KR100998000B1 - Temperature sensing sensor structure of injection molding type and method for manufacturing the same - Google Patents

Abstract

PURPOSE: A temperature sensor structure of an injection type and a manufacturing method thereof are provided to enable the temperature sensor to be easily manufactured since the temperature sensor is manufactured in an injection manner using a synthetic resin and thus the manufacturing process of the temperature sensor is reduced. CONSTITUTION: A temperature sensor structure of an injection type comprises a lead line(11), a sensor chip(20), a first injection part(120) and a second injection part(130). The lead line is gas-welded to a wire(10). The sensor chip is connected to the end of the lead line to sense the heat or the temperature of a product. An epoxy part(110) is formed on the outer end of the lead line and the sensor chip. The epoxy part covers and coats the end of the lead line and the sensor chip with a high-heat-conduction polymer. The first injection part is insert-injected in order to cover the one side of the lead line and the one side of the wire. The second injection part covers the first injection part and the sensor chip and is connected to the outer part of the sensor chip.

Description

TEMPERATURE SENSING SENSOR STRUCTURE OF INJECTION MOLDING TYPE AND METHOD FOR MANUFACTURING THE SAME}

The present invention relates to a temperature sensor used in the field of refrigeration and refrigeration, and home appliances, and more particularly, to reduce the manufacturing process of the temperature sensor and to manufacture the temperature sensor by an injection method. It is more easily and easily manufactured, and the working efficiency and productivity are improved, and as the adhesive force between the wire and the injection part of the temperature sensor is increased, malfunction or moisture does not penetrate the sensor chip of the temperature sensor. And prevent failure, and improve the quality of the temperature sensor by increasing the ability of detecting heat or temperature in the temperature sensor by using a resin having high thermal conductivity in the synthetic resin used to manufacture the temperature sensor. It relates to an injection type temperature sensor structure and a manufacturing method thereof.

In general, the temperature sensor is a sensor that detects heat or temperature at a site such as a home appliance and a refrigeration facility where moisture or moisture is distributed around, such as a refrigerator or a humidifier.

In the conventional temperature sensor, the sensor chip is placed at the end of the lead wire spot-welded to the wire, and then the end of the lead wire and the sensor chip are soldered. After that, the end of the lead wire and the sensor chip is epoxy coated with an epoxy resin.

Then, the entire lead wire and the sensor chip are wrapped in silicon and then primary epoxy coated with an epoxy resin, and the secondary epoxy coating is performed by dipping an epoxy resin on the upper and lower surfaces of the primary epoxy coating.

Then, the first and second epoxy-coated wires are inserted into the protective tube pipe, and then the epoxy resin for filling is filled into the protective tube pipe and the epoxy coating is completed once more, thereby manufacturing the temperature sensor.

However, the manufacturing process of the temperature sensor by the process of coating the epoxy resin and the process of curing the coated epoxy resin, such as the process of coating the epoxy resin is repeated several times in the process of manufacturing the temperature sensor This is very complicated and difficult, there is a problem that the work efficiency and productivity for manufacturing the temperature sensor is reduced, such as the increase in work time and manpower loss as the manufacturing process of the temperature sensor increases.

In addition, due to the degradation of the function of sensing the heat or temperature in the sensor chip of the temperature sensor by the epoxy resin coated to connect the wire, the lead wire and the sensor chip to each other in the temperature sensor because of the low thermal conductivity coefficient There was also a problem that the function, performance, quality of the temperature sensor is deteriorated.

On the other hand, since the adhesion between the wire and the epoxy resin of the temperature sensor is inferior due to the inflow of moisture or moisture between the wire and the coated epoxy resin, the sensor chip of the temperature sensor is Problems such as malfunctions or breakdowns, as well as problems such as the need to replace the temperature sensor from time to time due to the malfunctions and failures, there was also a problem that the replacement cost increases.

As the protective pipe used in the process of manufacturing the temperature sensor uses a metal material and a synthetic resin material, the quality of the temperature sensor due to insulation breakdown, poor withstand voltage, short circuit, etc. between the metal protective pipe pipe and the sensor chip is improved. Not only is it not only deteriorated but also a problem such as an increase in manufacturing cost due to the use of the protective tube pipe, etc. The synthetic resin protective tube has a low thermal conductivity coefficient, so that the temperature transfer time of the sensor is not transmitted smoothly to the chip, so that the temperature of the sensor is long. There was also a loss.

The present invention has been proposed in order to solve the problems in the prior art as described above, by manufacturing a temperature sensor using an injection method using a synthetic resin having high thermal conductivity, thereby manufacturing a temperature sensor according to the injection method By reducing the temperature sensor is easier and easier to manufacture, as well as reducing the work time and manpower loss caused by this purpose is to reduce the manufacturing cost as well as to improve the work efficiency and productivity.

In addition, the present invention by using a synthetic resin having an adhesive force with the wire in the manufacturing of the temperature sensor by the injection method, by preventing the penetration of moisture or moisture between the wire and the injection portion as the adhesion between the wire and the injection portion is increased. The purpose of the present invention is not only to prevent malfunction and failure of the temperature sensor, but also to increase the service life of the temperature sensor, and to reduce the cost of replacing and repairing the temperature sensor as much as possible. .

In addition, the present invention by manufacturing a temperature sensor by injection into a synthetic resin of high thermal conductivity without using an epoxy resin used to manufacture a temperature sensor, the temperature sensor prevents a fault voltage or short circuit, etc. In addition, since the sensing force and thermal conductivity of sensing heat or temperature are improved, the purpose is to improve the performance and quality of the temperature sensor.

