KR100770653B1 - Depositing apparatus forming thin film - Google Patents

Depositing apparatus forming thin film Download PDF

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KR100770653B1
KR100770653B1 KR1020060047241A KR20060047241A KR100770653B1 KR 100770653 B1 KR100770653 B1 KR 100770653B1 KR 1020060047241 A KR1020060047241 A KR 1020060047241A KR 20060047241 A KR20060047241 A KR 20060047241A KR 100770653 B1 KR100770653 B1 KR 100770653B1
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deposition material
deposition
thin film
material
means
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KR1020060047241A
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Korean (ko)
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권현구
김창우
배경빈
윤주섭
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에이엔 에스 주식회사
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/542Controlling the film thickness or evaporation rate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/548Controlling the composition

Abstract

A depositing apparatus for forming a thin film is provided to maximize efficiency for using a deposition material by shielding the deposition material when unnecessary. A depositing apparatus for forming a thin film includes an evaporating source(20), a transporting pipe(30), a spaying unit(80), opening units(40,50) and a bypass line(60). The evaporating source evaporates a deposition material by heating the deposition material made of metal or organic matter. The transporting pipe transfers an evaporated deposition material to the spraying unit. The spraying unit includes a plurality of spraying nozzles. The spraying nozzles spray the evaporated deposition material to a substrate(S). The opening unit opens and closes the transporting pipe for controlling supply of the evaporated deposition material to the spraying unit. The bypass line is diverged from the transporting pipe and guides the evaporated deposition material when the transporting pipe is closed.

Description

박막형성용 증착장치{Depositing apparatus forming thin film} Thin-film evaporation apparatus-audio {Depositing apparatus forming thin film}

도 1은 종래 박막형성용 증착장치의 구조를 나타낸 것이다. 1 illustrates a structure of a conventional thin-film deposition apparatus-audio.

도 2는 본 발명에 의한 증착장치의 구조를 나타낸 것이다. Figure 2 shows the structure of a deposition apparatus according to the present invention.

도 3a 및 도 3b는 도 2에 도시된 증착장치의 요부 사용상태도이다. Figures 3a and 3b is a partial phase diagram of using the deposition apparatus shown in Fig.

**도면의 주요부분에 대한 부호의 설명** Description of the drawings ** **

1: 증착장치 10: 질량 유량 제어기 1: evaporator 10: mass flow controller

20: 증발원 30: 이송관 20: the evaporation source 30: air line

40, 50: 밸브 41: 밸로우즈 40, 50: valve 41: bellows

42: 금속구 60: 바이패스 라인 42: metal fitting 60: bypass line

70: 저장탱크 80: 분사헤드 70: Storage tank 80: ejection head

90: 셔터 90: Shutters

본 발명은 박막형성용 증착장치에 관한 것으로서, 보다 상세하게는 증착재료의 공급이 불필요할 경우에는 이를 차단함으로써 증착재료의 사용효율을 극대화할 수 있는 박막형성용 증착장치에 관한 것이다. The present invention relates to relates to a thin-film-audio deposition apparatus, and more particularly, if necessary the supply of the deposition material, which can maximize the use efficiency of the evaporation material by shutting off this thin-film deposition apparatus-audio.

최근 정보 통신 기술의 비약적인 발전과 시장의 팽창에 따라 디스플레이 소자로 평판표시소자(Flat Panel Display)가 각광받고 있다. Recent information has flat panel display devices (Flat Panel Display) as a display device in accordance with the expansion of the rapid development of communications technology and the market has been in the spotlight. 이러한 평판표시소자로는 액정 표시소자(Liquid Crystal Display), 플라즈마 디스플레이 소자(Plasma Display Panel), 유기 발광 소자(Organic Light Emitting Diodes) 등이 대표적이다. Such flat panel display device is typically a liquid crystal display device (Liquid Crystal Display), a plasma display device (Plasma Display Panel), an organic light emitting device (Organic Light Emitting Diodes).

그 중에서 유기발광소자는 빠른 응답속도, 기존의 액정표시소자보다 낮은 소비 전력, 경량성, 별도의 백라이트(back light) 장치가 필요 없어서 초 박형으로 만들 수 있는 점, 고휘도 등의 매우 좋은 장점을 가지고 있어서 차세대 디스플레이 소자로서 각광받고 있다. Among them, the organic light emitting device has a very great advantage of short response time, that high luminance such as a lower power consumption than the conventional liquid crystal display device, light weight, and a separate back light (back light) device that can be created with no second thin required in has been in the spotlight as a next generation display device.

