KR100787721B1 - Dicing die bond film suitable for processing of thin wafer - Google Patents

Abstract

A dicing die bond film suitable for processing a thin film wafer is provided to remove a chip flying effect by increasing fixing force to a ring frame. A dicing die bond film includes a supporting base layer, an adhesive layer, and a fixing adhesive layer. The adhesive layer includes a lower adhesive layer(32) and an upper adhesive layer(22). The lower adhesive layer is laminated on the supporting base layer. The upper adhesive layer is laminated on the lower adhesive layer. The peel strength between the lower adhesive layer and the ring frame is 0.007N/mm to 1.000N/mm. The peel strength between the upper adhesive and the fixing adhesive layer is 0.002N/mm to 0.020N/mm after the peel strength. Further, the upper adhesive layer contains 30-90 wt.% of acryl copolymer, 10-70 wt.% of acryl compound and 0.1-10 wt.% of photoinitiator based on 100 wt.% of the upper adhesive layer.

Description

Dicing die bond film suitable for processing thin film wafers {DICING DIE BOND FILM SUITABLE FOR PROCESSING OF THIN WAFER}

1 is a cross-sectional schematic diagram of a conventional dicing die bond film.

2 is a cross-sectional schematic diagram of a dicing die bond film of the present invention.

3 is a cross-sectional schematic view of a film to which a ring frame and a wafer are adhered.

* Description of the symbols for the main parts of the drawings

      DESCRIPTION OF SYMBOLS 1 Conventional dicing die film 2 Adhesive layer for fixing 3 Adhesive layer

      4: support base layer 12: fixing adhesive layer 22: upper adhesive layer

      31 support substrate layer 32 lower adhesive layer 100 wafer

      110: ring frame

The present invention relates to a dicing die bond film suitable for thin film wafer processing including a support base layer, an adhesive layer, and a fixing adhesive, and more particularly, the adhesive layer includes a lower adhesive layer and an upper adhesive layer. The present invention relates to a dicing die bond film suitable for thin film wafer processing without chip flying and excellent pick-up property.

In the manufacture of a conventional semiconductor device, a silicon wafer of large diameter is fixed with a dicing tape and diced to cut it into a semiconductor chip, and then the chip is peeled off and taken out from the dicing tape and placed on a semiconductor package substrate such as a lead frame. The curable liquid adhesive was prepared by adhesive fixing.

Recently, due to the simplification of the process and contamination of the semiconductor parts due to the flow component of the liquid adhesive, a dicing die bond sheet composed of an adhesive sheet having an adhesive layer of the dicing tape and a die bonding agent has been required.

That is, in the thin film wafer dicing process, the adhesion between the adhesive layer and the fixing adhesive layer is excellent, so that the wafer can be fixed well to the ring frame, and at the time of die bonding, the adhesion between the adhesive layer and the fixing adhesive layer is low. It is necessary to provide a film in which the adhesive layer and the adhesive layer are integrated in which peeling occurs at the interface between the two layers so that pick-up is not a problem.

As shown in Fig. 1, the adhesive layer 3 and the wafer fixing adhesive layer 2 are sequentially stacked on the support base layer 4, and the chip is picked up at the time of pick-up for die bonding. Dicing die bond films which can be peeled off from the pressure-sensitive adhesive layer simultaneously with the fixing adhesive layer have been introduced by many companies.

In this method, since the dicing tape and the fixing adhesive layer are integrated, the process is simplified compared with the conventional dicing tape and the liquid paste.

However, as electronic products become thin and short, the thickness of the wafer becomes thinner and the size of the chip increases, so it is not easy to separate the adhesive layer and the fixing adhesive layer during pick-up. It is happening.

In order to solve the above problem, a method of improving pickup by inserting a substrate layer between the adhesive layer and the fixing adhesive layer has been introduced, but there is a problem in that the peeling force must be adjusted through the adhesive layer of the adhesive layer.

In addition, when the adhesiveness of the adhesive layer is lowered to lower the peeling force between the adhesive layer and the fixing adhesive layer, the adhesive force of the adhesive layer to the ring frame fixing the wafer is lowered, so that the ring of the wafer in the dicing process or cleaning fixation after dicing is performed. There is a problem with fixing to the frame.

The present invention is to overcome the above-mentioned problems of the prior art, an object of the present invention is to easily pick up with the adhesive layer for fixing in the die-bonding process and the lower adhesive layer having a sufficient adhesive force for fixing the wafer to the ring frame It is to provide a dicing die-bonding film excellent in wafer processing processability, including at least two or more adhesive layers such as an upper adhesive layer having a low adhesive strength.

