KR100990770B1 - Plasma display panel and body structure of thereof - Google Patents

Abstract

A plasma display panel (PDP) is described that can effectively improve the discharge delay even when the rest period from the last discharge to the address discharge is long. In the PDP, the priming particle emitting layer is disposed so as to be exposed to the discharge space between two opposing substrate structures. The priming particle release layer is composed of magnesium oxide crystals to which 1 to 10000 ppm of a halogen element is added.

Plasma display, magnesium oxide crystals, priming particle emitting layer, address discharge, discharge delay

Description

Plasma display panel, substrate structure of plasma display panel {PLASMA DISPLAY PANEL AND BODY STRUCTURE OF THEREOF}

The present invention relates to a plasma display panel (hereinafter referred to as "PDP") and a substrate structure of a PDP.

6 is a perspective view showing the structure of a conventional PDP. The PDP has a structure in which the front substrate structure 1 and the back substrate structure 2 are bonded to each other. The front substrate structure 1 has a plurality of display electrodes 3 made of a transparent electrode 3a and a metal electrode 3b on the front substrate 1a made of a glass substrate. The display electrode 3 is covered with a dielectric layer 4, and a protective layer 5 made of a magnesium oxide layer having a high secondary electron emission coefficient is formed on the dielectric layer 4. The back side substrate structure 2 is arranged so that a plurality of address electrodes are orthogonal to the display electrodes on the back side substrate 2a made of a glass substrate. A partition wall 7 is formed between the address electrodes 6 to define the light emitting area (partitioning the discharge space), and red, green, and blue colors are formed in the area divided by the partition wall 7 on the address electrode 6. The phosphor layer 8 is formed. A discharge gas made of Ne-Xe gas is enclosed in an airtight discharge space partitioned by a partition between the bonded front side substrate structure 1 and the back side substrate structure 2. Although not shown, the address electrode 6 is covered with a dielectric layer, and the partition wall 7 and the phosphor layer 8 are formed on the dielectric layer.

Thus, in this PDP, by applying a voltage between the address electrode 6 and the display electrode 3 serving as the scan electrode, an address discharge is generated and a voltage is applied between the paired display electrodes 3, Reset discharge or sustain discharge for display is generated.

Such a PDP has been put into practical use as a large-sized thin television, and high definition has recently been advanced. Higher definitions increase the number of pixels, which increases the time for address operation for determining the lighting non-lighting of a cell. In order to suppress an increase in the address operation time (address period), it is necessary to reduce the pulse width of the address discharge voltage (also called the address voltage). However, since there is a variation in the time from the application of the voltage to the discharge (discharge delay), the discharge may not occur if the pulse width of the address voltage is too small. In this case, there is a problem that the quality of the image is deteriorated because the cells do not turn on correctly in the display period in which the addressed cells are kept lit.

As a means for improving the discharge delay of such a PDP, an example of forming a magnesium oxide crystal layer as an electron emission layer in a front substrate structure is disclosed by Japanese Patent Laid-Open No. 2006-59786.

The present inventors earnestly studied, and in the method disclosed in Japanese Patent Laid-Open No. 2006-59786, when the rest period from the last discharge to the address discharge is short (approximately several degrees or less), the effect of improving the discharge delay is improved. Although it appears that, when the rest period is long, it is evident that the improvement effect of the discharge delay is extremely deteriorated.

It is an object of the present invention to provide a PDP which can effectively improve the discharge delay even when the rest period from the last discharge to the address discharge is long.

According to the present invention, there is provided a PDP in which a priming particle emitting layer containing magnesium oxide crystals containing 1 to 10000 ppm of halogen element is disposed so as to be exposed to the discharge space between two opposing substrate structures.

As a result of earnestly researching the inventors, the priming particles (hereinafter referred to as "P particles") containing the magnesium oxide crystals (hereinafter referred to as "MgO crystals") containing 1 to 10000 ppm of halogen elements are discharged. When it is arrange | positioned so that it may be exposed to space, since the improvement effect of a discharge delay lasts for a long time, it discovered that even if the rest period from last discharge to an address discharge is long, discharge discharge can be improved effectively, Completion of this invention. Reached.

