KR100872416B1 - The structure of probe card for testing semiconductor - Google Patents

The structure of probe card for testing semiconductor Download PDF

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Publication number
KR100872416B1
KR100872416B1 KR1020070069450A KR20070069450A KR100872416B1 KR 100872416 B1 KR100872416 B1 KR 100872416B1 KR 1020070069450 A KR1020070069450 A KR 1020070069450A KR 20070069450 A KR20070069450 A KR 20070069450A KR 100872416 B1 KR100872416 B1 KR 100872416B1
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KR
South Korea
Prior art keywords
bolt
pcb substrate
needle fixing
fixing block
mounted
Prior art date
Application number
KR1020070069450A
Other languages
Korean (ko)
Inventor
강대균
Original Assignee
뎀코프로브(주)
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Publication date
Application filed by 뎀코프로브(주) filed Critical 뎀코프로브(주)
Priority to KR1020070069450A priority Critical patent/KR100872416B1/en
Application granted granted Critical
Publication of KR100872416B1 publication Critical patent/KR100872416B1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Abstract

The dual assembly bolt of the probe card for the semiconductor test is provided to prevent the bending of the center of the needle fixing block by supplying the top surface of the needle fixing block with the outside bolt. The dual assembly bolt of the probe card for the semiconductor test comprises the PCB substrate(10), the reinforcement plate(20), the base plate(60), the plurality of needle fixing blocks(30). The PCB substrate has the plate side in which a plurality of circuits is printed. The plurality of pinholes is formed in the center part of the PCB substrate. The reinforcement plate is mounted on the center of upper surface of the PCB substrate to prevent the deformation of the PCB substrate. The fastening bolt fixes a plurality of needle fixing to the edge of the base plate blocks. The needle fixing block is mounted on the lower surface of the PCB substrate by using the fastening bolt in the edge of the base plate.

Description

Double assembly bolt of semiconductor inspection probe card {The structure of probe card for testing semiconductor}

The present invention relates to a structure of a double assembly bolt mounted on a probe card for semiconductor inspection, and more particularly, when the needle fixing block is fixed using the double assembly bolt, an external bolt fastened to the upper surface of the needle fixing block is needle. The present invention relates to a structure of a double assembly bolt mounted on a probe card for semiconductor inspection, which can prevent bending of the needle fixing block due to supporting an upper surface of the fixing block.

The present invention relates to a structure of a double assembly bolt mounted on a probe card for semiconductor inspection, and when the needle fixing block is fixed using the double assembly bolt, the external bolt fastened to the upper surface of the needle fixing block is the top of the needle fixing block. The present invention relates to a structure of a double assembly bolt mounted on a semiconductor inspection probe card, which can prevent bending of the needle fixing block because it supports the surface.

In general, semiconductor devices are manufactured by performing a fabrication process of forming a pattern on a wafer and an assembly process of assembling the wafer on which the pattern is formed into each chip. An electronic die sorting (EDS) process is performed between the fabrication process and the assembly process to examine electrical characteristics of each chip constituting the wafer. This EDS process is performed to determine the defective chip among the chips constituting the wafer. In this case, the EDS process mainly uses an inspection apparatus that applies an electrical signal to the chips constituting the wafer and determines a defect by a signal checked from the applied electrical signal. Such inspection mainly uses an inspection apparatus including a probe card having needles for contacting the wafer and applying an electrical signal to inspect the electrical state of the chips constituting the wafer. The semiconductor device whose result of the test using a probe card is judged good quality is manufactured as a finished product by the post process of packaging.

In the electrical property inspection of a semiconductor wafer, a needle of a probe card is usually brought into contact with an electrode pad of a semiconductor wafer, and a specific current is energized through these needles to measure electrical characteristics in that case. Meanwhile, as semiconductor devices are gradually reduced to finer sizes, the degree of integration of circuits is also increased, so that electrode pads of semiconductor devices in contact with the needles of probe cards are becoming more fine.

Conventional probe cards used for semiconductor wafer inspection include a circular PCB substrate 10, a reinforcement plate 20 provided in the center of the upper surface of the PCB substrate 10, and a reinforcement plate in the center of the bottom surface of the PCB substrate 10. The needle fixing block 30 and the needle fixing block 30 provided correspondingly to the 20 are configured as the needle 50 fixed by an insulator 40 such as epoxy. Needle 50 is usually formed on both sides of the needle fixing block 30 to be symmetrical with each other, the upper end is welded to the wiring pattern formed on the outer periphery of the needle fixing block 30 at the bottom of the PCB substrate 10 It is joined by the lower end is provided with a shape in which the end is bent downward almost close to the vertical while forming a gentle inclination angle to the center of the needle fixing block (30). In this case, the inclined portion of the needle 50 is fixed by the method of being embedded in the insulator 40, such as epoxy, in the needle fixing block 30, and in particular, the ends bent downward are slightly bent in a direction facing each other. It has elasticity. Needles 50, which are formed symmetrically on both sides, are provided in the same number as electrode pads of the semiconductor device to be contacted in the front-rear direction. Meanwhile, a decoupling capacitor is attached to an upper surface of the PCB substrate 10 directly above the upper end of the needle 50 joined to the PCB substrate 10.