Aspects of the present invention for achieving the above object

A dicing die bond film comprising a support base layer, an adhesive layer, and a fixing adhesive, wherein the adhesive layer includes a lower adhesive layer and an upper adhesive layer, so that dicing is excellent in pick-up property without chip flying. It relates to a die bond film.

In the present invention, the peel strength between the lower adhesive layer and the ring frame (Peel strength) is 0.007N / mm to 1.000 N / mm, the peel strength between the upper adhesive layer and the fixing adhesive layer (Peel strength) is UV curing It is preferable that the after 0.001 N / mm to 0.020 N / mm.

In addition, in the dicing die bond film of the present invention, the upper adhesive layer is

Based on 100 parts by weight of solids

30 to 90 parts by weight of the acrylic copolymer;

10 to 70 parts by weight of an acrylic compound having an unsaturated bond; And

It may be formed of a composition comprising 0.1 to 10 parts by weight of the photoinitiator.

The acrylic copolymer used in the upper adhesive layer is preferably a glass transition temperature of -30 ℃ or more.

The acrylic compound having an unsaturated bond may be any one selected from the group consisting of urethane-based acrylic resins, epoxy acrylic resins, polyester acrylic resins, and polyether acrylic resins.

The support base layer is any one selected from the group consisting of polypropylene, polyethylene, polyester, polycarbonate, ethylene-vinyl acetate copolymer, ethylene-propylene copolymer, ethylene-ethyl acrylate copolymer and polyvinyl chloride Can be.

The upper adhesive layer and the lower adhesive layer may further include at least one of a curing agent and inorganic particles in addition to the above-described components.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

The dicing die bond film of the present invention is characterized in that the pressure-sensitive adhesive layer includes a lower pressure-sensitive adhesive layer laminated on the support base material layer and an upper pressure-sensitive adhesive layer laminated on the lower pressure-sensitive adhesive layer.

2 is a cross-sectional schematic diagram of a dicing die bond film according to the present invention. As shown in FIG. 2, the dicing die film of the present invention includes a support base layer 31, a lower adhesive layer 32, an upper adhesive layer 22, and a fixing adhesive layer 12.

In the present invention, the adhesive layer includes two or more layers such as upper and lower adhesive layers 32 having different adhesive strengths, and the lower adhesive layers 32 are stacked on the support base layer 31, and the upper adhesive layers 22 are lower. The adhesive layer 32 may be sequentially stacked.

The lower adhesive layer 32 has sufficient adhesive force necessary to fix the wafer to the ring frame, and the upper adhesive layer 22 has a low adhesive force to be easily picked up with the fixing adhesive layer 12 in the die bonding process. Have

In particular, in order to easily pick up the upper adhesive layer 22 adjacent to the fixing adhesive layer 12 in the die bonding process, the peel force between the fixing adhesive 12 and the upper adhesive layer 22 is 0.020 after UV curing. N / mm or less, and in order to keep the wafer fixed to the ring frame in the dicing process, the peel force between the ring frame and the lower adhesive layer 32 is preferably 0.007 N / mm or more.

More preferably, the peeling force between the fixing adhesive 12 and the upper adhesive layer 22 is 0.002 N / mm to 0.020 N / mm after UV curing, and peeling between the ring frame 110 and the lower adhesive layer 32. The force is in the case of 0.007 N / mm to 1.000 N / mm.

If the peel strength between the ring frame 110 and the lower adhesive layer 32 is less than 0.007 N / mm, chip flying may occur. If the peel strength exceeds 1.000 N / mm, the lower adhesive layer is removed from the ring frame. Problems may arise that are not easy to do and cause residue.

If the peel strength between the fixing adhesive 12 and the upper adhesive layer 22 is greater than 0.020 N / mm, the pick-up success rate may be significantly reduced, and if it is less than 0.002 N / mm, chip flying Problems may arise.

The composition of the lower pressure-sensitive adhesive layer 32 is a general pressure-sensitive adhesive composition that satisfies that the peel force between the ring frame and the lower pressure-sensitive adhesive layer 32 is 0.007 N / mm or more in order to maintain sufficient adhesion to fix the wafer to the ring frame. It does not have any limitation.

The composition forming the upper adhesive layer 22 of the present invention includes an acrylic copolymer, an acrylic compound having an unsaturated bond, and a photoinitiator. It is preferable that the said acrylic copolymer is 100,000 or more of weight average molecular weight, Preferably it is suitable that it is the range of 150,000-700,000. If the weight average molecular weight of the acrylic copolymer is less than 100,000 may cause a problem that the coating property is lowered and the physical properties do not appear uniformly.

