KR100936527B1 - 전자파 차폐재 및 그 제조 방법 - Google Patents
전자파 차폐재 및 그 제조 방법 Download PDFInfo
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- KR100936527B1 KR100936527B1 KR1020057000564A KR20057000564A KR100936527B1 KR 100936527 B1 KR100936527 B1 KR 100936527B1 KR 1020057000564 A KR1020057000564 A KR 1020057000564A KR 20057000564 A KR20057000564 A KR 20057000564A KR 100936527 B1 KR100936527 B1 KR 100936527B1
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- Prior art keywords
- shielding material
- electromagnetic wave
- plating
- silver
- wave shielding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
- H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/001—Magnets
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Silver Salt Photography Or Processing Solution Therefor (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (19)
- 투명 기재 및 그 위에 형성한 세선 패턴으로 이루어지는 전자파 차폐재로서,상기 세선 패턴이 물리현상(physical development)에 의한 금속 은을 촉매 핵으로 하는 금속 도금막으로 이루어지는 것을 특징으로 하는 전자파 차폐재.
- 제1항에 있어서,상기 세선 패턴이 15㎛ 이하의 두께 및 40㎛ 이하의 선폭으로 이루어지고, 전 광선 투과율이 50% 이상이고 표면 저항이 10옴/스퀘어 이하인 전자파 차폐재.
- 제2항에 있어서,전 광선 투과율이 60% 이상인 전자파 차폐재.
- 제2항 또는 제3항에 있어서,표면 저항이 7옴/스퀘어 이하인 전자파 차폐재.
- 제1항 또는 제2항에 있어서,세선 패턴의 두께가 0.5 내지 15㎛인 전자파 차폐재.
- 제1항 또는 제2항에 있어서,세선 패턴의 두께가 2 내지 12㎛인 전자파 차폐재.
- 제1항 또는 제2항에 있어서,세선 패턴의 선폭이 1 내지 40㎛인 전자파 차폐재.
- 제1항 또는 제2항에 있어서,상기 도금이 전해 도금인 전자파 차폐재.
- 제8항에 있어서,상기 도금이 동 및 니켈로부터 선택되는 적어도 1종의 도금인 전자파 차폐재.
- 투명 기재 위에, 물리현상(physical development) 핵층과 이 물리현상 핵층 위에 도포된 할로겐화은 유제층을 가지는 감광 재료를 노광하고, 물리현상 처리에 의하여 상기 물리현상 핵층 상에 임의의 세선 패턴으로 이루어진 금속 은을 석출시키고, 이어서 상기 물리현상 핵층 상에 형성된 할로겐화은 유제층을 제거한 후, 상기 물리현상된 금속 은을 촉매 핵으로 하여 금속을 도금하여, 미세 패턴으로 이루어진 전자파 차폐재를 얻는 것을 특징으로 하는 전자파 차폐재의 제조 방법.
- 제10항에 있어서,금속 도금 후의 상기 세선 패턴이 15㎛ 이하의 두께 및 40㎛ 이하의 선폭으로 이루어지고, 전 광선 투과율이 50% 이상이고 표면 저항이 10옴/스퀘어 이하인 전자파 차폐재의 제조 방법.
- 제11항에 있어서,전광선 투과율이 60% 이상인 전자파 차폐재의 제조 방법.
- 제11항 또는 제12항에 있어서,표면 저항이 7옴/스퀘어 이하인 전자파 차폐재의 제조 방법.
- 제10항 또는 제11항에 있어서,금속 도금 후의 세선 패턴의 두께가 0.5 내지 15㎛인 전자파 차폐재의 제조 방법.
- 제10항 또는 제11항에 있어서,금속 도금 후의 세선 패턴의 두께가 2 내지 12㎛인 전자파 차폐재의 제조 방법.
- 제10항 또는 제11항에 있어서,금속 도금 후의 세선 패턴의 선폭이 1 내지 40㎛인 전자파 차폐재의 제조 방법.
- 제10항 또는 제11항에 있어서,상기 도금이 전해 도금인 전자파 차폐재의 제조 방법.
- 제17항에 있어서,상기 도금이 동 및 니켈로부터 선택되는 적어도 1종의 도금인 전자파 차폐재의 제조 방법.