The conventional probe card is installed under the test head of the inspection equipment, the pogo pin of the test head is in contact with the circuit pattern formed on the upper surface of the PCB substrate 10 during the inspection process, the downward bending of each needle 50 As the contact ends are brought into contact with the inspection pads formed on the upper surface of the wafer, electrical current is conducted by conducting a current through each semiconductor device of the wafer.

In the conventional semiconductor inspection probe card, when assembling the needle fixing block to the ring of the base plate, a bolt is used to fix the needle fixing block because a space is generated between the upper surface of the needle fixing block at the lower surface of the PCB board. In case of tightening, there was a problem in that the center of the needle fixing block was bent.

In the structure of the double assembly bolt of the present invention, the outer bolt 1 is fastened to the upper surface of the needle fixing block 30 through the reinforcing plate 20 and the PCB substrate 10 so that the lower surface of the PCB substrate 10 At the height of the space portion 70 formed between the upper surface of the needle fixing block 30 and the balance of the needle fixing block 30 can be adjusted, the nut (2) on the upper outer peripheral surface of the outer bolt (1) The inner bolt 4 is fastened to the needle fixing block 30 by penetrating the inside of the external bolt 1, thereby fixing the needle fixing block 30 and adjusting the strength of the fixed force.

 According to the present invention, when the needle fixing block is fixed using the double assembly bolt, the external bolts fastened to the upper surface of the needle fixing block support the upper surface of the needle fixing block, thereby preventing the phenomenon of bending over the center of the needle fixing block. It is very useful in the semiconductor equipment industry.

According to the present invention, a plurality of circuits are printed on a plate surface, and a plurality of pin holes penetrating vertically in a center thereof are formed on the PCB substrate 10; A reinforcement plate 20 mounted at the center of the upper surface of the PCB substrate 10 to prevent deformation of the PCB substrate 10; A base plate (60) mounted on a lower surface of the PCB board (10) and having a plurality of needle fixing blocks (30) fixed to left and right at edges thereof using fastening bolts; A plurality of needle fixing blocks 30 mounted on the lower surface of the PCB substrate 10 in a state in which the fastening bolt is fixed to the edge of the base plate 60 in the left and right directions; The upper end of the PCB substrate 10 is fixed to the needle fixing block 30 by the insulator 40 and is inserted into the pinhole of the PCB substrate 10 through the guide hole 164 of the base plate 160. In the structure of the bolt mounted on the semiconductor inspection probe card consisting of the needle 50 is connected to the circuit pattern and fixed by soldering, formed between the upper surface of the needle fixing block 30 on the lower surface of the PCB substrate 10. An outer bolt 1 fastened to the upper surface of the needle fixing block 30 through the reinforcing plate 20 and the PCB substrate 10 to adjust the height of the space 70; A nut (2) fastened to an outer circumferential surface of the outer bolt (1); It relates to a structure of a double assembly bolt mounted to the probe card for semiconductor inspection, characterized in that consisting of the inner bolt (4) fastened to the needle fixing block 30 through the inside of the outer bolt (1).

The bolt structure of the present invention is characterized in that the spring washer 3 is mounted to the lower part of the nut 2 and the spring washer 5 is mounted to the lower part of the inner bolt 4.

The present invention is a structure of a double assembly bolt used for a semiconductor inspection probe card. In the probe board for semiconductor inspection using the double assembly bolt of the present invention as shown in Figures 1 to 3, the PCB substrate 10 has a plurality of circuits are printed on the plate surface, a plurality of vertical pinholes are formed in the center The reinforcement plate 20 is mounted at the center of the upper surface of the PCB substrate 10 to prevent deformation of the PCB substrate 10, and the base plate 60 is mounted at the lower surface of the PCB substrate 10 and fastened. The lower surface of the PCB substrate 10 in a state in which a plurality of needle fixing blocks 30 are fixed to the edges in the left and right directions using bolts, and fixed to the left and right directions using fastening bolts at the edges of the base plate 60. A plurality of needle fixing blocks 30 are mounted on the needle fixing blocks 30 and fixed to the needle fixing blocks 30 by the insulator 40 and penetrate through the guide holes 164 of the base plate 160 to pin pins of the PCB substrate 10. The upper part of the circuit board of the PCB substrate 10 Is connected to the turn has a needle (50) is fixed by soldering.

1 to 3, when assembling the needle fixing block 30 to the ring of the base plate 160 in the probe card for semiconductor inspection, the upper surface of the needle fixing block 30 on the lower surface of the PCB substrate 10 Since the space portion 70 is generated between the fastening the needle fixing block 30 by using a bolt to fix the phenomenon occurs in the center of the needle fixing block 30 as shown in Figures 4 to 6 In the case of fixing the needle fixing block 30 using the double assembly bolt of the present invention, since the external bolt 1 fastened to the upper surface of the needle fixing block 30 supports the upper surface of the needle fixing block 30, the needle It is possible to prevent the phenomenon that the center portion of the fixed block 30 is bent.

