KR100953010B1 - 기판처리장치 및 기판처리방법 - Google Patents

기판처리장치 및 기판처리방법 Download PDF

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Publication number
KR100953010B1
KR100953010B1 KR1020080001651A KR20080001651A KR100953010B1 KR 100953010 B1 KR100953010 B1 KR 100953010B1 KR 1020080001651 A KR1020080001651 A KR 1020080001651A KR 20080001651 A KR20080001651 A KR 20080001651A KR 100953010 B1 KR100953010 B1 KR 100953010B1
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KR
South Korea
Prior art keywords
substrate
processing
inversion
board
inversion mechanism
Prior art date
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KR1020080001651A
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English (en)
Korean (ko)
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KR20080067286A (ko
Inventor
코지 하시모토
Original Assignee
다이닛뽕스크린 세이조오 가부시키가이샤
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Publication of KR20080067286A publication Critical patent/KR20080067286A/ko
Application granted granted Critical
Publication of KR100953010B1 publication Critical patent/KR100953010B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020080001651A 2007-01-15 2008-01-07 기판처리장치 및 기판처리방법 KR100953010B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007006135A JP2008172160A (ja) 2007-01-15 2007-01-15 基板処理装置および基板処理方法
JPJP-P-2007-00006135 2007-01-15

Publications (2)

Publication Number Publication Date
KR20080067286A KR20080067286A (ko) 2008-07-18
KR100953010B1 true KR100953010B1 (ko) 2010-04-14

Family

ID=39617921

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080001651A KR100953010B1 (ko) 2007-01-15 2008-01-07 기판처리장치 및 기판처리방법

Country Status (5)

Country Link
US (1) US20080170931A1 (zh)
JP (1) JP2008172160A (zh)
KR (1) KR100953010B1 (zh)
CN (1) CN101226878B (zh)
TW (1) TWI341820B (zh)

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EP2052785B1 (en) 2007-10-23 2017-09-06 Nissan Motor Co., Ltd. Coating method, apparatus and product
US20100195083A1 (en) * 2009-02-03 2010-08-05 Wkk Distribution, Ltd. Automatic substrate transport system
JP5274339B2 (ja) 2009-03-30 2013-08-28 大日本スクリーン製造株式会社 基板処理装置および基板搬送方法
CN102339778A (zh) * 2010-07-23 2012-02-01 杜邦太阳能有限公司 玻璃基板搬运载具
KR101131686B1 (ko) * 2011-02-07 2012-03-28 주식회사 다우테크 발광다이오드 이송장치
CN103424991B (zh) * 2012-05-15 2015-09-30 上海微电子装备有限公司 一种硅片直线交换装置及方法
JP6280332B2 (ja) * 2013-09-09 2018-02-14 三星ダイヤモンド工業株式会社 基板反転搬送装置
JP6260461B2 (ja) * 2014-06-06 2018-01-17 トヨタ自動車株式会社 半導体製造装置
JP6086254B2 (ja) * 2014-09-19 2017-03-01 日新イオン機器株式会社 基板処理装置
KR102478317B1 (ko) * 2015-04-08 2022-12-16 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
TWI588927B (zh) * 2015-08-11 2017-06-21 亞智科技股份有限公司 移轉基板裝置、製程設備與取放基板的方法
JP6706935B2 (ja) * 2016-03-09 2020-06-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US10325779B2 (en) * 2016-03-30 2019-06-18 Tokyo Electron Limited Colloidal silica growth inhibitor and associated method and system
US10515820B2 (en) 2016-03-30 2019-12-24 Tokyo Electron Limited Process and apparatus for processing a nitride structure without silica deposition
TWI636715B (zh) * 2017-11-10 2018-09-21 台光電子材料股份有限公司 取粉裝置
CN107946220A (zh) * 2017-12-22 2018-04-20 君泰创新（北京）科技有限公司 电池片翻片装置
JP7007948B2 (ja) * 2018-02-28 2022-01-25 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
JP7156940B2 (ja) * 2018-12-28 2022-10-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7446073B2 (ja) * 2019-09-27 2024-03-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102483735B1 (ko) * 2022-06-15 2023-01-02 엔씨케이티 주식회사 다기능 반송로봇을 이용한 반도체 웨이퍼 세정장비

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JP2003151968A (ja) * 2001-11-13 2003-05-23 Dainippon Screen Mfg Co Ltd 薄膜形成装置、フィルム供給機構、フィルム収容カセット、搬送機構および搬送方法
JP2004119628A (ja) * 2002-09-25 2004-04-15 Dainippon Screen Mfg Co Ltd 基板処理装置

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US5743374A (en) * 1995-08-25 1998-04-28 Monsees; Claude E. Stack turner and replenisher and method
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US6361422B1 (en) * 1999-06-15 2002-03-26 Applied Materials, Inc. Method and apparatus for transferring semiconductor substrates using an input module
US6475279B1 (en) * 1999-07-19 2002-11-05 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US6527621B1 (en) * 1999-10-28 2003-03-04 Strasbaugh Pad retrieval apparatus for chemical mechanical planarization
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US6632281B2 (en) * 2000-02-01 2003-10-14 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US6413037B1 (en) * 2000-03-14 2002-07-02 Applied Materials, Inc. Flexibly mounted contact cup
US20030029479A1 (en) * 2001-08-08 2003-02-13 Dainippon Screen Mfg. Co, Ltd. Substrate cleaning apparatus and method
US6695572B2 (en) * 2001-09-28 2004-02-24 Agere Systems Inc. Method and apparatus for minimizing semiconductor wafer contamination
JP2004052108A (ja) * 2002-05-30 2004-02-19 Ebara Corp 基板処理装置
TWI262165B (en) * 2002-10-16 2006-09-21 Sez Ag Device and method for transporting wafer-shaped articles
JP2004327674A (ja) * 2003-04-24 2004-11-18 Dainippon Screen Mfg Co Ltd 基板反転装置およびそれを備えた基板処理装置
JP4467367B2 (ja) * 2004-06-22 2010-05-26 大日本スクリーン製造株式会社 基板反転装置、基板搬送装置、基板処理装置、基板反転方法、基板搬送方法および基板処理方法
JP4485980B2 (ja) * 2005-03-28 2010-06-23 大日本スクリーン製造株式会社 基板搬送装置および基板搬送方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003151968A (ja) * 2001-11-13 2003-05-23 Dainippon Screen Mfg Co Ltd 薄膜形成装置、フィルム供給機構、フィルム収容カセット、搬送機構および搬送方法
JP2004119628A (ja) * 2002-09-25 2004-04-15 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
KR20080067286A (ko) 2008-07-18
JP2008172160A (ja) 2008-07-24
CN101226878A (zh) 2008-07-23
US20080170931A1 (en) 2008-07-17
TW200836993A (en) 2008-09-16
CN101226878B (zh) 2010-11-17
TWI341820B (en) 2011-05-11

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