The reason why the effect of improving the discharge delay lasts for a long time by the present invention is not necessarily clear, but it is presumed that the added halogen element is replaced by oxygen in the MgO crystal, which becomes an electron trap and the electron emission characteristic is improved.

Further, according to the present invention, since the improvement effect of the discharge delay lasts for a long time, the discharge delay when the rest period is long can be effectively suppressed even in a relatively small amount, leading to cost reduction.

EMBODIMENT OF THE INVENTION Hereinafter, the Example of this invention is described using drawing. The structure shown in drawing and the following description is an illustration, and the scope of the present invention is not limited to what is shown in drawing or the following description. In addition, in the following embodiment, although a reflective 3-electrode surface discharge type PDP is demonstrated as an example, this invention is applicable also to PDP of this kind other than this. For example, the present invention can be applied to a transmissive PDP in which the configurations of the "front side" and "back side" are reversed, and PDPs having different numbers of electrodes, electrode arrangements, and discharge types.

1 shows the structure of a PDP according to an embodiment of the present invention, in which FIG. 1 (a) is a plan view, and FIGS. 1 (b) and (c) are II sectional views and II in FIG. -II section.

The PDP of the present embodiment has a front side substrate structure 1 and a back side substrate structure 2 arranged oppositely. The front substrate structure 1 covers a plurality of display electrodes 3 made of a transparent electrode 3a and a metal electrode 3b and a plurality of display electrodes 3 on the front substrate 1a, respectively. The dielectric layer 4 and the P particle emitting layer 11 are provided on the dielectric layer 4 via the protective layer 5.

The back side substrate structure 2 includes a plurality of address electrodes 6 intersecting (preferably orthogonal) to the display electrodes 3 on the back side substrate 2a and a dielectric layer covering the plurality of address electrodes 6. (9), the partition wall 7 and the phosphor layer 8 are provided on the dielectric layer 9.

The airtight discharge of the front side board | substrate structure 1 and the back side board | substrate structure 2 by which the peripheral part was joined by the sealing material and partitioned by the partition between the front side board | substrate structure 1 and the back side board | substrate structure 2 was carried out. In the space, a discharge gas (eg, a mixture of neon and a few percent of xenon) is sealed.

The P particle emitting layer 11 is disposed so as to be exposed to the discharge space and contains MgO crystals containing 1 to 10,000 ppm of a halogen element added thereto.

Hereinafter, each component is demonstrated in detail.

1-1. Substrate, display electrode, dielectric layer, protective layer (front substrate structure)

The board | substrate 1a of a front side is not specifically limited, Any board | substrate known in the said field can be used. Specifically, transparent substrates, such as a glass substrate and a plastic substrate, are mentioned.

The display electrode 3 includes a wide transparent electrode 3a made of, for example, ITO, SnO ₂ , and the like, for example, Ag, Au, Al, Cu, Cr, and a stack thereof for lowering the resistance of the electrode. It can be comprised by the narrow metal electrode 3b which consists of a sieve (for example, the laminated structure of Cr / Cu / Cr). The shape of the transparent electrode 3a and the metal electrode 3b is not specifically limited, T-shape or ladder shape may be sufficient. The shapes of the transparent electrode 3a and the metal electrode 3b may be same or different. For example, the transparent electrode 3a may be T-shaped or ladder-shaped, and the metal electrode 3b may be straight. In addition, the transparent electrode 3a can be abbreviate | omitted and in this case, the display electrode 3 consists only of the metal electrode 3b.

The plurality of display electrodes 3 constitute a pair of display electrodes in pairs, but an array in which non-discharge regions (also called reverse slits) are formed between the electrode pairs in an electrode array form, and the electrodes are arranged at equal intervals. All the adjacent electrodes are arrange | positioned by either of the ALIS type | mold arrays which become a discharge area | region. The pair is composed of a scan electrode 3Y used for address discharge between the address electrode 6 and a sustain electrode 3X used for sustain discharge between the scan electrode 3Y and the like.

The dielectric layer 4 can be formed by, for example, applying a low melting glass paste obtained by adding a binder and a solvent to a low melting glass frit on the substrate after the display electrode 3 is formed by screen printing and firing. The dielectric layer 4 may be formed by depositing silicon oxide on the substrate after the display electrode 3 is formed by the CVD method or the like.

