KR100725578B1 - Test method of diamond disc cutting power - Google Patents

Test method of diamond disc cutting power Download PDF

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Publication number
KR100725578B1
KR100725578B1 KR1020060048261A KR20060048261A KR100725578B1 KR 100725578 B1 KR100725578 B1 KR 100725578B1 KR 1020060048261 A KR1020060048261 A KR 1020060048261A KR 20060048261 A KR20060048261 A KR 20060048261A KR 100725578 B1 KR100725578 B1 KR 100725578B1
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South Korea
Prior art keywords
polishing pad
polishing
cutting
diamond
pad
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KR1020060048261A
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Korean (ko)
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맹주호
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새솔다이아몬드공업 주식회사
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A method for testing diamond disc cutting power is provided to reduce error by detecting the difference of weights of a polishing pad before and after cutting process, and to improve accuracy of measurement by ensuring sufficient amount of cutting volume from cutting performed during a relatively shorter time period. A method for testing diamond disc cutting power includes a step(A) of mounting a diamond disc(6) onto a grinding head(5) disposed on a turn table(1) on which a polishing pad(2) is to be arranged; a step(B) measuring the weight of the polishing pad prior to cutting; a step(C) of attaching the polishing pad onto the turn table; a step(D) of cutting the polishing pad for a predetermined time period by rotating the turn table while contacting the diamond disc to the polishing pad; a step(E) of measuring the weight of the polishing pad after cutting; and a step(F) of comparing weights of the polishing pad before and after cutting process.

Description

다이아몬드 연마구 절삭력 측정방법 {Test Method of Diamond Disc Cutting Power}{Test Method of Diamond Disc Cutting Power}

도 1은 종래의 반도체 웨이퍼 연마장치의 구성도1 is a block diagram of a conventional semiconductor wafer polishing apparatus

도 2는 종래의 다이아몬드연마구의 구성도2 is a block diagram of a conventional diamond polishing tool

도 3은 본 발명에 따른 다이아몬드 연마구 절삭력 측정방법을 보여주는 도면3 is a view showing a diamond abrasive cutting force measuring method according to the invention

도 4는 본 발명의 턴테이블과 폴리싱패드의 측면도Figure 4 is a side view of the turntable and polishing pad of the present invention

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

1. 턴테이블 2. 폴리싱패드 1. Turntable 2. Polishing pad

5. 연마헤드 6. 다이아몬드 연마구 5. Grinding Head 6. Diamond Grinding Tool

20. 기판 24. 돌출부20. Substrate 24. Protrusion

26. 오목부26. Concave

본 발명은 다이아몬드 연마구 절삭력 측정방법에 대한 것으로서, 좀 더 상세히는 측정시간이 단축되며 편차가 적고 측정이 용이한 새로운 방식의 다이아몬드 연마구 절삭력 측정방법에 대한 것이다.The present invention relates to a method of measuring diamond cutting tool cutting force, and more particularly, to a method of measuring diamond cutting tool cutting force of a new method of shorter measuring time, less variation, and easy to measure.

일반적으로 반도체 웨이퍼의 평탄화를 위해 폴리싱패드를 구비한 연마장치를 사용하여 연마하는데, 이러한 폴리싱패드를 반복 사용하면 연마슬러리에 함유되어 있던 연마입자나 연마칩이 폴리싱패드의 표면의 간극을 메우게 되고, 마찰열에 의해 폴리싱패드의 표면이 경면화되면, 연마표면이 적절한 수준의 거칠기를 상실하게 되어 연마기능이 저하된다. 이에 따라 폴리싱패드의 표면의 평탄도나 면거칠기를 웨이퍼의 연마에 적합한 수준으로 회복시키기 위해 다이아몬드 연마구가 사용된다.Generally, a polishing apparatus having a polishing pad is used to planarize a semiconductor wafer. When the polishing pad is repeatedly used, abrasive particles or polishing chips contained in the polishing slurry fill the gap between the surfaces of the polishing pad. When the surface of the polishing pad is mirrored by frictional heat, the polishing surface loses an appropriate level of roughness, and the polishing function is degraded. Accordingly, diamond polishing tools are used to restore the flatness or surface roughness of the surface of the polishing pad to a level suitable for polishing the wafer.

