KR101010765B1 - 열압착용 실리콘 고무 시트 - Google Patents

열압착용 실리콘 고무 시트 Download PDF

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Publication number
KR101010765B1
KR101010765B1 KR1020040014903A KR20040014903A KR101010765B1 KR 101010765 B1 KR101010765 B1 KR 101010765B1 KR 1020040014903 A KR1020040014903 A KR 1020040014903A KR 20040014903 A KR20040014903 A KR 20040014903A KR 101010765 B1 KR101010765 B1 KR 101010765B1
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KR
South Korea
Prior art keywords
silicone rubber
weight
component
rubber layer
parts
Prior art date
Application number
KR1020040014903A
Other languages
English (en)
Korean (ko)
Other versions
KR20040078908A (ko
Inventor
이꾸오 사꾸라이
다께오 요시다
히사하루 야마구찌
다께시 하시모또
Original Assignee
신에쓰 가가꾸 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 신에쓰 가가꾸 고교 가부시끼가이샤 filed Critical 신에쓰 가가꾸 고교 가부시끼가이샤
Publication of KR20040078908A publication Critical patent/KR20040078908A/ko
Application granted granted Critical
Publication of KR101010765B1 publication Critical patent/KR101010765B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/042—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/14—Carbides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)
KR1020040014903A 2003-03-07 2004-03-05 열압착용 실리콘 고무 시트 KR101010765B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00061136 2003-03-07
JP2003061136A JP3902558B2 (ja) 2003-03-07 2003-03-07 熱圧着用シリコーンゴムシート

Publications (2)

Publication Number Publication Date
KR20040078908A KR20040078908A (ko) 2004-09-13
KR101010765B1 true KR101010765B1 (ko) 2011-01-25

Family

ID=33123432

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040014903A KR101010765B1 (ko) 2003-03-07 2004-03-05 열압착용 실리콘 고무 시트

Country Status (4)