As a monomer of an acryl copolymer, acrylic acid alkyl ester, methacrylic acid alkyl ester, etc. whose carbon number of an alkyl group is less than 15 are used preferably. Moreover, carboxylic acid containing unsaturated compounds, such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, 2-hydroxy ethyl (meth) acrylate, 2-hydroxy propyl (meth) acrylate, N-metholol ( Meta) acrylamide, meta aryl sulfonic acid, N-vinyl pyrrolidone, vinyl propionate, vinyl acetate, styrene and the like can be used.

The upper adhesive layer 22 includes an acrylic copolymer of 30 to 90 parts by weight based on 100 solids. Since the upper adhesive layer 22 should have a low adhesive force that is easily picked up with the fixing adhesive layer 12, the lower adhesive layer 32 includes a somewhat less weight part based on the solid content of the acrylic copolymer than the lower adhesive layer 32. In particular, since the upper adhesive layer requires a low adhesive force with a fixing adhesive layer by UV curing, the acrylic compound having an unsaturated bond contains a higher weight part than the lower adhesive layer. Therefore, the upper pressure-sensitive adhesive layer includes a lower content of acrylic copolymer with respect to the lower pressure-sensitive adhesive layer.

If the acrylic copolymer is less than 30 parts by weight based on the solid content, there is a problem in the coating property and the adhesion with the support base layer, if more than 90 parts by weight may cause a problem that hardly the effect of UV curing.

On the other hand, the glass transition temperature of the acrylic copolymer used in the lower adhesive layer 32 of the present invention is less than -30 ℃, the glass transition temperature of the acrylic copolymer used in the upper adhesive layer 22 should be -30 ℃ or more. do. More preferably, the glass transition temperature of the acrylic copolymer used for the lower pressure-sensitive adhesive layer 32 is -70 ° C to -30 ° C, and the glass transition temperature of the acrylic copolymer used for the upper pressure-sensitive adhesive layer 22 is -30 ° C. To 50 ° C.

That is, in the case of the upper adhesive layer adjacent to the fixing adhesive layer, it is preferable that the glass transition temperature of the acrylic copolymer is -30 ° C or higher. Can be.

In addition, in the case of the lower adhesive layer 32, it is preferable to use an acrylic copolymer having a glass transition temperature of less than -30 ° C. For this reason, in the case of the lower adhesive layer, the support base layer 31 and the ring frame for wafer fixing are used. Initial adhesive force is important for increasing the adhesive strength with the glass, and when the glass transition temperature is -30 ° C or higher, since the adhesive force with the support base layer 31 or the ring frame for fixing the wafer is low, the dicing process or the post-dicing cleaning process This is because the lower adhesive layer 32 and the support base layer 31 or the ring fixing ring frame may cause a problem.

The acrylic compound having an unsaturated bond is preferably an acrylic resin having two or more unsaturated bonds in at least one molecule, unless it is a special case. It is more preferable to use urethane type acrylic resin. Epoxy acrylic resins, polyester acrylic resins, polyether acrylic resins and the like can also be used.

The weight average molecular weight of the urethane-based acrylic resin can be used in the range of about 500 to 10,000, more preferably about 1,000 to 4,000. This is because if the weight average molecular weight is less than 500, transfer to another layer may occur, and if the weight average molecular weight exceeds 10,000, there is a problem of low curing shrinkage. In particular, in the case of the upper pressure-sensitive adhesive adjacent to the fixing adhesive, when the urethane-based acrylic resin having a weight average molecular weight of more than 10,000 is used, since the curing shrinkage rate is low even after UV curing, high surface stickiness may cause problems during pickup.