도 1은 이러한 다이아몬드 연마구를 구비한 연마장치를 보여주는데, 도시된 바와 같이, 턴테이블(1)의 상면에 폴리싱패드(2)가 부착되며, 이 폴리싱패드(2)의 상면에는 좌우로 요동되며 자전되는 웨이퍼헤드(3)에 웨이퍼(4)가 부착되어, 이 웨이퍼(4)가 폴리싱패드(2)와 마찰되면서 연마된다. 그리고 이 웨이퍼헤드(3)의 일측에는 수평 이동되면서 회전되는 연마헤드(5)에 연마구(6)가 부착되어 폴리싱패드(2)와 마찰 접촉됨으로써 폴리싱패드(2)의 표면을 적절한 평탄도와 거칠기로 회복시키게 된다. 이 때 사용되는 다이아몬드 연마구(6)는 도 2에 도시된 바와 같이, 원판형의 연마구(6)의 상면에 다이아몬드입자(8)들이 분포되어 부착된다. 이러한 다이아몬드입자(8)들을 연마구(6)에 부착하기 위해서는 스테인레스스틸재의 연마구 플레이트 표면에 위사와 경사로 직조된 비전도성 스크린(11)을 체결치구를 이용하여 체결하고, 도금조에 투입한 후에, 스크린의 상면에 다이아몬드입자(8)를 뿌리면서 진동을 가하여 다이아몬드입자(8)가 스크린의 망눈에 골고루 끼워져 배열되도록 하고, 도금처리를 행하여, 형성된 도금층에 의해 다이아몬드입자(8)를 연마구(6)에 부착시키고 스크린을 제거하여 다이아몬드 연마구를 제조하게 된다.1 shows a polishing apparatus having such a diamond polishing tool. As shown in the drawing, a polishing pad 2 is attached to an upper surface of a turntable 1, and the upper surface of the polishing pad 2 is swung left and right and rotates. The wafer 4 is attached to the wafer head 3 to be polished while the wafer 4 is rubbed with the polishing pad 2. The polishing head 6 is attached to one side of the wafer head 3 to be rotated while being horizontally moved, and the polishing tool 6 is frictionally contacted with the polishing pad 2 so that the surface of the polishing pad 2 has an appropriate flatness and roughness. Will be restored. As shown in FIG. 2, the diamond abrasive tool 6 used at this time is distributed and attached to the top surface of the disk-shaped abrasive tool 6. In order to attach the diamond particles 8 to the polishing tool 6, the non-conductive screen 11, which is woven in a weft and inclined manner, is fastened to the surface of the polishing tool plate made of stainless steel using a fastening jig, and then put into a plating bath. Vibration is applied to the top surface of the screen while applying vibration so that the diamond particles 8 are evenly arranged in the meshes of the screen, and the plating process is performed so that the diamond particles 8 are polished by the formed plating layer. ) And remove the screen to produce a diamond abrasive.

이 때, 폴리싱패드(2)에 의해 연마되는 웨이퍼(4)의 평탄도를 정밀한 수준으로 제어하기 위해서는 이 폴리싱패드(2)를 연마하는 다이아몬드 연마구(6)의 절삭력을 미리 알아야 한다. 그런데, 이러한 다이아몬드 연마구(6)의 절삭력은 사용되는 다이아몬드입자의 상태나 기타 연마구의 제작 조건에 따라 변동되므로, 이러한 다이아몬드 연마구의 절삭력을 주기적으로 테스트하여 그 절삭력에 대한 데이터를 확보해 두어야 한다.At this time, in order to control the flatness of the wafer 4 polished by the polishing pad 2 to a precise level, the cutting force of the diamond polishing tool 6 polishing the polishing pad 2 must be known in advance. However, since the cutting force of the diamond abrasive tool 6 varies depending on the state of the diamond particles used or the manufacturing conditions of other abrasive tools, the cutting force of the diamond abrasive tool should be periodically tested to obtain data on the cutting force.

