KR101009340B1 - Method for fabricating nanoparticle layer and Method for preparing nano imprinting stamp using the same - Google Patents

Abstract

The present invention relates to a method for manufacturing a nanoparticle thin film and a method for manufacturing a stamp for nanoimprint using the same, the method for manufacturing a nanoparticle thin film of the present invention is a mixture in which a nanoparticle mixed resin in which nanoparticles and a polymer matrix are mixed is laminated on a substrate. Resin lamination step; A solvent removing step of removing the solvent from the nanoparticle mixed resin; And pressing and curing the nanoparticle mixed resin with a patternless flat plate, thereby forming a thin film of nanoparticles in which neighboring nanoparticles are arranged to be spaced apart from each other in the polymer matrix.

Description

Method for fabricating nanoparticle layer and Method for preparing nano imprinting stamp using the same}

The present invention relates to a method for manufacturing a nanoparticle thin film and a method for manufacturing a stamp for a nano imprint using the same, and more particularly, to manufacture a nanoparticle thin film on a substrate by coating a resin mixed with nanoparticles on a substrate. It relates to a method and a method for producing a stamp for nano imprint using the same.

Nano Technology (NT), together with Information Technology (IT) and Biotechnology (BT), is attracting attention as a new paradigm that will lead industrial development in the 21st century. Such nanotechnology is expected to converge with various scientific and technological fields such as physics, chemistry, biology, electronics, and materials engineering, and to dramatically improve the quality of life of human beings by overcoming the limitations of existing technologies.

Nanotechnology is largely divided into a top-down approach and a bottom-up approach according to the approach. The top-down approach is a technology that seeks to further advance existing microstructure fabrication techniques down to the nanometer scale, as seen in the history of semiconductor integrated devices that have evolved over the last few decades, to continue increasing information storage capacity and information processing speed. to be. In contrast, the bottom-up approach allows materials to be controlled at the atomic or molecular level, or by using spontaneous nanostructural phenomena to induce new physical and chemical properties that would not be possible with conventional technologies and to create new materials and devices. Technology.

A representative example of the top-down approach is the optical lithography technology used in the conventional semiconductor device manufacturing process. Technological advances of the 20th century, called the information technology revolution, have relied heavily on miniaturization and integration of semiconductor devices, and the key technology of the semiconductor device manufacturing process is optical lithography. However, optical lithography has a disadvantage in that it is difficult to produce a pitch of 100 nm or less due to the line width limit of the laser due to the characteristics of diffraction and refraction of light. Recently, a process development using nano imprint technology has been attempted.

Nanoimprint technology is a nanodevice fabrication method introduced by Professor Stephen Chu of Princeton University in the mid-1990s, and is attracting attention as a technology that can compensate for the low productivity of electron beam lithography and the disadvantage of expensive optical lithography equipment. That is, the nanoimprint technology produces a stamp having a nanoscale pattern, and imprints such a stamp on the polymer thin film to transfer the nanoscale pattern.

1 is a diagram illustrating a conventional method for manufacturing a stamp for nano imprint, and FIG. 2 is a diagram illustrating a conventional nano imprint lithography process using the nano imprint stamp of FIG. 1.

Referring to FIG. 1, in the conventional method of manufacturing a nanoimprint stamp, a nanocolloid is first deposited on the substrate 12 by depositing nanoparticles 11 through a coating process such as spin coating. (11) forms the nanoparticle single film 13 in contact with each other (Fig. 1 (a)). Subsequently, the nanoparticle single layer 13 is etched to form a separation thin film 14 in which neighboring nanoparticles 11 are arranged to be spaced apart from each other to expose the substrate 12 (FIG. 1B). Subsequently, the substrate 12 is etched to form the nanopattern 23 in which the nanopillars 21 and the nano holes 22 are alternately arranged (FIG. 1C), and remain on the nanopillars 21. By removing the nanoparticles 11, the stamp 30 for nanoimprint can be manufactured (FIG. 1 (d)).

Referring to FIG. 2, in the conventional nanoimprint lithography process, first, a nanoimprint stamp 30 and an imprint substrate 41 coated with a resin 42 on an upper surface thereof are provided (FIG. 2A). Thereafter, the nano pattern 23 and the resin 42 of the nano imprint stamp 30 are disposed to face each other, and the nano imprint stamp 30 is then stamped on the resin 42 (FIG. 2B). Thereafter, when the nanoimprint stamp 30 is separated, the nanopattern 23 of the nanoimprint stamp 30 is transferred onto the resin 42, so that the nanopattern 43 is formed on the top surface of the resin 42.