According to the present invention for achieving the above object, a sensor chip for sensing a temperature is soldered to one end of the lead wire spot-welded to one side of the wire, the sensor chip and the lead wire outside the end of the sensor chip and the lead wire An element epoxy part for coating a polymer having high thermal conductivity is formed to connect and bond the ends to each other, and one side of the wire and the outside of the lead wire are inserted into a synthetic resin having adhesive force to the wire to wrap and connect the wire and the lead wire together. The first injection part for injection is formed, and the second injection part for insert injection into a synthetic resin having high thermal conductivity is formed on the outside of the primary injection part and the sensor chip to wrap and connect the primary injection part and the sensor chip together. An injection type temperature sensor structure is provided.

In addition, the present invention, the sensor chip for sensing the temperature is soldered to one side end of the lead wire spot-welded to one side of the wire, the inside of the sensor chip and the wire so that the inside of the sensor chip and the lead wire and one side of the wire is inserted The primary injection part forming the space is injection molded with high thermal conductivity synthetic resin, and one side of the sensor chip, the lead wire and the wire is inserted into the primary injection part, and one side of the inserted sensor chip, the lead wire and the wire is 1 An injection type temperature sensor structure is provided, characterized in that a secondary injection portion for insert injection into a synthetic resin having an adhesive force with an electric wire is formed into a space portion in the primary injection portion to be coupled to the primary injection portion.

In addition, the present invention, the sensor chip for sensing the temperature is soldered to one side end of the lead wire spot-welded to one side of the wire, the thermoelectric so that the sensor chip and the end of the lead wire connected to each other outside the end of the sensor chip and the lead wire An element epoxy part for coating a highly conductive polymer is formed, and the first injection molding insert is made of synthetic resin, which is a material having high thermal conductivity, so as to surround and bond the element epoxy part and one side of the wire to the outside of the polymer coated device epoxy part. Injection-type temperature sensing sensor, characterized in that the injection portion is formed, the second injection portion for insert injection into the synthetic resin having an adhesive force with the wire to connect the primary injection portion and the wire to the other side of the primary injection portion is formed A structure is provided.

In addition, the present invention, the sensor chip for sensing the temperature is soldered to one side end of the lead wire spot-welded to one side of the wire, the thermoelectric so that the sensor chip and the end of the lead wire connected to each other outside the end of the sensor chip and the lead wire A device epoxy part for coating a highly conductive polymer is formed, and the first injection part forming an empty space inside the device epoxy part and one side of the wire is inserted into the outside of the device epoxy part and the electric wire. The secondary injection molding is injected into the synthetic resin having an adhesive force with the wire to the space in the primary injection portion to be tightly coupled in the element epoxy portion inserted into the primary injection portion and to join the wire and the primary injection portion An injection type temperature sensor structure is provided, characterized in that an injection portion is formed.

In another aspect, the present invention, the outer peripheral surface of the primary injection unit is provided with an injection type temperature sensor structure characterized in that the coupling groove is formed along the outer peripheral surface of the primary injection portion to increase the coupling force of the primary injection portion and the secondary injection portion. do.

In another aspect, the present invention, the injection type temperature sensor structure is characterized in that the coupling groove is formed along the inner circumferential surface of the primary injection portion and the secondary injection portion to increase the coupling force on the inner peripheral surface of the primary injection portion. Is provided.

In addition, the present invention, the injection type temperature, characterized in that the coupling grooves are formed along the inner and outer peripheral surfaces of the primary injection portion to increase the coupling force of the primary injection portion and the secondary injection portion on the inner, outer peripheral surface of the primary injection portion, respectively. A sensor structure is provided.

In another aspect, the present invention, the outer surface of the end portion of the device epoxy portion and the inner end side of the primary injection portion is formed in each of the same shape so as to be coupled in a state in which the element epoxy portion in close contact with the primary injection portion is an injection type temperature sensor structure Is provided.

In addition, the present invention is provided with an injection type temperature sensing sensor structure, characterized in that the shape of the end outer surface of the element epoxy portion and the inner end side of the primary injection portion are each formed in a round shape.

In another aspect, the present invention, the injection type of the injection type, characterized in that the outer surface of the secondary injection portion corresponding to the sensor chip to prevent the tearing of the outer surface of the secondary injection portion in the portion in contact with the primary injection portion of the injection type A temperature sensor structure is provided.

In addition, the present invention, in the position corresponding to each other on the outer surface of the device epoxy part, the position adjustment of the fixing pin of the mold is inserted so that it is placed in a certain position as well as preventing the device epoxy part side flow during the insert injection process of the primary injection part An injection type temperature sensor structure is provided, characterized in that the balls are formed respectively.

In another aspect, the present invention, the step of soldering the sensor chip to the lead wire connected to one side of the wire; Coating a polymer having a high thermal conductivity to form an element epoxy part which wraps and bonds an end of the lead wire with a sensor chip; Insert-injecting the synthetic resin having an adhesive force with the wire to form a primary injection part surrounding the one side of the wire and the lead wire; An injection-type temperature sensor manufacturing method is provided, comprising: inserting and inserting into a high thermal conductive synthetic resin to form a secondary injection unit which wraps together the primary injection unit and the device epoxy unit.

In another aspect, the present invention, the step of soldering the sensor chip to the lead wire connected to one side of the wire; Injection molding the primary injection part having an empty space therein with synthetic resin having high thermal conductivity; Inserting one side of the lead wire and the wire to which the sensor chip is soldered into the empty space of the first injection part; Inserting and inserting a synthetic resin having an adhesive force with the wire into the primary injection part such that the sensor chip forms a secondary injection part coupled to the soldered lead wire and the primary injection part into which one side of the wire is inserted; There is provided a method of manufacturing an injection type temperature sensor.

