KR100811390B1 - 가열 유닛 - Google Patents

가열 유닛 Download PDF

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Publication number
KR100811390B1
KR100811390B1 KR1020040071735A KR20040071735A KR100811390B1 KR 100811390 B1 KR100811390 B1 KR 100811390B1 KR 1020040071735 A KR1020040071735 A KR 1020040071735A KR 20040071735 A KR20040071735 A KR 20040071735A KR 100811390 B1 KR100811390 B1 KR 100811390B1
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KR
South Korea
Prior art keywords
heat transfer
heat
plate
heating unit
holder
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Expired - Fee Related
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KR1020040071735A
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English (en)
Korean (ko)
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KR20050039545A (ko
Inventor
미즈카와요우이치
미야우치고우지
Original Assignee
우시오덴키 가부시키가이샤
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Publication of KR20050039545A publication Critical patent/KR20050039545A/ko
Application granted granted Critical
Publication of KR100811390B1 publication Critical patent/KR100811390B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Resistance Heating (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020040071735A 2003-10-24 2004-09-08 가열 유닛 Expired - Fee Related KR100811390B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003364398A JP4321213B2 (ja) 2003-10-24 2003-10-24 加熱ユニット
JPJP-P-2003-00364398 2003-10-24

Publications (2)

Publication Number Publication Date
KR20050039545A KR20050039545A (ko) 2005-04-29
KR100811390B1 true KR100811390B1 (ko) 2008-03-10

Family

ID=34510108

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040071735A Expired - Fee Related KR100811390B1 (ko) 2003-10-24 2004-09-08 가열 유닛

Country Status (5)

Country Link
US (1) US7218847B2 (https=)
JP (1) JP4321213B2 (https=)
KR (1) KR100811390B1 (https=)
CN (1) CN1610081A (https=)
TW (1) TW200515482A (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
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US7695564B1 (en) * 2005-02-03 2010-04-13 Hrl Laboratories, Llc Thermal management substrate
JP4852852B2 (ja) * 2005-02-17 2012-01-11 ウシオ電機株式会社 加熱ユニット
KR100684584B1 (ko) 2005-07-15 2007-02-22 주식회사 아트라스비엑스 합성수지체 접합용 융착기의 열판
JP2007115926A (ja) * 2005-10-20 2007-05-10 Tokyo Univ Of Agriculture & Technology サーマルヘッドおよび熱処理装置
US7804148B2 (en) * 2006-02-16 2010-09-28 International Business Machines Corporation Opto-thermal mask including aligned thermal dissipative layer, reflective layer and transparent capping layer
TWI290777B (en) * 2006-02-27 2007-12-01 Guei-Fang Chen Lighting device with light emitting diode
US8691017B2 (en) * 2008-04-11 2014-04-08 National University Corporation Tohoku University Heat equalizer and organic film forming apparatus
JP4840437B2 (ja) * 2008-12-03 2011-12-21 東京エレクトロン株式会社 基板加熱装置、基板加熱方法及び記憶媒体
CN103088288A (zh) * 2011-11-03 2013-05-08 北京北方微电子基地设备工艺研究中心有限责任公司 基片处理设备及其腔室装置
CN103374698A (zh) * 2012-04-23 2013-10-30 北京北方微电子基地设备工艺研究中心有限责任公司 加热腔室以及等离子体加工设备
US9842753B2 (en) * 2013-04-26 2017-12-12 Applied Materials, Inc. Absorbing lamphead face
CN104333922B (zh) * 2014-11-21 2016-01-20 连云港市盛昌照明电器有限公司 一种石英玻璃加热管及其制备方法和热水器
CN106898567B (zh) * 2015-12-17 2020-03-31 北京北方华创微电子装备有限公司 一种透明介质窗、基片处理腔室和基片处理系统
US10495369B2 (en) * 2016-12-02 2019-12-03 Bsh Hausgeraete Gmbh Refrigeration device comprising a fan with an heat-conducting element
US20230338993A1 (en) * 2022-04-22 2023-10-26 Semes Co., Ltd. Apparatus for heating chemical liquid and system for treating substrate including the same
KR102906176B1 (ko) * 2023-11-20 2026-01-02 피에스케이홀딩스 (주) 레이저 기반 척 히팅 장치 및 척 히팅 방법
KR102827380B1 (ko) * 2024-04-25 2025-07-01 피에스케이홀딩스 (주) 레이저 기반 척 히팅 장치 및 이를 포함하는 기판 처리 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR880010622A (ko) * 1987-02-07 1988-10-10 원본미기재 열권선이나 할로겐램프로 과열되는 유리세라믹 평판인, 한 물질의 온도조절장치
JPH1070313A (ja) 1996-08-27 1998-03-10 Toshiba Corp 気相成長用基板及びその加熱方法
KR100315605B1 (ko) 1993-10-15 2002-02-19 윌리엄 비. 켐플러 고양된 온도에서의 반도체 소자의 급속테스팅장치및방법