However, in the prior art, a nanoparticle thin film is formed in which neighboring nanoparticles are continuously contacted due to the inter-particle interaction force, which is etched so that the neighboring nanoparticles are firstly arranged to be spaced apart from each other for later substrate etching. There is a problem that a rather complicated etching process is required to expose the and expose the second exposed substrate region.

An object of the present invention is to solve such a conventional problem, when forming a thin film dispersed with nanoparticles on a substrate, by pressing the thin film so that neighboring nanoparticles are arranged spaced apart in the resin, a complex multi-step The present invention provides a method for manufacturing a nanoparticle thin film and a method for manufacturing a stamp for nanoimprint using the same, which can simplify the manufacturing process without performing an etching process.

In order to achieve the above object, the nanoparticle thin film manufacturing method of the present invention comprises: a mixed resin laminating step of laminating a nanoparticle mixed resin mixed with nanoparticles and a polymer matrix on a substrate; A solvent removing step of removing the solvent from the nanoparticle mixed resin; And pressing and curing the nanoparticle mixed resin with a patternless flat plate, thereby forming a thin film of nanoparticles in which neighboring nanoparticles are arranged to be spaced apart from each other in the polymer matrix.

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In the method for producing a nanoparticle thin film according to the present invention, preferably, the nanoparticles are silica or metallic particles, and the polymer matrix is a resin that is cured when ultraviolet rays are irradiated.

In the method for producing a nanoparticle thin film according to the present invention, Preferably, the patternless plate is an ultraviolet permeable plate that transmits ultraviolet rays, and the pressure-curing step, while pressing the nanoparticle mixed resin with the ultraviolet-transparent plate Ultraviolet rays are irradiated to the nanoparticle mixed resin side to cure the nanoparticle mixed resin.

In the method for producing a nanoparticle thin film according to the present invention, preferably, in the nanoparticle mixed resin, the volume ratio of the nanoparticles to the resin is substantially 20% or less.

In the method for producing a nanoparticle thin film according to the present invention, preferably, the pressure hardening step, pressurize the nanoparticle mixed resin to a pressure of 10 bar or more with the patternless flat plate.

On the other hand, in order to achieve the above object, the nanoimprint stamp manufacturing method of the present invention, using a substrate formed with a nanoparticle thin film prepared according to claim 1, the polymer between the nanoparticles in the nanoparticle thin film Exposing the substrate by etching a matrix; A nanopattern forming step of forming a nanopattern on which the nanopillar and the nanohole are alternately disposed by etching the substrate; A polymer removal step of removing the polymer matrix remaining on the nanopillars; And a stamp forming step of forming a nano imprint stamp by laminating a metal material on the substrate having the nanopattern formed thereon.

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According to the method for manufacturing a nanoparticle thin film of the present invention, when applying and molding a thin film in which nanoparticles are dispersed on a substrate, the nanoparticles are arranged to be spaced apart in a resin by applying pressure to the nanoparticle thin film together with photocuring using ultraviolet rays. By doing so, it is possible to simplify the manufacturing process without performing a complicated multi-step etching process.

In addition, according to the nanoparticle thin film manufacturing method of the present invention, when the nanoparticle mixture resin is deposited by spin coating can be deposited at a low rotational speed, it is possible to prevent problems such as vibration, eccentricity, etc. generated during high-speed rotation In addition, the problem of non-uniformity of the thin film, which may occur due to vibration and eccentricity, may be improved.

Meanwhile, according to the method for manufacturing a nanoimprint stamp of the present invention, by forming a thin film in which nanoparticles are spaced apart and manufacturing a stamp for nanoimprint using a substrate on which the nanoparticle thin film is formed, a complex multi-step etching process is not performed. The manufacturing process can be simplified.

Hereinafter, embodiments of the method for manufacturing a nanoparticle thin film according to the present invention and a method for manufacturing a stamp for a nanoimprint using the same will be described in detail with reference to the accompanying drawings.

3 is a view showing an embodiment of a method for manufacturing a nanoparticle thin film of the present invention.

Referring to FIG. 3, the nanoparticle thin film manufacturing method of the present embodiment includes a mixing step (S110), a mixed resin stacking step (S120), a solvent removing step (S130), and a pressure hardening step (S140).

In the mixing step (S110), by mixing the nanoparticle solution 110 and the polymer matrix in which the nanoparticles 111 are dispersed to prepare a nanoparticle mixing resin 130. In the present embodiment, the nanoparticles 111 are silica or metallic particles, and the polymer matrix is preferably an ultraviolet curable resin 120 which is cured when ultraviolet rays are irradiated.