- 제18항에 있어서,전해 도금이 황산동 및 황산을 주성분으로 하는 욕 중에 물리현상 은(silver)이 형성된 투명 기재를 침지하고, 10 내지 40℃에서, 전류 밀도 1 내지 20암페어/dm2로 통전함으로써 이루어지는 전자파 차폐재의 제조 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2002-00203638 | 2002-07-12 | ||
JP2002203638 | 2002-07-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050026476A KR20050026476A (ko) | 2005-03-15 |
KR100936527B1 true KR100936527B1 (ko) | 2010-01-13 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020057000564A KR100936527B1 (ko) | 2002-07-12 | 2003-07-11 | 전자파 차폐재 및 그 제조 방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7749620B2 (ko) |
EP (1) | EP1553212B1 (ko) |
JP (2) | JP4429901B2 (ko) |
KR (1) | KR100936527B1 (ko) |
CN (1) | CN100346003C (ko) |
AU (1) | AU2003280996A1 (ko) |
WO (1) | WO2004007810A1 (ko) |
Families Citing this family (51)
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EP1553212B1 (en) * | 2002-07-12 | 2017-08-23 | Fujimori Kogyo Co., Ltd. | Electromagnetic wave shield material and process for producing the same |
US7934966B2 (en) | 2004-06-23 | 2011-05-03 | Fujifilm Corporation | Light-transmitting electromagnetic wave shielding film and process for producing the same |
JP4570436B2 (ja) * | 2004-10-12 | 2010-10-27 | 三菱製紙株式会社 | 金属メッシュおよび配線パタン転写シート |
JP4870963B2 (ja) * | 2004-10-19 | 2012-02-08 | 株式会社ブリヂストン | 電磁波シールド性光透過窓材の製造方法及びその方法に用いられるメッキ装置 |
JP4905803B2 (ja) * | 2005-03-15 | 2012-03-28 | 富士フイルム株式会社 | めっき処理方法、および導電性膜の製造方法 |
WO2006098336A1 (ja) * | 2005-03-15 | 2006-09-21 | Fujifilm Corporation | めっき処理方法、透光性導電性膜、および電磁波シールド膜 |
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JP2007009326A (ja) * | 2005-06-03 | 2007-01-18 | Fujifilm Corp | めっき処理方法、導電性膜、及び透光性電磁波シールド膜 |
WO2006129886A1 (en) * | 2005-06-03 | 2006-12-07 | Fujifilm Corporation | Plating method, electrically conductive film and light-transmitting electromagnetic wave shielding film |
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JP4512535B2 (ja) * | 2005-08-08 | 2010-07-28 | 三菱製紙株式会社 | 導電性材料の製造方法 |
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JP4902168B2 (ja) * | 2005-10-20 | 2012-03-21 | 藤森工業株式会社 | 電磁波シールド材及びその製造方法 |
JP4902167B2 (ja) * | 2005-10-20 | 2012-03-21 | 藤森工業株式会社 | 電磁波シールド材及びその製造方法 |
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EP1960194B1 (en) * | 2005-12-16 | 2013-08-07 | LG Chem. Ltd. | Method for preparing conductive pattern and conductive pattern prepared by the method |
JPWO2007069495A1 (ja) * | 2005-12-16 | 2009-05-21 | コニカミノルタエムジー株式会社 | 電磁波遮蔽材料、電磁波遮蔽材料の製造方法及びプラズマディスプレイパネル用電磁波遮蔽材料 |
JP4846360B2 (ja) * | 2005-12-27 | 2011-12-28 | 藤森工業株式会社 | 周波数選択透過型の電磁波シールド材およびその製造方法 |
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US20060115636A1 (en) | 2006-06-01 |
EP1553212A4 (en) | 2012-01-25 |
EP1553212A1 (en) | 2005-07-13 |
KR20050026476A (ko) | 2005-03-15 |
AU2003280996A1 (en) | 2004-02-02 |
AU2003280996A8 (en) | 2004-02-02 |
CN1668783A (zh) | 2005-09-14 |
JP2010043358A (ja) | 2010-02-25 |
JPWO2004007810A1 (ja) | 2005-11-10 |
US7749620B2 (en) | 2010-07-06 |
CN100346003C (zh) | 2007-10-31 |
WO2004007810A1 (ja) | 2004-01-22 |
JP5002634B2 (ja) | 2012-08-15 |
EP1553212B1 (en) | 2017-08-23 |
JP4429901B2 (ja) | 2010-03-10 |
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