이러한 유기발광소자는 기판 위에 양극 막, 유기 박막, 음극 막을 순서대로 입히고, 양극과 음극 사이에 전압을 걸어줌으로써 적당한 에너지의 차이가 유기 박막에 형성되어 스스로 발광하는 원리이다. The organic light emitting device is a principle that positive electrode layer, the organic thin film overlaid in order, a negative electrode film, the difference in energy by applying a suitable voltage between the anode and the cathode is formed on the organic light emitting thin film on the substrate itself. 즉, 주입되는 전자와 정공(hole)이 재결합하며 남는 여기 에너지가 빛으로 발생하는 것이다. That is, where the injected electrons and holes (hole) recombination and left to the energy generated by light. 이때 유기 물질의 도판트의 양에 따라 발생하는 빛의 파장을 조절할 수 있으므로 풀 칼라(full color)의 구현이 가능하다. At this time, it may adjust the wavelength of light generated by the amount of dopant in the organic substance it is possible to implement a full-color (full color).

유기발광소자의 자세한 구조는 도면에는 도시하지 않았지만 기판상에 양극(anode), 정공 주입층(hole injection layer), 정공 운송층(hole transfer layer), 발광층(emitting layer), 전자 운송층(eletron transfer layer), 전자 주입층(eletron injection layer), 음극(cathode)이 순서대로 적층되어 형성된다. Detailed structure of the organic light emitting device is drawing, the positive electrode (anode), a hole injection layer on a substrate, though not shown (hole injection layer), a hole transport layer (hole transfer layer), a light emitting layer (emitting layer), an electron transport layer (eletron transfer layer), is formed to be stacked in the electron injection layer (eletron injection layer), a negative electrode (cathode) in this order. 여기에서 양극으로는 면저항이 작고 투과성이 좋은 ITO(Indium Tin Oxide)이 주로 사용된다. Here, the positive electrode is often used a good ITO (Indium Tin Oxide) transparent sheet resistance is small. 그리고 유기 박막은 발광 효율을 높이기 위하여 정공 주입층, 정공 운송층, 발광층, 전자 운송층, 전자 주입층의 다층으로 구성되며, 발광층으로 사용되는 유기물질은 Alq 3 , TPD, PBD, m-MTDATA, TCTA 등이다. And an organic thin film is composed of a hole injection layer, a hole transport layer, light emitting layer, an electron transport layer, the electron injection layer, the multi-layer to increase the light emitting efficiency, an organic material used for the light emitting layer is Alq 3, TPD, PBD, m-MTDATA, TCTA is like. 또한, 음극으로는 LiF-Al 금속막이 사용된다. Further, the cathode is used as a film LiF-Al metal. 그리고 유기 박막이 공기 중의 수분과 산소에 매우 약하므로 소자의 수명(life time)을 증가시키기 위한 캡이 봉지된다. And, because the organic thin film is very weak to moisture and oxygen in the air cap to increase the service life (life time) of the device is sealed.

따라서 유기발광소자를 제조하기 위하여는 다양한 증착막을 형성하여야 하는데, 이러한 증착막 형성을 위한 종래의 방법으로는 포인트 증착, 라인증착, 유기기상증착(OVPD), 및 스캐닝프로세스(DSP) 등이 있다. Therefore, as is to be formed in a variety of vapor-deposited film to fabricate an organic light emitting device, the conventional method for forming such a deposited film has a deposition point, line deposition, organic vapor phase deposition (OVPD), and the scanning process (DSP).

도 1을 참조하여 종래의 DSP방식에 의한 증착장치의 구성을 설명하면, 증착재료를 가열하여 증발시키는 증발원(120)과, 상기 증발원(120)으로부터 증발된 증착재료를 이송하는 이송관(120)과, 상기 이송관(130)을 통해 공급된 기상의 증발재료를 기판(S)을 향해 분사하는 다수개의 노즐이 구비된 분사수단(140)를 포함하여 이루어진다. Referring to Figure 1, a configuration of a deposition apparatus according to the conventional DSP system, and the evaporation sources 120 to evaporate by heating the deposited material, feed tube 120 for transferring the deposition material evaporated from the evaporation source 120, and, comprises the feed pipe 130 of liquid injector 140, a plurality of nozzles are provided to jet towards the substrate (S) the evaporation material of the supplied gas phase through.