Ideally, when the nanoparticle mixed resin 130 is synthesized, the chemical bonding of the nanoparticles 111 and the UV curable resin 120 may be made. However, the selection of the resin 120 having the chemical properties to enable such chemical bonding may be performed. In difficult times, even when the resin 120 having a density similar to that of the nanoparticles 111 is selected, the nanoparticle mixed resin 130 may maintain chemical stability for a certain period of time.

At this time, by appropriate surface treatment to the nanoparticles 111 to be separated from each other between the nanoparticles 111, the volume ratio of the nanoparticles 111 in the resin 120 is the nanoparticles 111 in the final thin film It is desirable to keep the composition ratio to a minimum in consideration of the ratio. In the present embodiment, the volume ratio of the nanoparticles 111 to the resin 120 is substantially maintained to about 20% or less in consideration of the inter-nanoparticle spacing in the nanoparticle mixture resin 130.

In the mixed resin stacking step (S120), the nanoparticle mixed resin 130 is stacked on the substrate 140. The nanoparticle mixed resin 130 is spin coated on one surface of the substrate 140 to maintain a uniform coating thickness.

In the solvent removal step (S130), the solvent 112 of the nanoparticle solution 110 is removed from the nanoparticle mixing resin 130. Heat is applied to the substrate 140 to which the nanoparticle mixed resin 130 is applied to evaporate the solvent 112 that was present together with the nanoparticles 111 in the nanoparticle solution 110.

In the pressure-curing step (S140), by pressing and curing the nanoparticle mixed resin 130 with a patternless flat plate 150, the neighboring nanoparticles 111 are arranged in the resin 120 spaced apart nanoparticle thin film Mold 160. In this case, the nanoparticles 111 arranged spaced apart in the resin 120 have a single layer structure, as shown in FIG.

In the present embodiment, as the non-patterned flat plate 150 pressurizing the nanoparticle mixing resin 130, an ultraviolet-transmissive plate transmitting ultraviolet rays is used. In this case, the nanoparticle mixing resin 130 is pressed at a pressure of about 10 bar or more. It is desirable to.

The nanoparticle mixing resin 130 is pressed on the upper side of the nanoparticle mixing resin 130, and the ultraviolet ray irradiated from the upper side of the nanoparticle mixing resin 130 penetrates the ultraviolet transmitting plate and mixes the nanoparticles. Reach to the resin 130 to photocuring the nanoparticle mixed resin 130.

Through the nanoparticle thin film manufacturing method of the present embodiment, it is possible to obtain a nanoparticle thin film 160 in which neighboring nanoparticles 111 are arranged to be spaced apart from each other, such a nanoparticle thin film 160 can be obtained. The physical mechanism can be summarized in two ways. First, when the resin 120 is cured by irradiation with ultraviolet rays, shrinkage occurs in the resin 120 as a whole. The contraction of the resin 120 generates pressure in a direction perpendicular to the nanoparticles 111 present in the resin 120. Second, when the nanoparticle mixture resin 130 is pressed with the patternless flat plate 150 at the same time as UV curing, separation between the nanoparticles 111 is promoted by doubling the vertical compressive force generated during the UV curing process.

In the method for manufacturing a nanoparticle thin film according to the present embodiment configured as described above, when coating and molding a thin film in which nanoparticles are dispersed on a substrate, nanoparticles are applied by applying pressure to the nanoparticle thin film together with photocuring using ultraviolet light. By being spaced apart in the resin 120, it is possible to obtain an effect that can simplify the manufacturing process without performing a complex multi-step etching process.

In addition, the method for manufacturing a nanoparticle thin film according to the present embodiment configured as described above can be deposited at a low rotational speed when the nanoparticle mixed resin is deposited by spin coating, and thus, vibration, eccentricity, etc. generated during high-speed rotation The problem can be prevented, and the effect of improving the non-uniformity problem of the thin film, which may occur due to vibration and eccentricity, can be obtained.

On the other hand, Figure 4 is a view showing an embodiment of a nanoimprint stamp manufacturing method of the present invention using the nanoparticle thin film manufacturing method of FIG.

Referring to FIG. 4, the method for manufacturing a nanoimprint stamp according to the present embodiment uses a substrate on which the nanoparticle thin film illustrated in FIG. 3E is formed, and exposes a substrate (S150) and forms a nanopattern (S160). And a polymer removing step (S170), a stamp forming step (S180), and a separating step (S190).

In the substrate exposing step (S150), as illustrated in FIG. 4A, the polymer matrix in the nanoparticle thin film 160, that is, the region etched by etching the resin 120 located between the nanoparticles 111 is etched. Exposing the substrate 140. At this time, the etching of the resin 120 is performed by an oxygen dry etching method.