종래의 다이아몬드 연마구의 절삭력을 테스트하는 방법은 도 1과 같은 연마장치에 폴리싱패드(2)를 접착테이프로 부착한 후에, 패드의 두께를 다이얼게이지로 측정하고 소정시간 동안 다이아몬드 연마구로 폴리싱패드(2)를 연마한 후에, 남은 폴리싱패드(2)의 두께를 측정하여, 소정의 시간과 조건하에 폴리싱패드의 절삭된 깊이(두께차이)를 계산하여 다이아몬드 연마구의 절삭력을 측정하였다.In the conventional method for testing the cutting force of a diamond polishing tool, after attaching the polishing pad 2 to the polishing apparatus as shown in FIG. 1 with an adhesive tape, the thickness of the pad is measured with a dial gauge and the polishing pad 2 After polishing), the thickness of the remaining polishing pad 2 was measured, and the cutting depth (thickness difference) of the polishing pad was calculated under a predetermined time and conditions to measure the cutting force of the diamond polishing tool.

그런데 종래의 이러한 절삭력 측정방법은 사용하는 소프트한 재질의 폴리싱패드(2)에 게이지를 접촉시켜서 측정해야 하므로, 측정시에 폴리싱패드(2)가 눌려 서 변형되면 깊이 측정에 오차가 발생될 수밖에 없다. 아울러, 폴리싱패드(2)의 경도, 기공크기, 표면의 홈 상태, 비중 등의 물성이나 실험실의 습도나 온도 등에 따라 동일한 다이아몬드 연마구를 사용하더라도 패드의 절삭 깊이가 변동되므로 검사의 신뢰성이 낮다는 문제점이 있었다. 아울러, 장시간 폴리싱패드(2)를 절삭하더라도 패드가 절삭되는 두께는 상대적으로 미미하여, 신뢰성있는 절삭력 측정을 위해서는 상당한 시간동안 절삭을 해야 하므로, 테스트에 많은 시간이 소요되는 문제점이 있었다.By the way, such a conventional cutting force measuring method should be measured by contacting the gauge to the polishing pad (2) of the soft material to be used, if the polishing pad (2) is deformed by pressing at the time of measurement, errors in the depth measurement will inevitably occur . In addition, even if the same diamond abrasive tool is used depending on the hardness, pore size, surface groove state, specific gravity, etc. of the polishing pad 2, humidity or temperature of the laboratory, the cutting depth of the pad is changed, so the reliability of inspection is low. There was a problem. In addition, even when the polishing pad 2 is cut for a long time, the thickness at which the pad is cut is relatively insignificant, and thus, for a reliable cutting force measurement, the cutting time must be cut for a considerable time.

또한, 종래의 측정방법은 폴리싱패드(2)를 턴테이블(1)에 접착테이프를 이용하여 부착하므로 패드를 교체하는데 많은 시간이 소요되는데, 패드의 제조회사별로 다이아몬드 연마구의 절삭력을 테스트하기 위해 빈번한 패드의 교체를 필요로 하기 때문에, 패드의 교체에 시간이 소요되고 교체작업이 번거롭다는 문제점이 있었다.In addition, in the conventional measuring method, since the polishing pad 2 is attached to the turntable 1 by using an adhesive tape, it takes a lot of time to replace the pad. The pad is frequently used to test the cutting force of the diamond polishing tool by the manufacturer of the pad. Since the replacement of the pad, it takes a long time to replace the pad, there was a problem that the replacement is cumbersome.

본 발명은 전술한 바와 같은 종래의 다이아몬드 연마구의 절삭력 측정에 따른 문제점에 착안하여 제안된 것으로서, 본 발명은 측정시간이 단축되며 측정조건에 따른 편차가 적고 측정이 용이한 새로운 다이아몬드 연마구 절삭력 측정방법을 제공하고자 하는 것이다.The present invention has been proposed in view of the problems caused by the conventional cutting force measurement of the diamond grinding wheel, the present invention is shorter measurement time, less variation according to the measurement conditions, new diamond grinding tool measuring method easy to measure Is to provide.