In another aspect, the present invention, the step of soldering the sensor chip to the lead wire connected to one side of the wire; Coating a polymer having a high thermal conductivity to form an element epoxy part which wraps and bonds an end of the lead wire with a sensor chip; Insert-injecting a highly conductive synthetic resin to form a primary injection unit which wraps and bonds the device epoxy unit and one side of the electric wire; An injection type temperature sensing sensor manufacturing method is provided, comprising the steps of: insert-injecting a synthetic resin having an adhesive force with an electric wire to form a second injection part connecting the other side part and the wire to each other by the first injection part.

In another aspect, the present invention, the step of soldering the sensor chip to the lead wire connected to one side of the wire; Coating a polymer having a high thermal conductivity so as to form an element epoxy part which wraps and couples the end of the lead wire and the sensor chip; Injection molding the primary injection part having an empty space therein with synthetic resin having high thermal conductivity; Inserting one side of the lead wire and the wire to which the sensor chip is soldered into the empty space of the first injection part; A device epoxy part is inserted into and fixed in the primary injection part, and a synthetic resin having an adhesive force with an electric wire is inserted into a space in the primary injection part to form a secondary injection part that couples the primary injection part and the wire. It provides a method of manufacturing an injection type temperature sensor, characterized in that consisting of;

According to the present invention made as described above, by manufacturing a temperature sensor using an injection method using a synthetic resin having a wire and an adhesive force and a high thermal conductivity synthetic resin, as well as reducing the manufacturing process of the temperature sensor as an injection method Due to this has the effect of making the temperature sensor more easily and easily.

Therefore, not only reduce the working time and manpower loss of manufacturing the temperature sensor, but also reduce the manufacturing cost, it is also effective to improve the work efficiency and productivity by manufacturing various types of temperature sensor in a faster time.

In addition, during the manufacturing process of the temperature sensor by injection molding the synthetic resin having an adhesive force with the wire to produce a temperature sensor, the adhesive strength between the wire and the injection portion is increased and closely coupled, so that the water or between the wire and the injection portion By preventing the penetration of moisture, etc., the temperature sensor is also effective in preventing malfunction or failure caused by moisture or moisture.

As described above, the life of the temperature sensor may be increased, such as the use of the temperature sensor in a safer state for a long time, and the cost of replacing and repairing the temperature sensor may be reduced as much as possible.

On the other hand, by manufacturing a temperature sensor by injection-molded with a synthetic resin of high thermal conductivity, the sensor chip of the temperature sensor is improved in the sensing power to detect heat or temperature, and the performance of the temperature sensor is measured by measuring accurate heat or temperature There is also an improvement effect.

In addition, by injection molding the temperature sensor of the present invention into a synthetic resin having high thermal conductivity, the problem that occurs in the temperature sensor by the epoxy resin is not used because the conventional epoxy resin used when manufacturing the temperature sensor In addition, it is possible to prevent problems such as withstand voltage and short-circuit, as well as the high temperature response of the device by accurately detecting heat or temperature, thereby improving the quality of the temperature sensor.

In addition, since the dipping and coating of the epoxy resin used for manufacturing the temperature sensor and eliminating the curing process of the epoxy resin and the management according to the use conditions are unnecessary, the temperature sensor can be manufactured more simply. Not only is it possible to prevent the environmental pollution by the epoxy resin.

Hereinafter, an injection type temperature sensor structure and a method of manufacturing the same according to an embodiment of the present invention will be described in more detail with reference to FIGS. 1 to 2D.

1 is a structural diagram showing an embodiment of the temperature sensor of the present invention, Figures 2a to 2d is a view showing a state in which to produce a temperature sensor of the embodiment of the present invention sequentially.

The present invention is a temperature sensor for controlling the response in the product by detecting the heat or temperature in the field, such as a refrigeration facility in which moisture or moisture is distributed around, and in a home appliance such as a refrigerator or a humidifier and sending it to the outside (1) is provided.

As shown in FIGS. 1 to 2d, one embodiment of the temperature sensor 1 detects heat or temperature of a product at an end of a lead wire 11 that is spot welded to the wire 10 and coupled thereto. The sensor chip 20 is connected and coupled.

The sensor chip 20 is connected to the end of the lead wire 11 by soldering, that is, a soldering method. If the sensor chip 20 can be connected to the lead wire 11 in addition to the above method, You can use any method.

Outside the ends of the sensor chip 20 and the lead wire 11, the ends of the sensor chip 20 and the lead wire 11 are thermally conductive so as to more firmly couple the ends of the sensor chip 20 and the lead wire 11. A device epoxy part 110 is formed to coat and wrap with this high polymer.

The polymer is a compound produced by polymerization of molecules, such as a synthetic polymer or a natural polymer, and here, a conductive polymer having high thermal conductivity is used.

The wire 10 to be more firmly bonded to the one side of the lead wire 11 between the sensor chip 20 and the wire 10 and the outside of one side of the wire 10 in close contact with the wire 10. The primary injection part 120 is formed by insert injection to surround one side of the lead wire 11 and one side of the wire 10 with a synthetic resin having an adhesive force.

The primary injection unit 120 has a high adhesive strength with the wire 10 as well as the adhesive force with the wire 10 so that moisture or moisture does not penetrate between the wire 10 and the primary injection unit 120. In order to increase the use of a synthetic resin having an adhesive force with the coating of the wire 10, that is, the coating of the general wire 10 is polyvinyl chloride (PVC: polypropylene), polypropylene (PP: polypropylene), polyethylene (PE: polyethylene) and the like, and the synthetic resin of the primary injection part 120 is used by selecting any one of the same synthetic resin or hot melt adhesive as the wire coating.

