KR100692039B1 - Image display apparatus - Google Patents

Abstract

An image displaying apparatus is provided to reduce a fabrication cost by installing various components such as a circuit board on a protrusion without fixing devices such as a pem nut and a supporter bracket. In an image displaying apparatus, an image displaying panel (200) displays an image on a screen. A frame(210) is disposed at a rear surface of the image displaying panel(200). Circuit boards(220a,220b) are coupled to a rear side of the frame(210) to apply a driving voltage to the image displaying panel(200). Protrusions(211a,211b,211c,211d) are protruded from the frame(210) by being drawn toward the rear side. Holes(212,221,241) penetrated by a coupling device(230) for coupling the circuit boards(220a,220b) are formed on the protrusions(211a,211b,211c,211d). And the fixing units fixing the coupling device(230) are further provided between the protrusions(211a,211b,211c,211d) and the image displaying panel(200).

Description

Image Display Apparatus

1A to 1B are diagrams for explaining a conventional video display device.

2A to 2C are diagrams for explaining the configuration of the video display device of the present invention.

3 is a view for explaining another form of the fixing part.

4 is a view for explaining another form of the protrusion.

5 is a view for explaining a case in which the height of at least one of the plurality of protrusions is different from other protrusions.

6 is a view for explaining the number of holes formed in the protrusion and the shape of the fixing portion corresponding thereto.

7A to 7B are views for explaining an example of the structure of the plasma display panel.

<Explanation of symbols for the main parts of the drawings>

200: video display panel 210: heat sink

211a, 211b, 211c, and 211d: protrusions 212, 221, and 241: holes

220a, 220b: circuit board 230: fastening means

240a, 240b: fixed part

The present invention relates to an image display device, and more particularly, to an image display device having an improved structure of a heat sink (Frame) provided on a rear surface of an image display panel.

The image display apparatus includes an image display panel and a heat sink that supports the image display panel and emits heat generated from the image display panel to the outside.

There are various types of image display panels, such as a liquid crystal display (LCD), a field emission display (FED), an electroluminescense (EL), a plasma display panel, and the like.

The heat sink is installed on the back of the image display panel.

In addition, a circuit board for supplying a driving signal to the image display panel is disposed on the heat sink, and fixing means such as a PEM NUT and a supporter bracket are used for this purpose.

Looking at the conventional video display device that uses the fixing means such as a pampnut, a supporter bracket as follows.

1A to 1B are diagrams for describing a conventional video display device.

First, referring to FIG. 1A, in the conventional video display device, fixing means 110a, 110b, 110c, and 110d are disposed on a heat sink 100 installed on a rear surface of an image display panel (not shown).

In addition, circuit boards 120a and 120b are disposed on the fixing means 110a, 110b, 110c and 110d to apply a driving signal for driving the image display panel.

The arrangement of the heat sink 100, the fixing means 110a, 110b, 110c, and 110d and the circuit boards 120a and 120b in the conventional video display device will be described in detail with reference to FIG. 1B.

Referring to FIG. 1B, although not shown in the related art image display device, fixing means 110a, 110b, 110c, and 110d are bonded to the heat sink 100 by welding or the like, and thus bonded to the heat sink 100. The circuit boards 120a and 120b are fastened to the fixing means 110a, 110b, 110c and 110d by fastening means 130 such as a screw.

like this. In the conventional video display device, fixing means (120a, 120b) such as a pampnut and a supporter bracket are used to install the circuit boards 110a, 110b, 110c, and 110d on the heat sink 100 that apply a driving signal to the image display panel. Therefore, there is a problem in that the manufacturing cost increases due to the use of the fixing means (120a, 120b), such as a pamnut, supporter bracket.

In addition, in the conventional video display device, the entire manufacturing process is lengthened due to the time required for bonding the fixing means 120a and 120b, such as a pampnut and the supporter bracket, to the heat sink 100, thereby increasing the manufacturing cost. have.

