KR100687005B1 - Apparatus for manufacturing semiconductor devices equipped with wafer inspection system - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing apparatus in which a wafer inspection apparatus is integrally formed, wherein the semiconductor device manufacturing apparatus includes a buffer portion in which a wafer temporarily stays, wherein the wafer inspection apparatus for inspecting a wafer is integrally formed in the buffer portion. The wafer inspection apparatus includes a chuck rotatable for loading a wafer; An imager capable of imaging the wafer loaded on the chuck; And a control system for controlling the imager and obtaining predetermined information from the image of the wafer obtained by the imager. According to the present invention, since the wafer inspection apparatus is provided in the buffer portion, there is no need to transfer the wafer to other measurement equipment for inspection. Therefore, there is an effect that time required for wafer processing is saved.

Description

A device for manufacturing a semiconductor device in which a wafer inspection device is formed integrally {APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES EQUIPPED WITH WAFER INSPECTION SYSTEM}

1 is a plan view schematically showing an apparatus for manufacturing a semiconductor device according to an embodiment of the present invention.

2 is a block diagram showing a wafer inspection apparatus in the apparatus for manufacturing a semiconductor device according to the embodiment of the present invention.

3 is a plan view showing a part of the wafer inspection apparatus according to the embodiment of the present invention;

4 is a cross-sectional view showing a part of a wafer inspection apparatus according to an embodiment of the present invention.

<Description of Symbols for Major Parts of Drawings>

100; An apparatus 110 for manufacturing a semiconductor element; Loosen

120; Index unit 130; Buffer section

140; Robot movement passage 150; Process unit

200; Wafer inspection apparatus 210; Imager

215; Control system 220; Vision system department

230; Main control unit 235; Interface part

240; Reference 250; Lighting device

260; chuck

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing apparatus, and more particularly, to a semiconductor device manufacturing apparatus in which an apparatus for inspecting an edge portion of a wafer is integrally formed.

A semiconductor device is a large scale integration (LSI) that is realized through a process of depositing and patterning a thin film on a wafer several times and is currently widely used in various fields of our industry. have. In the thin film deposition process of the semiconductor device manufacturing process, the bevel process of selectively etching the thin film deposited on the wafer can be improved to improve the characteristics of the wafer. In other words, by selectively etching the thin film deposited on the wafer edge, especially the thin film deposited on the wafer to remove the unnecessary material that may be generated as a contaminant during the wafer processing process and to reduce the stress applied to the wafer further improved process To make it possible.

After this bevel process, the sample wafer is measured by a predetermined measurement equipment to confirm the process result. By the way, it is conventional to check the result of the bevel process by using the naked eye of the image measured by the measurement equipment. Since it is judged by the operator's supervision, not by the established standard, there is a very big problem that there is a possibility of error in the judgment of the residual film quality.

On the other hand, the beveling process proceeds to certain specific installations, which conventionally have a buffer section where the wafer temporarily stays. Conventionally, wafers subjected to the beveling process once stayed in the buffer part and then moved to other measuring equipment, and then inspected the wafer edge part. Accordingly, a separate wafer inspection apparatus was required in addition to the equipment in which the bevel process or the other process proceeds. In addition, since it takes a long time to transfer the wafer to the wafer inspection apparatus, the wafer processing time increases, resulting in a cost increase.

Accordingly, the present invention has been made to solve the above-mentioned problems in the prior art, and an object of the present invention is to provide an apparatus for manufacturing a semiconductor device in which a wafer inspection apparatus is integrally provided.

A semiconductor device manufacturing apparatus for achieving the above object is characterized in that the wafer inspection device is formed in the buffer portion.

According to an aspect of an exemplary embodiment, there is provided a semiconductor device manufacturing apparatus including a buffer unit for temporarily holding a wafer, wherein the buffer unit includes a wafer inspection apparatus for inspecting a wafer. Equipped with an integrated body, the wafer inspection apparatus includes a chuck rotatable for loading a wafer; An imager capable of imaging the wafer loaded on the chuck; And a control system for controlling the imager and obtaining predetermined information from the image of the wafer obtained by the imager.

In one embodiment of the present invention, it further comprises a reference for providing a reference position of the imager.

In one embodiment of the present invention, the reference is characterized in that fixedly installed at a position adjacent to the edge of the wafer loaded on the chuck.

In one embodiment of the present invention, the imager is fixedly installed or rotatably installed along the outer peripheral surface of the wafer loaded on the chuck.

In one embodiment of the present invention, it characterized in that it further comprises a lighting device for illuminating between the reference and the wafer.

In one embodiment of the invention, the illumination device is characterized in that it is installed under the wafer.

In another aspect of the present invention, there is provided a semiconductor device manufacturing apparatus including a buffer unit for temporarily holding a wafer, wherein the buffer unit includes a wafer inspection apparatus for inspecting a wafer. Equipped with an integrated body, the wafer inspection apparatus includes a chuck rotatable for loading a wafer; A fixed imager capable of imaging the wafer loaded on the chuck; A reference fixedly installed at a position adjacent to an edge of a wafer loaded on the chuck to provide a reference position of the imager; An illumination device positioned below the wafer loaded on the chuck to illuminate between the reference and the wafer; And a control system for controlling the imager and obtaining predetermined information from the image of the wafer obtained by the imager.

According to the semiconductor device manufacturing apparatus according to the present invention, since the wafer inspection apparatus is provided in the buffer portion, there is no need to transfer the wafer to other measurement equipment for inspection. Thus, time for wafer processing is saved.

Hereinafter, an apparatus for manufacturing a semiconductor device according to the present invention will be described in detail with reference to the accompanying drawings.

