KR100687535B1 - Apparatus device for liquid crystal display - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a driving device of a liquid crystal display device, wherein input terminals of a driving drive IC connected to the connection leads are arranged in a mirror so as to be symmetrical with respect to both sides of the center with respect to the center of the driving drive IC. Input terminals formed at positions symmetrical with respect to the center of the IC are connected to each other via metal wires formed inside the driving drive IC, while being symmetrical with the input leads of the first TCPs bonded to the printed circuit board. Signal transmission lines formed on the printed circuit board are formed between the first TCPs and the second TCPs to electrically connect the input leads formed on the second TCPs.

Then, since the signal transmission lines are formed only on one side of the connection pads based on the connection pads, the size of the printed circuit board is smaller than in the related art, or the number of layers forming the printed circuit board is reduced.

In addition, the length of each signal transmission line is reduced to reduce the resistance value and the amount of electromagnetic waves generated, thereby improving product reliability.

Drive drive IC, input terminal, mirror array, metal wiring, TCP, printed circuit board, signal transmission wiring

Description

Apparatus for liquid crystal display

1 is an exploded perspective view showing a driving device of a conventional liquid crystal display device.

2 is a perspective view showing a driving device of the liquid crystal display device according to the present invention;

Figure 3 is an exploded perspective view showing a drive device according to the present invention.

4 is an explanatory view showing a state in which the printed circuit board and the tape carrier package are electrically connected to each other according to the present invention.

The present invention relates to a driving device of a liquid crystal display device, and more particularly, to position the input terminals on both sides of the center with respect to the center of the driving drive IC in a mirror form, and symmetrically with respect to the center of the driving drive IC. A pair of input terminals formed on the printed circuit board by connecting a pair of input terminals formed on the printed circuit board and having the same signal input thereto to be formed on the metal wiring layer of the driving drive IC. The present invention relates to a driving device of a liquid crystal display device having a reduced formation area, thereby reducing the size of a printed circuit board or the number of layers laminated.

Recently, the liquid crystal display device, which has been spotlighted as a display product, uses a liquid crystal panel that displays information using the electrical / optical properties of the liquid crystal, a driving device that is electrically connected to the liquid crystal panel to drive the liquid crystal panel, and guides light to the liquid crystal panel. It consists of a backlight assembly.

The liquid crystal panel includes a thin film transistor (TFT) substrate, a color filter substrate facing the TFT substrate, and a liquid crystal material injected between both substrates. In a typical TFT substrate, a plurality of gate lines and a plurality of data lines are formed to cross each other, and a thin film transistor and a pixel electrode, which are switching elements, are formed in an intersection area of the gate lines and the data lines. Input pads electrically connected to the driving device are formed at one end of each of the gate lines and the data lines.

On the other hand, the driving device is a source driving drive IC electrically connected to the input pads formed at one end of the data lines to apply a gray voltage to each of the data lines, and the gate pads electrically connected to the input pads formed at one end of the gate lines. The gate drive driver IC that applies the thin film transistor ON / OFF signal to the gate, the source and the gate drive drive IC are electrically connected to each other, and active elements and passive elements that generate various drive signals are mounted. It is composed of printed circuit waves which are connected with passive elements and have signal transmission lines for transmitting driving signals to source and gate driving drive ICs.

There are two main methods for interconnecting the liquid crystal panel and the driving device having the above-described configuration, one of which is a chip on glass (hereinafter referred to as "COG") bonding method, and the other is a tab. (TAB; Tape Automated Bonding) bonding method.                         

In the COG bonding method, the source and gate drive driver ICs are directly mounted on one side and one side of the liquid crystal panel on which the input pads are formed, and the output terminals of the source and gate drive drive ICs are connected to the respective input pads. The connector is used to electrically connect the input terminals of the source and gate driving drive ICs with the signal transmission patterns of the printed circuit board.

In addition, the tap bonding method connects output pads of a tape carrier package in which a source and gate driving drive IC are mounted on a soft tape to input pads of gate lines and data lines, and the input leads of the tape carrier package are connected to the printed circuit board. Electrical connections to the signaling patterns. Since only the tap bonding method is shown here, the tap bonding method will be described below.

The signal transmission lines 44 electrically connected to the input leads 15 of the tape carrier package 20 are formed of the printed circuit board 40 to which the tape carrier packages 20 are attached as shown in FIG. 1. It extends in a wave shape along one long side.