The protective layer 5 is made of a metal (more specifically, a divalent metal) oxide such as magnesium oxide, calcium oxide, strontium oxide or barium oxide, and preferably magnesium oxide. The protective layer 5 is formed by a vapor deposition method, a sputtering method, a coating method, or the like.

1-2. Substrate, address electrode, dielectric layer, barrier rib, phosphor layer (back side substrate structure)

The board | substrate 2a of the back side is not specifically limited, Any board | substrate known in the said field can be used. Specifically, transparent substrates, such as a glass substrate and a plastic substrate, are mentioned.

The address electrode 6 can be comprised, for example with Ag, Au, A1, Cu, Cr, and those laminated bodies (for example, laminated structure of Cr / Cu / Cr).

The dielectric layer 9 can be formed by the same material and method as the dielectric layer 4.

The partition 7 can be formed by forming a partition forming material layer such as a low melting glass paste on the dielectric layer 9, patterning the partition forming material layer by sand blasting or the like, and firing. The partition 7 may be formed by a method other than this. The shape of the partition 7 is not limited, For example, it can be set as stripe type, meander type, lattice type, or ladder type.

The phosphor layer 8 is coated with, for example, screen printing, a method using a dispenser, or the like in a groove between adjacent partitions 7 by applying a phosphor paste containing phosphor powder and a binder. It can form by baking after repeating for every B).

1-3. Priming Particle (P Particle) Emission Layer

The P particle emitting layer 11 is disposed so as to be exposed to the discharge space, and contains MgO crystals (hereinafter referred to as MgO crystals added with halogen elements "halogen-added MgO crystals") containing 1 to 10,000 ppm of halogen elements. It consists of P particle emitting material. In this specification, "ppm" is a weight concentration. The P particle-releasing material may contain components other than halogenated MgO crystals, may contain halogenated MgO crystals as a main component, and may consist only of halogenated MgO crystals.

The kind of halogen element is not specifically limited. A halogen element consists of 1 type, or 2 or more types of fluorine, chlorine, bromine, and iodine, for example. In the case of fluorine, it has been confirmed that the effect of improving the discharge delay lasts for a long time, but similar effects are obtained even when halogen other than fluorine is added from the similarity of the electronic state.

The amount of the halogen element added is not particularly limited. The addition amount of a halogen element is 1-10000 ppm, for example. In the Examples, since it is confirmed that the same effect is obtained even if the amount of halogen element is changed in the range of 24 to 440 ppm, the effect of the amount of halogen element added to the effect is considered not to be significant, and the amount of addition is about 1 to 10000 ppm. If it is in the range of, it is considered that the effect of improving the discharge delay lasts for a long time. The amount of halogen element added is, for example, 1, 5, 10, 15, 20, 30, 40, 50, 60, 70, 80, 90, 100, 120, 140, 160, 180, 200, 250, 300, 350, 400, 450, 500, 600, 700, 800, 900, 1000, 1500, 2000, 3000, 4000, 5000, 6000, 7000, 8000, 9000 or 10000 ppm. The addition amount of a halogen element may be in the range between any two numerical values illustrated here. The amount of the halogen element added can be measured by combustion-ion chromatograph analysis.

The method for producing the halogenated MgO crystals is not particularly limited. Halogenated MgO crystal | crystallization can be manufactured by mixing and baking MgO crystal | crystallization and a halogen containing substance, and pulverizing in an example. MgO crystals are described later. Examples of the halogen-containing substance include halides of magnesium (such as magnesium fluoride) and halides of Al, Li, Mn, Zn, Ca, and Ce. It is preferable to perform baking at 1000-1700 degreeC. The temperature of firing is, for example, 1000, 1100, 1200, 1300, 1400, 1500, 1600 or 1700 ° C. The temperature of baking may be in the range between any two numerical values illustrated here. Although the method of disintegrating a fired material is not specifically limited, For example, the method of making a fired material into a mortar, grind | pulverizing it into a pestle, and making it into powder shape is mentioned.

Halogenated MgO crystals are preferably powdery, and the size and shape thereof are not particularly limited, but the average particle diameter is preferably 0.05 to 20 µm. This is because the halogen-added MgO crystals have a small effect of improving the discharge delay when the average particle diameter is too small, and the P particle emitting layer 11 is difficult to be uniformly formed when the average particle diameter is too large.

