KR100859082B1 - 도포 방법 - Google Patents
도포 방법 Download PDFInfo
- Publication number
- KR100859082B1 KR100859082B1 KR1020070066864A KR20070066864A KR100859082B1 KR 100859082 B1 KR100859082 B1 KR 100859082B1 KR 1020070066864 A KR1020070066864 A KR 1020070066864A KR 20070066864 A KR20070066864 A KR 20070066864A KR 100859082 B1 KR100859082 B1 KR 100859082B1
- Authority
- KR
- South Korea
- Prior art keywords
- coating
- coating liquid
- die
- coated
- discharge port
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
- B05C5/0262—Coating heads with slot-shaped outlet adjustable in width, i.e. having lips movable relative to each other in order to modify the slot width, e.g. to close it
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006337687A JP4799390B2 (ja) | 2006-12-15 | 2006-12-15 | 塗布方法 |
JPJP-P-2006-00337687 | 2006-12-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080055594A KR20080055594A (ko) | 2008-06-19 |
KR100859082B1 true KR100859082B1 (ko) | 2008-09-17 |
Family
ID=39565310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070066864A KR100859082B1 (ko) | 2006-12-15 | 2007-07-04 | 도포 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4799390B2 (zh) |
KR (1) | KR100859082B1 (zh) |
CN (1) | CN101204696B (zh) |
TW (1) | TWI322040B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101498607B1 (ko) * | 2008-09-19 | 2015-03-05 | 주식회사 탑 엔지니어링 | 페이스트 패턴의 검사대상부분을 선정하는 방법 |
WO2013049133A1 (en) | 2011-09-28 | 2013-04-04 | 3M Innovative Properties Company | Method of coating liquid optically clear adhesives onto rigid substrates |
JP6460694B2 (ja) * | 2014-09-22 | 2019-01-30 | Ntn株式会社 | 塗布方法および塗布装置 |
JP6801387B2 (ja) * | 2015-11-16 | 2020-12-16 | 東京エレクトロン株式会社 | 塗布膜形成方法、塗布膜形成装置及び記憶媒体 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05190438A (ja) * | 1992-01-10 | 1993-07-30 | Mitsubishi Electric Corp | 半導体製造装置 |
KR20020028829A (ko) * | 2000-10-10 | 2002-04-17 | 나카네 히사시 | 도포방법 |
JP2005270875A (ja) | 2004-03-25 | 2005-10-06 | Tokyo Ohka Kogyo Co Ltd | 塗膜形成方法 |
KR20060006540A (ko) * | 2004-07-16 | 2006-01-19 | 삼성전자주식회사 | 포토레지스트 코팅 장치 및 방법 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11239754A (ja) * | 1998-02-25 | 1999-09-07 | Hirata Corp | 流体塗布装置および流体塗布方法 |
JP4736177B2 (ja) * | 2000-11-16 | 2011-07-27 | 大日本印刷株式会社 | 枚葉基板の製造方法 |
JP4218376B2 (ja) * | 2003-03-12 | 2009-02-04 | 東レ株式会社 | 塗布方法およびディスプレイ用部材の製造方法 |
JP4071183B2 (ja) * | 2003-09-12 | 2008-04-02 | 東京エレクトロン株式会社 | 塗布方法及び塗布装置 |
JP4490780B2 (ja) * | 2004-10-07 | 2010-06-30 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
-
2006
- 2006-12-15 JP JP2006337687A patent/JP4799390B2/ja active Active
-
2007
- 2007-05-29 TW TW096119076A patent/TWI322040B/zh active
- 2007-06-22 CN CN2007101280419A patent/CN101204696B/zh active Active
- 2007-07-04 KR KR1020070066864A patent/KR100859082B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05190438A (ja) * | 1992-01-10 | 1993-07-30 | Mitsubishi Electric Corp | 半導体製造装置 |
KR20020028829A (ko) * | 2000-10-10 | 2002-04-17 | 나카네 히사시 | 도포방법 |
JP2005270875A (ja) | 2004-03-25 | 2005-10-06 | Tokyo Ohka Kogyo Co Ltd | 塗膜形成方法 |
KR20060006540A (ko) * | 2004-07-16 | 2006-01-19 | 삼성전자주식회사 | 포토레지스트 코팅 장치 및 방법 |
Also Published As
Publication number | Publication date |
---|---|
TW200824800A (en) | 2008-06-16 |
CN101204696A (zh) | 2008-06-25 |
TWI322040B (en) | 2010-03-21 |
CN101204696B (zh) | 2012-07-25 |
JP4799390B2 (ja) | 2011-10-26 |
JP2008149225A (ja) | 2008-07-03 |
KR20080055594A (ko) | 2008-06-19 |
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