Moreover, as an acrylic compound which has an unsaturated bond, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 2-hydroxy-3- acro Hydroxy propyl (meth) acrylate 1-hydroxybutyl (meth) acrylate, polycaprolactone polyol mono (meth) acrylate, 2-hydroxy-3-phenyloxypropyl (meth) acrylate, 2-hydroxy 3-phenoxy propyl acrylate, glycidyl (meth) acrylate, (2-methacryloyloxyethylhexahydro phthalate, 2-methacryloyloxyethyl succinic acid ester, neopentylglycol mono (meth) acrylate 1,6-hexanediol mono (meth) acrylate, pentaerythritol penta (meth) acrylate, dipentaerythritolpenta (meth) acrylate (Dipentaerythritolpenta (meth) acrylate), glycerin di (meth) Acrylate, tetrahydrofurfuryl (meth) acrylate, isodecyl (meth) acrylate, 2- (2-ethoxyethoxy) ethyl (meth) acrylic Laterate, stearyl (meth) acrylate, lauryl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, isobornyl (meth) acrylate, tridecyl (meth) acrylate, ethoxy addition type nonylphenol (Meth) acrylate (ethoxylated nonylphenolacrylate), ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, Polyethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,3-butylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, ethoxy addition type bisphenol -( Ta) acrylate, cyclohexanedimethanol di (meth) acrylate, phenoxytetraethylene glycol (meth) acrylate, 2-methacryloyloxyethyl phosphate, 2-methacryloyloxyethyl phosphate, dimethylol tri Cyclodecane di (meth) acrylate, dipentaerythritol hexaacrylate, and the like.

The upper adhesive layer 22 preferably contains an acrylic compound having an unsaturated bond of 10 to 70 parts by weight based on 100 solids.

Since the upper adhesive layer 22 should have a low adhesive force in order to easily pick up with the fixing adhesive layer 12 after UV curing, the acrylic compound having an unsaturated bond compared to the lower adhesive layer 32 is based on an acrylic copolymer. It will contain a somewhat higher content. The lower pressure-sensitive adhesive layer has a smaller content of an acrylic compound having an unsaturated bond than the upper pressure-sensitive adhesive layer, since the adhesive force with the upper pressure-sensitive adhesive layer should be high even after UV curing and have little effect of UV curing.

In the case of the upper adhesive layer, when the acrylic compound having an unsaturated bond is less than 10 parts by weight based on 100 parts by weight of solid, the shrinkage rate after UV curing is low, which may cause a problem in pick-up due to high peeling force with the adhesive. This is because shrinkage is too high, which can also cause problems when picking up.

Photoinitiators in the present invention are benzophenone, benzoin , isopropyl benzoin ether, isobutyl benzoin ether, 2-ethyl anthraquinone, chloro anthraquinone, chloro thioxanthone, dodecyl thioxanthone, 2,4-dimethyl Thioxanthone, isopropyl thioxanthone, benzyl dimethyl ketal, hydroxy cyclohexyl phenyl ketone, hydroxy dimethyl acetophenone, 2-methyl-1 [4- (methylthio) phenyl] -2-morpholin-1-one , 4-benzoyl-4'-methyldiphenyl sulfide, 4-methyl benzophenone, 4-phenyl benzophenone, 2,4,6-trimethylbenzoyl diphenyl phosphine and the like.

In addition, a photoinitiator may be used for a smooth photoinitiation reaction. As the photoinitiator, ethyl-4-dimethylamino benzoate, 2-ethylnucleosil 4-dimethylamino benzoate and the like can be used.

Photoinitiator or photoinitiator may be used in the range of 0.1 to 10 parts by weight based on 100 solids. In particular, it is preferable to use in the range of 0.5-5 weight part.

The composition forming the upper adhesive layer 22 and the lower adhesive layer 32 of the present invention may further include one or more of a curing agent and inorganic particles in addition to the above-described components.

As said hardening | curing agent, the epoxy resin produced | generated by reaction of bisphenol A and epichlorohydrin, the epoxy resin produced | generated by reaction of a phenol resin and epichlorohydrin, ethylene glycol diglycidyl ether, glycerin triglycidyl Epoxy-based compounds such as ether, 1,6-nucleodiol diglycidyl ether, trimetholpropane triglycidyl ether, polyglycerol polyglycidyl ether, and melamine such as hexamethoxy methyl melamine and hexaethoxy methyl melamine System compounds, 2,4-trilene diisocyanate, 2,6-trilene diisocyanate, diphenyl methane 4,4'- diisocyanate. Isocyanate compounds such as 1,3-xylene diisocyanate, 1,4-xylene diisocyanate, 1,3-bis isocyanomethyl cyclohexane, tetramethyl xylene diisocyanate, and 1,5-naphthalene diisocyanate. It can select and use from an epoxy type compound or an isocyanate type compound according to this.

Inorganic particles usable in the present invention include aluminum hydroxide, zinc oxide, barium lactate, talc, titanium oxide, magnesium hydroxide, calcium carbonate, boron nitride, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, Crystalline silica, amorphous silica, etc. are mentioned, The shape of an inorganic particle is not specifically limited. These inorganic particles can be used alone or in combination of two or more thereof.

