KR100997287B1 - 높은 강도 및 높은 내연화성을 갖는 구리 합금 - Google Patents
높은 강도 및 높은 내연화성을 갖는 구리 합금 Download PDFInfo
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- KR100997287B1 KR100997287B1 KR1020070075530A KR20070075530A KR100997287B1 KR 100997287 B1 KR100997287 B1 KR 100997287B1 KR 1020070075530 A KR1020070075530 A KR 1020070075530A KR 20070075530 A KR20070075530 A KR 20070075530A KR 100997287 B1 KR100997287 B1 KR 100997287B1
- Authority
- KR
- South Korea
- Prior art keywords
- copper alloy
- mass
- softening resistance
- alloy
- amount
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (5)
- 0.01 내지 4.0 질량%의 범위의 Fe, 0.01 내지 0.15 질량%의 범위의 P, 0.59 질량% 이상 4.0 질량% 이하의 Sn 및 총합이 0.001 내지 0.02 질량%의 범위의 Ni, Mg, Ca, Al, Si 및 Cr로 이루어지는 그룹으로부터 선택된 하나 이상의 원소를 포함하고, 잔부가 Cu 및 불가피 불순물이고, 구리 합금에 함유된 Fe의 양에 대한 추출 잔류물법에 의해 개구 크기가 0.1㎛인 필터 상에 추출되어 분리되는 추출 잔류물의 Fe의 양의 비가 80% 이하인 높은 강도 및 높은 내연화성을 갖는 구리 합금이며,상기 추출 잔류물법은,10 질량% 농도의 암모늄 아세테이트를 함유하는 300ml 메탄올 용액에 10g의 구리 합금을 침지하고 상기 구리 합금을 애노드로서 사용하는 단계와,10mA/cm2의 전류 밀도에서 캐소드로서 백금을 사용하여 정전류 전해법을 적용하고, 이에 의해 상기 메탄올 용액 내에 상기 구리 합금을 용해하는 단계와,0.1㎛의 개구 크기를 갖는 폴리카보네이트 멤브레인 필터의 사용에 의해 감소된 압력 하에서 상기 구리 합금이 용해되어 있는 상기 메탄올 용액을 여과하는 단계와,상기 필터 상에 용해되지 않은 잔류물을 분리하여 추출하는 단계를 포함하고,상기 추출 잔류물의 Fe의 양은 ICP 방출 분광계에 의해 이후에 분석되도록 1:1의 비로 물과 왕수를 혼합함으로써 준비된 용액 내에 상기 필터 상의 용해되지 않은 잔류물을 용해함으로써 구해지는 구리 합금.
- 제1항에 있어서, Fe 함량은 0.01 내지 0.5 질량%의 범위인 구리 합금.
- 제1항 또는 제2항에 있어서, 0.005 내지 3.0 질량%의 범위의 Zn를 더 포함하는 구리 합금.
- 제1항 또는 제2항에 있어서, 상기 구리 합금은 IC 리드 프레임으로서 사용을 위한 구리 합금 시트의 형태인 구리 합금.
- 제3항에 있어서, 상기 구리 합금은 IC 리드 프레임으로서 사용을 위한 구리 합금 시트의 형태인 구리 합금.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006206672A JP4950584B2 (ja) | 2006-07-28 | 2006-07-28 | 高強度および耐熱性を備えた銅合金 |
JPJP-P-2006-00206672 | 2006-07-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080011109A KR20080011109A (ko) | 2008-01-31 |
KR100997287B1 true KR100997287B1 (ko) | 2010-11-29 |
Family
ID=38294110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070075530A KR100997287B1 (ko) | 2006-07-28 | 2007-07-27 | 높은 강도 및 높은 내연화성을 갖는 구리 합금 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080025867A1 (ko) |
EP (1) | EP1882751A1 (ko) |
JP (1) | JP4950584B2 (ko) |
KR (1) | KR100997287B1 (ko) |
CN (1) | CN101113499A (ko) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1803829B1 (en) * | 2004-08-17 | 2013-05-22 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy plate for electric and electronic parts having bendability |
US20090116996A1 (en) * | 2005-06-08 | 2009-05-07 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel Ltd.) | Copper alloy, copper alloy plate, and process for producing the same |
US8268098B2 (en) * | 2006-05-26 | 2012-09-18 | Kobe Steel, Ltd. | Copper alloy having high strength, high electric conductivity and excellent bending workability |
WO2008010378A1 (en) * | 2006-07-21 | 2008-01-24 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy sheets for electrical/electronic part |
EP2088214B1 (en) * | 2006-10-02 | 2011-08-03 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy plate for electrical and electronic components |
JP2009179864A (ja) * | 2008-01-31 | 2009-08-13 | Kobe Steel Ltd | 耐応力緩和特性に優れた銅合金板 |