위와 같이 구성된 종래의 증착장치(100)는 진공챔버내에 기판(S)을 로딩하고, 로딩된 기판과 마스크(M)를 얼라인하여 정위치에 밀착시킨 후, 증발원(120)을 가열하여 증착재료를 기판(S)을 향해 분사함으로써 박막을 형성한다. Conventional deposition apparatus 100 configured as above is the after loading a substrate (S) in the vacuum chamber, alignment due to close contact with the position of the loaded substrate and the mask (M), deposited by heating the evaporation source 120, the material by jetting toward the substrate (S) to form a thin film.

한편, 기판의 로딩시 또는 기판과 마스크의 정렬시 등에는 증착재료가 분사되어서는 아니된다. On the other hand, the alignment of the loading state or the substrate and the mask of the substrate, etc. are not to be deposited material is injected. 종래에는 회동가능한 셔터(150)를 이용하고 있다. Conventionally, and using a rotatable shutter (150). 즉, 공정 준비시에는 기판(S)과 분사수단(140) 사이에 셔터(150)를 개재시켜 기판에 증착재료가 증착되는 것을 방지하고, 공정시에는 상기 셔터(150)를 회동시켜 증착하는 것이다. That is, by interposing a shutter (150) between the substrate (S) and spraying means 140, when the process preparation prevents deposition material is deposited on the substrate, and when the process is to deposit by rotating the shutter 150 .

그러나 유기발광소자의 제조에 이용되는 유기물 등의 증착재료는 대부분 매우 고가이다. However, the evaporation material of the organic material, such as for use in the production of the organic light emitting device are mostly very expensive. 따라서 셔터에 의한 방식은 분사되는 증착재료를 차단하여 기판에 증착되는 것을 방지할 뿐, 이를 재활용할 수 없기 때문에 증착재료의 낭비가 심하다는 문제점이 있다. Therefore, methods according to the shutter has a severe problem is the waste of the evaporation material because to prevent the deposition on the substrate to interrupt the vapor deposition material to be injected only, to recycle them.

본 발명은 상술한 문제점을 해결하기 위하여 안출된 것으로서, 본 발명의 목적은 증착재료의 공급이 불필요할 경우에는 이를 차단함으로써 증착재료의 사용효율을 극대화할 수 있는 박막형성용 증착장치를 제공함에 있다. The present invention been made in view of solving the above problems, it is an object of the present invention to provide a thin-film-audio deposition apparatus which can maximize the use efficiency of the deposition material to provide by blocking them when unnecessary supply of the deposition material.

위와 같은 기술적 과제를 해결하기 위하여 본 발명에 의한 박막형성용 증착장치는 증착재료를 가열하여 증발시키는 증발원; Thin film deposition-audio system according to the present invention to solve the technical problem as above has an evaporation source for evaporating an evaporation material by heating; 상기 증발원으로부터 공급된 기상의 증착재료를 이송하는 이송관; Transport pipe for transporting the deposited material of the vapor supplied from the evaporation source; 상기 이송관을 개폐하는 개폐수단; Opening and closing means for opening and closing the air line; 및 상기 이송관에 연결되어 상기 증착재료를 기판을 향해 분사하는 분사수단;을 포함하여 이루 어진다. Eojinda made including; and connected to the transport pipe injection means for injecting the deposition material toward the substrate.

상기 개폐수단은 다양한 형태로 제작될 수 있으며, 특히, 공압에 의해 신축가능한 밸로우즈; The closing means may be produced in various forms, in particular, possible expansion and contraction by the pneumatic bellows; 및 상기 밸로우즈의 신축에 의해 상기 이송관을 개폐하는 금속구;를 포함하여 이루어지는 것이 바람직하다. And a metal fitting to open and close the air line by expansion and contraction of the bellows; preferably comprises a.

또한 상기 이송관으로부터 분기되어 상기 개폐수단에 의해 상기 이송관의 폐쇄시 증착재료를 유도하는 바이패스라인과, 상기 바이패스라인에 의해 유도되는 상기 증착재료를 저장하는 저장탱크가 더 구비되는 것이 더욱 바람직하다. Further more it is branched from the air line is a storage tank is further provided for storing the deposition material which is guided by the by-pass line leading to the evaporation materials during closing of the transport pipe by the opening and closing means, the by-pass line desirable.

또한 상기 개폐수단을 가열하는 히터가 더 구비되는 것이 바람직하다. In addition, it is preferable that a heater for heating the open-close means is further provided.

마지막으로 상기 분사수단과 기판 사이에는 회동가능한 셔터가 더 구비될 수 있다. Finally, between the injection means and the substrate has a rotating shutter can be further provided.

이하, 첨부된 도면을 참조하여 본 발명의 구성 및 작용을 구체적으로 설명한다. Will be described below with reference to the accompanying drawings, the construction and operation of the present invention in detail.

도 2를 참조하면, 본 발명에 의한 증착장치(1)는 증발원(20), 이송관(30), 분사수단(80), 개폐수단(40, 50) 및 바이패스라인(60)을 포함하여 이루어진다. 2, the deposition apparatus 1 according to the present invention, including an evaporation source 20, the air line 30, spray means 80, switching means 40 and 50 and by-pass line 60 achieved.

상기 증발원(20)은 내부에 금속 또는 유기물 등의 증착재료를 수용하고 가열함으로써, 증착재료를 증발시키는 요소이다. The evaporation source 20 is an element of receiving an evaporation material, such as metals or organic materials therein, and evaporated by heating the deposition materials.

상기 이송관(30)은 상기 증발원(20)에서 증발된 기상의 증착재료를 후술하는 분사수단(80)로 유입시키는 요소이다. The air line 30 is a factor that flows into the injection means 80 below the evaporation material of the vapor evaporated from the evaporation source (20).

상기 분사수단(80)은 상기 이송관(30)으로부터 유입된 상기 기상의 증착재료 를 기판(S)을 향해 분사하는 복수개의 분사노즐을 포함하여 구성된다. The injection means 80 is configured to include a plurality of jetting nozzles which jet towards the substrate (S), the deposition material of the vapor introduced from the feed pipe 30. 상기 기판(S)은 메탈마스크(M)와 얼라인되어 정위치에 밀착되어 있다. The substrate (S) are aligned with the metal mask (M) and is adhered in place. 또한, 상기 분사수단(80)과 기판(S) 사이에는 셔터(90)가 구비된다. Further, between the injection means (80) and the substrate (S) is provided with a shutter (90). 상기 셔터(90)는 회동이 가능하도록 구성되어, 공정 준비시에는 기판(S)과 분사헤드(80) 사이에 셔터(90)를 개재시켜 기판(S)에 증착재료가 증착되는 것을 방지하고, 공정시에는 상기 셔터(90)를 회동시켜 개방함으로써 증착하는 것이다. The shutter 90 is prevented from pivoting is configured to allow, to between the substrate (S) with the injection head 80 when step preparation via the shutter 90, the deposition material deposited on the substrate (S), and when the process is to deposit by opening by rotating the shutter 90. 또한 도시하지는 아니하였으나, 상기 분사헤드(80)의 온도제어를 위한 열전대가 더 구비된다. Although also not not shown in the drawings, a thermocouple for temperature control of the ejection head 80 is further provided.

또한 상기 증착원(20)의 승압속도를 제어하기 위하여 질량 유량 제어기(Mass Flow Controller, MFC)(10)가 구비되는데, 이 때 희석가스(dilution gas)가 사용된다. In addition, there is provided with a mass flow controller (Mass Flow Controller, MFC) (10) to control the step-up rate of the evaporation source 20, that time is used by a diluting gas (dilution gas). 즉, 상기 희석가스는 질량 유량 제어기(10)에 의해 공급량이 제어되면서 공급라인을 통해 주입된다. That is, the dilution gas is introduced through a feed line as a feed rate controlled by the mass flow controller 10.

특히, 본 발명에 의한 증착장치(1)는 이송관(30)을 개폐하는 개폐수단(40)이 더 구비되어 있다. In particular, the deposition apparatus 1 according to the invention is further provided with a closing means 40 for opening and closing an air line (30). 이를 통해 상기 이송관(30)을 개폐함으로써 증발원(20)으로부터 증발된 상기 증착재료를 분사수단(80)으로의 공급을 제어할 수 있는 것이다. This will in the supply to the feed pipe 30 to the deposited material to the injection means 80 is evaporated from the evaporation source 20 by opening and closing can be controlled through.