본 발명의 한 특징에 따르면, 웨이퍼(4) 연마용 폴리싱패드(2)의 표면을 절 삭하여 폴리싱패드(2)를 적절한 평탄도와 거칠기로 회복시키는데 사용되며, 상면에 다이아몬드입자(8)가 부착되는 다이아몬드 연마구(6)의 절삭력 테스트 방법에 있어서, 상기 폴리싱패드(2)가 설치될 턴테이블(1)의 상부에 배치되는 연마헤드(5)에 테스트할 측정대상 다이아몬드 연마구(6)를 장착하는 단계(A), 절삭 전의 폴리싱패드(2)의 무게를 측정하는 단계(B), 상기 폴리싱패드(2)를 턴테이블(1)의 상면에 부착하는 단계(C), 다이아몬드 연마구(6)를 폴리싱패드(2)에 접촉시키면서 턴테이블(1)을 회전시켜서 폴리싱패드(2)를 소정시간 절삭하는 단계(D), 절삭 후의 폴리싱패드(2)의 무게를 측정하는 단계(E), 폴리싱패드(2)의 절삭전과 절삭후의 무게를 비교하는 단계(F)로 구성되는 것을 특징으로 하는 다이아몬드 연마구 절삭력 측정방법이 제공된다.According to one feature of the invention, the surface of the polishing pad 2 for polishing the wafer 4 is used to restore the polishing pad 2 to proper flatness and roughness, and diamond particles 8 adhere to the upper surface. In the cutting force testing method of the diamond polishing tool 6 to be mounted, the diamond polishing tool 6 to be tested is mounted on the polishing head 5 disposed above the turntable 1 on which the polishing pad 2 is to be installed. Step (A), measuring the weight of the polishing pad 2 before cutting (B), attaching the polishing pad 2 to the top surface of the turntable 1 (C), the diamond polishing tool 6 Rotating the turntable 1 while contacting the polishing pad 2 to cut the polishing pad 2 for a predetermined time (D), measuring the weight of the polishing pad 2 after cutting (E), and the polishing pad. (2) comparing the weight before and after cutting in (2) This diamond kite harness cutting method to measure a gong is provided.