In addition, in the conventional image display apparatus, defects are likely to occur due to alignment errors in the process of bonding the fixing means 120a and 120b, such as a pamnut and a supporter bracket, to the heat sink 100. There is a problem that the manufacturing cost is further increased.

SUMMARY OF THE INVENTION In order to solve the above problems, an object of the present invention is to provide an image display device capable of sufficiently stably installing a circuit board on a heat sink without using fixing means such as a pemnut and a supporter bracket by improving the structure of the heat sink.

The image display device of the present invention for achieving the above object is coupled to the image display panel for displaying an image on the screen, the heat sink is provided on the back of the image display panel and the rear of the heat sink, and is driven to the image display panel And a circuit board for applying a voltage, wherein the heat sink is provided with a protrusion that is protruded toward the rear, and the protrusion has a hole through which a fastening means for fastening the circuit board is formed. Preferably, a fixing part to which the fastening means is fixed is further provided between the protrusion and the image display panel.

In addition, the plurality of protrusions, the height of at least one of the plurality of protrusions is characterized in that different from the height of the other protrusions.

In addition, the height of the protrusion is characterized in that it is formed in proportion to the heat generation amount of the circuit board.

In addition, the height of the protrusion is characterized in that within 3mm to 15mm.

In addition, the protruding portion is characterized in that the cross section of the trapezoidal shape is longer than the length of the upper side of the base side.

In addition, the protrusion is characterized in that the cross section of the rectangular shape.

In addition, the protruding portion is characterized in that its cross section is longitudinal.

The hole may be formed by being drawn in the direction of the image display panel on the protrusion.

In addition, the hole is characterized in that formed at least one per projection.

In addition, at least one fastening means is fixed to one of the fixing parts.

The image display panel may be a plasma display panel which displays an image on a screen by using plasma discharge.

Hereinafter, an image display device of the present invention will be described in detail with reference to the accompanying drawings.

2A to 2C are views for explaining the configuration of the video display device of the present invention.

First, referring to FIG. 2A, an image display apparatus of the present invention includes an image display panel 200, a heat sink 210, and circuit boards 220a and 220b.

The image display panel 200 displays an image on the screen.

The heat dissipation plate 210 is installed on the rear surface of the image display panel 200 to support the image display panel 200 and to discharge heat generated from the image display panel 200 to the outside.

In particular, the heat dissipation plate 210 is provided with protrusions 211a, 211b, 211c, and 211d protruding from the rear side. In addition, the protrusions 211a, 211b, 211c, and 211d have at least one hole 212 through which the fastening means 230 such as a screw for fastening the circuit boards 220a and 220b passes. .

Further, a fixing part 240 to which the fastening means 230 is fixed is further provided between the protrusions 211a, 211b, 211c, and 211d and the image display panel 200.

The fixing part 240 is preferably formed with a hole 241 through which the fastening means 230 penetrates.

In addition, the fixing part 240 is made of a metallic material that is easy to form the hole 241, it is preferably formed in the shape of a bar (Bar).

The circuit boards 220a and 200b are coupled to the rear of the heat sink 210 and apply a driving signal to the image display panel 200. In addition, it is preferable that holes 221 through which the fastening means 230 pass are formed in the circuit boards 220a and 220b.

The fastening means 230 passes through the holes 221 formed in the circuit boards 220a and 220b and the holes 212 formed in the protrusions 211a, 211b, 211c, and 211d to the holes 241 of the fixing part 240. By being fastened, the circuit boards 220a and 220b are installed on the heat sink 210.

Here, the protrusions 211a, 211b, 211c, and 211d described above will be described in detail with reference to FIG. 2B.

Referring to FIG. 2B, the protrusions 211a, 211b, 211c, and 211d are drawn to the rear on the heat sink 210 to protrude to a predetermined height h.

Preferably, the protrusions 211a, 211b, 211c, and 211d are formed by drawing their cross sections longitudinally toward the rear side on the heat sink 210.

Here, the height h of the protrusions 211a, 211b, 211c, and 211d is proportional to the amount of heat generated by the circuit boards 220a and 220b disposed on the protrusions 211a, 211b, 211c, and 211d.