한편, 상기 개폐수단(40)에 의해 상기 이송관(30)이 폐쇄될 시 상기 증착재료를 유도하는 바이패스라인(60)이 상기 이송관(30)으로부터 분기되어 형성된다. On the other hand, by the closing means 40 when this is closed the feed pipe 30 by-pass line 60 leading to the deposition material is formed is branched from the air line (30).

또한 상기 바이패스라인(60)상에도 개폐수단(50)이 더 부가되어 있음을 알 수 있다. It can also be seen that the by-pass line opening and closing means 50 to 60, a is further added.

또한 상기 바이패스라인(60)을 통해 유도되는 증착재료를 저장하여 재활용하도록 저장탱크(70)가 더 구비되어 있다. In addition, there is a storage tank 70, further comprising recycling to save the deposition material which is led through the bypass line 60.

도 3a를 참조하여 본 발명에 의한 개폐수단(40)의 구성을 구체적으로 설명한다. To Fig. 3a to the present invention will be described in detail a configuration of the switching means 40 according to the. 도시된 바와 같이, 상기 개폐수단(40)은 공압에 의해 신축이 가능한 밸로우즈(41)와, 상기 밸로우즈(41)에 연결되어 상기 이송관(30)을 개폐하는 금속구(42)를 포함하여 이루어진다. As shown, the closing means 40 comprises a metal fitting 42 for opening and closing the air line 30 is new is connected to a potential bellows 41 and the bellows 41 by a pneumatic by made. 물론 상기 금속구(42)는 고온에서도 내열성을 갖는 재질로 형성된다. Of course, the metal fitting 42 is formed of a material having heat resistance at high temperatures.

도 3a와 도 3b를 참조하여 상기 개폐수단(40)의 작용을 설명한다. Reference to Figure 3b and Figure 3a will be described the operation of the closing means (40). 먼저 도 3a의 상태는 증발원으로부터 증발된 기상의 증착재료는 이송관(30)을 통해 분사수단으로 공급된다. First state of Figure 3a of the vapor deposition material evaporated from the evaporation source is fed to the spraying means through an air line 30.

다음으로, 기판의 로딩이나 마스크와의 얼라인 등 증착이 수행되지 않는 동안에는 도 3b와 같이 상기 밸로우즈(41)에 패쇄용 공압을 가하여 밸로우즈(41)를 신장시키고, 그 결과 이에 연결된 금속구(42)가 상기 이송관(30)을 패쇄시키는 것이다. Next, by applying air pressure for the closed to the bellows 41 as shown in Figure 3b, during which alignment such as the vapor deposition process of the loading or the mask of the substrate is not carried out and expands the bellows 41, so that this attached metal ball is to 42 is closed to the conveying pipe 30. 이 상태에서는 도시되지는 아니하였으나, 분사수단으로 공급되는 것이 차단된 증발된 증착재료는 바이패스라인으로 유도되어 저장탱크에 저장된다. In this state, but will not be shown, the vaporized evaporation material to be supplied to the liquid injector block is guided to the bypass line is stored in the storage tank.

반대로, 증착공정을 수행하기 위하여는 상기 밸로우즈(41)에 개방용 공압을 가하여 밸로우즈(41)를 압축시키고, 그 결과 다시 도 3a와 같이 금속구(42)가 상기 이송관(30)을 개방시키는 것이다. On the other hand, in order to perform a deposition process is the metal fitting 42 is in the feed tube 30 as shown in Figure 3a the dogfight.Visualize the position, then slip and compress Woods 41, bellows 41 is added to air pressure for open, the result again It is to open. 이 때는 상기 바이패스라인이 패쇄된다. In this case that the bypass line is closed.

이하에서는 본 발명에 의한 증착장치의 작용을 설명한다. The following describes the operation of the deposition apparatus according to the present invention. 먼저 진공챔버(미도시)의 내부에 기판(S)을 로딩하고, 마스크(M)를 얼라인하여 정위치에 밀착시킨다. First loading a substrate (S) on the inside of the vacuum chamber (not shown), and because of the alignment mask (M) thereby tightly in place. 이와 같이 공정의 준비중에는 상기 개폐수단(40)을 이용하여 이송관(30)을 패쇄함으로써 증착재료가 분사수단(80)으로 공급되는 것을 차단한다. According to the above preparation process it has closed the feed pipe 30 using the opening and closing means 40 and prevents the deposition material is supplied to the injection means 80.

위의 준비단계가 완료되면, 셔터(90)를 회동하여 개방하고, 상기 개폐수단(40)을 이용하여 상기 이송관(30)을 개방함으로써 증착재료를 분사수단(80)으로 공급하고, 분사수단(80)은 기판(S)을 향해 증착재료를 분사하여 증착하는 것이다. When the preparation of the above step is completed, by rotating the shutter 90 is opened and supplies the deposition material by opening the feed pipe 30 using the opening and closing means 40 in the injection unit 80, injection means 80 is to deposit by spraying the deposition material toward the substrate (S).

마찬가지로, 증착공정이 완료 또는 새로운 증착공정을 수행하기 위하여 준비하는 단계에서는 다시금 이송관(30)을 패쇄하는 것이다. Similarly, in the step of the deposition process, ready to perform a new deposition process is to complete or closed again, an air line (30).

본 발명에 따르면 공정의 진행에 따라 증착재료의 공급을 제어할 수 있는 효과가 있다. According to the invention there is an effect that it is possible to control the supply of the deposition material with the progress of the process.

따라서, 증착재료의 공급이 불필요할 경우에는 이를 차단함으로써 증착재료의 사용효율을 극대화할 수 있는 것이다. Therefore, when the supply of the deposition material will be necessary to maximize the efficiency of the evaporation material by blocking them.

Claims (6)

  1. 증착재료를 가열하여 증발시키는 증발원; An evaporation source for evaporating an evaporation material by heating;
    상기 증발원으로부터 공급된 기상의 증착재료를 이송하는 이송관; Transport pipe for transporting the deposited material of the vapor supplied from the evaporation source;
    상기 이송관을 개폐하는 개폐수단; Opening and closing means for opening and closing the air line; And
    상기 이송관에 연결되어 상기 증착재료를 기판을 향해 분사하는 분사수단;을 포함하여 이루어지는 것을 특징으로 하는 박막형성용 증착장치. Foil-type-audio deposition apparatus which comprises including; is connected to the transport pipe injection means for injecting the deposition material toward the substrate.
  2. 제 1 항에 있어서, According to claim 1,
    상기 개폐수단은, The on-off means,
    공압에 의해 신축가능한 밸로우즈; Possible expansion by a pneumatic bellows; And
    상기 밸로우즈의 신축에 의해 상기 이송관을 개폐하는 금속구;를 포함하여 이루어지는 것을 특징으로 하는 박막형성용 증착장치. Foil-type-audio deposition apparatus comprising the; by the expansion and contraction of the bellows metal fitting to open and close the air line.
  3. 제 1 항에 있어서, According to claim 1,
    상기 이송관으로부터 분기되어 상기 개폐수단에 의해 상기 이송관의 폐쇄시 증착재료를 유도하는 바이패스라인이 더 구비되는 것을 특징으로 하는 박막형성용 증착장치. Thin film deposition-audio device, characterized in that branching from the transfer tube is by the open-close means is further provided with a bypass line leading to the evaporation materials during closing of the transport pipe.
  4. 제 3 항에 있어서, 4. The method of claim 3,
    상기 바이패스라인에 의해 유도되는 상기 증착재료를 저장하는 저장탱크가 더 구비되는 것을 특징으로 하는 박막형성용 증착장치. Thin film deposition-audio device, characterized in that a storage tank for storing the deposition material which is guided by the by-pass line is further provided.
  5. 제 2 항에 있어서, 3. The method of claim 2,
    상기 개폐수단을 가열하는 히터가 더 구비되는 것을 특징으로 하는 박막형성용 증착장치. Foil-type-audio vapor deposition apparatus wherein a heater for heating the open-close means is further provided.
  6. 제 1 항에 있어서, According to claim 1,
    상기 분사수단과 기판 사이에는 회동가능한 셔터가 더 구비되는 것을 특징으로 하는 박막형성용 증착장치. Thin film deposition-audio device, characterized in that the shutter can be rotated is further provided between the injection means and the substrate.
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