KR100920335B1 - 반도체 몰딩장치 - Google Patents

반도체 몰딩장치 Download PDF

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Publication number
KR100920335B1
KR100920335B1 KR1020090037834A KR20090037834A KR100920335B1 KR 100920335 B1 KR100920335 B1 KR 100920335B1 KR 1020090037834 A KR1020090037834 A KR 1020090037834A KR 20090037834 A KR20090037834 A KR 20090037834A KR 100920335 B1 KR100920335 B1 KR 100920335B1
Authority
KR
South Korea
Prior art keywords
mold
press
unit
resin
circuit board
Prior art date
Application number
KR1020090037834A
Other languages
English (en)
Korean (ko)
Inventor
박노선
임채용
서희석
Original Assignee
우리마이크론(주)
박노선
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 우리마이크론(주), 박노선 filed Critical 우리마이크론(주)
Priority to KR1020090037834A priority Critical patent/KR100920335B1/ko
Application granted granted Critical
Publication of KR100920335B1 publication Critical patent/KR100920335B1/ko
Priority to TW099113544A priority patent/TW201041070A/zh
Priority to JP2010103701A priority patent/JP2010263212A/ja
Priority to CN2010101713277A priority patent/CN101877320A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR1020090037834A 2009-04-29 2009-04-29 반도체 몰딩장치 KR100920335B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020090037834A KR100920335B1 (ko) 2009-04-29 2009-04-29 반도체 몰딩장치
TW099113544A TW201041070A (en) 2009-04-29 2010-04-28 Semiconductor molding device
JP2010103701A JP2010263212A (ja) 2009-04-29 2010-04-28 半導体モールド装置およびその制御方法
CN2010101713277A CN101877320A (zh) 2009-04-29 2010-04-28 半导体模塑装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090037834A KR100920335B1 (ko) 2009-04-29 2009-04-29 반도체 몰딩장치

Publications (1)

Publication Number Publication Date
KR100920335B1 true KR100920335B1 (ko) 2009-10-07

Family

ID=41572053

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090037834A KR100920335B1 (ko) 2009-04-29 2009-04-29 반도체 몰딩장치

Country Status (4)

Country Link
JP (1) JP2010263212A (zh)
KR (1) KR100920335B1 (zh)
CN (1) CN101877320A (zh)
TW (1) TW201041070A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101361816B1 (ko) 2007-10-18 2014-02-11 세메스 주식회사 기판 정렬 유닛 및 이를 갖는 기판 성형 장치

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5562273B2 (ja) * 2011-03-02 2014-07-30 Ｔｏｗａ株式会社 光電子部品の製造方法及び製造装置
JP5387646B2 (ja) * 2011-10-07 2014-01-15 第一精工株式会社 樹脂封止装置
JP2013084788A (ja) * 2011-10-11 2013-05-09 Daiichi Seiko Co Ltd 樹脂封止金型装置および樹脂封止方法
DE102019128667B3 (de) * 2019-10-23 2020-09-10 Semikron Elektronik Gmbh & Co. Kg Sinterpresse und Drucksinterverfahren zur Herstellung einer Sinterverbindung mittels der Sinterpresse

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006157051A (ja) 2006-02-24 2006-06-15 Towa Corp 半導体チップの樹脂封止成形装置
JP2008207450A (ja) 2007-02-27 2008-09-11 Towa Corp 発光素子の圧縮成形方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11309751A (ja) * 1998-04-30 1999-11-09 Risako Sasaki 循環する金型を用いたモールド方法
JP3911402B2 (ja) * 2001-10-23 2007-05-09 アピックヤマダ株式会社 半導体封止装置
JP2008028189A (ja) * 2006-07-21 2008-02-07 Renesas Technology Corp 半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006157051A (ja) 2006-02-24 2006-06-15 Towa Corp 半導体チップの樹脂封止成形装置
JP2008207450A (ja) 2007-02-27 2008-09-11 Towa Corp 発光素子の圧縮成形方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101361816B1 (ko) 2007-10-18 2014-02-11 세메스 주식회사 기판 정렬 유닛 및 이를 갖는 기판 성형 장치

Also Published As

Publication number Publication date
TW201041070A (en) 2010-11-16
JP2010263212A (ja) 2010-11-18
CN101877320A (zh) 2010-11-03

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