KR100689705B1 - Illuminating apparatus comprising means for controlling temperature of projection lens - Google Patents

Illuminating apparatus comprising means for controlling temperature of projection lens Download PDF

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Publication number
KR100689705B1
KR100689705B1 KR1020010024250A KR20010024250A KR100689705B1 KR 100689705 B1 KR100689705 B1 KR 100689705B1 KR 1020010024250 A KR1020010024250 A KR 1020010024250A KR 20010024250 A KR20010024250 A KR 20010024250A KR 100689705 B1 KR100689705 B1 KR 100689705B1
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KR
South Korea
Prior art keywords
projection lens
exposure apparatus
type
light source
temperature
Prior art date
Application number
KR1020010024250A
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Korean (ko)
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KR20020085031A (en
Inventor
강현우
Original Assignee
삼성전자주식회사
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Priority to KR1020010024250A priority Critical patent/KR100689705B1/en
Publication of KR20020085031A publication Critical patent/KR20020085031A/en
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Publication of KR100689705B1 publication Critical patent/KR100689705B1/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891Temperature

Abstract

The present invention relates to an exposure apparatus having a projection lens temperature adjusting means, and the present invention provides for at least a projection of a light source and a pattern engraved in a mask on a wafer to convert the light emitted from the light source into planar light. An exposure apparatus having a projection lens, wherein the temperature adjusting means is provided around the projection lens to remove heat transferred from the projection lens circumference to maintain the projection lens at a predetermined temperature. Provides an exposure apparatus, characterized in that the thermoelectric element.
Semiconductor, exposure device, projection lens, temperature control

Description

TECHNICAL FIELD The exposure apparatus includes a projection lens temperature adjusting means.             

1 is a view showing a schematic configuration of an exposure apparatus including a projection lens temperature adjusting means according to an embodiment of the present invention.

FIG. 2 is a view showing in more detail the configuration of the projection lens temperature adjusting means provided around the second optical system in FIG. 1.

     * Description of Signs of Major Parts of Drawings *

10: light source 12, 16: first and second optical system

14 mask 18 wafer stage

20: wafer 22: projection lens temperature adjusting means

24: first and second semiconductor material connection metal

26: heat insulating material 28: current direction

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing apparatus for a semiconductor device, and more particularly, to an exposure apparatus including temperature adjusting means around a projection lens.

The manufacturing process of the semiconductor device consists of a repetition of a thin film forming process and a photolithography process of patterning the formed thin film in a desired form.

As the degree of integration of semiconductor devices increases, the photolithography process becomes more complicated and an exposure apparatus having a higher resolution is required.

In this way, the degree of integration of the semiconductor device depends on the performance of the exposure apparatus, in particular the resolution.

The resolution of the exposure apparatus is related to the wavelength of the light used and the aberration of the lens.

The shorter the wavelength of the light used, the higher the resolution, but in order to ensure this, it is necessary to remove aberrations from the projection lens used in the exposure apparatus and to minimize physical state changes.

The aberration or physical state change of the projection lens is greatly influenced by the temperature of the lens itself.

Therefore, during the exposure, the projection lens needs to be kept constant at a predetermined temperature. For this purpose, a conventional exposure apparatus such as a stepper or scanner includes a projection lens temperature adjusting device called a TCU (Temperature Control Unit). .

TCU is a water-cooled cooling apparatus using pure water (DI Water) as a refrigerant, and generally has excellent cooling efficiency, but has the following problems.

First, because water is used, even in a closed loop, the amount of cooling water is reduced by gradual evaporation as time goes by, so it is necessary to replenish water by detecting it, resulting in human or time loss.

Second, the time required for the temperature stabilization stage suitable for the process progress after the TCU is longer than that of the TCU down.

Therefore, the present invention is to improve the above-mentioned problems of the prior art, the present invention is easy to adjust the temperature of the projection lens and the exposure apparatus having a projection lens temperature adjusting means that can greatly reduce the time required to stabilize the temperature It is to provide.

In order to achieve the above object, the present invention provides an exposure apparatus including at least a light source, a fly-eye lens for converting light emitted from the light source into planar light, and a projection lens for miniaturizing and projecting a pattern engraved on a mask onto a wafer. Temperature control means is provided around the projection lens to remove heat transmitted from the projection lens circumference to keep the projection lens constant at a predetermined temperature, wherein the temperature control means is made of a thermoelectric element. Most prominent ?? There is a characteristic.

The thermoelectric element is composed of alternating n-type and p-type semiconductor materials, and a pair of adjacent n-type and p-type semiconductor materials are connected by metal so that current directions in the adjacent n-type and p-type semiconductor materials are reversed. have.

When the exposure apparatus according to the present invention is used, it is easy to switch the heat absorbing / heating part simply by changing the direction of the current, and the heat absorbing / heating amount is adjusted according to the amount of current, so that precise temperature control is possible to facilitate temperature control of the projection lens. And since it can adjust precisely and the heat absorption effect is quickly shown, the time required for temperature stabilization of a projection lens can be reduced.

Hereinafter, an exposure apparatus including a projection lens temperature adjusting means according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 schematically shows an exposure apparatus having a projection lens temperature adjusting means according to an embodiment of the present invention, wherein the exposure apparatus according to the embodiment of the present invention includes a light source 10, a first optical system 12, It is comprised as the mask 14 and the 2nd optical system 16. As shown in FIG.

Reference numerals 18 and 20 in the drawings denote wafers loaded on the wafer stage 18 located under the second optical system 16, respectively.

The light source 10 emits light of a single wavelength capable of realizing a line width CD determined according to the degree of integration.

The first optical system 12, together with an element for converting light emitted from the light source 10 into planar light, such as a fly's eye lens, has an aperture limiting a part of the incident light to obtain a more uniform line width and higher resolution. ), Such as Incident Aperture.                     