For example, in the case of the protrusions 211a, 211b, 211c, and 211d in which the circuit boards 220a and 220b with relatively high heat generation are arranged, such as an intelligent power module, such protrusions 211a, 211b, The height h of 211c and 211d is made relatively higher so that heat generated in the circuit boards 220a and 220b is more easily discharged to the outside.

On the other hand, in the case of the protrusions 211a, 211b, 211c, and 211d on which the circuit boards 220a and 220b with relatively low heat generation are disposed, the height h of the protrusions 211a, 211b, 211c, and 211d is relatively determined. It does not matter if it is lower.

Preferably, the height h of the protrusions 211a, 211b, 211c, and 211d is 3 mm or more and 15 mm or less.

The reason why the height h of the protrusions 211a, 211b, 211c, and 211d is 3 mm or more and 15 mm or less is because the height h of the protrusions 211a, 211b, 211c, and 211d is less than 3 mm. , The gaps between the circuit boards 220a and 220b disposed on the 211b, 211c and 211d and the image display panel 200 are excessively narrow so that heat generated from the circuit boards 220a and 220b is transferred to the image display panel 200. As a result, the operation characteristic of the image display panel 200 increases, and when the height h of the protrusions 211a, 211b, 211c, and 211d is greater than 15 mm, the thickness of the image display device may be excessively thick. Because it increases.

In addition, as described above, the protrusions 211a, 211b, 211c, and 211d are formed with holes 212, and the holes 212 are arranged on the protrusions 211a, 211b, 211c, and 211d in the direction of the image display panel 200. It is preferable to be formed by drawing in. That is, the holes 212 are formed to be recessed in the direction of the image display panel 200 on the protrusions 211a, 211b, 211c, and 211d.

As described above, when the hole 212 is formed by being drawn in the direction of the image display panel 200 on the protrusions 211a, 211b, 211c, and 211d, the fastening means 230 when the fastening means 230 is fastened to the outside direction. It does not fall easily, and thus the circuit boards 220a and 220b can be fastened more strongly.

The fastening structures of the protrusions 211a, 211b, 211c, and 211d, the circuit boards 220a and 220b, and the fixing part 240 will be described in detail with reference to FIG. 2C.

Referring to FIG. 2C, the fastening means 230 is fixed to the fixing part 240 through the circuit boards 220a and 220b and the protrusions 211a, 211b, 211c and 211d so that the fastener 240 as shown in FIGS. 1A to 1B is fixed. The circuit boards 220a and 220b are fastened to the heat sink 210 even without the PEM NUT and the supporter bracket.

Accordingly, the manufacturing cost is reduced by reducing the cost of omission of the pampnut, the supporter bracket and the like.

In the above, only the case where the fixing part 240 has a bar shape has been illustrated and described. Alternatively, the shape of the fixing part 240 may be variously changed. This will be described with reference to FIG. 3 attached thereto.

3 is a view for explaining another form of the fixing part.

Referring to FIG. 3, a predetermined material is filled in the space between the protrusions 211a, 211b, 211c, and 211d formed on the heat sink 210 and the image display panel 200 to form the fixing part 300. That is, the fixing part 300 is substantially the same shape as that of the space between the protrusions 211a, 211b, 211c, and 211d and the image display panel 200.

The material forming the fixing part 300 of this type has fluidity to be filled in the space between the protrusions 211a, 211b, 211c, and 211d and the image display panel 200, and also when the fastening means 230 is fastened. It is preferable that the fastening means 230 have a property of not falling outward.

For example, the material forming the fixing part 300 as shown in FIG. 3 is a silicon material so as to be filled in the space between the protrusions 211a, 211b, 211c, and 211d and the image display panel 200. It has a predetermined fluidity and has strength enough to hold the fastening means 230 so as not to fall out after being hardened.

On the other hand, the protrusions 211a, 211b, 211c, and 211d have been shown and described only in the case where their cross-section is in the form of a bell, but unlike the protrusions 211a, 211b, 211c, and 211d, the cross-sections are rectangular and trapezoidal. It may be in various forms such as form. This will be described with reference to FIG. 4.

4 is a view for explaining another form of the protrusion.

Referring to FIG. 4, the protrusions 211a, 211b, 211c, and 211d formed on the heat sink 210 may have a trapezoidal shape whose cross section is longer than the length of the upper side as shown in (a).

Alternatively, the protrusions 211a, 211b, 211c, and 211d formed on the heat sink 210 may have a rectangular cross section as shown in (b).

The shape of the cross section of such protrusions 211a, 211b, 211c, and 211d may be determined by the drawing equipment used.

Meanwhile, when a plurality of protrusions 211a, 211b, 211c, and 211d are formed on one heat sink 210, at least one height of the plurality of protrusions 211a, 211b, 211c, and 211d may be formed differently from the other. have. This will be described with reference to FIG. 5.

5 is a view for explaining a case in which the height of at least one of the plurality of protrusions is different from other protrusions.

Referring to FIG. 5, among the four protrusions 501a, 501b, 502a, and 502b formed in one heat sink 500, the height h1 of the first protrusions 501a and 501b as shown in FIG. It is higher than the height h2 of the same second protrusions 502a and 502b.

The first circuit board 510a is disposed on the first protrusions 501a and 501b as shown in (a), and the second circuit board 510b is disposed on the second protrusions 502a and 502b.

Here, as shown in (a), the calorific value of the first circuit board 510a disposed on the first protrusions 501a and 501b, which is relatively higher than that of (b), is higher than that of the second circuit board 510b. Larger is preferred.

That is, the heights of the first protrusions 501a and 501b in which the first circuit board 510a having a larger heat generation amount are disposed are relatively higher. In this way, heat generated in the first circuit board 510a having a relatively high heat generation amount can be more easily discharged to the outside.

On the other hand, the number of holes formed in the protrusions and the shape of the fixing portion corresponding to this can be variously changed, with reference to Figure 6 attached to this as follows.

6 is a view for explaining the number of holes formed in the protrusion and the shape of the fixing portion corresponding thereto.

Referring to FIG. 6, the heat sink 600 includes third protrusions 601a, 602a, 603a, and 604a, in which one hole 601b, 602b, 603b, and 604b are formed, and a plurality of holes, for example, four holes 606. Fourth protrusions 605a and 605b are formed.

The third circuit board 610a is disposed on the third protrusions 601a, 602a, 603a, and 604a, and the fourth circuit board 610b is disposed on the fourth protrusions 605a and 605b.

The holes 611a formed on the third circuit board 610a are formed at positions corresponding to the holes 601b, 602b, 603b, and 604b formed on the third protrusions 601a, 602a, 603a, and 604a. The holes 611b formed on the fourth circuit board 610b are also formed at positions corresponding to the holes 606 formed on the fourth protrusions 605a and 605b.

Here, one fastening means 630 penetrating the hole 611a of the third circuit board 610a and the hole 601b of the protruding portion 601a is coupled to the hole 621a of the fixing portion 620a.

The fixed part of 620a corresponding to the protrusion of 601a is formed with one hole corresponding to the hole of 601b, that is, a hole of 621a.

Meanwhile, four fastening means 630 penetrating through the hole 611b of the fourth circuit board 610b and the hole 606 of the protruding portion 605a are respectively coupled to the hole 621b of the fixing portion 620b.

The fixed part of 620b corresponding to the protrusion of 605a is formed with a plurality of holes corresponding to the hole of 606, for example, four holes 606.

As such, one or more holes are formed in one fixing portion, and the fastening means is fixed to the one or more holes. As a result, one or more fastening means is fixed to one fixing part.

The image display panel of the image display device of the present invention described above in detail is preferably a plasma display panel for displaying an image using plasma discharge.

