KR100794649B1 - 로드락 챔버 - Google Patents
로드락 챔버 Download PDFInfo
- Publication number
- KR100794649B1 KR100794649B1 KR1020060019994A KR20060019994A KR100794649B1 KR 100794649 B1 KR100794649 B1 KR 100794649B1 KR 1020060019994 A KR1020060019994 A KR 1020060019994A KR 20060019994 A KR20060019994 A KR 20060019994A KR 100794649 B1 KR100794649 B1 KR 100794649B1
- Authority
- KR
- South Korea
- Prior art keywords
- lock chamber
- loading
- load lock
- bottom plate
- main body
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000002826 coolant Substances 0.000 claims abstract description 6
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 abstract description 24
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 239000010409 thin film Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (5)
- 본체와 덮개를 포함하는 로드락 챔버에 있어서,상기 본체의 저판에는 기판을 적재할 수 있는 적재부가 일체형성되며, 상기 적재부는 상기 기판을 적재하기 위한 적재면과, 반송로봇의 암이 진입할 수 있는 진입면으로 이루어지되,상기 본체의 저판 또는 덮개의 두께방향으로는 냉매유로가 일체형성되며, 상기 로드락 챔버는 다층구조로 상기 본체를 상하로 적어도 2개 이상 적층한 후, 최상부에 위치하는 본체의 상면에 상기 덮개를 결합하는 것을 특징으로 하는 로드락 챔버.
- 삭제
- 삭제
- 삭제
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060019994A KR100794649B1 (ko) | 2006-03-02 | 2006-03-02 | 로드락 챔버 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060019994A KR100794649B1 (ko) | 2006-03-02 | 2006-03-02 | 로드락 챔버 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070090366A KR20070090366A (ko) | 2007-09-06 |
KR100794649B1 true KR100794649B1 (ko) | 2008-01-14 |
Family
ID=38688775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060019994A KR100794649B1 (ko) | 2006-03-02 | 2006-03-02 | 로드락 챔버 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100794649B1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101032272B1 (ko) * | 2008-12-31 | 2011-05-06 | 주식회사 테스 | 로드락 챔버 및 이를 이용한 기판 처리 방법 |
CN104099613B (zh) * | 2013-04-03 | 2017-02-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 反应腔室及等离子体加工设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100312046B1 (ko) | 1996-04-30 | 2003-11-28 | 어플라이드 머티어리얼스, 인코포레이티드 | 2개이상의웨이퍼를동시에처리하기위한멀티데크식웨이퍼처리시스템및방법 |
KR20050037964A (ko) * | 2003-10-20 | 2005-04-25 | 어플라이드 머티어리얼스, 인코포레이티드 | 대면적 기판 처리 시스템용 로드락 챔버 |
KR20050081426A (ko) * | 2004-02-13 | 2005-08-19 | 주식회사 에이디피엔지니어링 | 평판표시소자 제조장치 |
-
2006
- 2006-03-02 KR KR1020060019994A patent/KR100794649B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100312046B1 (ko) | 1996-04-30 | 2003-11-28 | 어플라이드 머티어리얼스, 인코포레이티드 | 2개이상의웨이퍼를동시에처리하기위한멀티데크식웨이퍼처리시스템및방법 |
KR20050037964A (ko) * | 2003-10-20 | 2005-04-25 | 어플라이드 머티어리얼스, 인코포레이티드 | 대면적 기판 처리 시스템용 로드락 챔버 |
KR20050081426A (ko) * | 2004-02-13 | 2005-08-19 | 주식회사 에이디피엔지니어링 | 평판표시소자 제조장치 |
Also Published As
Publication number | Publication date |
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KR20070090366A (ko) | 2007-09-06 |
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