KR100887357B1 - 고온계 무연 솔더 조성물과 이를 이용한 전자기기 및인쇄회로기판 - Google Patents
고온계 무연 솔더 조성물과 이를 이용한 전자기기 및인쇄회로기판 Download PDFInfo
- Publication number
- KR100887357B1 KR100887357B1 KR1020070015642A KR20070015642A KR100887357B1 KR 100887357 B1 KR100887357 B1 KR 100887357B1 KR 1020070015642 A KR1020070015642 A KR 1020070015642A KR 20070015642 A KR20070015642 A KR 20070015642A KR 100887357 B1 KR100887357 B1 KR 100887357B1
- Authority
- KR
- South Korea
- Prior art keywords
- lead
- weight
- free solder
- solder
- silicon
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (4)
- 동 2~5중량%, 실리콘 0.001~0.05 미만 중량%, 코발트 0.001~0.01 미만 중량%및 주석을 잔부로 포함하는고온계 무연 솔더 조성물.
- 고온계 무연 솔더 합금에 의해 고착되는 다수개의 전자부품을 포함하는 전자기기로서,상기 고온계 무연 솔더 합금은 동 2~5중량%, 실리콘 0.001~0.05 미만 중량%, 코발트 0.001~0.01 미만 중량%, 및 주석을 잔부로 포함하는전자기기.
- 제2항에 있어서,상기 전자기기는 컴퓨터, 디지털 비디오 캠코더, 디지털 텔레비젼, 디지털 카메라, 이동통신단말기 중 하나가 선택되는전자기기.
- 고온계 무연 솔더 합금에 의해 고착되는 인쇄회로기판으로서,상기 고온계 무연 솔더 합금은 동 2~5중량%, 실리콘 0.001~0.05 미만 중량%, 코발트 0.001~0.01 미만 중량%, 및 주석을 잔부로 포함하는인쇄회로기판.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070015642A KR100887357B1 (ko) | 2006-02-14 | 2007-02-14 | 고온계 무연 솔더 조성물과 이를 이용한 전자기기 및인쇄회로기판 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060014300 | 2006-02-14 | ||
KR20060014300 | 2006-02-14 | ||
KR1020070015642A KR100887357B1 (ko) | 2006-02-14 | 2007-02-14 | 고온계 무연 솔더 조성물과 이를 이용한 전자기기 및인쇄회로기판 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070082062A KR20070082062A (ko) | 2007-08-20 |
KR100887357B1 true KR100887357B1 (ko) | 2009-03-06 |
Family
ID=38611797
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070015642A KR100887357B1 (ko) | 2006-02-14 | 2007-02-14 | 고온계 무연 솔더 조성물과 이를 이용한 전자기기 및인쇄회로기판 |
Country Status (1)
Country | Link |
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KR (1) | KR100887357B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009022758A1 (en) * | 2007-08-14 | 2009-02-19 | Ecojoin | Pb-free solder compositions and pcb and electronic device using the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020046192A (ko) * | 2000-12-11 | 2002-06-20 | 솔더코트 가부시키가이샤 | 솔더, 프린트배선기판의 표면처리방법, 및 전자부품의 장착방법 |
JP2004261863A (ja) * | 2003-01-07 | 2004-09-24 | Senju Metal Ind Co Ltd | 鉛フリーはんだ |
-
2007
- 2007-02-14 KR KR1020070015642A patent/KR100887357B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020046192A (ko) * | 2000-12-11 | 2002-06-20 | 솔더코트 가부시키가이샤 | 솔더, 프린트배선기판의 표면처리방법, 및 전자부품의 장착방법 |
JP2004261863A (ja) * | 2003-01-07 | 2004-09-24 | Senju Metal Ind Co Ltd | 鉛フリーはんだ |
Also Published As
Publication number | Publication date |
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KR20070082062A (ko) | 2007-08-20 |
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