The sensor chip 20 is protected from the outside on the outside of the element epoxy part 110 in which the first injection part 120 and the sensor chip 20 are soldered, and heat or temperature of the sensor chip 20 is prevented. In order to detect more accurately, the secondary injection part 120 which is insert-injected to bond while wrapping the primary injection part 120 and the element epoxy part 110 is made of a synthetic resin having high thermal conductivity to the sensor chip 20. Formed.

The secondary injection unit 130 uses a high thermal conductivity synthetic resin to accurately sense heat or temperature in the temperature sensor 1, that is, polypropylene (PP: polyproylene), Polyphenylene sulfide (PPS: polyphenylene surfide), polybutylene terephthalate (PBT: polybutylene terephthalate) and the like, the synthetic resin of the secondary injection unit 130 is used to select any one of them.

One side of the secondary injection unit 130 is formed with a fastening hole 121 is inserted into a fastening member such as bolts and screws to fasten the temperature sensor (1) to the device.

Meanwhile, the first injection part 120 and the second injection part 130 are formed on the outer circumferential surface of the first injection part 120, that is, the outer circumferential surface of the first injection part 120, which is the opposite side of the sensor chip 20. When insert injection molding the secondary injection unit 130 to be more firmly coupled is formed with a coupling groove 122 through which synthetic resin flows.

In addition, the primary injection unit 120, which is in contact with the secondary injection unit 130, is connected to the primary injection unit 120 while the primary injection unit 120 is folded in the process of using the temperature sensor 1. The coating rupture prevention part 123 is formed to wrap the wire 10 to a predetermined thickness to prevent the coating from being torn.

The temperature sensor 1 according to the exemplary embodiment of the present invention configured as described above uses an electric wire and a lead wire 11 wrapped with a covering of the wire 10 at one end of the wire 10 as shown in FIG. 2A by using a terminal or the like. Spot weld to join each other.

Then, after placing the sensor chip 20 for sensing the heat or temperature of the product at the end of the lead wire 11 and soldered so that the sensor chip 20 is more firmly connected to the end of the lead wire 11 ( soldering) work (S101).

When the sensor chip 20 is coupled to the end of the lead wire 11, as shown in FIG. 2B, the end of the lead wire 11 and the sensor chip 20 are wrapped in the device epoxy part 110, that is, the device epoxy. The unit 110 protects the sensor chip 20 by the device epoxy unit 110 by coating the end of the lead wire 11 and the sensor chip 20 by using a polymer having high thermal conductivity. Of course, the end of the lead wire 11 and the sensor chip 20 is more firmly coupled (S102).

Then, the primary injection part 120 is insert injection molded to surround the lead wire 11 and the wire 10 between the wire 10 and the sensor chip 20 (S103).

That is, as shown in FIG. 2c, the wire 10 to which the sensor chip 20 is coupled is placed in a mold of a device capable of insert injection, such as an injection molding machine, and then a synthetic resin having an adhesive force with the wire 10 in the injection molding machine. When the injection is performed, the primary injection unit 120 is not only injection molded, but the primary injection unit 120 surrounds one side of the wire 10 and the lead wire 11.

In addition, the primary injection unit 120 and the wire 10 is a material having a high affinity with each other, so that the adhesion between the primary injection unit 120 and the wire 10 is sealed, so that moisture or moisture It is possible to prevent the back from penetrating the sensor chip 20.

When the injection molding of the first injection part 120 is completed, as shown in FIG. 2D, the second injection part is formed to surround the outside of the sensor chip 20, that is, the element epoxy part 110 and the first injection part 120. 130 is insert injection molding (S104).

That is, when the primary injection unit 120 is placed in the injection molding of the wire 10 in the mold of the injection machine and then injected with a high thermal conductivity synthetic resin, the synthetic resin of the primary injection unit 120 and the device epoxy portion Since the second injection unit 130 covering the entirety of the insert 110 is injected, the manufacturing of the temperature sensor 1 as shown in FIG. 1 is completed.

On the other hand, another first embodiment of the temperature sensor 1 of the present invention, as shown in Figures 3 to 5D, the spot of the product to the end of the lead wire 11 is bonded to the spot (spot) to the wire (10) Sensor chip 20 for sensing heat or temperature is connected and coupled.

The sensor chip 20 is connected to the end of the lead wire 11 by soldering, that is, a soldering method. If the sensor chip 20 can be connected to the lead wire 11 in addition to the above method, You can use any method.

Injection molding is made of synthetic resin having high thermal conductivity such that one side of the sensor chip 20, the lead wire 11, and the wire 10 is inserted outside the one side of the sensor chip 20, the lead wire 11, and the wire 10. Primary injection unit 220 is formed.

In the first injection part 220, a space 224 is formed in which the sensor chip 20, the lead wire 11, and one side of the wire 10 are inserted.

One side of the sensor chip 20, the lead wire 11, and the wire 10 is inserted into the first injection part 220, as well as of the inserted sensor chip 20, the lead wire 11, and the wire 10. A second injection unit 230 for insert injection by inserting a synthetic resin having an adhesive force with the wire into the space portion 224 of the primary injection unit 220 to couple one side into the primary injection unit 220 is formed have.

The synthetic resin of the first injection part 220 includes high thermal conductivity polypropylene (PP: polyproylene), polyphenylene sulfide (PPS: polyphenylene surfide), polybutylene terephthalate (PBT: polybutylene terephthalate) Select one of these and use it.

The synthetic resin of the secondary injection part 230 has a high adhesive strength with the wire 10, polyvinyl chloride (PVC), polypropylene (PP: polypropylene), polyethylene (PE: polyethylene), hot melt (Hot Melt) And any one of them is used.

One side of the first injection part 220 is formed with a fastening hole 221 is inserted into a fastening member such as bolts and screws to fasten the temperature sensor (1) to the device.