Advantages of the present invention over prior art will become apparent from the detailed description and claims with reference to the accompanying drawings. In particular, the present invention is well pointed out and claimed in the claims. However, the present invention may be best understood by reference to the following detailed description in conjunction with the accompanying drawings. Like reference numerals in the drawings denote like elements throughout the various drawings.

1 is a plan view schematically showing a semiconductor device manufacturing apparatus according to an embodiment of the present invention, Figure 2 is a block diagram showing a wafer inspection apparatus in a semiconductor device manufacturing apparatus according to an embodiment of the present invention. 3 is a plan view showing a part of the wafer inspection apparatus according to an embodiment of the present invention, Figure 4 is a cross-sectional view showing a part of the wafer inspection apparatus according to an embodiment of the present invention.

(Example)

Referring to FIG. 1, an apparatus 100 for manufacturing a semiconductor device according to an exemplary embodiment may include an index unit 120 having a robot that loads / unloads wafers from a pool 110 in which a plurality of wafers are loaded. And a buffer unit 130 providing a place where the wafer temporarily stays, a movement passage 140 of the robot for loading / unloading the wafer from the buffer unit 130, and a predetermined process on both sides of the movement passage 140. A plurality of process units 150 (for example, bevel processes) are provided. Here, the buffer unit 130 includes a wafer inspection apparatus 200 for inspecting a wafer, particularly an edge portion of the wafer.

2 and 3, the wafer inspection apparatus 200 stores, discriminates, and processes one imager 210 and an image of a wafer edge portion obtained by the imager 210. It is composed of One of the outer circumferential surfaces of the wafer W is formed with a reference 240 serving as a reference position (Home Position) of the imager 210. The reference 240 is fixedly installed in the buffer unit 130. Since the reference 240 is fixed even when the imager 210 is replaced, reproducibility of data is ensured when the diameter of the wafer W is measured. Meanwhile, the wafer W is loaded on the chuck 260, and the chuck 260 is rotatable.

The imager 210 may be fixedly installed as a camera for photographing the wafer edge to obtain a wafer image, in particular an image of the edge of the wafer W, or may be rotatably installed at the edge of the wafer.

The state inspection of the wafer W using the imager 210 is implemented while the imager 210 and the wafer W are rotated by more than 360 ° relative to each other. The relative movement between the imager 210 and the wafer W may be achieved by both rotating. For example, the imager 210 may rotate to the left and the wafer W may rotate to the right. Alternatively, the state of the wafer W can be inspected while any one of the imager 210 and the wafer W rotates. However, when the wafer W is fixed and the imager 210 rotates, there is no possibility that particles generated from the imager 210 or the wafer inspection apparatus 215 fall on the wafer W and cause wafer contamination. Therefore, it is preferable that the imager 210 is fixed and the wafer W rotates.

When the imager 210 photographs the wafer edge while the wafer W is rotated, at least three spaced apart at equal intervals, for example, three locations spaced 120 ° apart from the wafer edge.

The control system 215 is composed of several parts, each of which is composed of a vision system 220 and the main control unit 230 for each function. If necessary, the interface unit 235 may be further included.

The vision system unit 220 controls the camera 210 to allow the camera to take a wafer image, in particular, by photographing a wafer edge, to store the obtained wafer image, and to store the obtained wafer image at a distance spaced 120 ° apart from the edge of the stored wafer. a, b, c) and the like are measured.

The main control unit 230 has already set and registered the reference data, and compares the registered registered data with the wafer image obtained by the camera 210 by driving the built-in program.

As an example of the method of comparing and discriminating, it is determined whether or not this X value is within a range of a setting registered value when the interval of the wafer edge portion that has undergone the beveling process is measured as X. If the X value is within the range of the setting registered value, the bevel process is determined as good, and if it is out of the range, it is determined as bad. In another example, the diameter of the wafer can be measured. As shown in FIG. 4, the diameter D of the wafer W may be measured by obtaining a, b, and c and substituting it into the following equation.

The interface unit 235 is configured by a monitor that allows the operator to easily understand the current work progress and information from the outside.

On the other hand, as shown in Figure 4, the illumination device 250 can be further installed under the edge of the wafer (W) to be measured. When the illumination device 250 is installed, a clearer image of the wafer edge portion can be obtained, thereby reducing the measurement error significantly.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. And, it is possible to change or modify within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the written description, and / or the skill or knowledge in the art. The above-described embodiments are intended to illustrate the best state in carrying out the present invention, the practice in other states known in the art for using other inventions such as the present invention, and the specific fields of application and uses of the invention. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

As described above in detail, according to the semiconductor device manufacturing apparatus according to the present invention, since the wafer inspection apparatus is provided in the buffer portion, there is no need to transfer the wafer to other measurement equipment for inspection. Thus, time for wafer processing is saved.

Claims (8)

In the apparatus for manufacturing a semiconductor element comprising a buffer portion for temporarily holding a wafer, the buffer portion is equipped with a wafer inspection device for inspecting the edge portion of the wafer integrally, The wafer inspection device, A chuck rotatable for loading a wafer; An imaging device capable of photographing the edge portion of the wafer loaded on the chuck; A reference fixed to the outside of the edge of the wafer so that any one of an outer circumferential surface of the wafer becomes a reference position of the imager; A control system for controlling the imager and obtaining predetermined information from an image of a wafer obtained by the imager; Apparatus for manufacturing a semiconductor device comprising a. delete delete The method of claim 1, And said imager is fixedly installed. The method of claim 1, And an illumination device capable of illuminating the reference and the wafer. The method of claim 5, The lighting device is a device for manufacturing a semiconductor device, characterized in that provided below the edge of the wafer. delete The method of claim 1, And the imager is rotatably installed along an outer circumferential surface of the wafer.

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