이하에서 도면을 참조하여 본 발명의 바람직한 실시예를 설명하면 다음과 같다. 도 3은 본 발명에 따른 다이아몬드 연마구의 절삭력 측정방법을 보여주는 도면으로서, 먼저 폴리싱패드(2)가 설치될 턴테이블(1)이 구비되며, 턴테이블(1)의 상부에 배치되어 턴테이블(1)을 향하도록 하향연장되는 연마헤드(5)를 구비한 테스트장치에서, 연마헤드(5)에 테스트할 측정대상 다이아몬드 연마구(6)를 장착한다(A). 다음에 연마할 폴리싱패드(2)의 무게를 측정하여 절삭전의 폴리싱패드(2)의 중량데이터를 입수한다(B). 입수된 데이터는 절삭력 측정 프로그램에 입력하여 둔다. 다음에 폴리싱패드(2)를 턴테이블(1)에 부착시킨다(C). 이 때, 종래와 같이 폴리싱패드(2)의 배면에 접착제층이 도포되어 이 접착제층으로 턴테이블(1)에 부착시킬 수 도 있으나, 본 발명의 바람직한 실시예에 따르면, 도 4에 도시된 바와 같이, 턴테이블(1) 상에 돌출부(24)를 형성하고, 폴리싱패드(2)의 배면에는 기판(20)을 적층하되, 이 기판(20)에는 상기 턴테이블(1)의 돌출부(24)와 맞물려 결합되는 오목부(26)를 형성하여, 폴리싱패드(2)를 기판(20)과 함께 간단하게 턴테이블(1)에 끼워서 장착할 수 있도록 한다. 한편, 전술한 설명에서 다이아몬드 연마구(6)를 먼저 장착하고, 폴리싱패드(2)의 무개를 측정한 후에 나중에 부착하는 것으로 설명하였으나, 이는 시간적은 순서를 의미하는 것이 아니라 그러한 단계가 필요하다는 것을 의미하는 것이므로, 폴리싱패드(2)를 먼저 장착하고 나중에 다이아몬드 연마구(6)를 부착하여도 무방하다.Hereinafter, with reference to the drawings will be described a preferred embodiment of the present invention. 3 is a view illustrating a cutting force measuring method of a diamond polishing tool according to the present invention, which is first provided with a turntable 1 on which a polishing pad 2 is to be installed, and is disposed above the turntable 1 to face the turntable 1. In the test apparatus having the polishing head 5 extended downward so as to attach the measurement target diamond polishing tool 6 to the polishing head 5 (A). Next, the weight of the polishing pad 2 to be polished is measured to obtain weight data of the polishing pad 2 before cutting (B). The obtained data is entered into the cutting force measuring program. Next, the polishing pad 2 is attached to the turntable 1 (C). At this time, the adhesive layer is applied to the back surface of the polishing pad 2 as in the prior art, but may be attached to the turntable 1 with the adhesive layer, according to a preferred embodiment of the present invention, as shown in FIG. A protrusion 24 is formed on the turntable 1, and a substrate 20 is stacked on the rear surface of the polishing pad 2, and the substrate 20 is engaged with the protrusion 24 of the turntable 1. The concave portion 26 is formed, so that the polishing pad 2 can be easily fitted to the turntable 1 together with the substrate 20. On the other hand, in the above description, the diamond polishing tool 6 was first mounted, and then the weight of the polishing pad 2 was measured and then attached later. However, this does not mean a temporal order, but rather that such steps are necessary. Since it means, the polishing pad 2 may be attached first, and the diamond polishing tool 6 may be attached later.

다음에, 턴테이블(1)을 소정시간과 속도로 작동하여 폴리싱패드(2)를 절삭시킨다(D). 이어서, 폴리싱패드(D)에 부착된 가루나 이물질을 에어건으로 분사하여 제거한 후에 절삭 후의 폴리싱패드(2)의 무게를 측정한다(E). 다음에 폴리싱패드(2)의 절삭전의 무게와 절삭후의 무게를 비교하여 절삭량에 따른 절삭력을 측정한다(F). Next, the turntable 1 is operated at a predetermined time and speed to cut the polishing pad 2 (D). Subsequently, after the powder or foreign matter adhering to the polishing pad D is removed by spraying with an air gun, the weight of the polishing pad 2 after cutting is measured (E). Next, the cutting force according to the cutting amount is measured by comparing the weight before cutting and the weight after cutting of the polishing pad 2 (F).

이상에서 설명한 본 발명에 따르면, 종래와 같이 절삭력의 측정을 위해 소프트한 재질의 폴리싱패드(2)의 절삭 깊이를 측정하는 대신에 절삭 전후의 무게의 차이를 검출함으로써, 측정에 따른 오차를 줄일 수 있고, 상대적으로 짧은 시간 동안만의 절삭만으로도 충분한 무게의 절삭량을 확보할 수 있어서, 측정의 정밀도가 향 상된다. 또한, 폴리싱패드(2)의 저면측에 오목부(26) 또는 돌출부를 형성하고, 이에 대응하여 턴테이블(1)의 상면에 돌출부(24) 또는 오묵부를 형성함으로써, 간편하고 신속하게 폴리싱패드(2)를 교체할 수 있어서 제조회사별 폴리싱패드에 대한 충분하 검사도 가능하고, 다이아몬드 연마구에 대한 샘플링 비율을 높이거나 전수검사도 가능하여 검사의 신뢰성을 높일 수 있다. According to the present invention described above, instead of measuring the cutting depth of the polishing pad 2 of soft material for measuring the cutting force as in the prior art, by detecting the difference in the weight before and after cutting, it is possible to reduce the error according to the measurement In addition, a cutting amount of sufficient weight can be secured by only cutting for a relatively short time, thereby improving the accuracy of the measurement. In addition, by forming a recess 26 or a protrusion on the bottom side of the polishing pad 2, and correspondingly forming a protrusion 24 or a recess on the top surface of the turntable 1, the polishing pad 2 can be easily and quickly. ), It is possible to inspect enough polishing pads by manufacturer, and to increase the sampling rate of diamond polishing tools or to perform the whole inspection, thereby increasing the reliability of the inspection.