That is, based on the connection pads 47 of the signal transmission lines 44 to which the input leads 15 of the tape carrier package 20 are connected, the signal transmission lines may be provided on one side of the connection pads 47. 45 is repeatedly formed in a “∩” shape, and signal transmission lines 46 are repeatedly formed in a “신호” shape on the other side of the connection pads 47. The signal transmission lines 46 formed on the other side of the second line) extend from the signal transmission lines 45 formed on one side of the connection pads 44.

The reason why the signal transmission lines 45 and 46 are alternately formed on both sides of the connection pads 47 based on the connection pads 47 to have a wave shape is bonded to the printed circuit board 40. The input leads 25 of the plurality of tape carrier packages 20 are arranged in the same order to each other, and are arranged at the same position in each tape carrier package 20, and the input leads into which the same signal is input ( This is because 25) is entirely connected to one signal transfer wire 44.

This will be described in more detail as follows. Here, for convenience of description, the tape carrier package first attached to the liquid crystal panel (not shown) and the printed circuit board 40 is referred to as a first tape carrier package 21, and the two tape carrier packages are attached to the liquid crystal panel and the printed circuit board 40. The second tape carrier package to be attached is called a second tape carrier package 23.

As shown in FIG. 1, a number 1 is given to an input lead 26 formed at the leftmost side of the first tape carrier package 21, and an input lead 29 formed at the rightmost side of the first tape carrier package 21. In the second tape carrier package 23, the number 1 is assigned to the leftmost input lead 25 and the number n is assigned to the rightmost input lead 29). Is given.

Each of the numbered input terminals 26 is bonded to the first signal transmission lines 48a arranged first among the signal transmission lines 44 formed on the printed circuit board 40. Each of the two numbered input leads 27 is bonded with the second signal transmission lines 48b arranged second of the signal transmission lines 44, and each of the n numbered input leads 27 is connected. The input leads 29 are bonded to the signal transmission lines 48n arranged at the last of the signal transmission lines 44.                         

Therefore, in order to connect all of the input leads 26, 27 ... 29 arranged at the same position to one signal transmission lines 48a, 48b ... 48n, the signal transmission lines 44 are wave-shaped as described above. There is no choice but to form.

However, when the signal transmission lines 44 are formed in the wave shape as described above, the size of the printed circuit board 40 is increased or the number of layers stacked is increased, thereby increasing the manufacturing cost of the liquid crystal display device. . This is because the number of signal transmission lines 44 that can be formed in one layer is determined by the wiring width of the signal transmission lines 44 and the interval between the signal transmission lines 44.

That is, in order to form one data, one clock, and one control signal transmission line among the signal transmission lines 44, a space of at least 0.24 mm (wire width 0.11 mm + gap between the wires 0.13 mm) is required. Forming power, gray and ground signal transmission requires a minimum space of 0.33 mm (wire width 0.18 mm + spacing 0.15 mm between wires).

For example, eighteen data signal transmission lines, two clock signal transmission lines, three control signal transmission lines, and the like are formed on the same layer of the printed circuit board 40, and three power and ground signal transmission lines are formed. If it is assumed that about 10 gray signal transmission wires are formed, it takes 10.8 mm of space to form the above-described signal transmission wires 44 on one side and the other side of the connection pads 47, so that the printed circuit The space occupied by the signal transmission lines 44 in the substrate 40 is 21.6 mm in total.

Meanwhile, when the signal transmission patterns 44 are alternately formed on one side and the other side of the connection pads 44 on the basis of the connection pads 47, the lengths of the signal transmission lines 44 are increased. In addition, the resistance value and the emission amount of the electromagnetic wave are increased, there is a problem that the distortion of the signal is generated and the reliability of the product is lowered.

Here, reference numeral 30 denotes a drive drive IC.

Accordingly, an object of the present invention is to reduce the number of layers constituting the printed circuit board when the signal transmission lines are formed on the same size printed circuit board, and to divide and form the signal transmission lines on the same number of layers as before. In this case, the size of the printed circuit board is reduced.

Another object of the present invention is to form the length of the signal transmission lines as short as possible to reduce the resistance value, the influence of the capacitance and the amount of electromagnetic waves generated.

Still other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.