The mask 14 is provided with a pattern to be formed on the wafer 20, and the center thereof is provided so as to coincide with the optical axis L of the exposure apparatus.

The second optical system 16 is an optical system for condensing light passing through the mask 14, that is, light having pattern information drawn on the mask 14, to a predetermined region of the wafer 20.

That is, the optical system includes a reduction projection lens (not shown) for reducing the same pattern as the pattern drawn on the mask 14 and transferring it to the predetermined area of the wafer.

Around the second optical system 16, there is provided a means 22 for minimizing the physical change according to the temperature of the projection lens and the resulting aberration change.

The means 22 is a temperature adjusting means provided in a form surrounding the second optical system 16 and is a thermoelectric element composed of the first and second semiconductor materials 22a and 22b.

The first and second semiconductor materials 22a and 22b are n-type and p-type semiconductor materials, respectively, and may be a semiconductor material such as germanium (Ge) or silicon (Si), or lead-tellurium (Pb-Te) or bismuth- Compound semiconductor materials such as tellurium (Bi-Te), indium-arsenic (In-As), and the like.

Meanwhile, FIG. 2 illustrates in more detail the projection lens temperature adjusting means provided around the second optical system in accordance with the present invention, wherein the first and second semiconductor materials 22a and 22b constituting the means 22 are formed in accordance with the present invention. 2 are alternately provided around the optical system 16.

One side of the reservoir first and second semiconductor material layers 22a and 22b is connected to the metal 24, and the other side of each of the first and second semiconductor material layers 22a and 22b thus connected is The metal is connected to another neighboring semiconductor material layer.

For example, the other side of the n-type semiconductor material layer in which one side of the n-type semiconductor material layer is connected to the metal by the neighboring p-type semiconductor material layer is connected to the other p-type semiconductor material layer by metal.

When a current is supplied to the metal 24 in this way, the direction of the current 28 flows upward in the first semiconductor material layer 22a, which is an n-type semiconductor material layer, as shown in the figure, and the second semiconductor, which is a p-type semiconductor material layer. The material layer 22b flows downward.

Accordingly, the lower portions of the first and second semiconductor material layers 22a and 22b become heat generating portions, and the upper portions become cooling portions that absorb heat.

When the direction 28 of the current flowing in the first and second semiconductor material layers 22a and 22b is reversed, the heat generating portion and the cooling portion are reversed.

Heat generated in the heat generating portion is removed by flowing a cooling gas to the heat generating portion.

As such, the first and second semiconductor material layers 22a and 22b constituting the thermoelectric element are provided in the heat insulating material 26.

While many details are set forth in the foregoing description, they should be construed as illustrative of preferred embodiments rather than to limit the scope of the invention.

For example, one of ordinary skill in the art may replace the means 22 provided around the second optical system 16 as a thermoelectric device in which two kinds of metals are bonded instead of semiconductors.

In addition, as a means of cooling the projection lens based on the technical idea of the present invention, it is possible to implement a cooling means having a mechanism different from the present invention without using a refrigerant such as water any more.

Therefore, the scope of the present invention should not be defined by the described embodiments, but should be determined by the technical spirit described in the claims.

Using the exposure apparatus according to the present invention as described above, it is easy to switch the heat absorbing / heating part simply by changing the direction of the current, and the heat absorbing / heating amount is adjusted according to the amount of current, so precise temperature control is possible, and thus the temperature of the projection lens can be easily It can be adjusted precisely and precisely, and the heat-absorbing and heat-producing effect can be shown quickly, thereby reducing the time required for temperature stabilization of the projection lens.

Claims (2)

  1. An exposure apparatus comprising at least a light source, a fly-eye lens for converting light emitted from the light source into planar light, and a projection lens for reducing and projecting a pattern engraved on a mask onto a wafer,
    Temperature control means is provided around the projection lens to remove heat transferred from the projection lens circumference to maintain the projection lens at a predetermined temperature, wherein the temperature control means is an exposure made of a thermoelectric element. Device.
  2. The thermoelectric device of claim 1, wherein the n-type and p-type semiconductor materials are alternately formed, and a pair of neighboring n-type and p-type semiconductor materials are disposed so that current directions in the n-type and p-type semiconductor materials are opposite to each other. Exposure device connected by metal.
KR1020010024250A 2001-05-04 2001-05-04 Illuminating apparatus comprising means for controlling temperature of projection lens KR100689705B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020010024250A KR100689705B1 (en) 2001-05-04 2001-05-04 Illuminating apparatus comprising means for controlling temperature of projection lens

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020010024250A KR100689705B1 (en) 2001-05-04 2001-05-04 Illuminating apparatus comprising means for controlling temperature of projection lens

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KR20020085031A KR20020085031A (en) 2002-11-16
KR100689705B1 true KR100689705B1 (en) 2007-03-08

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088178A (en) * 1994-04-22 1996-01-12 Canon Inc Projection aligner and manufacture of device
JPH0950952A (en) * 1995-08-07 1997-02-18 Nikon Corp Projection aligner
JPH09102454A (en) * 1995-10-03 1997-04-15 Nikon Corp Projection aligner
KR19980042711A (en) * 1996-11-25 1998-08-17 요시다쇼이치로 Exposure device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088178A (en) * 1994-04-22 1996-01-12 Canon Inc Projection aligner and manufacture of device
JPH0950952A (en) * 1995-08-07 1997-02-18 Nikon Corp Projection aligner
JPH09102454A (en) * 1995-10-03 1997-04-15 Nikon Corp Projection aligner
KR19980042711A (en) * 1996-11-25 1998-08-17 요시다쇼이치로 Exposure device

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KR20020085031A (en) 2002-11-16

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