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DE144656C (https=) *
US535321A (en) * 1895-03-05 delany
US2601011A (en) * 1948-09-21 1952-06-17 Westinghouse Electric Corp Heating apparatus
US3395631A (en) * 1965-06-24 1968-08-06 Gaf Corp Thermal developing apparatus
US3798415A (en) * 1972-08-25 1974-03-19 Graham Corp M Electrically heated cooking utensil
GB2137060A (en) * 1983-03-25 1984-09-26 Gen Electric Radiant-Energy Heating and/or Cooking Apparatus
JPS60145629A (ja) * 1984-01-10 1985-08-01 Nec Corp 熱処理法
JPS61219130A (ja) * 1985-03-25 1986-09-29 Toshiba Mach Co Ltd 気相成長装置
JPS6363773A (ja) * 1986-09-04 1988-03-22 Nippon Telegr & Teleph Corp <Ntt> 接着方法
JPS63257221A (ja) * 1987-04-14 1988-10-25 Nec Corp ランプアニ−ル装置
FR2621772A1 (fr) * 1987-07-10 1989-04-14 Huber Kurt Dispositif de chauffage electrique transformant l'energie lumineuse en energie calorifique
JP2927877B2 (ja) * 1990-04-09 1999-07-28 エム・セテック株式会社 半導体製造装置の均一加熱構造
JPH0576699A (ja) * 1991-01-08 1993-03-30 Matsushita Electric Ind Co Ltd アイロン
JPH04275417A (ja) * 1991-03-04 1992-10-01 Nec Corp 熱処理装置
US5220155A (en) * 1992-03-12 1993-06-15 Emerson Electric Co. Heating and sensing apparatus for range top
JP3046446B2 (ja) 1992-03-17 2000-05-29 三菱電機株式会社 半導体製造装置
JPH06132233A (ja) 1992-10-20 1994-05-13 Nippon Sanso Kk 薄膜製造装置用加熱装置の均熱板
JPH06260422A (ja) 1993-03-08 1994-09-16 Kokusai Electric Co Ltd ガラス基板加熱方法及びその装置
JPH07172996A (ja) 1993-12-20 1995-07-11 Matsushita Electric Ind Co Ltd 誘電体薄膜の製造方法及びその製造装置
JP3578872B2 (ja) * 1995-10-26 2004-10-20 三菱電機株式会社 Ｘ線マスクの製造方法および加熱装置
JPH10321547A (ja) 1997-05-22 1998-12-04 Kokusai Electric Co Ltd 熱処理装置
JP2000321907A (ja) * 1999-05-17 2000-11-24 Konica Corp 定着装置
US6345169B1 (en) * 1999-07-01 2002-02-05 Konica Corporation Fixing apparatus with heat ray generating device
JP2001027860A (ja) * 1999-07-13 2001-01-30 Konica Corp 定着装置
SE515785C2 (sv) * 2000-02-23 2001-10-08 Obducat Ab Anordning för homogen värmning av ett objekt och användning av anordningen
JP2001332607A (ja) 2000-05-25 2001-11-30 Canon Inc 基板加熱装置および均熱板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR880010622A (ko) * 1987-02-07 1988-10-10 원본미기재 열권선이나 할로겐램프로 과열되는 유리세라믹 평판인, 한 물질의 온도조절장치
KR100315605B1 (ko) 1993-10-15 2002-02-19 윌리엄 비. 켐플러 고양된 온도에서의 반도체 소자의 급속테스팅장치및방법
JPH1070313A (ja) 1996-08-27 1998-03-10 Toshiba Corp 気相成長用基板及びその加熱方法

Also Published As

Publication number Publication date
JP2005129385A (ja) 2005-05-19
CN1610081A (zh) 2005-04-27
US20050089317A1 (en) 2005-04-28
TWI313487B (https=) 2009-08-11
JP4321213B2 (ja) 2009-08-26
US7218847B2 (en) 2007-05-15
KR20050039545A (ko) 2005-04-29
TW200515482A (en) 2005-05-01

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