KR100859082B1 - 도포 방법 - Google Patents

도포 방법 Download PDF

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Publication number
KR100859082B1
KR100859082B1 KR1020070066864A KR20070066864A KR100859082B1 KR 100859082 B1 KR100859082 B1 KR 100859082B1 KR 1020070066864 A KR1020070066864 A KR 1020070066864A KR 20070066864 A KR20070066864 A KR 20070066864A KR 100859082 B1 KR100859082 B1 KR 100859082B1
Authority
KR
South Korea
Prior art keywords
coating
coating liquid
die
coated
discharge port
Prior art date
Application number
KR1020070066864A
Other languages
English (en)
Korean (ko)
Other versions
KR20080055594A (ko
Inventor
지단 웨이
후미아키 미무라
Original Assignee
쥬가이로 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쥬가이로 고교 가부시키가이샤 filed Critical 쥬가이로 고교 가부시키가이샤
Publication of KR20080055594A publication Critical patent/KR20080055594A/ko
Application granted granted Critical
Publication of KR100859082B1 publication Critical patent/KR100859082B1/ko

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254Coating heads with slot-shaped outlet
    • B05C5/0262Coating heads with slot-shaped outlet adjustable in width, i.e. having lips movable relative to each other in order to modify the slot width, e.g. to close it
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254Coating heads with slot-shaped outlet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/26Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
KR1020070066864A 2006-12-15 2007-07-04 도포 방법 KR100859082B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006337687A JP4799390B2 (ja) 2006-12-15 2006-12-15 塗布方法
JPJP-P-2006-00337687 2006-12-15

Publications (2)

Publication Number Publication Date
KR20080055594A KR20080055594A (ko) 2008-06-19
KR100859082B1 true KR100859082B1 (ko) 2008-09-17

Family

ID=39565310

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070066864A KR100859082B1 (ko) 2006-12-15 2007-07-04 도포 방법

Country Status (4)

Country Link
JP (1) JP4799390B2 (zh)
KR (1) KR100859082B1 (zh)
CN (1) CN101204696B (zh)
TW (1) TWI322040B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101498607B1 (ko) * 2008-09-19 2015-03-05 주식회사 탑 엔지니어링 페이스트 패턴의 검사대상부분을 선정하는 방법
WO2013049133A1 (en) 2011-09-28 2013-04-04 3M Innovative Properties Company Method of coating liquid optically clear adhesives onto rigid substrates
JP6460694B2 (ja) * 2014-09-22 2019-01-30 Ntn株式会社 塗布方法および塗布装置
JP6801387B2 (ja) * 2015-11-16 2020-12-16 東京エレクトロン株式会社 塗布膜形成方法、塗布膜形成装置及び記憶媒体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05190438A (ja) * 1992-01-10 1993-07-30 Mitsubishi Electric Corp 半導体製造装置
KR20020028829A (ko) * 2000-10-10 2002-04-17 나카네 히사시 도포방법
JP2005270875A (ja) 2004-03-25 2005-10-06 Tokyo Ohka Kogyo Co Ltd 塗膜形成方法
KR20060006540A (ko) * 2004-07-16 2006-01-19 삼성전자주식회사 포토레지스트 코팅 장치 및 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11239754A (ja) * 1998-02-25 1999-09-07 Hirata Corp 流体塗布装置および流体塗布方法
JP4736177B2 (ja) * 2000-11-16 2011-07-27 大日本印刷株式会社 枚葉基板の製造方法
JP4218376B2 (ja) * 2003-03-12 2009-02-04 東レ株式会社 塗布方法およびディスプレイ用部材の製造方法
JP4071183B2 (ja) * 2003-09-12 2008-04-02 東京エレクトロン株式会社 塗布方法及び塗布装置
JP4490780B2 (ja) * 2004-10-07 2010-06-30 大日本スクリーン製造株式会社 基板処理装置および基板処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05190438A (ja) * 1992-01-10 1993-07-30 Mitsubishi Electric Corp 半導体製造装置
KR20020028829A (ko) * 2000-10-10 2002-04-17 나카네 히사시 도포방법
JP2005270875A (ja) 2004-03-25 2005-10-06 Tokyo Ohka Kogyo Co Ltd 塗膜形成方法
KR20060006540A (ko) * 2004-07-16 2006-01-19 삼성전자주식회사 포토레지스트 코팅 장치 및 방법

Also Published As

Publication number Publication date
TW200824800A (en) 2008-06-16
CN101204696A (zh) 2008-06-25
TWI322040B (en) 2010-03-21
CN101204696B (zh) 2012-07-25
JP4799390B2 (ja) 2011-10-26
JP2008149225A (ja) 2008-07-03
KR20080055594A (ko) 2008-06-19

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