The average particle diameter of halogen-containing MgO crystals can be calculated | required according to following formula (1).

(Where a is a shape coefficient of 6, S is a BET specific surface area determined by nitrogen adsorption, and ρ is the true density of halogenated MgO crystals)

The average particle diameter of the halogenated MgO crystals is specifically, for example, 0.05, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 2, 3, 4, 5, 6, 7 , 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20 μm. The range of the average particle diameter of a halogenated MgO crystal may be between any two of the numerical values illustrated as said specific average particle diameter.

Next, MgO crystals used for producing halogenated MgO crystals will be described. MgO crystals have a characteristic of performing cathode luminescence emission having a peak within a wavelength region of 200 to 300 nm by irradiation with an electron beam. MgO crystals are preferably powdery, and the size and shape thereof are not particularly limited, but the average particle diameter is preferably 0.05 to 20 µm.

The average particle diameter of MgO crystals can be obtained according to the following equation.

(Where a is a shape coefficient of 6, S is a BET specific surface area determined by nitrogen adsorption method, ρ is a true density of magnesium oxide)

The average particle diameter of MgO crystals specifically, is 0.05, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 2, 3, 4, 5, 6, 7, 8 , 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20 μm. The range of the average particle diameter of MgO crystal | crystallization may be between any two of the numerical values illustrated as said specific average particle diameter.

Although the manufacturing method of MgO crystal | crystallization is not specifically limited, It is preferable to manufacture by the vapor phase method which makes magnesium vapor and oxygen react, for example, the method of Unexamined-Japanese-Patent No. 2004-182521, and "Material" digestion 62 years 11 It can be prepared by the method described in "Synthesis and Properties of Magnesia Powder by Meteorological Method" on pages 1157 to 1161 of the monthly issue 36, 410. In addition, you may purchase MgO crystals from Ube Material Corporation. It is preferable to manufacture by a vapor phase method, because MgO crystals are manufactured by a vapor phase method, and high purity single crystals are obtained.

The P particle emitting layer 11 can be disposed on the dielectric layer 4 directly or through another layer. In FIG. 1, the P particle emitting layer 11 is disposed on the dielectric layer 4 via the protective layer 5. As an example, the structure of FIG. 1 should just be arrange | positioned somewhere in the discharge space so that the P particle emitting layer 11 may be exposed to the discharge space between the front side board | substrate structure 1 and the back side board | substrate structure 2. This is because if the P particle emitting layer 11 is disposed somewhere in the discharge space, the discharge delay is improved by the P particles from the P particle emitting layer 11. Although it is preferable that the whole P particle emitting layer 11 is exposed to discharge space, only a part may be exposed. For example, the P particle emitting layer 11 may be disposed on the front substrate structure 1 or may be disposed on the back substrate structure 2. When the P particle emitting layer 11 is disposed on the front substrate structure 1, the protective layer 5 may be omitted and the P particle emitting layer 11 may be disposed on the dielectric layer 4, and may have an opening. The protective layer 5 may be disposed on the dielectric layer 4, and the P particle emitting layer 11 may be disposed in the opening.

The thickness and the shape of the P particle emitting layer 11 are not particularly limited. The P particle emitting layer 11 may be disposed on the entire surface of the display region or may be disposed only on a part of the display region. For example, it may be formed only in the region overlapping with the display electrode 3 in plan view or only in the region overlapping with the scan electrode 3Y. In this case, the usage-amount of P particle emitting material can be reduced, without reducing the improvement effect of discharge delay much. It may be formed only in an area overlapping with the metal electrode 3b, or only in an area overlapping with a non-discharge line (reverse slit) between display electrode pairs in which no surface discharge occurs. In this case, the fall of the brightness by forming the P particle emitting layer 11 can be suppressed. The P particle emitting layer 11 may be formed in a straight shape, or may be formed in an island shape separated for each discharge cell.

The formation method of the P particle emitting layer 11 is not specifically limited. The P particle emitting layer 11 can be formed by, for example, dispersing toward the protective layer 5 in the state of dispersing the powder-like P particle emitting material intact or in a dispersion medium. In addition, P particle-emitting material may be attached onto the protective layer 5 by screen printing. The P particle emitting layer 11 may be formed by attaching a paste or suspension containing a P particle emitting material to a site where the P particle emitting layer 11 is formed by using a dispenser or an ink jet device.

