KR100892255B1 - Picking apparatus for pick and place of test handler - Google Patents

Abstract

The present invention relates to a pick and place picking device of a test handler, by adjusting the holding interval of the picking device for holding or releasing the semiconductor device, one picking device is different loading standard (gap between the semiconductor devices loaded) Disclosed is a technique for enabling all of the test trays to be applied.

Test handler, pick and place device, loader hand, unloader hand, picking element, picker

Description

Picking device for pick and place of test handler {PICKING APPARATUS FOR PICK AND PLACE OF TEST HANDLER}

1 is a front view of a picking apparatus according to the prior art.

2 is a front view of a picking apparatus according to a first embodiment of the present invention.

3 is another use state diagram of the picking apparatus of FIG.

4 is a reference diagram for explaining a use state of the picking apparatus of FIG.

5 is a front view of a picking apparatus according to a second embodiment of the present invention.

FIG. 6 is a reference diagram for describing a use state of the picking apparatus of FIG. 5. FIG.

7 is a front view of a picking apparatus according to a third embodiment of the present invention.

8 is a front view of a picking apparatus according to a fourth embodiment of the present invention.

FIG. 9 is an enlarged cross-sectional view of part W of FIG. 8.

* Description of the symbols for the main parts of the drawings *

200, 500, 700, 800: Picking device

211, 511, 711, 811: first picking element

221, 521, 721, 821: second picking element

230, 530, 730, 830: fixed block

240, 540, 740: vacuum pressure transmission member

840: anti-rotation member

250, 750: Spacer

550: first interval adjusting device

560: second interval adjusting device

B: vacuum flow path

B _i : Inlet B _o : Outlet

The present invention relates to a picking device for pick and place of a test handler.

The test handler refers to a device for classifying the tested semiconductor devices according to their specifications after supplying the semiconductor devices to the tester before the shipment of the produced semiconductor devices.

Such a test handler has already been disclosed through a number of public documents such as Korean Patent Laid-Open Publication No. 2003-0029266 (name of the invention: test handler).

In general, the test handler loads the semiconductor devices loaded in the customer tray into the test tray, supplies the semiconductor devices loaded in the test tray to the tester, and unloads the tested semiconductor devices from the test tray to the customer tray. have.

As described above, the test handler loads the semiconductor devices from the customer tray to the test tray or unloads the test tray into the customer tray, and has a device called pick and place to perform such a task. These pick and place are called loader hand, unloader hand, sorter hand, etc. according to their role.

The pick-and-place is composed of a plurality of picking devices. In the past, one picking device was configured to hold one semiconductor device.

However, as the number of semiconductor devices tested simultaneously increases, holding one semiconductor device by one picking device is no longer desirable from the productive point of view of the device.

Accordingly, as shown in FIG. 1, a technology has been developed in which two picking devices are configured in one picking device so that one picking device can hold two semiconductor devices.

Referring to FIG. 1, the picking apparatus 100 includes a fixing block 120 for fixing two picking elements 110, a position between two picking elements 110 (that is, a holding interval between picking elements) and a picking element 110. The anti-rotation member 130 is configured to prevent rotation of the picking elements 110. Each picking element 110 includes a picker 111 for holding or releasing a semiconductor element by a vacuum pressure and a vacuum pipe 112 for supplying a vacuum pressure from a vacuum pump not shown to the picker 111. do. The picker 111 includes a vacuum pad 111a for adsorbing or releasing the semiconductor devices by vacuum pressure and a pad holder 111b for fixedly connecting the vacuum pad 111a to the vacuum pipe 112.

Picking device 100 as described above is concave downwards picker 111, more specifically picker 111 by vacuum or release pressure (hereinafter referred to as "vacuum pressure") by the operation of the vacuum pump not shown The semiconductor device may be held or released by the vacuum pad 111a by being transferred to the vacuum pad 111a to maintain the concave space of the vacuum pad 111a in a vacuum state or to release the vacuum state.

