KR100683414B1 - 부품마운팅장치 - Google Patents
부품마운팅장치 Download PDFInfo
- Publication number
- KR100683414B1 KR100683414B1 KR1020050086467A KR20050086467A KR100683414B1 KR 100683414 B1 KR100683414 B1 KR 100683414B1 KR 1020050086467 A KR1020050086467 A KR 1020050086467A KR 20050086467 A KR20050086467 A KR 20050086467A KR 100683414 B1 KR100683414 B1 KR 100683414B1
- Authority
- KR
- South Korea
- Prior art keywords
- head
- component
- main panel
- head portion
- piezometer
- Prior art date
Links
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
Claims (7)
- 메인패널을 지지하는 스테이지와, 부품을 상기 메인패널에 부착시키는 마운팅헤드를 포함하는 부품마운팅장치에 있어서,상기 마운팅헤드는,상기 부품을 탈착가능하게 지지하는 헤드부와;상기 헤드부를 변위 및 회동시켜 상기 부품을 상기 메인패널의 부착 지점 상에 정위치시키는 수평얼라인부; 및상기 헤드부를 왕복 이송하여 상기 부품을 상기 메인패널에 부착시키는 수직구동부를 포함하며,상기 수평얼라인부는, 상기 헤드부에 나란하게 부착되어 각각 인장 또는 수축됨으로써 상기 헤드부를 변위 또는 회동시키는 한 쌍의 일방향 변위조절부를 포함하고,상기 일방향 변위조절부는, 일단이 상기 헤드부에 연결된 피에조미터를 포함하는 것을 특징으로 하는 부품마운팅장치.
- 삭제
- 삭제
- 제1항에 있어서,상기 피에조미터와 상기 헤드부를 매개하는 플렉시블팁(Flexible Tip)을 더 포함하는 것을 특징으로 하는 부품마운팅장치.
- 제1항에 있어서,상기 일방향 변위조절부는,상기 헤드부에 가해지는 전단력이 상기 피에조미터에 전달되는 것을 방지하기 위한 지지베어링을 더 포함하는 것을 특징으로 하는 부품마운팅장치.
- 제1항에 있어서,상기 헤드부의 적어도 일측 면에 접촉되어 상기 헤드부의 진동을 방지하는 지지부를 더 포함하는 것을 특징으로 하는 부품마운팅장치.
- 제1항에 있어서,상기 수평얼라인부는 수평 방향의 소정 간격으로 복수 개 구비된 것을 특징으로 하는 부품마운팅장치.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050086467A KR100683414B1 (ko) | 2005-09-15 | 2005-09-15 | 부품마운팅장치 |
CNB2005101359686A CN100566536C (zh) | 2005-09-15 | 2005-12-29 | 零部件安装装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050086467A KR100683414B1 (ko) | 2005-09-15 | 2005-09-15 | 부품마운팅장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100683414B1 true KR100683414B1 (ko) | 2007-02-20 |
Family
ID=37879270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050086467A KR100683414B1 (ko) | 2005-09-15 | 2005-09-15 | 부품마운팅장치 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100683414B1 (ko) |
CN (1) | CN100566536C (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240085712A (ko) * | 2022-12-08 | 2024-06-17 | 주식회사 이안하이텍 | 마이크로led소자 리페어 장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001217596A (ja) * | 1999-03-15 | 2001-08-10 | Toray Eng Co Ltd | チップ実装装置におけるアライメント方法 |
JP2001257500A (ja) * | 2000-03-10 | 2001-09-21 | Toray Eng Co Ltd | チップ実装装置およびその装置におけるアライメント方法 |
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2005
- 2005-09-15 KR KR1020050086467A patent/KR100683414B1/ko active IP Right Grant
- 2005-12-29 CN CNB2005101359686A patent/CN100566536C/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001217596A (ja) * | 1999-03-15 | 2001-08-10 | Toray Eng Co Ltd | チップ実装装置におけるアライメント方法 |
JP2001257500A (ja) * | 2000-03-10 | 2001-09-21 | Toray Eng Co Ltd | チップ実装装置およびその装置におけるアライメント方法 |
Non-Patent Citations (2)
Title |
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13217596 |
13257500 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240085712A (ko) * | 2022-12-08 | 2024-06-17 | 주식회사 이안하이텍 | 마이크로led소자 리페어 장치 |
KR102746387B1 (ko) * | 2022-12-08 | 2024-12-24 | 주식회사 이안하이텍 | 마이크로led소자 리페어 장치 |
Also Published As
Publication number | Publication date |
---|---|
CN1933718A (zh) | 2007-03-21 |
CN100566536C (zh) | 2009-12-02 |
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