The support base layer 31 of the present invention is selected from the group consisting of polypropylene, polyethylene, polyester, polycarbonate, ethylene-vinyl acetate copolymer, ethylene-propylene copolymer, ethylene-ethyl acrylate copolymer and polyvinyl chloride Will be.

Although the thickness of the support base material layer 31 is 50-150 micrometers, it is not specifically limited.

The fixing adhesive layer 12 of this invention is generally comprised from a binder polymer, an epoxy resin, an epoxy hardening | curing agent, etc.

It is not specifically defined as a binder polymer, It is possible if it can reduce generation | occurrence | production of a crack. Generally, imide resins, nitrile butadiene rubbers, styrene butadiene rubbers, acrylic copolymers, urethane rubbers and the like can be used. In particular, an imide resin or an acrylic copolymer can be preferably used.

An epoxy resin is not specifically defined and can be used if it contains an epoxy group in a molecule | numerator. In particular, in view of reliability, an aromatic compound is preferable, and a compound having two or more epoxy groups in a molecule is preferable.

Generally as an epoxy hardening | curing agent, the compound etc. which have an amine, a polyamide, an acid anhydride, boron fluoride, a phenolic hydroxyl group are preferable. Especially in this invention, bisphenol-type resins, such as bisphenol A, bisphenol F, bisphenol S, and phenol resins, such as a phenol novolak and a cresol novolak, are preferable.

Dicing die bond film of the present invention by coating and drying each layer on the substrate layer to obtain a coating film and finally through the lamination process the support substrate layer 31, the lower adhesive layer 32, the upper adhesive layer 22 ) And four layers of the fixing adhesive layer 12.

The dicing die bond film consisting of four layers of the support base material layer 31, the lower adhesion layer 32, the upper adhesion layer 22, and the adhesive layer using the two adhesion layers of which adhesive strength was changed as mentioned above is die In the cleaning process after the dicing process and the dicing fixing, the adhesion of the film to the ring frame is excellent to fix the wafer without shaking, and in the die bonding process, the picking-up success rate is excellent because of the low adhesive strength with the fixing adhesive during pickup.

 Hereinafter, the present invention will be described in more detail with reference to Examples. These examples are for illustrative purposes only and are not intended to limit the protection scope of the present invention.

[Acrylic copolymer synthesis example 1]

After installing the cooler in a reflux flask, 78 parts by weight of 2-ethyl nucleus acrylate, 6 parts by weight of ethyl acrylate, 6 parts by weight of vinyl acetate monomer, 5 parts by weight of acrylic acid, and 5 parts by weight of 2-hydroxy ethyl methacrylate Into the flask, 0.1 parts by weight of azobis isobutyronitrile as a polymerization initiator and 90 parts by weight of ethyl acetate were added to the polymerization solvent, followed by reaction for 5 hours at the reflux temperature of ethyl acetate. Again, 0.1 parts by weight of azobis isobutyronitrile was dissolved in 10 parts by weight of toluene, and then added to the flask, followed by 3 hours of reaction at reflux. In this case, the weight average molecular weight of the synthesized resin was measured through glass scanning temperature and gel chromatography (GPC) through a differential scanning calorimeter (DSC). The weight average molecular weight of the synthesized resin was 400,000, and the glass transition temperature was -50 ° C.

[Acryl Copolymer Synthesis Example 2]

After installing the cooler in the reflux flask, 23 parts by weight of methyl methacrylate, 39 parts by weight of 2-ethyl nucleus acrylate, 6 parts by weight of ethyl acrylate, 12 parts by weight of vinyl acetate monomer, 12 parts by weight of acrylic acid, 2-hydride 8 parts by weight of oxyethyl methacrylate was added to the flask, 0.1 parts by weight of azobis isobutyronitrile as a polymerization initiator and 90 parts by weight of ethyl acetate were added as a polymerization solvent, followed by reaction at an reflux temperature of ethyl acetate for 5 hours. It was. Again, 0.1 parts by weight of azobis isobutyronitrile was dissolved in 10 parts by weight of toluene, and then added to the flask, followed by 3 hours of reaction at reflux. In this case, the weight average molecular weight of the synthesized resin was measured through glass scanning temperature and gel chromatography (GPC) through a differential scanning calorimeter (DSC). The weight average molecular weight of the synthesized resin was 600,000, and the glass transition temperature was -20 ° C.