On the other hand, the test tray of the test handler is loaded with a plurality of semiconductor devices at regular intervals, and if necessary, such as when the physical specifications of the semiconductor devices to be tested are changed or the amount of one test is increased. The test tray and the loading standard (load gap between the loaded semiconductor elements) may be replaced by another test tray.

If the gap between the semiconductor elements loaded in the newly replaced test tray is different from the gap between the semiconductor elements loaded in the old test tray, the previous picking Since the device was no longer applicable, the old pick and place had to be replaced with a pick and place with a new picking device. That is, the old pick and place had to be replaced with a new pick and place with a picking device having a gripping interval that meets the loading standard of the replaced new test tray. This causes a problem that causes waste of resources and an increase in replacement costs.

A first object of the present invention for solving the above problems is to provide a picking apparatus capable of varying the holding position of the picking element.

A second object of the present invention is to provide a technique capable of varying the holding intervals of picking elements in a picking device having a plurality of picking elements by more specifically utilizing a picking device capable of changing the holding position.

Pick and place the picking device of the test handler according to the present invention for achieving the above object, a pair of picking elements provided in parallel to hold or release the semiconductor device; A fixed block for fixing the pair of picking elements to each other; And An interval adjusting device provided to adjust a holding interval of the pair of picking elements; Characterized in that it comprises a.

Each of the pair of picking elements may include a picker provided to hold or release a semiconductor element; And a transfer element for transferring a gripping and gripping force to the picker. It includes, and the spacing device is characterized in that to adjust the spacing between the pickers more specific.

The gap adjusting device may include: a rotation member provided to be rotatable using any center line as a rotation axis, and the picker being fixedly biased based on the center line; And a fixing member for fixing the rotating member. It includes another specific feature to include.

The spacing device may include: a power source providing power for allowing a specific picker to slide to face the other picker; And a sliding member for sliding the specific picker to face the other picker while sliding according to the operation of the power source. It includes another specific feature to include.

In addition, the pick and place picking device of the test handler according to the present invention for achieving the above object is provided for holding or releasing the semiconductor element by vacuum pressure, which can be selectively positioned in at least two or more positions Pickers; A positioning device for adjusting the picker to be selectively positioned at the at least two positions; A vacuum pipe provided to provide a vacuum pressure to the picker; And an inlet facing the vacuum pipe and input through the inlet to transfer the vacuum pressure from the vacuum pipe to the picker, which can be selectively positioned at the at least two positions by the positioning device. A vacuum pressure transfer member having a vacuum flow path having at least two outlets for outputting a vacuum pressure to the picker; Characterized in that it comprises a.

In addition, the pick and place picking element of the test handler according to the present invention for achieving the above object is provided for holding or releasing the semiconductor element by vacuum pressure, which may be selectively positioned in at least two positions Pickers; And a vacuum pipe provided to provide a vacuum pressure to the picker. Including, The picker and the vacuum pipe is integrally modular, a vacuum flow path having an inlet through which the vacuum pressure is input through the vacuum pipe and an outlet through which the vacuum pressure is output through the picker is the vacuum pipe and the picker It is formed in a single path over, characterized in that the inlet and the outlet of the vacuum flow path is not located on the same water line.

Hereinafter, preferred embodiments of a pick and place picking device for a test handler according to the present invention as described above (hereinafter, abbreviated as 'picking device') will be described with reference to FIG. 2 for the sake of brevity. Overlapping descriptions will be omitted or compressed if possible.

First Embodiment

2 is a front view of the picking apparatus 200 according to the first embodiment of the present invention.

Referring to Figure 2, the picking device 200 according to the present embodiment, a pair of picking elements (210, 220), a fixed block 230, a vacuum pressure transmission member 240 and a spacing device provided in parallel 250 and the like.