In the structure of the double assembly bolt of the present invention as shown in Figures 4 to 6 the outer bolt 1 is fastened to the upper surface of the needle fixing block 30 through the reinforcing plate 20 and the PCB board 10 In the lower surface of the PCB substrate 10, the height of the space portion 70 formed between the upper surface of the needle fixing block 30 can be adjusted and the balance of the needle fixing block 30 can be adjusted. The nut 2 is fastened on the outer circumferential surface, and the inner bolt 4 is fastened to the needle fixing block 30 by penetrating the inside of the outer bolt 1, thereby fixing the needle fixing block 30 at the same time. You can adjust the intensity. 4 to 6, the structure of the bolt of the present invention, the spring washer (3) is mounted on the lower part of the nut (2) and the spring washer (5) is preferably mounted on the lower part of the inner bolt (4) It can strengthen the strength of.

1 is a plan view showing the top of a conventional probe card.

Figure 2 is a perspective view showing a base plate mounted on a conventional probe card.

3 is a cross-sectional view showing a conventional probe card.

Figure 4 is a perspective view showing the structure of a double assembly bolt of the present invention.

5 is a perspective view showing the structure of a double assembly bolt of the present invention.

Figure 6 is a cross-sectional view showing the structure of a double assembly bolt of the present invention.

Figure 7 is a perspective view showing the structure of a double assembly bolt of the present invention.

8 is a perspective view showing the outer bolt of the present invention.

Figure 9 is a perspective view showing the outer bolt of the present invention.

Explanation of symbols on the main parts of the drawings

1: external bolt 2: nut

3: spring washer 4: internal bolt

5: spring washer

10: PCB substrate 20: gusset

30: needle fixing block 40: insulator

50: needle 70: space part

60, 160: base plate 164: guide hole

Claims (2)

  1. A PCB substrate 10 having a plurality of circuits printed on the plate surface, and having a plurality of pinholes vertically penetrating in the center thereof; A reinforcement plate 20 mounted at the center of the upper surface of the PCB substrate 10 to prevent deformation of the PCB substrate 10; A base plate (60) mounted on a lower surface of the PCB board (10) and having a plurality of needle fixing blocks (30) fixed to left and right at edges thereof using fastening bolts; A plurality of needle fixing blocks 30 mounted on the lower surface of the PCB substrate 10 in a state in which the fastening bolt is fixed to the edge of the base plate 60 in the left and right directions; The upper end of the PCB substrate 10 is fixed to the needle fixing block 30 by the insulator 40 and is inserted into the pinhole of the PCB substrate 10 through the guide hole 164 of the base plate 160. In the structure of a bolt mounted on a semiconductor inspection probe card consisting of a needle 50 connected to a circuit pattern and fixed by soldering, the structure of the bolt is a needle fixing block 30 on the lower surface of the PCB substrate 10. An outer bolt 1 fastened to the upper surface of the needle fixing block 30 through the reinforcing plate 20 and the PCB substrate 10 so as to adjust the height of the space portion 70 formed between the upper surfaces of the needle fixing block 30; A nut (2) fastened to an outer circumferential surface of the outer bolt (1); The double assembly bolt of the probe card for semiconductor inspection, characterized in that consisting of the inner bolt (4) is fastened to the needle fixing block 30 through the inside of the outer bolt (1).
  2. The semiconductor inspection probe according to claim 1, wherein the bolt structure has a spring washer (3) mounted on the lower part of the nut (2) and a spring washer (5) mounted on the lower part of the inner bolt (4). Double assembly bolt on the card.
KR1020070069450A 2007-07-11 2007-07-11 The structure of probe card for testing semiconductor KR100872416B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070069450A KR100872416B1 (en) 2007-07-11 2007-07-11 The structure of probe card for testing semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070069450A KR100872416B1 (en) 2007-07-11 2007-07-11 The structure of probe card for testing semiconductor

Publications (1)

Publication Number Publication Date
KR100872416B1 true KR100872416B1 (en) 2008-12-05

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Family Applications (1)

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KR1020070069450A KR100872416B1 (en) 2007-07-11 2007-07-11 The structure of probe card for testing semiconductor

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040014211A (en) * 2002-08-09 2004-02-14 니혼 덴시자이료 가부시키가이샤 Probe card
KR20060125335A (en) * 2005-06-02 2006-12-06 주식회사 파이컴 Probe card
KR20070016291A (en) * 2005-08-02 2007-02-08 주식회사 파이컴 Probe card assembly

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040014211A (en) * 2002-08-09 2004-02-14 니혼 덴시자이료 가부시키가이샤 Probe card
KR20060125335A (en) * 2005-06-02 2006-12-06 주식회사 파이컴 Probe card
KR20070016291A (en) * 2005-08-02 2007-02-08 주식회사 파이컴 Probe card assembly

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