KR100758144B1 - 서미스터 소체 형성용 수지 조성물 및 서미스터 - Google Patents

서미스터 소체 형성용 수지 조성물 및 서미스터 Download PDF

Info

Publication number
KR100758144B1
KR100758144B1 KR1020050056898A KR20050056898A KR100758144B1 KR 100758144 B1 KR100758144 B1 KR 100758144B1 KR 1020050056898 A KR1020050056898 A KR 1020050056898A KR 20050056898 A KR20050056898 A KR 20050056898A KR 100758144 B1 KR100758144 B1 KR 100758144B1
Authority
KR
South Korea
Prior art keywords
thermistor
resin composition
epoxy resin
resin
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020050056898A
Other languages
English (en)
Korean (ko)
Other versions
KR20060048688A (ko
Inventor
유키에 모리
사토시 시라이
Original Assignee
티디케이가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 티디케이가부시기가이샤 filed Critical 티디케이가부시기가이샤
Publication of KR20060048688A publication Critical patent/KR20060048688A/ko
Application granted granted Critical
Publication of KR100758144B1 publication Critical patent/KR100758144B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the permanent binder
    • H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the permanent binder composed of organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
KR1020050056898A 2004-06-29 2005-06-29 서미스터 소체 형성용 수지 조성물 및 서미스터 Expired - Fee Related KR100758144B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004192026A JP2006013378A (ja) 2004-06-29 2004-06-29 サーミスタ素体形成用樹脂組成物及びサーミスタ
JPJP-P-2004-00192026 2004-06-29

Publications (2)

Publication Number Publication Date
KR20060048688A KR20060048688A (ko) 2006-05-18
KR100758144B1 true KR100758144B1 (ko) 2007-09-13

Family

ID=34981564

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050056898A Expired - Fee Related KR100758144B1 (ko) 2004-06-29 2005-06-29 서미스터 소체 형성용 수지 조성물 및 서미스터

Country Status (7)

Country Link
US (1) US7270776B2 (https=)
EP (1) EP1612811B1 (https=)
JP (1) JP2006013378A (https=)
KR (1) KR100758144B1 (https=)
CN (1) CN100410319C (https=)
DE (1) DE602005004703T2 (https=)
TW (1) TW200613433A (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4796322B2 (ja) * 2005-03-30 2011-10-19 阪本薬品工業株式会社 新規な熱硬化性樹脂組成物
US8383322B2 (en) 2005-08-05 2013-02-26 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography watermark reduction
US7993808B2 (en) 2005-09-30 2011-08-09 Taiwan Semiconductor Manufacturing Company, Ltd. TARC material for immersion watermark reduction
US9297932B2 (en) 2006-03-10 2016-03-29 Nippon Shokubai Co., Ltd Polarizer protective film, polarizing plate, and image display apparatus
ES2691528T3 (es) * 2006-07-31 2018-11-27 Henkel Ag & Co. Kgaa Composiciones adhesivas basadas en resina epoxi curable
US8518628B2 (en) 2006-09-22 2013-08-27 Taiwan Semiconductor Manufacturing Company, Ltd. Surface switchable photoresist
WO2008045270A1 (en) * 2006-10-06 2008-04-17 Henkel Ag & Co. Kgaa Pumpable epoxy paste adhesives resistant to wash-off
JP5357629B2 (ja) 2008-07-01 2013-12-04 新日鉄住金化学株式会社 光導波路用樹脂組成物およびそれを用いた光導波路
CN102046690B (zh) * 2008-07-31 2013-01-16 大赛璐化学工业株式会社 光半导体密封用树脂组合物和使用了该树脂组合物的光半导体装置
JP2010077305A (ja) * 2008-09-26 2010-04-08 Yokohama Rubber Co Ltd:The エポキシ樹脂組成物
SE534437C2 (sv) * 2009-09-29 2011-08-23 Conflux Ab Värmeelement med positiv temperaturkoefficient och deras framställning
CN102286190B (zh) * 2011-06-23 2013-04-17 浙江华正新材料股份有限公司 一种无卤树脂组合物及用该组合物制成的覆铜板
EP2948968B1 (en) 2013-01-28 2018-03-28 Massachusetts Institute of Technology Electromechanical device
EP3104376A4 (en) * 2014-02-06 2017-09-06 Japan Science and Technology Agency Resin composition for temperature sensor, element for temperature sensor, temperature sensor, and method for producing element for temperature sensor
CN108648889B (zh) * 2018-03-15 2020-04-28 佛山市信鼎电子科技有限公司 一种电子元件的制备方法
CN110793658A (zh) * 2019-11-26 2020-02-14 青岛科技大学 一种自带电路保护功能的聚合物基温敏电阻器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5250228A (en) 1991-11-06 1993-10-05 Raychem Corporation Conductive polymer composition
EP0896344A2 (en) * 1997-07-21 1999-02-10 General Electric Company Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite
US5968419A (en) 1997-12-08 1999-10-19 Westinghouse Electric Company Llc Conductive polymer compositions, electrical devices and methods of making
US6375867B1 (en) 1993-11-29 2002-04-23 Eaton Corporation Process for making a positive temperature coefficient conductive polymer from a thermosetting epoxy resin and conductive fillers
WO2003105160A1 (ja) * 2002-05-31 2003-12-18 タツタ電線株式会社 導電性ペースト、これを用いた多層基板及びその製造方法
WO2004029720A1 (ja) 2002-09-30 2004-04-08 Zeon Corporation 感放射線性樹脂組成物、樹脂パターン膜とその形成方法、及び樹脂パターン膜の利用