[Acryl Copolymer Synthesis Example 3]

After installing the cooler in a reflux flask, 23 parts by weight of methyl methacrylate, 39 parts by weight of 2-ethyl nucleus acrylate, 11 parts by weight of ethyl acrylate, 12 parts by weight of vinyl acetate monomer, and 15 parts by weight of acrylic acid were placed in the flask. 0.1 weight part of azobis isobutyronitrile as a polymerization initiator and 90 weight part of ethyl acetate as a polymerization solvent were added, and it reacted at the reflux temperature of ethyl acetate for 5 hours. Again, 0.1 parts by weight of azobis isobutyronitrile was dissolved in 10 parts by weight of toluene, and then added to the flask, followed by 3 hours of reaction at reflux. In this case, the weight average molecular weight of the synthesized resin was measured through glass scanning temperature and gel chromatography (GPC) through a differential scanning calorimeter (DSC). The weight average molecular weight of the synthesized resin was 500,000, and the glass transition temperature was -15 ° C.

[Production Example 1]

11 parts by weight of naphthol-type epoxy resin [manufactured by NIPPON KAYAKU, NC-7300L], cresol novolac resin [manufactured by MEIWA Plastics, MEH- 7800 4S] 11 parts by weight, 0.3 parts by weight of 2-phenyl 4-methyl imidazole as a curing accelerator, and 2 parts by weight of γ-glycidoxy propyl trimethoxy silane [manufactured by CHISSO Chemical, S-510], silica [manufactured by DEGUSSA , R-972] was added 12 parts by weight. Methyl ethyl ketone was added thereto so that the total solid content was 30% by weight, followed by stirring for 1 hour. The stirred composition was evenly dispersed using a bead mill. The dispersed composition was coated on a 38-micron-thick polyethylene terephthalate film and dried at 80 ° C. for 10 minutes to obtain a fixing adhesive layer 12 having a thickness of 20 microns.

[Production Example 2]

Ethyl acetate was added to the acrylic copolymer synthesized in Synthesis Example 2 so that the solid content was 30% by weight. 40 parts by weight of a 15-functional urethane acrylate [manufactured by SHIN NAKAMURA, U-15HA], cellulose acetate butyrate [manufactured by EASTMAN, CAB-551- to 167 parts by weight of the acrylic copolymer synthesized in Synthesis Example 2 having a solid content of 30% by weight 0.2] 10 parts by weight of isocyanate-containing acrylic copolymer curing agent [Japan Polyurethanes (manufacturer), L-45] 2 parts by weight, 5 parts by weight of epoxy-containing acrylic copolymer curing agent [SOKEN Chemical, 5XM] and 2, 1.5 parts by weight of 2-dimethoxy-1,2-diphenylethane-1-one (2,2-Dimethoxy-1,2-diphenylethane-1-one) [CIBA GEIGY, IRGACURE-651] was added. Ethyl acetate was added thereto so that the total solid content was 30% by weight, followed by stirring for 1 hour. After stirring, the composition was coated on a 38-micron-thick polyethylene terephthalate film and dried to a thickness of 10 microns, and then dried at 80 ° C. for 10 minutes. After drying, the film was transferred to a 100-micron polyolefin film and left at 40 ° C. for 3 days to obtain an upper adhesive layer 22.

[Production Example 3]

Ethyl acetate was added to the acrylic copolymer synthesized in Synthesis Example 3 so that the solid content was 30% by weight. 50 parts by weight of a 6-functional urethane acrylate [SHIN NAKAMURA, U-6HA], an epoxy-containing acrylic copolymer curing agent [SOKEN Chemical Co., 5XM] to 167 parts by weight of the acrylic copolymer synthesized in Synthesis Example 3 having a solid content of 30% by weight ] 2,2-dimethoxy-1,2-diphenylethane-1-one (10,2 parts by weight and photopolymerization initiator) [CIBA GEIGY, IRGACURE-651 ] 1.5 parts by weight was added. Ethyl acetate was added thereto so that the total solid content was 30% by weight, followed by stirring for 1 hour. After stirring, the composition was coated on a 38-micron-thick polyethylene terephthalate film and dried to a thickness of 10 microns, and then dried at 80 ° C. for 10 minutes. After drying, the film was transferred to a 100-micron polyolefin film and left at 40 ° C. for 3 days to obtain an upper adhesive layer 22.