Country Link
JP (1) JP3902558B2 (ja)
KR (1) KR101010765B1 (ja)
CN (1) CN1247375C (ja)
TW (1) TW200420701A (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006080445A1 (ja) * 2005-01-31 2006-08-03 Nitto Denko Corporation 圧着離型シート
JP2006281670A (ja) * 2005-04-01 2006-10-19 Shin Etsu Chem Co Ltd 熱圧着用シート
JP4561989B2 (ja) * 2005-04-22 2010-10-13 信越化学工業株式会社 熱圧着用複層ゴムシート
JP4572243B2 (ja) * 2008-03-27 2010-11-04 信越化学工業株式会社 熱伝導性積層体およびその製造方法
JP5386200B2 (ja) * 2008-04-30 2014-01-15 中興化成工業株式会社 複合シート
JP5058938B2 (ja) * 2008-10-22 2012-10-24 信越化学工業株式会社 熱圧着用シリコーンゴムシート
EP2408014A4 (en) * 2009-03-11 2015-09-09 Shinetsu Chemical Co CONNECTION SHEET FOR SOLAR BATTERY CELL ELECTRODE, METHOD FOR MANUFACTURING SOLAR CELL MODULE, AND SOLAR CELL MODULE
JP5272866B2 (ja) 2009-04-15 2013-08-28 信越化学工業株式会社 熱圧着用シリコーンゴムシート
JP5581764B2 (ja) * 2010-03-24 2014-09-03 信越化学工業株式会社 シリコーンゴム組成物及び帯電防止性シリコーンゴム硬化物の耐圧縮永久歪性を向上する方法
JP5363401B2 (ja) * 2010-04-13 2013-12-11 信越化学工業株式会社 熱圧着用シリコーンゴム積層シート及びその製造方法
JP2013175492A (ja) * 2010-06-14 2013-09-05 Panasonic Corp 半導体装置およびその製造方法
CN101879820B (zh) * 2010-06-24 2012-01-25 中国乐凯胶片集团公司 一种用于正喷灯箱胶片的喷墨记录材料
JP5673444B2 (ja) * 2010-10-19 2015-02-18 信越化学工業株式会社 熱圧着用シリコーンゴムシート及び電気・電子機器部品の接合方法
CN102529230B (zh) * 2010-10-19 2015-04-22 信越化学工业株式会社 热压合用硅橡胶片材及电气和/或电子设备部件的接合方法
JP5381964B2 (ja) * 2010-11-17 2014-01-08 信越化学工業株式会社 熱圧着用シリコーンゴムシート
JP5679211B2 (ja) * 2011-12-02 2015-03-04 信越ポリマー株式会社 転写印刷用転写シートおよびその製造方法
KR101641561B1 (ko) 2014-10-01 2016-07-21 한국전기연구원 접속재용 전도성 실리콘 코팅 접착제 및 그 제조방법
JP6508344B2 (ja) * 2015-08-28 2019-05-08 日立化成株式会社 緩衝シート用組成物及び緩衝シート
JP6627681B2 (ja) 2016-07-27 2020-01-08 信越化学工業株式会社 熱圧着用熱伝導性複合シート及びその製造方法
WO2018026035A1 (ko) * 2016-08-04 2018-02-08 (주)피코팩 금속 판을 포함하는 반도체 패키징 구조 및 이의 제조방법
FR3058148A1 (fr) * 2016-10-31 2018-05-04 Compagnie Generale Des Etablissements Michelin Composition de caoutchouc comprenant une charge renforcante specifique
CN108172436A (zh) * 2018-01-29 2018-06-15 苏州市信天游光电材料有限公司 一种手机侧键板及其制作方法
CN110920178B (zh) * 2019-12-05 2022-03-15 北京航空材料研究院有限公司 一种变刚度导电复合材料及其制备方法
KR102650400B1 (ko) * 2022-01-20 2024-03-26 박현배 다회성 열압착용 실리콘 쿠션패드 및 이를 이용한 연성 인쇄회로기판 제조방법
KR102650410B1 (ko) * 2022-01-20 2024-03-25 박현배 다회성 열압착용 실리콘 쿠션패드의 제조방법 및 이를 이용한 연성 인쇄회로기판 제조방법
CN115160790A (zh) * 2022-07-12 2022-10-11 苏州昌和应用材料有限公司 压合机用烧付铁板及其制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04236265A (ja) * 1991-01-18 1992-08-25 Shin Etsu Chem Co Ltd 離型性シリコーンゴム組成物及びその硬化物
JPH1076606A (ja) * 1996-09-02 1998-03-24 Shin Etsu Chem Co Ltd シリコーンゴム積層体及びその製造方法
JPH10219199A (ja) * 1997-02-05 1998-08-18 Shin Etsu Chem Co Ltd 熱圧着用シリコーンゴムシート
JP2001207141A (ja) * 2000-01-28 2001-07-31 Shin Etsu Chem Co Ltd 接着性シリコーンゴムシート

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04236265A (ja) * 1991-01-18 1992-08-25 Shin Etsu Chem Co Ltd 離型性シリコーンゴム組成物及びその硬化物
JPH1076606A (ja) * 1996-09-02 1998-03-24 Shin Etsu Chem Co Ltd シリコーンゴム積層体及びその製造方法
JPH10219199A (ja) * 1997-02-05 1998-08-18 Shin Etsu Chem Co Ltd 熱圧着用シリコーンゴムシート
JP2001207141A (ja) * 2000-01-28 2001-07-31 Shin Etsu Chem Co Ltd 接着性シリコーンゴムシート

Also Published As

Publication number Publication date
TW200420701A (en) 2004-10-16
KR20040078908A (ko) 2004-09-13
JP3902558B2 (ja) 2007-04-11
CN1526547A (zh) 2004-09-08
JP2004273669A (ja) 2004-09-30
CN1247375C (zh) 2006-03-29
TWI307659B (ja) 2009-03-21

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