In the nanopattern forming step (S160), as shown in FIG. 4B, the nanopattern 141 and the nanohole 142 are alternately disposed by etching the substrate 140. Is formed on the substrate 140. In this case, the power of the gas and the plasma is differently selected according to the material of the substrate 140.

In the present embodiment, the etching of the substrate 140 is performed by anisotropic etching, and the etching selectivity of the nanoparticles 111 and the substrate 140 is almost similar to that of the nanoparticles during etching of the substrate 140. 111 is also removed. Meanwhile, while the substrate 140 is etched, the nanoparticles 111 may not be etched but serve as an etch barrier to separately remove the nanoparticles 111 after the substrate 140 is etched.

In the polymer removing step (S170), as shown in Figure 4 (c), by using the oxygen dry etching method to remove the resin 120 remaining on the nano-pillar 141, nano-pillar 141 and The nano holes 142 are exposed.

In the stamp forming step (S180), first, as shown in FIG. 4 (d), the metal base layer 171 is deposited on the substrate 140 on which the nanopattern 143 is formed, and then, as shown in FIG. 4 (e). As described above, the same metal material as the metal base layer 171 is laminated through the electroplating process to form the nanoimprint stamp 170. The nano pattern 143 of the substrate 140 is transferred as it is to the nano imprint stamp 170 formed as described above. Reference numeral 173 denotes a nanopattern of the nanoimprint stamp 170.

In the separation step (S190), as shown in Figure 4 (f), the completed nano imprint stamp 170 is separated from the substrate 140.

The method for manufacturing a stamp for nanoimprint according to the present embodiment configured as described above comprises forming a stamp for nanoimprint using a substrate on which the nanoparticle thin film is formed by forming a thin film in which nanoparticles are spaced apart from each other, thereby forming a complicated multi-step etching process. The effect of simplifying the manufacturing process without performing the process can be obtained.

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The scope of the present invention is not limited to the above-described embodiments and modifications, but may be embodied in various forms of embodiments within the scope of the appended claims. Without departing from the gist of the invention claimed in the claims, it is intended that any person skilled in the art to which the present invention pertains falls within the scope of the claims described herein to various extents that can be modified.

1 is a view showing a conventional method for manufacturing a stamp for nano imprint,

FIG. 2 is a diagram illustrating a conventional nanoimprint lithography process using the nanoimprint stamp of FIG. 1,

3 is a view showing an embodiment of a method for manufacturing a nanoparticle thin film of the present invention,

4 is a view showing an embodiment of a method for manufacturing a stamp for a nano imprint of the present invention by using the method for manufacturing a nanoparticle thin film of FIG.

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<Explanation of symbols for the main parts of the drawings>

110: nanoparticle solution 111: nanoparticle

112: solvent 120: resin

130: nanoparticle mixed resin 140: substrate

150: patternless plate 160: nanoparticle thin film

Claims (8)

A mixed resin lamination step of laminating a nanoparticle mixed resin mixed with nanoparticles and a polymer matrix on a substrate; A solvent removing step of removing the solvent from the nanoparticle mixed resin; And Pressurizing and curing the nanoparticle mixed resin with a non-patterned flat plate, the pressure-curing step of forming a nanoparticle thin film in which neighboring nanoparticles are arranged in a single layer spaced apart in the polymer matrix; nanoparticles comprising a Thin film manufacturing method. delete The method of claim 1, The nanoparticles are silica or metallic particles, The polymer matrix is a nanoparticle thin film manufacturing method, characterized in that the resin is cured when irradiated with ultraviolet light. The method of claim 3, The patternless flat plate is an ultraviolet light transmitting plate that transmits ultraviolet light, The pressure hardening step, The method for producing a nanoparticle thin film, wherein the nanoparticle mixed resin is cured by irradiating ultraviolet rays toward the nanoparticle mixed resin while pressing the nanoparticle mixed resin with the UV-transmissive plate. The method of claim 1, In the nanoparticle mixed resin, the nanoparticle thin film manufacturing method, characterized in that the volume ratio of the nanoparticles to the resin is substantially 20% or less. The method of claim 1, The pressure hardening step, Method for producing a nanoparticle thin film, characterized in that for pressing the nanoparticle mixed resin at a pressure of 10 bar or more with the patternless flat plate. As using the substrate on which the nanoparticle thin film prepared by claim 1 is formed, Exposing the substrate by etching a polymer matrix between the nanoparticles in the nanoparticle thin film; A nanopattern forming step of forming a nanopattern on which the nanopillar and the nanohole are alternately disposed by etching the substrate; A polymer removal step of removing the polymer matrix remaining on the nanopillars; And a stamp forming step of forming a nanoimprint stamp by laminating a metal material on the substrate on which the nanopattern is formed. delete

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