JP5123720B2 (ja) * | 2008-04-22 | 2013-01-23 | 株式会社神戸製鋼所 | 耐熱性に優れた電気電子部品用銅合金板 |
EP3128039B1 (en) * | 2008-09-30 | 2019-05-01 | JX Nippon Mining & Metals Corp. | High-purity copper sputtering target or high-purity copper alloy sputtering target |
KR101058765B1 (ko) | 2008-09-30 | 2011-08-24 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 고순도 구리 및 전해에 의한 고순도 구리의 제조 방법 |
CN101768680B (zh) * | 2008-12-26 | 2011-07-20 | 北京有色金属研究总院 | 一种适用于引线框架用铜合金的复合变质剂 |
CN104073677B (zh) * | 2013-03-27 | 2017-01-11 | 株式会社神户制钢所 | Led的引线框用铜合金板条 |
JP6328380B2 (ja) * | 2013-05-31 | 2018-05-23 | Jx金属株式会社 | 導電性及び曲げたわみ係数に優れる銅合金板 |
JP6210910B2 (ja) * | 2014-03-18 | 2017-10-11 | 株式会社神戸製鋼所 | 強度、耐熱性及び曲げ加工性に優れたFe−P系銅合金板 |
JP2016211053A (ja) | 2015-05-12 | 2016-12-15 | 株式会社神戸製鋼所 | 耐熱性に優れた銅合金 |
CN105063416A (zh) * | 2015-07-22 | 2015-11-18 | 芜湖楚江合金铜材有限公司 | 一种环保节约型铜合金线材及其加工方法 |
CN105323878B (zh) * | 2015-08-17 | 2017-11-24 | 林月瑜 | 一种发热丝材料及其制备方法 |
JP6446007B2 (ja) * | 2015-12-25 | 2018-12-26 | 株式会社神戸製鋼所 | 放熱部品用銅合金板 |
CN106350698B (zh) * | 2016-09-09 | 2018-03-27 | 宁波博威合金板带有限公司 | 抗软化铜合金、制备方法及其应用 |
WO2018066414A1 (ja) * | 2016-10-05 | 2018-04-12 | 株式会社神戸製鋼所 | 放熱部品用銅合金板、放熱部品、及び放熱部品の製造方法 |
CN109149794B (zh) * | 2017-06-28 | 2020-11-17 | 金宝电子工业股份有限公司 | 无线充电系统与无线充电方法 |
CN109777994A (zh) * | 2019-04-01 | 2019-05-21 | 宁波金田铜业(集团)股份有限公司 | 一种电子屏蔽铜合金线材及其制备方法和应用 |
CN110042273B (zh) * | 2019-05-29 | 2020-11-06 | 南京达迈科技实业有限公司 | 一种高强高导铜合金管及其制备方法 |
CN110146667A (zh) * | 2019-06-25 | 2019-08-20 | 广州市婵昕生物科技有限责任公司 | 一种具有温控功能的便捷型农药残留检测仪 |
CN110616353B (zh) * | 2019-10-28 | 2021-09-24 | 河南科技大学 | 一种高纯高导铜及其制备方法 |
CN114058896A (zh) * | 2021-09-30 | 2022-02-18 | 浙江海亮股份有限公司 | 高强抗氧锡青铜合金及制备方法 |
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JP2000328157A (ja) | 1999-05-13 | 2000-11-28 | Kobe Steel Ltd | 曲げ加工性が優れた銅合金板 |
JP2001279347A (ja) | 2000-03-30 | 2001-10-10 | Kobe Steel Ltd | 曲げ加工性および耐熱性に優れた高強度銅合金およびその製造方法 |
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US5820701A (en) * | 1996-11-07 | 1998-10-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
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EP1803829B1 (en) * | 2004-08-17 | 2013-05-22 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy plate for electric and electronic parts having bendability |
-
2006
- 2006-07-28 JP JP2006206672A patent/JP4950584B2/ja not_active Expired - Fee Related
-
2007
- 2007-05-31 US US11/756,117 patent/US20080025867A1/en not_active Abandoned
- 2007-06-13 EP EP07011610A patent/EP1882751A1/en not_active Withdrawn
- 2007-06-26 CN CNA2007101262374A patent/CN101113499A/zh active Pending
- 2007-07-27 KR KR1020070075530A patent/KR100997287B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000328157A (ja) | 1999-05-13 | 2000-11-28 | Kobe Steel Ltd | 曲げ加工性が優れた銅合金板 |
JP2001279347A (ja) | 2000-03-30 | 2001-10-10 | Kobe Steel Ltd | 曲げ加工性および耐熱性に優れた高強度銅合金およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20080025867A1 (en) | 2008-01-31 |
CN101113499A (zh) | 2008-01-30 |
JP2008031525A (ja) | 2008-02-14 |
JP4950584B2 (ja) | 2012-06-13 |
KR20080011109A (ko) | 2008-01-31 |
EP1882751A1 (en) | 2008-01-30 |
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