The present invention for achieving the above object is a liquid crystal panel for displaying information by the electro-optical properties of the liquid crystal, a printed circuit board for generating a driving signal required to drive the liquid crystal panel, liquid crystal panel and printed circuit board and electrical And a connection part electrically connected to the liquid crystal panel and the printed circuit board and the driving drive IC. The input terminals of the driving drive IC connected to the input leads of the connection part include a driving drive IC. A pair of input terminals arranged in a mirror form on both sides with respect to the center of the symmetry, and symmetrical with respect to the center of the drive drive IC, and having the same signal input therein are formed in the metal wiring layer of the drive drive IC. Signal transmission wires connected to metal wires and formed on a printed circuit board Attachment associated from among the odd-numbered even-numbered input leads and a printed circuit board of the first connecting portion is the second attachment of the printed circuit board is electrically connected to the input lead of the second connection which is the input lead of the first connection and symmetry.

Hereinafter, the driving device of the liquid crystal display according to the present invention will be described with reference to FIGS. 2 to 4.

Among the components constituting the liquid crystal display device 100, the liquid crystal panel 100 displaying information and the printed circuit board 400 generating various driving signals to drive the liquid crystal panel 110 may include a plurality of tape carrier packages 200. (Hereinafter referred to as "TCP").

The liquid crystal panel 110 includes a TFT substrate 120, a color filter substrate 130 attached to the TFT substrate 120, and a liquid crystal material injected between both substrates. Here, a plurality of gate lines (not shown) and a plurality of data lines (not shown) are formed on the TFT substrate 120 to cross each other, and thin film transistor elements are formed at the intersections of the gate lines and the data lines, and the gate lines are formed. Input pads (not shown) are formed at one end of the and data lines.

The TCP 200 according to the present invention includes a soft tape 205 having connection patterns formed thereon, and a drive drive IC 300 mounted on the tape 205 to be electrically connected to the connection patterns and to drive the liquid crystal panel 110. It is composed of

The plurality of connection patterns have one end connected to the input terminals 350 and 360 of the driving drive IC 300 and the other end bonded to the printed arc substrate 400 to electrically connect the printed circuit board 400 and the driving drive IC 300. Input leads 250 and 260, one end of which is connected to an output terminal (not shown) of the driving drive IC 300, and the other end of which is bonded to the input pads formed on the liquid crystal panel 100 so as to bond the driving drive IC 300 and the liquid crystal. It consists of output leads (not shown) that electrically connect the panel 110.

According to the present invention, the input terminals 350 and 360 of the driving drive IC 300 connected to the input leads 260 are shown in FIG. 4 to reduce the size of the printed circuit board 300 or the number of stacked layers. Likewise, the mirrors are arranged on both sides of the center line 310 with respect to the center line 310 of the drive drive IC 300, and are formed at portions that are symmetrical to each other based on the center line 310 of the drive drive IC 300. The pair of input terminals 350 and 360 to which the same signal is to be input are connected to each other by metal wires 340 formed in the metal wire layer of the driving drive IC 300.

This will be described in more detail with reference to FIG. 4 as follows.

For convenience of description, an area from one end in the longitudinal direction of the drive drive IC 300 to the center line 310 of the drive drive IC 300 is referred to as a first area 320, and from the center line 310 of the drive drive IC 300. An area up to the other end of the driving drive IC 300 in the longitudinal direction is referred to as a second area 330. In addition, it is assumed that n + 3 input terminals 350 and 360 through which 6-bit R, G, and B data are input are formed in the first region 320 and the second region 330, for example.

In the first region 320, the first input terminals 350 from 1 to n + 3 are arranged in ascending order. The first input terminal 351 is formed on the leftmost side of the first region 320. The input terminal 359 of n + 3 is formed at the far right of the first region 320 (center of the driving drive IC).

On the other hand, in the second region 330, the second input terminals 360 from 1 to n + 3 are arranged in descending order, and in the leftmost part of the second region 330 (the center of the driving drive IC), n + An input terminal 369 of 3 is formed, and a first input terminal 361 is formed at the rightmost side of the second region 330.

Meanwhile, the first and second input terminals 350 and 360 formed at symmetrical portions of the first input terminal 350 and the second input terminal 360 and input the same signal are metal wires 340. Are connected to each other by Therefore, the R, G, and B data input from the printed circuit board 400 to the first input terminals 350 are transferred to the second input terminals 360 through the metal wires 340. That is, as shown in FIG. 4, the first input terminal 351 formed on the leftmost side of the first region 320 among the first input terminals 350 has a second region among the second input terminals 360. The first input terminal 361 formed at the rightmost side of 330 and the metal wire 340 are electrically connected, and the n + 3 input terminal 359 formed at the rightmost side of the first region 320 is The n + 3 input terminal 369 formed on the left side of the second region 330 is electrically connected to the metal via 340.