The first picking element 210 of the pair of picking elements 210 and 220 is a first picker 211 and a first picker 211 provided to hold or release the semiconductor element by vacuum pressure. A first vacuum pipe 212 for supplying a vacuum pressure is provided. The first picker 211 connects and fixes the first vacuum pad 211a and the first vacuum pad 211a to the first vacuum pipe 212 to adsorb or release the semiconductor element by vacuum pressure. One pad holder 211b is provided.

The second picking device 220 of the pair of picking elements 210 and 220 is a second picker 221 and the second picker 221 which are provided for holding or releasing the semiconductor device by vacuum pressure. A second vacuum pipe 222 for supplying a vacuum pressure to the furnace is provided. The second picker 221 connects and fixes the second vacuum pad 221a and the second vacuum pad 221a to the gap controller 250 to adsorb or release the semiconductor element by vacuum pressure. A pad holder 221b is provided.

For reference, the first and second vacuum pipes 212 and 222 are elements for transferring the vacuum pressure generated from the vacuum pump not shown to the pickers 211 and 221 for holding and releasing the semiconductor device. The picker 211, 221 serves as a transmission element for transmitting the gripping and release force generated from the power source (vacuum pump).

On the other hand, the fixed block 230 holds the relative position of the pair of picking elements (210, 220) by fixing the vacuum pipes (212, 222) of both picking elements (210, 220) and a pair of picking The elements 210 and 220 are blocked to be configured as one picking device 200.

In addition, the vacuum pressure transfer member 240 fixes the lower ends of the vacuum pipes 212 and 222 to prevent rotation of the vacuum pipes 212 and 222. In addition, a portion corresponding to the second picker 221 is one inlet (a) facing the second vacuum pipe 222 and is input through the inlet (a) as described in detail in the enlarged portion. A vacuum flow path A having two outlets b and c for outputting the vacuum pressure to the first position P ₁ and the second position P ₂ is formed. As a result, the vacuum pressure transmitting member 240 may selectively select the vacuum pressure coming from the second vacuum pipe 222 at the first position P ₁ and the second position P ₂ . It is to carry out the role.

The gap adjusting device 250 is provided as a position adjusting device for converting the position of the second picker 221, and a rotating member 251 rotatably coupled to the vacuum pressure transmitting member 240 and the rotating member 251. It includes a fixing member 252 that can be fixed in a rotated state. In the present embodiment, the fixing member 252 is provided with a male screw bolt, and the female screw bolt is formed on the rotating member 251 and the vacuum pressure transmitting member 240, in particular, the vacuum pressure transmitting member 240 has two screws. A female thread bolt is formed.

The rotating member 251 is provided to be rotatable using the upper and lower center lines Z of the second vacuum pipe 222 as the rotation axis, and the second picker 221 is formed at the center line Z. It is fixedly connected to one side and is biased by a radius R. Therefore, according to the rotation state of the rotating member 251, the second picker 221 fixed by being biased by a predetermined radius R based on the center line Z is fixed to the first position P ₁ and the second position P ₂ . It can be selectively positioned in. Of course, depending on the implementation, the rotating member 251 and the second picker 221 may be integrally molded into one component. In addition, according to the present embodiment, the rotary member 251 is implemented by rotating the rotating element S as the center of rotation, but depending on the application, the rotary member 251 is vacuum pressure transfer member 240 at different positions. The configuration of two or more fixing members that can be detachably fixed to the) may also be considered.

For reference, the first position P ₁ and the second position P ₂ have a symmetrical interval of 2R with respect to the center line Z, and two outlets b of the vacuum flow path A. , c) also has a spacing of 2R. In addition, the two outlets b and c of the vacuum flow path A are formed to be opened to the first position 1 ( P ₁ ) and the second position (P ₂ ), respectively, so that the second picker 221 is placed in the first position. In the case of (P ₁ ), the vacuum pressure is transmitted to the second picker 221 through the outlet b, and when the second picker 221 is in the second position P ₂ , the second picker through the outlet c. A vacuum pressure is to be transmitted to 221. In addition, in the present embodiment, the position where the second picker 221 is not located (the first position when the second picker is in the second position and the second position when the second picker is in the first position). Although the outlet b or c corresponding to the outlet b or c is configured to be closed by the rotating member 251, the outlet b or c corresponds to a position where the second picker 221 is not positioned by using a separate closing member. It may be implemented to close the exit.