Meanwhile, the first injection part 220 and the second injection part 230 are formed on an inner circumferential surface of the first injection part 220, that is, an inner circumferential surface of the first injection part 220 opposite to the sensor chip 20. When insert injection molding the secondary injection portion 230 to be more firmly coupled is formed a coupling groove 222 through which the synthetic resin flows.

The second injection unit 230, which is in contact with the first injection unit 220, is connected to the second injection unit 230 in the process of using the temperature sensor 1. The coating rupture preventing unit 223 is formed to wrap the wire 10 to a predetermined thickness to prevent the coating from being torn.

The temperature sensor 1 according to another embodiment of the present invention configured as described above has an electric wire and a lead wire 11 wrapped around the wire 10 at one end of the wire 10 as shown in FIG. Use spot welding to connect to each other.

Then, after placing the sensor chip 20 for sensing the heat or temperature of the product at the end of the lead wire 11 and soldered so that the sensor chip 20 is more firmly connected to the end of the lead wire 11 ( soldering) (S201).

Then, as shown in FIG. 5b, injection molding the primary injection part 220 using a high thermal conductive synthetic resin to insert one side of the sensor chip 20, the lead wire 11, and the wire 10 ( S202), the first injection part 220 forms a space part 224, which is an empty space inside.

The first injection part 220 is positioned in the mold of the injection machine, and the lead wire 11 having the sensor chip 20 soldered into the space part 224 of the primary injection part 220 as shown in FIG. 5C. One side of the electric wire 10 is inserted (S203).

Then, as shown in FIG. 5d, the injection molding of the secondary injection unit 230 is performed by inserting a synthetic resin having an adhesive force with the wire 10 into the space 224 of the primary injection unit 220 (S204). In other words, the injected synthetic resin flows in the space portion 224 of the primary injection part 220 while covering the sensor chip 20, the lead wire 11, and one side of the wire 10, and the sensor chip 20. Since one side of the lead wire 11 and the wire 10 is coupled in the primary injection part 220, the manufacturing of the temperature sensor 1 as shown in FIG. 3 is completed.

On the other hand, another second embodiment of the temperature sensor 1 of the present invention, as shown in Figures 6 to 9d, the spot of the product to the end of the lead wire 11 is bonded to the spot (spot) to the wire 10 Sensor chip 20 for sensing heat or temperature is connected and coupled.

The sensor chip 20 is connected to the end of the lead wire 11 by soldering, that is, a soldering method. If the sensor chip 20 can be connected to the lead wire 11 in addition to the above method, You can use any method.

Outside the ends of the sensor chip 20 and the lead wire 11, the ends of the sensor chip 20 and the lead wire 11 are thermally conductive so as to more firmly couple the ends of the sensor chip 20 and the lead wire 11. A device epoxy part 310 is formed to coat and wrap with this high polymer.

The device epoxy part 310 prevents the device epoxy part 310 from flowing in the insert injection molding process of the first injection part 320, which will be described later, on the outer surface of the device epoxy part 310 corresponding to each other. Positioning holes 324 are formed to be inserted into the fixing pin formed in the mold of the injection machine so that 310 is placed at a constant position.

Outside the polymer-coated device epoxy part 310, the device epoxy part 310 and one side of the wire 10 is wrapped and connected, as well as more accurately sense the heat or temperature in the sensor chip 20 The primary injection part 320 is formed to insert the injection into a synthetic resin with a high thermal conductivity.

On the other side of the primary injection unit 320, that is, the other side of the primary injection unit 320, which is the opposite side of the sensor chip 20, the primary injection unit 320 and the wire 10 are in close contact with each other. While being bonded in the secondary injection portion 330 for insert injection into a synthetic resin having an adhesive force with the wire 10 to form a connection coupling.

The synthetic resin of the first injection part 320 includes high thermal conductivity polypropylene (PP: polyproylene), polyphenylene sulfide (PPS: polyphenylene surfide), polybutylene terephthalate (PBT: polybutylene terephthalate), etc. Select one of these and use it.

The synthetic resin of the secondary injection unit 330 has a high adhesive strength with the wire 10, polyvinyl chloride (PVC), polypropylene (PP: polypropylene), polyethylene (PE: polyethylene), hot melt (Hot Melt) And any one of them is used.

One side of the first injection part 320 is formed with a fastening hole 321 is inserted into a fastening member such as bolts and screws to couple the temperature sensor 1 to the device.

Meanwhile, the first injection part 320 and the second injection part 330 are formed on an inner circumferential surface of the first injection part 320, that is, an inner circumferential surface of the first injection part 320, which is the opposite side of the sensor chip 20. When insert-molding the secondary injection part 330 to be more firmly coupled, a coupling groove 322 into which a synthetic resin flows is formed.

The second injection unit 330, which is in contact with the first injection unit 320, is connected to the second injection unit 330 in the process of using the temperature sensor 1. A covering rupture preventing portion 323 is formed to wrap the wire 10 to a predetermined thickness to prevent the coating from being torn.

The temperature sensor 1 according to the second embodiment of the present invention configured as described above has an electric wire and a lead wire 11 wrapped around the wire 10 at one end of the wire 10 as shown in FIG. 9A. Use spot welding to connect to each other.

Then, after placing the sensor chip 20 for sensing the heat or temperature of the product at the end of the lead wire 11 and soldered so that the sensor chip 20 is more firmly connected to the end of the lead wire 11 ( soldering) (S301).

When the sensor chip 20 is coupled to the end of the lead wire 11, as shown in FIG. 9B, one side of the sensor chip 20, the lead wire 11, and the wire 10 may be wrapped with an element epoxy part 310. That is, the device epoxy part 310 is coated to cover one side of the sensor chip 20, the lead wire 11, and the wire 10 by using a polymer having high thermal conductivity (S302).