That is, in the Plasma Display Apparatus including a plasma display panel and a heat sink disposed on the rear surface of the plasma display panel, it is preferable that the heat sink is formed to include a protrusion protruding from the drawing.

Here, an example of the structure of the plasma display panel will be described with reference to FIGS. 7A to 7B.

7A to 7B are views for explaining an example of the structure of the plasma display panel.

First, referring to FIG. 7A, a plasma display panel of the present invention may include a front panel including an electrode, preferably a front substrate 701 on which scan electrodes 702 and Y and sustain electrodes 703 and Z are formed. A rear panel including a back substrate 711 on which an electrode, preferably an address electrode 713 and X, intersects 700 and the scan electrodes 702 and Y and the sustain electrodes 703 and Z described above. 710 is made of a combination.

Here, the electrodes formed on the front substrate 701, preferably the scan electrodes 702 and Y and the sustain electrodes 703 and Z, generate a discharge in a discharge space, that is, a discharge cell, and at the same time Maintain the discharge.

The dielectric layer, preferably on the front substrate 701 on which the scan electrodes 702 and Y and the sustain electrodes 703 and Z are formed, covers the scan electrodes 702 and Y and the sustain electrodes 703 and Z. Upper dielectric layer 704 is formed.

This upper dielectric layer 704 limits the discharge currents of the scan electrodes 702 and Y and the sustain electrodes 703 and Z and insulates the scan electrodes 702 and Y from the sustain electrodes 703 and Z.

A protective layer 705 is formed on the upper dielectric layer 704 to facilitate discharge conditions. The protective layer 705 is formed by, for example, depositing a material such as magnesium oxide (MgO) over the upper dielectric layer 704.

On the other hand, the electrodes formed on the rear substrate 711, preferably the address electrodes 713 and X, are electrodes for supplying data pulses to the discharge cells.

A dielectric layer, preferably a lower dielectric layer 715 is formed on the rear substrate 711 on which the address electrodes 713 and X are formed to cover the address electrodes 713 and X.

This lower dielectric layer 715 insulates the address electrodes 713, X.

The upper portion of the lower dielectric layer 715 is formed with a discharge space, that is, a partition wall 712 such as a stripe type or a well type for partitioning the discharge cells. Accordingly, discharge cells such as red (R), green (G), and blue (B) are formed between the front substrate 701 and the rear substrate 711.

Here, a predetermined discharge gas is filled in the discharge cell partitioned by the partition wall 712.

In addition, a phosphor layer 714 is formed in a discharge cell partitioned by the partition wall 712 to emit visible light for image display during address discharge. For example, red (R), green (G), and blue (B) phosphor layers may be formed.

In the plasma display panel of the present invention described above, when the driving voltage is supplied to at least one of the scan electrodes 702, Y, the sustain electrodes 703, Z, and the address electrodes 713, X, the partition wall 712 is provided. Discharges occur within the discharge cells partitioned by each other.

Then, vacuum ultraviolet rays are generated in the discharge gas filled in the discharge cells, and the vacuum ultraviolet rays are applied to the phosphor layer 714 formed in the discharge cells. Then, a predetermined visible light is generated in the phosphor layer 714, and the visible light is emitted to the outside through the front substrate 701 on which the upper dielectric layer 704 is formed. A predetermined image is displayed on the outer surface.

Meanwhile, in the description of FIG. 7A, only the case where the scan electrodes 702 and Y and the sustain electrodes 703 and Z each consist of one layer is illustrated and described. Alternatively, the scan electrodes 702 and Y or It is also possible that at least one of the sustain electrodes 703 and Z consists of a plurality of layers. This will be described with reference to FIG. 7B.

Referring to FIG. 7B, the scan electrodes 702 and Y and the sustain electrodes 703 and Z may be formed of two layers, respectively.

In particular, in consideration of light transmittance and electrical conductivity, the scan electrodes 702 and Y and the sustain electrodes 703 and Z are opaque silver (Ag) in order to emit light generated in the discharge cell to the outside and to secure driving efficiency. Bus electrodes 702b and 703b and transparent electrodes 702a and 703a made of transparent indium tin oxide (ITO).