A use state of the picking apparatus 200 according to the first embodiment as described above will be described with reference to FIGS.

FIG. 2 currently maintains the gap between the two pickers 211 and 221 at L. FIG. This state is selected when the interval between semiconductor elements loaded in the test tray is L. FIG.

After that, when the old test tray is replaced with a new test tray as necessary, when the gap between semiconductor elements loaded in the new test tray becomes L + 2R, the administrator releases the fixing member 252 from being fixed. After rotating the rotating member 251 180 degrees to be in the state as shown in Figure 3 and again to fix the rotating member 251 by the fixing member 252. For reference, as the rotating member 251 rotates, the second picker 221 fixedly connected to the rotating member 251 also rotates based on the center line Z.

That is, since the rotating member 251 is maintained as shown in FIG. It can be applied to a newly replaced test tray.

FIG. 4 compares the intervals between the pickers 211 and 221 in the state of FIG. 2 and the state of FIG. 3. As shown in FIG. 4, the second picker 221 is connected to the first position P ₁ . It can be seen that the holding interval of the picking apparatus according to the first embodiment can be arbitrarily selected at any one of two intervals L and L + 2R depending on where the second position P ₂ is located. .

Second Embodiment

5 is a front view of a picking apparatus 500 according to a second embodiment of the present invention. This embodiment is further developed in the first embodiment, and relates to a technique for allowing both pickers to perform position conversion so that an interval between pickers can be arbitrarily selected from a total of four intervals.

Referring to FIG. 5, the picking apparatus 500 according to the present embodiment includes a pair of picking elements 510 and 520, a fixed block 530, a vacuum pressure transfer member 540, and a first interval provided in parallel. It is configured to include an adjusting device 550 and the second interval adjusting device 560 and the like.

The first picking element 510 of the pair of picking elements 510 and 520 is a first picker 511 and a first picker 511 which are provided for holding or releasing the semiconductor element by vacuum pressure. A first vacuum pipe 512 for supplying a vacuum pressure is provided. The first picker 511 connects and fixes the first vacuum pad 511a and the first vacuum pad 511a to the first gap controller 550 to adsorb or release the semiconductor element by vacuum pressure. A first pad holder 511b is provided.

The second picking element 520 of the pair of picking elements 510 and 520 includes a second picker 521 and a second picker 521 which are provided for holding or releasing the semiconductor element by vacuum pressure. And a second vacuum pipe 522 for supplying a vacuum pressure. The second picker 521 connects and fixes the second vacuum pad 521a and the second vacuum pad 521a to the second gap controller 560 to adsorb or release the semiconductor element by vacuum pressure. A second pad holder 521b is provided.

The fixed block 530 fixes the pair of picking elements 510 and 520 by fixing the vacuum pipes 512 and 522 of the first and second picking elements 510 and 520. The picking elements 510 and 520 are blocked so that they can be configured as a single picking device 500.

In addition, the vacuum pressure transfer member 540 fixes the lower ends of the vacuum pipes 512 and 522 to prevent rotation of the empty pipes 512 and 522. The portions corresponding to both pickers 511 and 521 have an inlet facing the vacuum pipes 512 and 522, respectively, and a vacuum having two outlets for outputting the vacuum pressure input through the inlets to two positions, respectively. Flow paths A ₁ and A ₂ are formed. Therefore, the vacuum pressure transfer member 540 is a vacuum pressure from the vacuum pipes (512, 522) to the first and second pickers (511, 521) that can be selectively positioned in any one of two positions respectively. It is to play a role.