[Production Example 4]

Ethyl acetate was added to the acrylic copolymer synthesized in Synthesis Example 1 so that the solid content was 30% by weight. 30 parts by weight of a 6-functional urethane acrylate [SHIN NAKAMURA, U-6H], an isocyanate-containing acrylic copolymer curing agent [Japan Polyurethane] in 233 parts by weight of the acrylic copolymer synthesized in Synthesis Example 1 having a solid content of 30% by weight 2,2 dimethoxy-1,2-diphenylethane-1-one by 2 parts by weight, 5 parts by weight of an epoxy-containing acrylic copolymer curing agent [SOKEN Chemical, 5XM] and a photopolymerization initiator. 1.5 parts by weight of 2-Dimethoxy-1,2-diphenylethane-1-one) [CIBA GEIGY, IRGACURE-651] was added. Ethyl acetate was added thereto so that the total solid content was 30% by weight, followed by stirring for 1 hour. After stirring, the composition was coated on a 38-micron-thick polyethylene terephthalate film and dried to a thickness of 10 microns, and then dried at 80 ° C. for 10 minutes. After drying, the film was transferred to a 100-micron polyolefin film and left at 40 ° C. for 3 days to obtain a lower pressure-sensitive adhesive layer 32.

Example  One

The fixing adhesive layer 12 coated in [Production Example 1] is cut to fit an 8-inch wafer size. The upper adhesive layer 22 coated in [Production Example 2] was laminated on the fixing adhesive layer 12, cut into the same size as the fixing adhesive layer 12, and then, as a base layer of the upper adhesive layer 22. Remove the used polyolefin film. Again, the lower adhesive layer 32 coated in [Production Example 4] is laminated on the surface of the upper adhesive layer 22. Using the laminated film subjected to the above process, the fixing adhesive layer 12 is placed on the back of the wafer having a thickness of 80 microns, and then a wafer mount process is performed at a pressure of 0.1 MPa at a temperature of 60 ° C. using a ring frame. At this time, the lower adhesive layer 32 is attached to the back of the ring frame. Subsequently, the wafer-mounted wafer is fixed to a dicing apparatus and cut into 10 mm x 10 mm chip sizes at a speed of 100 mm / sec. After irradiating with an exposure dose of 200 mJ / cm 2 from the bottom surface of the wafer through a UV curing machine, the pick-up property was evaluated in a pickup device.

Example  2

The fixing adhesive layer 12 coated in [Production Example 1] is cut to fit an 8-inch wafer size. The upper adhesive layer 22 coated in [Production Example 3] was laminated on the fixing adhesive layer 12 surface, cut to the same size as the fixing adhesive layer 12, and then the base layer of the upper adhesive layer 22. Remove the polyolefin film used. Again, the lower adhesive layer 32 coated in [Production Example 4] is laminated on the surface of the upper adhesive layer 22. Using the laminated film subjected to the above process, the fixing adhesive layer 12 is placed on the back of the wafer having a thickness of 80 microns, and then a wafer mount process is performed at a pressure of 0.1 MPa at a temperature of 60 ° C. using a ring frame. At this time, the lower adhesive layer (C) is bonded to the back of the ring frame. Subsequently, the wafer-mounted wafer is fixed to a dicing apparatus and cut into 10 mm x 10 mm chip sizes at a speed of 100 mm / sec. After irradiating with an exposure dose of 200 mJ / cm 2 from the bottom surface of the wafer through a UV curing machine, the pick-up property was evaluated in a pickup device.

Comparative example  One

The fixing adhesive layer 12 coated in [Production Example 1] is cut to fit an 8-inch wafer size. The upper adhesive layer 22 coated in [Production Example 3] was laminated on the surface of the fixing adhesive layer 12 to obtain a laminated film. Using the laminated film, the fixing adhesive layer 12 is placed on the back of the wafer having a thickness of 80 microns, and then a wafer mount process is performed using a ring frame at a pressure of 0.1 MPa at a temperature of 60 ° C. At this time, the upper adhesive layer 22 is attached to the back of the ring frame. Subsequently, the wafer-mounted wafer is fixed to a dicing apparatus and cut into 10 mm x 10 mm chip sizes at a speed of 100 mm / sec. After irradiating with an exposure dose of 200 mJ / cm 2 from the bottom surface of the wafer through a UV curing machine, the pick-up property was evaluated in a pickup device.

Comparative example  2

The fixing adhesive layer 12 coated in [Production Example 1] is cut to fit an 8-inch wafer size. The lower adhesive layer 32 coated in [Production Example 4] was laminated on the surface of the fixing adhesive layer 12 to obtain a laminated film. Using the laminated film, the fixing adhesive layer 12 is placed on the back of the wafer having a thickness of 80 microns, and then a wafer mount process is performed using a ring frame at a pressure of 0.1 MPa at a temperature of 60 ° C. At this time, the lower adhesive layer 32 is attached to the back of the ring frame. Subsequently, the wafer-mounted wafer is fixed to a dicing apparatus and cut into 10 mm x 10 mm chip sizes at a speed of 100 mm / sec. After irradiating with an exposure dose of 200 mJ / cm 2 from the bottom surface of the wafer through a UV curing machine, the pick-up property was evaluated in a pickup device.