As such, the reason why the scan electrodes 702 and Y and the sustain electrodes 703 and Z include the transparent electrodes 702a and 703a is that when visible light generated in the discharge cells is emitted to the outside of the plasma display panel. To be released effectively.

In addition, the reason why the scan electrodes 702 and Y and the sustain electrodes 703 and Z include the bus electrodes 702b and 703b is that the scan electrodes 702 and Y and the sustain electrodes 703 and Z are transparent electrodes. In the case of including only 702a and 703a, the driving efficiency can be reduced because the electrical conductivity of the transparent electrodes 702a and 703a is relatively low, so that the transparent electrodes 702a and 703a can cause such a reduction in the driving efficiency. To compensate for low electrical conductivity.

7A to 7B, only one example of the plasma display panel is shown and described, and it is to be understood that the present invention is not limited to the plasma display panel having the structure shown in FIGS. 7A to 7B. For example, the plasma display panel of FIGS. 7A to 7B shows only the case where the upper dielectric layer 704 and the lower dielectric layer 715 are each one layer, but the upper dielectric layer 704 and At least one or more of the lower dielectric layers 715 may be formed of a plurality of layers.

In the plasma display apparatus including the plasma display panel, the heat dissipation plate is provided with a protrusion that is drawn toward the rear and protrudes, and the protrusion is formed with a hole through which the fastening means for fastening the circuit board is formed. In addition, the fixing unit is further provided between the protrusion and the plasma display panel.

As such, it is preferable that the heat sink having the protrusions drawn and projected is applied to the plasma display apparatus because the plasma display panel is more easily enlarged than other image display panels, compared to other image display panels having an average size. This is because the heat sink applied to the plasma display device is relatively higher because the heat sink applied to the plasma display device is relatively larger and the size of the heat sink applied to the plasma display device is also larger than that of other image display panels.

As such, the technical configuration of the present invention described above can be understood by those skilled in the art that the present invention can be implemented in other specific forms without changing the technical spirit or essential features of the present invention.

Therefore, the exemplary embodiments described above are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the appended claims rather than the foregoing detailed description, and the meaning and scope of the claims are as follows. And all changes or modifications derived from the equivalent concept should be interpreted as being included in the scope of the present invention.

As described in detail above, the video display device of the present invention is manufactured by omitting fixing means such as a pampnut and a supporter bracket by forming protrusions which are drawn on the heat sink and protruding, and disposing various parts such as a circuit board on the protrusions. There is an effect that can reduce the unit cost.

In addition, the fixing part is disposed between the protrusion of the heat sink and the image display panel, so that a component such as a circuit board is more firmly fixed to the heat sink.

Claims (11)

An image display panel displaying an image on a screen; A heat sink installed on a rear surface of the image display panel; And A circuit board coupled to the rear side of the heat sink and configured to apply a driving voltage to the image display panel; Including, The heat sink is provided with a protrusion that is protruded by drawing toward the rear (Drawing), The protrusion is formed with a hole (Hole) through which the fastening means for fastening the circuit board, And a fixing part to which the fastening means is fixed between the protrusion and the image display panel. The method of claim 1, The protrusion is a plurality, And a height of at least one of the plurality of protrusions is different from that of the other protrusions. The method of claim 1, And the height of the protrusion is formed in proportion to the amount of heat generated by the circuit board. The method of claim 1, And a height of the protrusion is within 3mm to 15mm. The method of claim 1, And the projecting portion has a trapezoidal shape whose cross section is longer than the length of the upper side. The method of claim 1, And the protrusion has a rectangular cross section. The method of claim 1, And the projecting portion is vertical in cross section. The method of claim 1, The hole is And an image display panel is drawn in the direction of the image display panel. The method of claim 1, And at least one hole is formed in each protrusion. The method of claim 1, At least one fastening means is fixed to the fixing part. The method of claim 1, And the image display panel is a plasma display panel which displays an image on a screen using plasma discharge.

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