The first interval adjusting device 550 is a first rotation member 551 rotatably coupled to one side of the vacuum pressure transmission member 540 and an agent capable of fixing the first rotation member 551 in a rotated state. 1 includes a fixing member 552.

The first rotating member 551 is provided to be rotatable using the upper and lower first center lines Z ₁ of the first vacuum pipe 512 as the rotation axis. The first rotating member 551 includes the first picker 511. ) Is fixedly connected to the first center line (Z ₁ ) to be biased by a radius R ₁ to one side. Therefore, the first picker 511 which is fixed by being biased by a predetermined radius R ₁ based on the first center line Z ₁ according to the rotation state of the first rotating member 551 is referred to the first center line Z ₁ . Therefore, it can be selectively positioned at two positions spaced by 2R ₁ .

In addition, the second interval adjusting device 560 may fix the second rotating member 561 and the second rotating member 561 rotatably coupled to the other side of the vacuum pressure transmission member 540 in a rotated state. And a second fixing member 562 thereon.

The second rotating member 561 is provided to be rotatable using the upper and lower second center lines Z ₂ of the second vacuum pipe 522 as the rotation axis, and the second rotating member 561 has the second picker 521 described above. ) Is fixedly connected to the side of the second center line (Z ₂ ) so as to be biased by a radius R ₂ . Therefore, the second picker 521 is biased by a predetermined radius R ₂ based on the second center line Z ₂ and fixed according to the rotation state of the second rotating member 561 based on the second center line Z ₂ . As a result, it can be selectively positioned at two positions spaced by 2R ₂ . For reference, in the second embodiment, R ₂ > R ₁ . Conversely, it is also possible if R ₂ <R ₁ .

A use state of the picking apparatus 500 according to the second embodiment as described above will be described with reference to FIG.

As described above in the first embodiment, the first picker 511 according to the rotation state of the first and second pickers 511 and 521 which rotate together with the rotation of the first and second rotating members 551 and 561. And the position of the second picker 521 may be varied. In FIG. 6, an interval between the two pickers 511 and 521 according to the rotation state of the first and second pickers 511 and 521 is easily represented. .

That is, as referenced in FIG. 6, the first and second pickers 511 and 521 may be selected as an arbitrary interval among the intervals of L, L + R ₁ , L + R ₂ , and L + R ₁ + R ₂ . It is supposed to be.

Therefore, if the stacking interval of the semiconductor devices loaded on the test tray is any one of L, L + R ₁ , L + R ₂ , and L + R ₁ + R ₂ , the picking apparatus 500 according to the present embodiment may be configured as a test tray. It can be used continuously without being affected by the replacement. For reference, if R ₁ = R ₂ , the interval between the first and second pickers 511 and 521 may be adjusted to any one of three intervals L, L + R ₁ , and L + 2R ₁ .

Third Embodiment

7 is a front view of a picking apparatus 700 according to a third embodiment of the present invention.

Referring to FIG. 7, the picking apparatus 700 according to the present embodiment includes a pair of picking elements 710 and 720, a fixed block 730, a vacuum pressure transfer member 740, and a gap adjusting device provided in parallel. 750 and the like.

The first picking element 710 of the pair of picking elements 710 and 720 is a first picker 711 and a first picker 711 which are provided for holding or releasing the semiconductor element by vacuum pressure. A first vacuum pipe 712 for supplying a vacuum pressure is provided. The first picker 711 connects and fixes the first vacuum pad 711a and the first vacuum pad 711a to the first vacuum pipe 712 to adsorb or release the semiconductor element by vacuum pressure. One pad holder 711b is provided.