Hereinafter, specific examples of the present invention will be described. In the following examples, the effect of improving the discharge delay by arranging the fluorine-added MgO crystals (hereinafter referred to as "F-added MgO crystals") to be exposed to the discharge space was investigated. In addition, it compared with the case where the normal MgO crystal which does not add fluorine was arrange | positioned so that it may expose to discharge space.

1. Method for producing F-added MgO crystals

Five kinds of F-added MgO crystals (called Examples Samples A to E) having different amounts of F addition were produced by the following method.

First, MgO crystals (manufactured by Ube Materials Co., Ltd., product name: Meteorological method, high purity ultra fine powder magnesia (2000A)) and MgF ₂ (manufactured by Furuchi Chemical Co., Ltd., purity: 99.99%) are agglomerated and disintegrated using mortar and pestle, respectively. It was made into powder shape.

Next, so that the mixing amount shown in Table 1, were weighed aggregation pulverized MgO crystals and a MgF _2, and was mixed in a tumbler mixer.

Next, the mixed thing was baked at 1450 degreeC in air | atmosphere for 1 hour.

Next, the calcined powder was agglomerated and pulverized to obtain a powder form to obtain F-added MgO crystals of Examples Samples A to E.

Next, the F addition amount of Example sample A and C was measured by the combustion ion chromatograph analysis. The results are shown in Table 1. In addition, the estimated value of the F addition amount of Example sample B, D, and E estimated from the measured value of the F addition amount of Example sample A and C was calculated | required according to the graph of FIG. In Table 1, the estimated value of the amount of F addition was shown in parentheses.

2. Manufacturing Method of PDP

Next, the PDP which has the P particle emission layer 11 which consists of F addition MgO crystal | crystallization of Example sample A, B, C, D or E was manufactured by the following method. In addition, in order to use it for the comparative example of the discharge delay test mentioned later, PDP was manufactured on the same method and conditions using MgO crystal | crystallization (maker, brand name is the same) which F was not added instead of F addition MgO crystal.

2-1. summary

As shown in Figs. 1A to 1C, the display electrode 3, the dielectric layer 4, the protective layer 5, and the P particle emission layer 11 are formed on the glass substrate 1a. The side substrate structure 1 was produced. Furthermore, the back side substrate structure 2 was produced by forming the address electrode 6, the dielectric layer 9, the partition 7, and the phosphor layer 8 on the glass substrate 2a. Next, a panel having an airtight discharge space therein was produced by overlapping the front side substrate structure 1 and the back side substrate structure 2 with each other and sealing the periphery with a sealing material. Next, after exhausting the inside of the discharge space, the discharge gas was sealed to complete the PDP.

2-2. Formation method of P particle emitting layer

The P particle emission layer 11 was formed in the following method in detail.

First, the F-added MgO crystals were mixed at a ratio of 2 g relative to 1 L of IPA (manufactured by Kanto Chemical Co., Ltd., for electronic industry), dispersed by an ultrasonic disperser, and coagulated to disintegrate to prepare a slurry.

Next, the said particle | grain was spray-coated using the spray gun for coating on the protective layer 5, and the P particle emitting layer 11 was formed by repeating the process of blowing dry air after that several times. The P particle emitting layer 11 was formed such that the weight of the F-added MgO crystals was 2 g per 1 m 2.

2-3. etc

Other conditions were as follows.

Front side substrate structure (1):

Width of display electrode 3a: 270 mu m

Metal electrode 3b width: 95 micrometers

Width of discharge gap: 100 μm

Dielectric layer 4: Formed by application baking of low melting glass paste, thickness: 30 micrometers

Protective layer 5: MgO layer by electron beam evaporation, thickness: 7500 kPa

Back side substrate structure (2):

Width of the address electrode 6: 70 μm

Dielectric layer 9: formed by coating baking of low melting glass paste, thickness: 10micrometer

Thickness of phosphor layer 8 directly above address electrode 6: 20 μm

Material of phosphor layer 8: Zn ₂ SiO ₄ : Mn (green phosphor)