As described above, the first input terminals 350 and the second input terminals 360 are arranged in a mirror shape on both sides of the center line 310 based on the center line 310 of the driving drive IC 300, and the metal wirings are arranged in a mirror shape. When the first and second input terminals 350 and 360 to which the same signals are input by the signals 340 are connected, the design of the signal transmission lines 440 is simpler than in the related art, and the printed circuit board ( Only about half of a space is required to form the signal transmission lines 440 on the 400.

The structure of such signal transmission lines will be described with reference to FIGS. 2 to 4 as follows.

Hereinafter, for convenience of description, among the input leads 250 and 260 of each TCO 200, the input leads connected to the first input terminals 350 of the driving drive IC 300 are referred to as first input leads 250. The input leads connected to the second input terminals 360 are referred to as second input leads 260. In FIG. 4, odd-numbered bonded TCPs of the printed circuit board 400 are referred to as first TCP 201 and even-numbered The bonded TCPs are referred to as the second TCP 203.

The signal transmission lines 440 are formed along the long side of the printed circuit board 400 to which the TCPs 201 and 203 are bonded to electrically connect the first TCP 201 and the second TCP 203 to the outside. The second input leads 260 are formed in a “U” shape between the second input leads 260 of the first TCP 201 and the first input leads 250 of the second TCP 203. And the first input leads 250 are connected.

More specifically, as shown in FIG. 4, the first signal transmission line 441 formed at the innermost side of the signal transmission lines 440 and having the shortest length is the first of the second input leads 260. It is formed on the right side of the TCP 201 and is formed on the left side of the second TCP 203 among the first input leads 261 and the first input leads connected to the first input terminal, and the first input terminal ( The first input lead 251 connected to the 351 is connected.

Also, the n + 3 signal transmission line 449 formed at the outermost side of the signal transfer lines 440 and having the longest connection length is formed at the center of the first TCPs 201 among the second input leads 260. N + 3 input leads 269 and n + 3 input terminals 369 connected to n + 3 input terminals 369 and formed in the center of second TCP 203 among n + 3 input terminals 369 The n + 3 input lead 259 to be connected is connected.

As described above, the metal wires 340 are electrically connected to the input leads 250 and 260 and the input terminals 350 and 360 that are formed at positions symmetrical with each other in the TCP 200 and to which the same signal is input. In addition, the signal transmission lines 440 formed on the printed circuit board 400 electrically connect the first and second TCPs 201 and 203 adjacent to each other. Therefore, unlike the related art, the signal transmission lines 440 are connected to the connection pads 470 by the metal wires 340 electrically connecting the first and second input terminals 350 and 360. Since only one side of the 470 is formed, the space required for forming the signal transmission lines 440 in the printed circuit board 400 is greatly reduced when the present invention is applied.

For example, 23 data, clock, and control signal transmission lines that require at least 0.24 mm of space to form one signal transmission line 440, and 0.33 at least to form one signal transmission line 440. In the case of forming 16 power, ground, and gray signal transmission wires that require a space of mm, a space of at least 21.6 mm is required to form these 39 signal transmission wires 440 on the same layer. It became. However, in the present invention, since the signal transmission lines 440 are formed only on one side of the connection pad 470 by the metal wires 340, the 39 signal transmission lines 440 are formed on the same layer. It only takes space.

Therefore, when all of the 39 signal transmission lines 440 described for example in one layer are formed, the size of the printed circuit board 400 is significantly reduced compared to the conventional, and the printed circuit board 400 having the same size as the conventional one is formed. In the case of forming all of the 39 signal transmission lines 440 described above, the number of layers constituting the printed circuit board 400 is reduced as compared with the related art.

A process of inputting various driving signals including RGB data to each driving drive IC by the signal transmission lines and the metal wirings formed as described above will be described below.

When various driving signals including RGB data are generated from various active elements (not shown) electrically connected to the signal transmission lines 440, the driving signals generated from the active elements are n + 3 signal transmission lines ( 440 is transmitted to the first input leads 250 of the first TCP 201.

The driving signals transmitted to the first input leads 250 are input to each of the first input terminals 350 formed in the first region 320 of the driving drive IC 300 along the first input leads 250. The driving signals input to the first input terminals 350 are input to the second input terminals 360 arranged to be symmetrical with the first input terminals 350 through the metal wires 340.