The second picking element 720 of the pair of picking elements 710 and 720 is a second picker 721 and the second picker 721 which are provided for holding or releasing the semiconductor element by vacuum pressure. And a second vacuum pipe 722 for supplying a vacuum pressure to the furnace. The second picker 721 connects and fixes the second vacuum pad 721a and the second vacuum pad 721a, which adsorb or release the semiconductor element by vacuum pressure, to the gap controller 750. Two pad holders 721b are provided.

On the other hand, the fixed block 730 fixes the relative position of the pair of picking elements 710, 720 by fixing the vacuum pipes (712, 722) of both picking elements (710, 720) and a pair of picking The elements 710 and 720 may be blocked to be configured as one picking device 700.

In addition, the vacuum pressure transfer member 740 fixes the lower ends of the vacuum pipes 712 and 722 to prevent rotation of the vacuum pipes 712 and 722. In addition, a portion corresponding to the second picker 721 includes one inlet facing the second vacuum pipe 722 and a vacuum pressure input through the inlet to the first position P ₁ and the second position P ₂ . A vacuum flow path U having two outlets for outputting the furnace is formed.

The gap adjusting device 750 includes a sliding member 751 slidably coupled to the vacuum pressure transmission member 740 and a cylinder 752 provided as a power source for providing power for allowing the sliding member 751 to slide. Consists of That is, the cylinder 752 serves to provide power for sliding the sliding member 751 and ultimately sliding the second picker 721 coupled to the sliding member 751 to face the first picker 711. It is. For reference, although not shown in FIG. 7, it is more preferable to add a member that allows the sliding member 751 to be in close contact with the vacuum pressure transmission member 740.

According to the third embodiment as described above, even if the administrator does not work for adjusting the spacing, the space between the pickers 711 and 721 can be adjusted by automatically operating the cylinder 752 by the control device. do. Of course, in the case of the third embodiment, as in the case of the second embodiment, it is also possible to configure both pickers so that the position can be changed. In addition, when a plurality of picking devices are provided in one pick and place, it is possible to adjust the interval between pickers of each of the plurality of picking devices by one cylinder.

Fourth Embodiment

FIG. 8 is a front view of the picking apparatus 800 according to the fourth embodiment of the present invention, and FIG. 9 is an enlarged front sectional view of a portion W of FIG.

Referring to FIG. 8, the picking apparatus 800 according to the present exemplary embodiment includes a pair of picking elements 810 and 820, a fixing block 830, a rotation preventing member 840, and the like, which are provided in parallel. do.

The first picking element 810 of the pair of picking elements 810 and 820 is a first picker 811 and the first picker 811 which are provided for holding or releasing the semiconductor element by vacuum pressure. A first vacuum pipe 812 for supplying a vacuum pressure is provided.

The second picking element 820 of the pair of picking elements 810 and 820 is a second picker 821 and the second picker 821 which are provided for holding or releasing the semiconductor element by vacuum pressure. A second vacuum pipe 822 for supplying a vacuum pressure is provided. Here, the second picker 821 and the second vacuum pipe 822 are integrally modularized as referenced in FIGS. 8 and 9. A vacuum flow path B having an inlet B _i through which the vacuum pressure on the upper side of the second vacuum pipe 822 flows and an outlet _Bo through which the vacuum pressure on the lower side of the second picker 821 is outputted are provided. There is formed long in the vertical direction, wherein the inlet (B _i) and an outlet (B _o) is not in the same repair. That is, the inlet (B _i) is placed on the repair H ₁ and the outlet (B _o) lies on a repair H ₂ H ₁ and spaced a perpendicular distance L. Therefore, when the integrally modularized second picker 821 and the second vacuum pipe 822 are manually or automatically rotated, the first picker 811 and the second picking element 820 of the first picking element 810 are rotated. The interval between the two pickers 821 can be adjusted.

The fixed block 830 holds the pair of picking elements 810 and 820 by fixing the vacuum pipes 812 and 822 of both picking elements 810 and 820. 810 and 820 are blocked to be configured as one picking device 800.