Height of partition 7: 140 μm Width at top: 50 μm

Pitch of the partition wall 7 (dimension A in FIG. 1A): 360 µm

Discharge Gas: Ne96% -Xe4%, 500Torr

3. Discharge delay test

Next, the discharge delay test was done about each manufactured PDP. The discharge delay test was performed by the voltage waveform for a measurement shown in FIG. In the reset discharge period, the reset discharge is caused between the sustain electrode 3X and the scan electrode 3Y to reset the state of charge of the dielectric layer, thereby removing the influence of the previous discharge. In the preliminary discharge period, after selecting a specific cell, a discharge was caused between the sustain electrode 3X and the scan electrode 3Y to excite the P particle-emitting material. Thereafter, after the 10 to 50 mA rest period has elapsed, a voltage is applied to the address electrode 6 in the address discharge period, and the time from when the voltage is applied until the discharge is actually started is measured. The time until discharge start was measured 1000 times, and the time until the cumulative discharge probability became 90% was defined as the discharge delay.

The result obtained in this way is shown in Table 2, FIG. 4, and FIG. 4 is a graph showing the relationship between the rest period and the discharge delay of the PDP manufactured using the example sample C and the PDP manufactured using no additive MgO crystals. 5 plots Table 2.

As is apparent from Fig. 4, in the PDP manufactured using the example sample C, it can be seen that the discharge delay is short even in the portion having a long rest period, as compared with the PDP prepared using the additive-free MgO crystals. This means that the F-added MgO crystals, like Example Sample C, have a longer effect of suppressing the discharge delay compared to the non-added MgO crystals.

In addition, as is apparent from Table 2 and Fig. 5, it is understood that the change in discharge delay is small in the range of 24 to 440 ppm of the F addition amount. This indicates that the effect of the addition amount of F element on the improvement effect of the discharge delay is not large, and it is thought that the improvement effect of the discharge delay lasts for a long time if the addition amount is in the range of about 1-10000 ppm.

1 is a diagram showing the structure of a PDP according to an embodiment of the present invention, in which FIG. 1A is a plan view, FIG. 1B and FIG. 1C are II in FIG. 1A, respectively. Section and II-II section.

2 is a graph for obtaining an estimated value of the amount of F addition of samples B, D, and E in the embodiment of the present invention.

3 is a diagram showing voltage waveforms used for measuring the discharge delay of the embodiment of the present invention.

4 is a graph showing a relationship between a pause period and a discharge delay of a PDP prepared using Example Sample C and a PDP prepared using no additive MgO crystals.

5 is a graph showing a relationship between a measured value or an estimated value of an F addition amount and a discharge delay according to an embodiment of the present invention.

6 is a perspective view showing the structure of a conventional PDP.

<Explanation of symbols for the main parts of the drawings>

1: Front side substrate structure

1a: front side board

2: back side substrate structure

2a: back side substrate

3a: transparent electrode

3b: metal electrode

3: display electrode

4, 9: dielectric layer

5: protective layer

6: address electrode

7: bulkhead

8: phosphor layer

11: P particle emitting layer

Claims (22)