Then, one side of the polymer-coated device epoxy part 310 and the wire 10 is insert injection molded to insert the primary injection part 320 to be wrapped in a high thermal conductive synthetic resin as shown in Figure 9c (S303) ).

At this time, the position adjustment holes 324 are formed on the outer surface of the element epoxy portion 310 in the position corresponding to each other, the respective position adjustment in the process of insert injection molding the primary injection unit 320 As the fixing pins formed in the mold of the injection machine are respectively inserted into the balls 324, when the injection molding of the primary injection part 320 is performed, the device epoxy part 310 is not flowed but is placed in the correct position. The primary injection part 320 is insert injection molded.

Therefore, the device epoxy part 310 surrounding the sensor chip 20 and one side of the wire 10 are coupled by the primary injection part 320, and the synthetic resin of the primary injection part 320 is wired ( 10, the first injection part 320 and the wire 10 is in close contact with each other because it is a material having an adhesive force with the 10) is sealed between the first injection part 320 and the wire 10, Prevent moisture or moisture from penetrating the sensor chip 20.

When the injection molding of the primary injection unit 320 is completed, as shown in FIG. 9D, the injection-molded wire 10 is positioned in the mold of the injection machine as shown in FIG. 9D. Insert injection molding the secondary injection unit 330 with a synthetic resin having an adhesive force with the wire 10 on the other side of the primary injection unit 320 on the opposite side (S304).

Then, the synthetic resin of the secondary injection unit 330 is inserted into the injection molding while surrounding the outer surface of the other side and the wire 10 of the primary injection unit 320 of the temperature sensor 1 as shown in FIG. Manufacturing is complete.

On the other hand, another third embodiment of the temperature sensor 1 of the present invention, as shown in Figures 10 to 11D, the spot of the product to the end of the lead wire 11 is bonded to the spot (spot) to the wire (10) Sensor chip 20 for sensing heat or temperature is connected and coupled.

The sensor chip 20 is connected to the end of the lead wire 11 by soldering, that is, a soldering method. If the sensor chip 20 can be connected to the lead wire 11 in addition to the above method, You can use any method.

Outside the ends of the sensor chip 20 and the lead wire 11, the ends of the sensor chip 20 and the lead wire 11 are thermally conductive so as to more firmly couple the ends of the sensor chip 20 and the lead wire 11. A device epoxy part 410 is formed to coat and wrap with this high polymer.

The first injection part 420 that is injection molded from a high temperature conductive synthetic resin so that the outside of the device epoxy part 410, that is, the device epoxy part 410 surrounding the sensor chip 20 and one side of the wire 10 is inserted. ) Is formed, and the first injection part 420 is formed with a space 424 which is empty inside so that the device epoxy part 410 and one side of the wire can be inserted therein.

The device epoxy part 410, the lead wire 11, and the wire 10 in the state where the device epoxy part 410, the lead wire 11, and one side of the wire 10 are inserted into the primary injection part 420. A second injection part 430 is formed to insert and insert injection of a synthetic resin having an adhesive force with an electric wire into the space part 424 of the first injection part 420 so as to couple one side of the first injection part 420 into the first injection part 420. have.

The secondary injection part 430 is injection molded to the rear end of the device epoxy part 410 while wrapping one side of the wire 10.

The synthetic resin of the first injection part 420 may be a high thermal conductivity polypropylene (PP: polyproylene), polyphenylene sulfide (PPS: polyphenylene surfide), polybutylene terephthalate (PBT: polybutylene terephthalate), Use any one of these.

The synthetic resin of the secondary injection part 430 has a high adhesive strength with the wire 10, polyvinyl chloride (PVC), polypropylene (PP: polypropylene), polyethylene (PE: polyethylene), hot melt (Hot Melt) And any one of them is used.

The outer surface of the end portion of the element epoxy portion 410, that is, the side where the sensor chip 20 is located in the drawing, the outer surface portion 410a of the element epoxy portion 410 and the space portion of the primary injection portion 420 ( 424) The inner end 420a is formed in the same shape in various shapes such as a round shape and an angular shape so that the element epoxy part 410 is inserted into and fixed in the space part 424 of the primary injection part 420. have.

One side of the primary injection unit 420 is formed with a fastening hole 421 is inserted into a fastening member such as bolts and screws to fasten the temperature sensor 1 to the device.

Meanwhile, the first injection part 420 and the second injection part are formed on the inner and outer circumferential surfaces of the primary injection part 420, that is, the inner and outer circumferential surfaces of the primary injection part 320 that are opposite to the element epoxy part 410. When insert-molding the secondary injection part 430 so that the part 430 is more firmly coupled, a coupling groove part 422 is formed through which a synthetic resin flows. That is, the coupling groove part 422 is a primary injection part. An inner coupling groove 422a formed on the inner circumferential surface of 420 and an outer coupling groove 422b formed on the outer circumferential surface of the primary injection part 420.

The secondary injection part 430, which is a side in contact with the primary injection part 420, has a coating of the wire 10 at a portion where the secondary injection part 430 is folded in the process of using the temperature sensor 1. A covering rupture prevention part 423 is formed to wrap the wire 10 to a predetermined thickness to prevent tearing.

The temperature sensor 1 according to the third embodiment of the present invention configured as described above has an electric wire and a lead wire 11 wrapped around the wire 10 at one end of the wire 10 as shown in FIG. Use spot welding to connect to each other.

Then, after placing the sensor chip 20 for sensing the heat or temperature of the product at the end of the lead wire 11 and soldered so that the sensor chip 20 more firmly connected to the end of the lead wire 11 ( soldering) work (S401).