Example  And In the comparative example  Evaluation of physical properties of the manufactured laminated film

The physical properties of the laminated films prepared by Examples 1 and 2 and Comparative Examples 1 and 2 were evaluated as follows, and the results are shown in Table 1 below.

(1) Chip Flying During Dicing Process: A wafer mounted wafer is fixed to a dicing apparatus and cut into 10 mm x 10 mm chip sizes at a speed of 100 mm / sec. At this time, it is observed whether there is a flying phenomenon of the chip from the pressure-sensitive adhesive surface.

(2) Chip Flying during Dicing Cleaning: The wafer is cleaned with ultrapure water while the dicing wafer is rotated at 30,000 r.p.m. At this time, observe whether there is a chip blowing phenomenon.

(3) Peel strength between the ring frame and the adhesive layer adjacent thereto during the dicing process: 180 ° peel force measurement of the ring frame and the adhesive layer

 Measurement condition-Load cell: 5N, Speed: 500mm / min, Specimen: 15mm

(4) Success rate of pickup: The success rate of pickup through the pickup device is displayed.

(5) Peel strength between the fixing adhesive layer 12 and the adhesive layer adjacent thereto:

  180 ° peeling force measurement of the fixing adhesive layer 12 and the adhesive layer

  Measurement condition-Load cell: 5N, Speed: 500mm / min, Specimen: 15mm

As can be seen from Table 1, since the upper adhesive layer 22 adjacent to the fixing adhesive has low adhesive force, the pick-up property is excellent, and the lower adhesive layer 32 adjacent to the ring frame has high adhesive force and high wafer fixability. There is no chip flying in the dicing process and pick-up is superior to Comparative Examples 1 and 2.

Although the preferred embodiments have been described above, the present invention can be practiced in various ways within the scope not departing from the protection scope of the present invention, it should be construed that such various modifications are also included within the protection scope of the present invention. do.

The dicing die bond film of the present invention is excellent in the fixing force to the ring frame of the wafer in the dicing process and the post-dicing cleaning process, there is no chip flying, and in the pick-up process, the adhesive layer and the adhesive force are low, so the peeling is easy. As a result, the pick-up success rate is excellent, which is suitable for use of thin wafers.

Claims (8)

 A dicing die bond film comprising a support base layer, a pressure-sensitive adhesive layer, and a fixing adhesive layer, wherein the pressure-sensitive adhesive layer includes a lower pressure-sensitive adhesive layer laminated on the support base material layer and an upper pressure-sensitive adhesive layer laminated on the lower pressure-sensitive adhesive layer. , And Peel strength between the lower adhesive layer and the ring frame (Peel strength) is 0.007N / mm to 1.000 N / mm, Peel strength between the upper adhesive layer and the fixing adhesive layer is UV curing Dicing die bond film, characterized in that from 0.002 N / mm to 0.020 N / mm. delete According to claim 1, wherein the upper adhesive layer is based on 100 parts by weight of solid content 30 to 90 parts by weight of the acrylic copolymer; 10 to 70 parts by weight of an acrylic compound having an unsaturated bond; And Dicing die bond film, characterized in that formed from a composition comprising 0.1 to 10 parts by weight of the photoinitiator. The dicing die bond film of claim 3, wherein the acrylic copolymer used in the upper adhesive layer has a glass transition temperature of −30 ° C. or higher. The dicing die bond film according to claim 3, wherein the acrylic compound having an unsaturated bond is any one selected from the group consisting of urethane-based acrylic resins, epoxy acrylic resins, polyester acrylic resins, and polyether acrylic resins. . The dicing die bond film according to claim 5, wherein the unsaturated bond-containing acrylic compound has a weight average molecular weight of 500 to 10,000. The support substrate layer according to any one of claims 1, 3, and 4, wherein the support base layer is polypropylene, polyethylene, polyester, polycarbonate, ethylene-vinyl acetate copolymer, ethylene-propylene copolymer, ethylene-ethyl Dicing die bond film, characterized in that any one selected from the group consisting of acrylate copolymer and polyvinyl chloride. The dicing die bond film of claim 1, wherein the upper adhesive layer further comprises at least one of a curing agent and inorganic particles.

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