Subsequently, the driving signals transmitted to the second input terminals 360 are transferred to the signal transmission lines 440 formed on the printed circuit board 400 through the second input leads 260 of the first TCP 201. The driving signals transmitted to the signal transmission lines 440 are input to the first input leads 250 of the second TCP 203 located adjacent to the first TCP 201.

The driving signals are continuously transmitted from the first TCP 201 bonded to the printed circuit board 400 to the last TCP (not shown) through the above-described path.

As described above, the input terminals of the driving drive ICs connected to the connection leads are arranged in mirrors so as to be symmetrical with respect to both sides of the center with respect to the center of the driving drive IC, and with respect to the center of the driving drive ICs. Input terminals formed at symmetrical positions are connected to the metal wirings inside the driving drive IC, while input leads of TCPs attached to the printed circuit board are connected by signal transmission lines formed on the printed circuit board.

That is, because of the metal wires formed inside the driving drive IC, the signal transfer wires are formed on only one side of the connection pads based on the connection pads connected to the input leads, thereby reducing the size of the printed circuit board. Since the number of layers constituting the printed circuit board is reduced, the manufacturing cost of the product can be reduced.

In addition, since TCP input terminals and input leads are arranged to be symmetrical to each other with respect to the center of the drive driver IC, the lengths of the signal transmission lines connecting the pair of input leads to which the same signal is input are shortened, thereby providing a resistance value. And the amount of electromagnetic waves is reduced has the effect of improving the reliability of the product.

Claims (6)

A liquid crystal panel displaying information by electric and optical properties of the liquid crystal; A printed circuit board electrically connected to the liquid crystal panel and mounted with active elements and passive elements to generate various driving signals for driving the liquid crystal panel; A drive drive IC electrically connected to the liquid crystal panel and the printed circuit board to drive the liquid crystal panel; And Connection leads are formed on one surface of the connection lead to electrically connect the liquid crystal panel, the printed circuit board, and the driving drive IC; The drive drive IC First input terminals connected to the connection leads and formed on one side of the center with respect to the center of the driving drive IC; Second input terminals connected to the connection leads and formed on the other side of the center with respect to the center of the driving drive IC so as to be symmetrical with the first input terminals; The first input terminal and the second input terminal are formed in a plurality of metal wiring layers of the drive drive IC, and are formed at positions symmetrical with respect to one side and the other side with respect to the center of the drive drive IC and input the same signal. Metal wires for electrically connecting; And An output terminal formed at the other end in the width direction of the driving drive IC opposite to the first and second input terminals and outputting a driving signal generated by the driving drive IC to the liquid crystal panel; The connection part includes first connection parts bonded to an odd number of the printed circuit board and the liquid crystal panel, and second connection parts bonded to even numbers of the printed circuit board and the liquid crystal panel. 2 The connecting leads formed at the connecting part First input leads, one end of which is connected to the first input terminals and the other end of which is connected to the printed circuit board, to transmit signals related to the driving transmitted from the printed circuit board to the first input terminals; Second input leads having one end connected to the second input terminals and the other end connected to the printed circuit board to transmit signals related to the driving transmitted from the printed circuit board to the second input terminals, The printed circuit board includes signal transmission lines formed at positions symmetrical to each other and electrically connecting the second connection leads of the first connection part to which the same signal is input and the first connection leads of the second connection part. And two connection pads connected to the other ends of the first and second connection leads at both ends of the signal transmission lines. The method of claim 1, wherein the first input terminals are formed n, characterized in that arranged in ascending order from one input terminal to n input terminals from one longitudinal side of the drive drive IC to the center of the drive drive IC. A drive device for a liquid crystal display device. The method of claim 1, wherein the second input terminals are formed n, characterized in that arranged in descending order from the n input terminal to the first input terminal from the center of the drive drive IC to the other longitudinal direction of the drive drive IC. A drive device for a liquid crystal display device. The driving apparatus of claim 1, wherein the signal transmission lines are formed in a “U” shape on one side of the connection pads based on the connection pads. The liquid crystal display device of claim 1, wherein the connection part is a connection connector in which first and second connection leads are formed on a flexible tape to electrically connect the printed circuit board to the driving drive IC. Device. The driving unit of claim 1, wherein the driving unit is mounted on a soft tape, and the first and second connection leads are formed on one side of the driving unit IC based on the driving unit IC. And a tape carrier package having output leads for electrically connecting the output terminals and the liquid crystal panel to the other side of the drive IC.

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