When the sensor chip 20 is coupled to the end of the lead wire 11, as shown in FIG. 11B, the sensor chip 20 and the end of the lead wire 11 are wrapped in the element epoxy part 410, that is, the thermal conductivity is high. The device epoxy part 410 using the polymer is coated with the sensor chip 20 and the ends of the lead wire 11 while coating (S402), so that the sensor chip 20 and the lead wire 11 by the device epoxy part 410. Is more tightly coupled.

And, as shown in Figure 11c the synthetic resin having a high thermal conductivity of the primary injection portion 420 having a space 424 is an empty space inside so that one side of the element epoxy portion 410 and the wire 10 can be inserted Injection molding is performed (S403).

Thereafter, the first injection part 420 is positioned in the mold of the injection machine, and then the device epoxy part 410 and the device epoxy part 410 are inserted into the space part 424 of the first injection part 420. Insert up to one side of the combined wire 10 (S404).

At this time, the end portion 420a of the space portion 424 of the primary injection portion 420 and the outer surface 410a of the end portion of the element epoxy portion 410 are formed in the same shape, that is, the same as the round shape here. Accordingly, the end portion 420a of the space portion 424 of the primary injection portion 420 and the outer surface 410a of the end portion of the device epoxy portion 410 are inserted and fixed in close contact.

Then, a synthetic resin having an adhesive force with the wire 10 is injected into the space part 424 of the primary injection part 420 to insert injection (S405) the secondary injection part 430. The synthetic resin injected into the space part 424 of the primary injection part 420 flows to the rear end of the device epoxy part 410 and at one end of the wire 10 at the rear end of the device epoxy part 410. The secondary injection part 430 is insert injection molded to the side.

Therefore, the secondary injection part 430 couples the element epoxy part 410 into the space part 424 of the primary injection part 420 as well as the primary injection part 420 and the wire 10. Due to the combination surrounding one side, the manufacturing of the temperature sensor 1 as shown in FIG. 10 is completed.

As shown in the above embodiment and each other embodiment, by using a synthetic resin having an adhesive force with the wire, as well as by injection molding the temperature sensor 1 using a synthetic resin having high thermal conductivity, the temperature sensor ( 1) By preventing the penetration of moisture, moisture, etc. to prevent malfunctions and failures, as well as using the above-described temperature sensor 1 more safely, the temperature sensor 1 more than the heat or temperature generated from the device High-speed response is possible by accurately detecting and transmitting the performance and quality of the temperature sensor 1 is improved.

As described above, the injection type temperature sensor structure and its manufacturing method according to the present invention have been described with reference to the illustrated drawings, but the present invention is not limited by the embodiments and drawings described herein and the technical scope of the present invention. Various modifications may be made by those skilled in the art, and thus should not be individually understood from the technical spirit or the prospect of the present invention.

1 is a structural diagram showing an embodiment of the present invention, a temperature sensor,

2a to 2d are views sequentially showing a state of manufacturing a temperature sensor of an embodiment of the present invention.

Figure 3 is a structural diagram showing another embodiment of the temperature sensor of the present invention.

Figure 4 is a plan view showing a temperature sensor of another embodiment of the present invention in a plan view.

5A to 5D are views sequentially showing a state of manufacturing a temperature sensor according to another embodiment of the present invention.

Figure 6 is a structural diagram showing another second embodiment of the temperature sensor of the present invention.

Figure 7 is a plan view showing a temperature sensor of a second embodiment of the present invention in a plane.

Figure 8 is a side view showing one side of the temperature sensor of the second embodiment of the present invention from the side.

9A to 9D are views sequentially showing a state of manufacturing a temperature sensor according to a second embodiment of the present invention.

Figure 10 is a structural diagram showing another third embodiment of the temperature sensor of the present invention.

11A to 11D are views sequentially showing a state of manufacturing a temperature sensor according to another third embodiment of the present invention.

Figure 11 is a block diagram showing a manufacturing process of the temperature sensor of an embodiment of the present invention.

12 is a block diagram showing a manufacturing process of a temperature sensor according to another embodiment of the present invention.

Figure 13 is a block diagram showing a manufacturing process of the temperature sensor of the second embodiment of the present invention.

14 is a block diagram showing a manufacturing process of a temperature sensor according to a third embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

1: temperature sensor 10: wire

11: lead wire 20: sensor chip

110: device epoxy part 120,220.320,420: primary injection part

130,230,330,430: Second injection part 121,221,321,421: Fastening hole

122,222.322.422: Coupling groove 123,223,323,423: Cover rupture prevention

Claims (20)

