US20050137751A1 (en) * | 2003-12-05 | 2005-06-23 | Cox Damon K. | Auto-diagnostic method and apparatus |
-
2002
- 2002-04-19 US US10/126,493 patent/US7085622B2/en not_active Expired - Lifetime
-
2003
- 2003-04-18 EP EP03788226A patent/EP1514094B1/en not_active Expired - Lifetime
- 2003-04-18 CN CN038108046A patent/CN1653326B/zh not_active Expired - Lifetime
- 2003-04-18 WO PCT/US2003/012288 patent/WO2004017387A2/en active IP Right Grant
- 2003-04-18 DE DE60309467T patent/DE60309467T2/de not_active Expired - Lifetime
- 2003-04-18 KR KR1020047016803A patent/KR101011076B1/ko active IP Right Grant
- 2003-04-18 AU AU2003285810A patent/AU2003285810A1/en not_active Abandoned
- 2003-04-18 JP JP2004529057A patent/JP4703187B2/ja not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010030320A (ko) * | 1999-09-07 | 2001-04-16 | 조셉 제이. 스위니 | 기판 검사 장치 및 방법 |
WO2002029393A2 (en) | 2000-10-06 | 2002-04-11 | Applied Materials, Inc. | Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques |
KR20040012667A (ko) * | 2000-10-06 | 2004-02-11 | 어플라이드 머티어리얼스, 인코포레이티드 | 자동 프로세스 검증 및 계층적 기판 검사를 위한 방법 및장치 |
Also Published As
Publication number | Publication date |
---|---|
WO2004017387A3 (en) | 2004-04-08 |
WO2004017387A2 (en) | 2004-02-26 |
AU2003285810A8 (en) | 2004-03-03 |
JP2005525709A (ja) | 2005-08-25 |
US20030198376A1 (en) | 2003-10-23 |
JP4703187B2 (ja) | 2011-06-15 |
US7085622B2 (en) | 2006-08-01 |
AU2003285810A1 (en) | 2004-03-03 |
KR20040101540A (ko) | 2004-12-02 |
DE60309467D1 (de) | 2006-12-14 |
CN1653326B (zh) | 2011-08-17 |
EP1514094A2 (en) | 2005-03-16 |
DE60309467T2 (de) | 2007-09-20 |
CN1653326A (zh) | 2005-08-10 |
EP1514094B1 (en) | 2006-11-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101011076B1 (ko) | 관측 시스템 | |
KR101163237B1 (ko) | 웨이퍼 운반 로봇을 교정하기 위한 시각화 시스템 및 방법 | |
US9352466B2 (en) | Robot positioning system for semiconductor tools | |
KR101613135B1 (ko) | 반도체 기판의 위치 검출 장치 및 위치 검출 방법 | |
US6591161B2 (en) | Method for determining robot alignment | |
US7008884B2 (en) | Transfer robot and inspection method for thin substrate | |
KR100936085B1 (ko) | 무선 기판형 센서 | |
CN101675511B (zh) | 处理装置和被处理体的识别方法 | |
US20080097646A1 (en) | Calibration of a substrate handling robot | |
US20070004058A1 (en) | Semiconductor manufacturing device with transfer robot | |
JP2004536443A (ja) | セルフティーチングロボット | |
JP2021521651A (ja) | 半導体処理のための無線基板状ティーチングセンサ | |
TWI390660B (zh) | 用於半導體晶圓對準之方法與設備 | |
US7493231B2 (en) | Process for determining the actual position of a rotation axis of a transportation mechanism | |
JP3138391B2 (ja) | 位置合わせ装置及び位置合わせ方法 | |
TW202345211A (zh) | 基板處理裝置及基板處理方法 | |
JPH0917845A (ja) | 位置合せ装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E90F | Notification of reason for final refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20131227 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20141230 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20151230 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20161229 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20180110 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20190102 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20200102 Year of fee payment: 10 |