Claims (1)

웨이퍼(4) 연마용 폴리싱패드(2)의 표면을 절삭하여 폴리싱패드(2)를 적절한 평탄도와 거칠기로 회복시키는데 사용되며, 상면에 다이아몬드입자(8)가 부착되는 다이아몬드 연마구(6)의 절삭력 테스트 방법에 있어서, 상기 폴리싱패드(2)가 설치될 턴테이블(1)의 상부에 배치되는 연마헤드(5)에 테스트할 측정대상 다이아몬드 연마구(6)를 장착하는 단계(A), 절삭 전의 폴리싱패드(2)의 무게를 측정하는 단계(B), 상기 폴리싱패드(2)를 턴테이블(1)의 상면에 부착하는 단계(C), 다이아몬드 연마구(6)를 폴리싱패드(2)에 접촉시키면서 턴테이블(1)을 회전시켜서 폴리싱패드(2)를 소정시간 절삭하는 단계(D), 절삭 후의 폴리싱패드(2)의 무게를 측정하는 단계(E), 폴리싱패드(2)의 절삭전과 절삭후의 무게를 비교하는 단계(F)로 구성되는 것을 특징으로 하는 다이아몬드 연마구 절삭력 측정방법.The cutting force of the diamond polishing tool 6, which is used to cut the surface of the polishing polishing pad 2 for polishing the wafer 4 to restore the polishing pad 2 to proper flatness and roughness, and to which the diamond particles 8 adhere to the upper surface. In the test method, the step (A) of mounting the diamond polishing tool (6) to be tested is mounted on the polishing head (5) disposed above the turntable (1) on which the polishing pad (2) is to be installed (A), polishing before cutting. Measuring the weight of the pad 2 (B), attaching the polishing pad 2 to the top surface of the turntable 1 (C), while contacting the polishing pad 2 with the diamond polishing tool 6. Rotating the turntable 1 to cut the polishing pad 2 for a predetermined time (D), measuring the weight of the polishing pad 2 after cutting (E), the weight before and after cutting the polishing pad 2 Diamond polishing, characterized in that consisting of the step (F) How to measure sphere cutting force.
KR1020060048261A 2006-05-29 2006-05-29 Test method of diamond disc cutting power KR100725578B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107433521A (en) * 2017-08-07 2017-12-05 贵州大学 The Testing Platform of high speed and precision roll bistrique

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JPH06206145A (en) * 1991-06-21 1994-07-26 Konica Corp Cutting work device
JPH08243882A (en) * 1995-03-05 1996-09-24 Hitachi Seiki Co Ltd Method and device for supervising cutting condition of machine tool
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Publication number Priority date Publication date Assignee Title
JPS5796754A (en) 1980-11-26 1982-06-16 Sumitomo Electric Ind Ltd Automatic tool wear detecting method in cutting high hardness material
JPH06206145A (en) * 1991-06-21 1994-07-26 Konica Corp Cutting work device
JPH08243882A (en) * 1995-03-05 1996-09-24 Hitachi Seiki Co Ltd Method and device for supervising cutting condition of machine tool
KR20030061076A (en) * 2002-01-10 2003-07-18 한국기초과학지원연구원 Tool holder
KR20050115153A (en) * 2004-06-03 2005-12-07 한국과학기술원 Tool wear monitoring system with hybrid approach to cutting force regulation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107433521A (en) * 2017-08-07 2017-12-05 贵州大学 The Testing Platform of high speed and precision roll bistrique

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