On one end of the lead wire spot-welded to one side of the wire, a sensor chip for sensing the temperature is soldered, Outside the end of the sensor chip and the lead wire is formed an element epoxy part for coating a polymer so as to connect the end of the sensor chip and the lead wire to each other, One side of the wire and the outside of the lead wire is formed with a first injection portion for insert injection into the synthetic resin having an adhesive force with the wire to wrap and connect the wire and lead wire together, An injection type temperature sensing sensor structure, characterized in that the secondary injection portion for insert injection into the synthetic resin is formed on the outside of the primary injection portion and the sensor chip to wrap and connect the primary injection portion and the sensor chip together. delete On one end of the lead wire spot-welded to one side of the wire, a sensor chip for sensing the temperature is soldered, On the outside of the end of the sensor chip and the lead wire is formed an element epoxy part for coating a polymer so as to connect the end of the sensor chip and the lead wire to each other, Outside the polymer-coated device epoxy part is formed a first injection part for insert injection into the synthetic resin to wrap and connect the device epoxy part and one side of the wire, An injection type temperature sensor structure, characterized in that the second injection portion for insert injection into the synthetic resin having an adhesive force with the wire to the other side portion of the primary injection portion is connected to the primary injection portion and the wire. On one end of the lead wire spot-welded to one side of the wire, a sensor chip for sensing the temperature is soldered, On the outside of the end of the sensor chip and the lead wire is formed an element epoxy part for coating a polymer so as to connect the end of the sensor chip and the lead wire to each other, The first injection part which forms an empty space inside the device epoxy part and one side of the electric wire is inserted into the outside of the device epoxy part and the wire, and is injection molded with synthetic resin, The secondary injection portion for insert injection into the synthetic resin having an adhesive force with the wire is formed in the space in the primary injection portion is coupled to the device epoxy portion inserted into the primary injection portion in close contact with the wire and the primary injection portion. An injection type temperature sensor structure. The method of claim 1, An injection type temperature sensing sensor structure, characterized in that the coupling groove is formed along the outer circumferential surface of the primary injection portion to increase the coupling force of the primary injection portion and the secondary injection portion on the outer peripheral surface of the primary injection portion. The method of claim 3, wherein An injection type temperature sensing sensor structure, characterized in that the coupling groove is formed along the inner circumferential surface of the primary injection unit to increase the coupling force of the primary injection unit and the secondary injection unit on the inner peripheral surface of the primary injection unit. The method of claim 4, wherein The inner and outer peripheral surfaces of the primary injection unit, the injection type temperature sensor structure characterized in that the coupling grooves are formed along the inner and outer peripheral surfaces of the primary injection unit to increase the coupling force of the primary injection unit and the secondary injection unit. The method of claim 4, wherein The outer surface of the end portion of the element epoxy portion and the inner end side of the primary injection portion are formed in the same shape so that the element epoxy portion is in close contact with the primary injection portion, respectively, characterized in that the injection type temperature sensor structure. The method of claim 8, The shape of the end outer surface of the element epoxy portion and the inner end side of the primary injection portion is formed in a round shape, respectively, characterized in that the injection type temperature sensor structure. The method according to claim 3 or 4, The outer surface of the secondary injection portion, which is a side corresponding to the sensor chip, an injection type temperature sensor structure, characterized in that the coating rupture prevention portion is formed to prevent the outer surface of the secondary injection portion from tearing in contact with the primary injection portion. The method of claim 3, wherein In the position corresponding to each other on the outer surface of the element epoxy part, the injection hole of the injection molding part of the primary injection part is prevented from flowing, as well as positioning holes for inserting the fixing pins of the mold to be placed at a certain position Injection type temperature sensor structure. The method of claim 1, Synthetic resin of the primary injection unit is polyvinyl chloride (PVC), polypropylene (PP), polyethylene (PE), hot melt (Hot Melt), characterized in that the injection type temperature sensor structure. The method of claim 1, Synthetic resin of the secondary injection part is any one of polypropylene (PP), polyphenylene sulfide (PPS), polybutylene terephthalate (PBT) injection type temperature sensor structure. The method according to claim 3 or 4, Synthetic resin of the primary injection part is any one of polypropylene (PP), polyphenylene sulfide (PPS), polybutylene terephthalate (PBT) injection type temperature sensor structure. The method according to claim 3 or 4, Synthetic resin of the secondary injection unit is polyvinyl chloride (PVC), proppropylene (PP), polyethylene (PE), hot melt (Hot Melt), characterized in that the injection type temperature sensor structure. Soldering the sensor chip to the lead wire connected to one side of the wire (S101); Coating a polymer to form an element epoxy part which wraps and couples the end of the lead wire and the sensor chip (S102); Insert injection into a synthetic resin having an adhesive force with the wire so as to form a primary injection part surrounding one side of the wire and the lead wire (S103); And inserting the insert into the synthetic resin to form a secondary injection unit which combines the primary injection unit and the device epoxy unit together to form a secondary injection unit (S104). Soldering the sensor chip to the lead wire connected to one side of the wire (S201); Injection molding the primary injection part to form an empty space in a synthetic resin (S202); Inserting one side of the lead wire and the wire to which the sensor chip is soldered into the empty space of the first injection part (S203); Inserting and inserting a synthetic resin having an adhesive force with the wire in the primary injection part to form a secondary injection part in which the sensor chip is coupled in the primary injection part into which the soldered lead wire and one side of the wire are inserted (S204); Method of manufacturing an injection type temperature sensor, characterized in that consisting of. Soldering the sensor chip to the lead wire connected to one side of the wire (S301); Coating a polymer to form an element epoxy part which wraps and couples the end of the lead wire and the sensor chip (S302); Insert injection into a synthetic resin to form a primary injection unit which wraps and bonds the device epoxy unit and one side of the electric wire (S303); And inserting the insert into the synthetic resin having an adhesive force with the wire to form a second injection portion connecting the other side portion and the wire to each other by connecting the primary injection portion (S304). The method of claim 18, In the step of forming the element epoxy part, in the insert injection step of forming the element injection part, a position adjusting hole into which the fixing pin of the mold is inserted is formed at a position corresponding to each other on the outer surface of the element epoxy part to prevent the device epoxy part from flowing. Injection type temperature sensor manufacturing method characterized in that. Soldering the sensor chip to the lead wire connected to one side of the wire (S401); Coating a polymer to form an element epoxy unit which wraps and couples the end of the lead wire and the sensor chip (S402); Injection molding the primary injection part to form an empty space in a synthetic resin (S403); Inserting one side of the lead wire and the wire to which the sensor chip is soldered into the empty space of the first injection part (S404); A device epoxy part is inserted into and fixed in the primary injection part, and a synthetic resin having an adhesive force with an electric wire is inserted into a space in the primary injection part to form a secondary injection part that couples the primary injection part and the wire. Injection step (S405); Method of manufacturing an injection type temperature sensor, characterized in that consisting of.

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