KR100673630B1 - 반도체 소자 밀봉용 에폭시 수지 조성물 - Google Patents
반도체 소자 밀봉용 에폭시 수지 조성물 Download PDFInfo
- Publication number
- KR100673630B1 KR100673630B1 KR1020050135935A KR20050135935A KR100673630B1 KR 100673630 B1 KR100673630 B1 KR 100673630B1 KR 1020050135935 A KR1020050135935 A KR 1020050135935A KR 20050135935 A KR20050135935 A KR 20050135935A KR 100673630 B1 KR100673630 B1 KR 100673630B1
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- resin composition
- coupling agent
- silane coupling
- semiconductor device
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 58
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 58
- 239000000203 mixture Substances 0.000 title claims abstract description 55
- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 27
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000004593 Epoxy Substances 0.000 claims abstract description 7
- 150000001412 amines Chemical class 0.000 claims abstract description 5
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims description 13
- 239000007822 coupling agent Substances 0.000 claims description 9
- 239000011256 inorganic filler Substances 0.000 claims description 5
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 5
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 125000006274 (C1-C3)alkoxy group Chemical group 0.000 abstract 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 14
- 239000010931 gold Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 229910052737 gold Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 206010040844 Skin exfoliation Diseases 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 229920002545 silicone oil Polymers 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- -1 dimethylaminomethyl Tertiary amines Chemical class 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000011417 postcuring Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- QWOVEJBDMKHZQK-UHFFFAOYSA-N 1,3,5-tris(3-trimethoxysilylpropyl)-1,3,5-triazinane-2,4,6-trione Chemical compound CO[Si](OC)(OC)CCCN1C(=O)N(CCC[Si](OC)(OC)OC)C(=O)N(CCC[Si](OC)(OC)OC)C1=O QWOVEJBDMKHZQK-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000009659 non-destructive testing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229920001299 polypropylene fumarate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/66—Substances characterised by their function in the composition
- C08L2666/72—Fillers; Inorganic pigments; Reinforcing additives
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
구성성분(단위:중량%) | 비교예1 | 비교예2 | 비교예3 | 실시예1 | 실시예2 | |
에폭시 수지 | 다방향족 에폭시 수지 | 4.87 | ||||
바이페닐 에폭시 수지 | 2.10 | |||||
경화제 | 자일록 | 4.16 | ||||
다방향족 페놀 수지 | 0.64 | |||||
경화 촉진제 | 트리페닐포스핀 | 0.20 | ||||
무기 충전제 | 실리카 | 87.00 | ||||
커플링제 | 3-Glycidoxypropyltriethoxysilane | 0.20 | 0.20 | - | - | 0.20 |
Dimethyldimethoxysilane | 0.30 | - | 0.20 | 0.20 | - | |
N-2(aminoethyl)3-aminopropyltrimethoxysilane | - | 0.30 | 0.30 | - | - | |
Tris(3-trimethoxysilylpropyl)iso-cyanurate1) | - | - | - | 0.30 | 0.30 | |
착색제 | 카본블랙 | 0.27 | ||||
왁스 | 카르나우바왁스 | 0.26 |
평가항목 | 비교예1 | 비교예2 | 비교예3 | 실시예1 | 실시예2 | ||
스파이럴 플로우(inch) | 40 | 45 | 38 | 41 | 42 | ||
Tg(℃) | 126 | 125 | 124 | 128 | 127 | ||
리드 프레임 부착력 (kgf) | Cu | After PMC | 65 | 78 | 73 | 78 | 72 |
After 60℃/60%+120hrs | 59 | 70 | 63 | 70 | 67 | ||
Ni-Pd-Au PPF | After PMC | 0 | 0 | 0 | 48 | 40 | |
After 60℃/60%+120hrs | 0 | 0 | 0 | 40 | 32 | ||
Ni-Pd-Au/Ag PPF | After PMC | 43 | 53 | 59 | 78 | 72 | |
After 60℃/60%+120hrs | 23 | 38 | 47 | 65 | 63 | ||
신뢰성 | 외관 크랙발생수 | 0 | 0 | 0 | 0 | 0 | |
에폭시수지 조성물과 리드 프레임간의 박리 발생 수 | 60 | 60 | 60 | 0 | 0 | ||
총시험한 반도체 소자수 | 60 | 60 | 60 | 60 | 60 |
Claims (5)
- 제 1항에 있어서, 상기 시아누레이트계 실란 커플링제의 함량이 전체 에폭시 수지 조성물에 대하여 0.01 ∼ 1 중량%인 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물.
- 제 1항에 있어서, 상기 시아누레이트계 실란 커플링제에 에폭시 실란 커플링제, 머켑토 실란 커플링제, 아민계 실란 커플링제 및 메틸 트리 메톡시 실란 커플링제로 구성된 군에서 선택되는 1종 이상을 병용하는 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물.
- 제 3항에 있어서, 상기 커플링제의 총 함량이 0.01 ∼ 1 중량%인 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물.
- 제 1항에 있어서, 무기 충전제를 전체 에폭시 수지 조성물 대비 82 ∼ 92 중량%로 추가 포함하는 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050135935A KR100673630B1 (ko) | 2005-12-30 | 2005-12-30 | 반도체 소자 밀봉용 에폭시 수지 조성물 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050135935A KR100673630B1 (ko) | 2005-12-30 | 2005-12-30 | 반도체 소자 밀봉용 에폭시 수지 조성물 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100673630B1 true KR100673630B1 (ko) | 2007-01-24 |
Family
ID=38014710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050135935A KR100673630B1 (ko) | 2005-12-30 | 2005-12-30 | 반도체 소자 밀봉용 에폭시 수지 조성물 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100673630B1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9534075B2 (en) | 2011-11-01 | 2017-01-03 | Korea Institute Of Industrial Technology | Isocyanurate epoxy compound having alkoxysilyl group, method of preparing same, composition including same, cured product of the composition, and use of the composition |
US11840601B2 (en) | 2019-11-15 | 2023-12-12 | Korea Institute Of Industrial Technology | Composition of alkoxysilyl-functionalized epoxy resin and composite thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4720515A (en) | 1985-05-17 | 1988-01-19 | Denki Kagaku Kogyo Kabushiki Kaisha | Epoxy resin composition for encapsulating semiconductor |
US4874858A (en) | 1988-03-28 | 1989-10-17 | The B. F. Goodrich Company | Triazine-containing multisilane coupling agents for coating glass fibers, for adhesives, and for protective coatings |
US6391948B1 (en) | 1999-12-14 | 2002-05-21 | 3M Innovative Properties Company | Triazine compounds and use thereof |
-
2005
- 2005-12-30 KR KR1020050135935A patent/KR100673630B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4720515A (en) | 1985-05-17 | 1988-01-19 | Denki Kagaku Kogyo Kabushiki Kaisha | Epoxy resin composition for encapsulating semiconductor |
US4874858A (en) | 1988-03-28 | 1989-10-17 | The B. F. Goodrich Company | