KR100833637B1 - 검사 유닛 - Google Patents
검사 유닛 Download PDFInfo
- Publication number
- KR100833637B1 KR100833637B1 KR1020050092560A KR20050092560A KR100833637B1 KR 100833637 B1 KR100833637 B1 KR 100833637B1 KR 1020050092560 A KR1020050092560 A KR 1020050092560A KR 20050092560 A KR20050092560 A KR 20050092560A KR 100833637 B1 KR100833637 B1 KR 100833637B1
- Authority
- KR
- South Korea
- Prior art keywords
- hole
- contact probe
- retainer
- inspection unit
- tubular body
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Connecting Device With Holders (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
Claims (6)
- 검사 회로가 배치되는 기판에 장착되도록 되어 있는 제1 면과, 피검사 디바이스에 대향하도록 되어 있는 제2 면을 구비하고, 제1 직경을 가지고 상기 제1 면과 상기 제2 면을 연통시키는 제1 관통 구멍이 형성되어 있는 전도성 부재;상기 제1 직경보다 작은 제2 직경을 가진 관형 몸체와, 상기 관형 몸체의 한쪽 단부로부터 후퇴가능하게 돌출하는 플런저를 포함하는 접촉 프로브;제2 관통 구멍이 형성되어 있고, 상기 제2 관통 구멍을 상기 제1 관통 구멍과 연통시키기 위해 적어도 상기 전도성 부재의 제2면과 대향하여, 상기 플런저만이 상기 제2 관통 구멍의 한쪽 단부로부터 돌출하는 상태에서 상기 접촉 프로브가 상기 전도성 부재의 제1 관통 구멍에 유지되는 것인 제1 리테이너;상기 관형 몸체의 한쪽 단부를 상기 제1 관통 구멍과 동심으로 유지시키는 제2 리테이너를 포함하는 것인 검사 유닛.
- 제1항에 있어서, 상기 제2 리테이너는, 상기 전도성 부재와 상기 제1 리테이너 사이에 배치되고, 상기 관형 몸체의 한쪽 단부가 관통하는 구멍이 형성되어 있는 절연 시트인 것인 검사 유닛.
- 제1항에 있어서, 상기 제2 리테이너는, 상기 관형 몸체에 끼워지고 상기 관형 몸체의 외면과 상기 제1 관통 구멍의 내면 사이의 갭보다 더 크지 않은 폭을 갖는 환형 절연 부재인 것인 검사 유닛.
- 제1항에 있어서, 상기 제1 리테이너는 제3 관통 구멍을 구비하는 전도성 판 부재와, 상기 제2 관통 구멍이 형성되어 있고 상기 제3 관통 구멍에 끼워지는 절연 스페이서를 포함하는 것인 검사 유닛.
- 제1항에 있어서, 상기 제1 리테이너는 상기 제2 관통 구멍이 형성되어 있는 절연 판 부재를 포함하는 것인 검사 유닛.
- 제1항에 있어서, 상기 접촉 프로브는 RF 신호를 전송하도록 되어 있는 것인 검사 유닛.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004288231A JP4535828B2 (ja) | 2004-09-30 | 2004-09-30 | 検査ユニットの製法 |
JPJP-P-2004-00288231 | 2004-09-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060051978A KR20060051978A (ko) | 2006-05-19 |
KR100833637B1 true KR100833637B1 (ko) | 2008-05-30 |
Family
ID=36098307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050092560A KR100833637B1 (ko) | 2004-09-30 | 2005-09-30 | 검사 유닛 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7126362B2 (ko) |
JP (1) | JP4535828B2 (ko) |
KR (1) | KR100833637B1 (ko) |
MY (1) | MY134463A (ko) |
TW (1) | TWI293122B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102315536B1 (ko) | 2021-08-31 | 2021-10-21 | 하병호 | 검사소켓 및 그 제조방법 |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4438601B2 (ja) * | 2004-10-28 | 2010-03-24 | 株式会社ヨコオ | 検査ユニットの製法 |
US7293994B2 (en) * | 2005-12-08 | 2007-11-13 | International Business Machines Corporation | Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member |
US7362118B2 (en) * | 2006-08-25 | 2008-04-22 | Interconnect Devices, Inc. | Probe with contact ring |
EP2093576A4 (en) * | 2006-12-15 | 2010-09-22 | Nhk Spring Co Ltd | CONDUCTIVE CONTACT SUPPORT, CONDUCTIVE CONTACT UNIT AND METHOD FOR MANUFACTURING A CONDUCTIVE CONTACT SUPPORT |
WO2009031394A1 (ja) * | 2007-09-03 | 2009-03-12 | Advantest Corporation | 電気接続構造、端子装置、ソケット、電子部品試験装置及びソケットの製造方法 |
JP4921344B2 (ja) * | 2007-12-26 | 2012-04-25 | 株式会社ヨコオ | 検査ソケット |
US7816932B2 (en) * | 2008-02-21 | 2010-10-19 | Teradyne, Inc. | Test system with high frequency interposer |
KR101600019B1 (ko) * | 2009-11-26 | 2016-03-04 | (주)엠투엔 | 프로브 기판 및 이를 포함하는 프로브 카드 |
JP2011247838A (ja) * | 2010-05-31 | 2011-12-08 | Ricoh Co Ltd | スイッチプローブ、基板検査装置及び基板検査システム |
US9689897B2 (en) * | 2010-06-03 | 2017-06-27 | Hsio Technologies, Llc | Performance enhanced semiconductor socket |
US9182425B2 (en) * | 2012-05-21 | 2015-11-10 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Probe supporting and aligning apparatus |
JP6372208B2 (ja) * | 2014-07-11 | 2018-08-15 | 山一電機株式会社 | 基板接続用コネクタ |
JP2016096297A (ja) * | 2014-11-17 | 2016-05-26 | イビデン株式会社 | 金属塊内蔵配線板及びその製造方法 |
US20170059611A1 (en) * | 2015-09-02 | 2017-03-02 | Oracle International Corporation | Coaxial integrated circuit test socket |
US9876307B2 (en) * | 2015-09-03 | 2018-01-23 | Apple Inc. | Surface connector with silicone spring member |
US9899757B2 (en) * | 2015-09-03 | 2018-02-20 | Apple Inc. | Surface connector with silicone spring member |
KR101762836B1 (ko) * | 2015-09-10 | 2017-07-28 | 리노공업주식회사 | 프로브 소켓 |
CN106802391A (zh) * | 2017-03-24 | 2017-06-06 | 深圳市斯纳达科技有限公司 | 集成电路测试装置及其导电体组件 |
WO2019022204A1 (ja) * | 2017-07-28 | 2019-01-31 | 日本発條株式会社 | コンタクトプローブおよびプローブユニット |
JP7039259B2 (ja) * | 2017-11-16 | 2022-03-22 | 株式会社ヨコオ | プローブヘッド |
JP7153670B2 (ja) * | 2017-11-30 | 2022-10-14 | 株式会社エンプラス | 電気接続用ソケットの製造方法 |
US10892142B2 (en) * | 2018-03-16 | 2021-01-12 | Samsung Electronics Co., Ltd. | System for fabricating a semiconductor device |
KR102513417B1 (ko) * | 2018-03-16 | 2023-03-27 | 삼성전자주식회사 | 반도체 소자의 제조장치 |
TWI650561B (zh) * | 2018-04-13 | 2019-02-11 | 中國探針股份有限公司 | 應用於探針基座之絕緣件及其探針基座 |
CN108448278B (zh) * | 2018-05-18 | 2024-08-27 | 江苏吴通物联科技有限公司 | 一种框架式连接结构 |
US11782074B2 (en) | 2018-11-27 | 2023-10-10 | Nhk Spring Co., Ltd. | Probe unit |
CN109724483A (zh) * | 2018-12-17 | 2019-05-07 | 江西国泰民爆集团股份有限公司 | 一种用于电子雷管自动装配的产品检测模具 |
KR102141368B1 (ko) * | 2019-01-23 | 2020-08-05 | 박상량 | 반도체 디바이스용 소켓 |
CN109975585A (zh) * | 2019-03-15 | 2019-07-05 | 华为技术有限公司 | 一种测试装置、测试针及测试针的安装结构 |
TWI679424B (zh) * | 2019-03-29 | 2019-12-11 | 矽品精密工業股份有限公司 | 檢測裝置及其製法 |
CN112467486B (zh) * | 2020-10-29 | 2022-05-31 | 上海航天科工电器研究院有限公司 | 一种具有不同接触元件的超低矮板间射频同轴电连接器 |
WO2024053638A1 (ja) * | 2022-09-06 | 2024-03-14 | 株式会社ヨコオ | ソケット |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US6203345B1 (en) | 1999-11-09 | 2001-03-20 | Hon Hai Precision Ind. Co., Ltd. | Flexible circuit connector |
JP2001099889A (ja) * | 1999-09-29 | 2001-04-13 | Yokowo Co Ltd | 高周波回路の検査装置 |
JP2004170182A (ja) * | 2002-11-19 | 2004-06-17 | Yokowo Co Ltd | 高周波・高速用デバイスの検査治具およびコンタクトプローブ |
JP2004325306A (ja) * | 2003-04-25 | 2004-11-18 | Yokowo Co Ltd | 検査用同軸プローブおよびそれを用いた検査ユニット |
US6882168B2 (en) | 1997-04-08 | 2005-04-19 | Celadon Systems, Inc. | Probe tile for probing semiconductor wafer |
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JPH0333014Y2 (ko) * | 1984-11-30 | 1991-07-12 | ||
JP2539453B2 (ja) * | 1987-09-11 | 1996-10-02 | 株式会社日立製作所 | 半導体素子検査装置 |
JPH0628765U (ja) * | 1992-09-18 | 1994-04-15 | 安藤電気株式会社 | Icテスタ用接続リング |
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2004
- 2004-09-30 JP JP2004288231A patent/JP4535828B2/ja active Active
-
2005
- 2005-09-29 US US11/238,054 patent/US7126362B2/en active Active
- 2005-09-30 TW TW094134152A patent/TWI293122B/zh active
- 2005-09-30 MY MYPI20054623A patent/MY134463A/en unknown
- 2005-09-30 KR KR1020050092560A patent/KR100833637B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US6882168B2 (en) | 1997-04-08 | 2005-04-19 | Celadon Systems, Inc. | Probe tile for probing semiconductor wafer |
JP2001099889A (ja) * | 1999-09-29 | 2001-04-13 | Yokowo Co Ltd | 高周波回路の検査装置 |
US6203345B1 (en) | 1999-11-09 | 2001-03-20 | Hon Hai Precision Ind. Co., Ltd. | Flexible circuit connector |
JP2004170182A (ja) * | 2002-11-19 | 2004-06-17 | Yokowo Co Ltd | 高周波・高速用デバイスの検査治具およびコンタクトプローブ |
JP2004325306A (ja) * | 2003-04-25 | 2004-11-18 | Yokowo Co Ltd | 検査用同軸プローブおよびそれを用いた検査ユニット |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102315536B1 (ko) | 2021-08-31 | 2021-10-21 | 하병호 | 검사소켓 및 그 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
US20060066331A1 (en) | 2006-03-30 |
TW200612102A (en) | 2006-04-16 |
JP4535828B2 (ja) | 2010-09-01 |
KR20060051978A (ko) | 2006-05-19 |
TWI293122B (en) | 2008-02-01 |
US7126362B2 (en) | 2006-10-24 |
MY134463A (en) | 2007-12-31 |
JP2006098376A (ja) | 2006-04-13 |
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