In addition, the rotation preventing member 840 fixes the lower ends of the vacuum pipes 812 and 822 to prevent rotation of the vacuum pipes 812 and 822.

In the second picking device 820 according to the present embodiment, the vacuum channel B is formed to have a single path in a state in which the second picker 821 and the second vacuum pipe 822 are integrally modularized. By not allowing the inlet (B _i ) and the outlet (B _o ) to be on the same waterline, it is possible to adjust the distance between the first picker 811 and the second picker 821, while the second picker 821 and the second picker It is possible to prevent the vacuum pressure from leaking between the vacuum pipes 822.

As described in the above embodiments, the picking apparatus according to the present invention is configured to adjust the holding distance of the picking elements by adjusting the distance between the pickers, but the present invention is basically for adjusting the holding interval of the picking elements. It will be appreciated that a configuration can be made that allows the width of the device to be changed.

That is, the picking apparatus described above may be applied in various ways without departing from the basic technical idea of varying the holding interval of the picking elements. Therefore, although the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings, it is understood that the present invention is limited only to the above embodiments, since the above embodiments have only been described with reference to preferred examples of the present invention. It should not be understood that the scope of the invention should be understood by the claims and equivalent concepts described below.

As described in detail above, the present invention has the following effects.

Since it is possible to change the relative position of the picker provided in the picking element, it is possible to adjust the holding interval of a plurality of picking elements configured in one picking device, so that it can be applied to test trays of various standards, thereby, It has the effect of reducing the cost and A / S cost.

Claims (6)

delete delete A pair of picking elements provided in parallel to hold or release the semiconductor elements; A fixed block for fixing the pair of picking elements to each other; And An interval adjusting device provided to adjust a holding interval of the pair of picking elements; Including; Each of the pair of picking elements, Pickers provided for holding or releasing the semiconductor device; And A transfer element for transferring a gripping force and a gripping force to the picker; Including, The spacing device to adjust the spacing between the pickers A rotation member provided to be rotatable with any center line as the rotation axis, and the picker being fixedly biased based on the center line; And A fixing member for fixing the rotating member; Characterized in that it comprises Picking device for pick and place test handlers. A pair of picking elements provided in parallel to hold or release the semiconductor elements; A fixed block for fixing the pair of picking elements to each other; And An interval adjusting device provided to adjust a holding interval of the pair of picking elements; Including; Each of the pair of picking elements, Pickers provided for holding or releasing the semiconductor device; And A transfer element for transferring a gripping force and a gripping force to the picker; Including, The spacing device to adjust the spacing between the pickers, A power source that provides power to allow a particular picker to slide opposite the other picker; And A sliding member for sliding the specific picker to face the other picker while sliding according to the operation of the power source; Characterized in that it comprises Picking device for pick and place test handlers. A picker provided to hold or release the semiconductor element by vacuum pressure, the picker being selectively positioned at at least two positions; A positioning device for adjusting the picker to be selectively positioned at the at least two positions; A vacuum pipe provided to provide a vacuum pressure to the picker; And A vacuum input through the inlet and one inlet facing the vacuum pipe to transfer the vacuum pressure from the vacuum pipe to the picker which can be selectively positioned at the at least two positions by the positioning device. A vacuum pressure transfer member having a vacuum flow path having at least two outlets for outputting air pressure to the picker; Characterized in that it comprises Picking device for pick and place test handlers. A picker provided to hold or release the semiconductor element by vacuum pressure, the picker being selectively positioned at at least two positions; And A vacuum pipe provided to provide a vacuum pressure to the picker; Including but not limited to: The picker and the vacuum pipe are integrally modularized, and a vacuum flow path having an inlet through which the vacuum pressure is input through the vacuum pipe and an outlet through which the vacuum pressure is output through the picker is provided across the vacuum pipe and the picker. Formed by a path, The inlet and the outlet of the vacuum flow passage are not located on the same water line. Picking element for pick and place of test handler.

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