A plasma display panel in which a discharge space is formed between two opposing substrate structures, One side of the substrate structure includes a display electrode on the substrate, a dielectric layer covering the display electrode, a protective layer made of magnesium oxide covering the dielectric layer, and priming particle emission formed on the protective layer to be exposed to the discharge space. Including layers, The priming particle emitting layer is a powdered magnesium oxide crystal in which a halogen element is added in an amount of 24 ppm or more but less than 100 ppm, and has a magnesium oxide crystal that emits cathode luminescence light having a peak within a wavelength region of 200 to 300 nm by irradiation with an electron beam. Plasma display panel, characterized in that. The plasma display panel of claim 1, wherein the halogen element is fluorine. The plasma display panel according to claim 1, wherein an average particle diameter of the powdered magnesium oxide crystals is 0.05 to 20 µm. The method of claim 1, wherein the priming particle emitting layer is disposed only in a portion of the display area of the plasma display panel in plan view, and at least a part of the arranged priming particle emitting layer is exposed to the discharge space. Plasma display panel. The plasma display panel of claim 4, wherein the display electrode has a metal electrode, and the partial region in which the priming particle emitting layer is disposed is a region overlapping with the region by the metal electrode in plan view. . The plasma display panel according to claim 1, wherein the protective layer is a magnesium oxide layer formed by any one of a vapor deposition method, a sputtering method, and a coating method. A priming particle formed so as to be in contact with the discharge space on the substrate, a plurality of display electrodes formed on the substrate, a dielectric layer formed on the display electrodes, magnesium oxide formed on the dielectric layer, and a protective space on the protective layer. A substrate structure of a plasma display panel comprising an emission layer, The priming particle emitting layer is a powdered magnesium oxide crystal in which a halogen element is added in an amount of 24 ppm or more but less than 100 ppm, and is composed of magnesium oxide crystals that emit cathode luminescence emission having a peak within a wavelength range of 200 to 300 nm by irradiation with an electron beam. A substrate structure of a plasma display panel. 8. The substrate structure of claim 7, wherein the magnesium oxide crystals have an average particle diameter of 0.05 to 20 mu m. 8. The substrate structure of claim 7, wherein the halogen element is fluorine. The method of claim 7, wherein the priming particle emitting layer is disposed only in a portion of the display area of the plasma display panel in plan view, and at least a part of the arranged priming particle emitting layer is exposed to the discharge space. A substrate structure of a plasma display panel. The plasma display panel of claim 10, wherein the display electrode has a metal electrode, and the partial region in which the priming particle emitting layer is disposed is a region overlapping with the region by the metal electrode in plan view. Substrate structure. The substrate structure of a plasma display panel according to claim 7, wherein the protective layer is a magnesium oxide layer formed by any one of a vapor deposition method, a sputtering method, and a coating method. A plasma display panel in which a discharge space is formed between two opposing substrate structures, One side of the substrate structure includes a display electrode on a substrate, a dielectric layer formed on the display electrode, a protective layer made of magnesium oxide formed on the dielectric layer, and a priming formed on the protective layer so as to be exposed to the discharge space. A particle emitting layer, The priming particle releasing layer is a powdered magnesium oxide crystal composed of substantially only magnesium oxide and fluorine, and the fluorine is added in an amount of 24 ppm or more but less than 100 ppm. The cathode lumines having a peak within a wavelength region of 200 to 300 nm by irradiation with an electron beam. A plasma display panel comprising magnesium oxide crystals which emit necessity light. The plasma display panel according to claim 13, wherein the average particle diameter of the powdered magnesium oxide crystals is 0.05 to 20 µm. The method of claim 13, wherein the priming particle emitting layer is disposed only in a portion of the display area of the plasma display panel in plan view, and at least a part of the arranged priming particle emitting layer is exposed to the discharge space. Plasma display panel. The plasma display panel of claim 15, wherein the display electrode has a metal electrode, and the partial region where the priming particle emitting layer is disposed is a region overlapping with the region by the metal electrode in plan view. . The plasma display panel according to claim 13, wherein the protective layer is a magnesium oxide layer formed by any one of a vapor deposition method, a sputtering method, and a coating method. A priming particle formed so as to be in contact with the discharge space on the substrate, a plurality of display electrodes formed on the substrate, a dielectric layer formed on the display electrodes, magnesium oxide formed on the dielectric layer, and a protective space on the protective layer. A substrate structure of a plasma display panel comprising an emission layer, The priming particle releasing layer is a powdered magnesium oxide crystal composed of substantially only magnesium oxide and fluorine, and added with fluorine of 24 ppm or more and less than 100 ppm, and has a peak in the wavelength region of 200 to 300 nm by irradiation with an electron beam. A substrate structure of a plasma display panel having magnesium oxide crystals which emit sense light. 19. The substrate structure of claim 18, wherein the magnesium oxide crystals have an average particle diameter of 0.05 to 20 mu m. 19. The method of claim 18, wherein the priming particle emitting layer is disposed only in a portion of the display area of the plasma display panel in plan view, and at least a part of the arranged priming particle emitting layer is exposed to the discharge space. A substrate structure of a plasma display panel. 21. The plasma display panel of claim 20, wherein the display electrode has a metal electrode, and the partial region in which the priming particle emitting layer is disposed is a region overlapping with the region by the metal electrode in plan view. Substrate structure. The substrate structure of a plasma display panel according to claim 18, wherein the protective layer is a magnesium oxide layer formed by any one of a vapor deposition method, a sputtering method, and a coating method.

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