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1043911A (en) * 1975-04-14 1978-12-05 Robert B. Johnson Electronic device assembly on insulating substrates
DE3443789A1 (de) * 1983-12-02 1985-06-27 Osaka Soda Co. Ltd., Osaka Elektrische leitende klebstoffmasse
FR2614130B1 (fr) 1987-04-15 1992-01-17 Lorraine Carbone Materiau ayant une resistivite a coefficient de temperature positif
JP3101048B2 (ja) 1992-01-20 2000-10-23 ティーディーケイ株式会社 有機質正特性サーミスタ
JP3101047B2 (ja) * 1992-01-20 2000-10-23 ティーディーケイ株式会社 有機質正特性サーミスタ
DE4232969A1 (de) * 1992-10-01 1994-04-07 Abb Research Ltd Elektrisches Widerstandselement
US5700398A (en) 1994-12-14 1997-12-23 International Business Machines Corporation Composition containing a polymer and conductive filler and use thereof
US5935372A (en) * 1997-04-29 1999-08-10 Occidental Chemical Corporation Adhesive sealant for bonding metal parts to ceramics
US6139777A (en) * 1998-05-08 2000-10-31 Matsushita Electric Industrial Co., Ltd. Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same
JP3683113B2 (ja) 1998-11-02 2005-08-17 Ｔｄｋ株式会社 有機質正特性サーミスタ
JP3506629B2 (ja) 1999-01-28 2004-03-15 Ｔｄｋ株式会社 有機質正特性サーミスタ
EP1548758A4 (en) 2003-03-25 2007-07-11 Tdk Corp ORGANIC THERMISTANCE HAVING POSITIVE TEMPERATURE COEFFICIENT
JP4261407B2 (ja) 2004-03-31 2009-04-30 Ｔｄｋ株式会社 有機質正特性サーミスタ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5250228A (en) 1991-11-06 1993-10-05 Raychem Corporation Conductive polymer composition
US6375867B1 (en) 1993-11-29 2002-04-23 Eaton Corporation Process for making a positive temperature coefficient conductive polymer from a thermosetting epoxy resin and conductive fillers
EP0896344A2 (en) * 1997-07-21 1999-02-10 General Electric Company Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite
JPH11126706A (ja) 1997-07-21 1999-05-11 General Electric Co <Ge> 電流制限装置、導電性複合材および該複合材の製造方法
US5968419A (en) 1997-12-08 1999-10-19 Westinghouse Electric Company Llc Conductive polymer compositions, electrical devices and methods of making
WO2003105160A1 (ja) * 2002-05-31 2003-12-18 タツタ電線株式会社 導電性ペースト、これを用いた多層基板及びその製造方法
WO2004029720A1 (ja) 2002-09-30 2004-04-08 Zeon Corporation 感放射線性樹脂組成物、樹脂パターン膜とその形成方法、及び樹脂パターン膜の利用

Also Published As

Publication number Publication date
JP2006013378A (ja) 2006-01-12
DE602005004703T2 (de) 2009-02-12
KR20060048688A (ko) 2006-05-18
DE602005004703D1 (de) 2008-03-27
TW200613433A (en) 2006-05-01
CN100410319C (zh) 2008-08-13
CN1715329A (zh) 2006-01-04
US20060022790A1 (en) 2006-02-02
US7270776B2 (en) 2007-09-18
EP1612811B1 (en) 2008-02-13
TWI295307B (https=) 2008-04-01
EP1612811A1 (en) 2006-01-04

Similar Documents

Publication Publication Date Title
KR100758144B1 (ko) 서미스터 소체 형성용 수지 조성물 및 서미스터
EP2182585B1 (en) Circuit member connecting structure
US9249342B2 (en) Polymeric PTC thermistors
KR102431084B1 (ko) 도전 페이스트, 접속 구조체 및 접속 구조체의 제조 방법
JP2008111092A (ja) 回路接続材料及びそれを用いた接続構造体
JP5779385B2 (ja) 接続構造体の製造方法及び接続構造体
EP1548758A1 (en) Organic positive temperature coefficient thermistor
JP2001345349A (ja) 接続材料及び接続構造体
WO2020054288A1 (ja) 導電材料及び接続構造体
JP2016004971A (ja) 接続構造体及び接続構造体の製造方法
KR102580259B1 (ko) 도전성 접착제 조성물
JP2013211561A (ja) 回路接続用接着フィルム
US7304562B2 (en) Organic PTC thermistor and production
JP7377007B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2019096549A (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2005294550A (ja) 有機質正特性サーミスタ
KR101861896B1 (ko) 이방 도전성 필름, 이를 이용한 디스플레이 장치 및 그 제조 방법
JP4262152B2 (ja) サーミスタ
KR20200015445A (ko) 도전 재료 및 접속 구조체
JP2006245065A (ja) サーミスタの製造方法
JP4220428B2 (ja) 有機質正特性サーミスタ
JP2007103397A (ja) Ｐｔｃサーミスタの製造方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

G170 Re-publication after modification of scope of protection [patent]
PG1701 Publication of correction

St.27 status event code: A-5-5-P10-P19-oth-PG1701

Patent document republication publication date: 20080417

Republication note text: Request for Correction Notice (Document Request)

Gazette number: 1007581440000

Gazette reference publication date: 20070913

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20100907

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20100907

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000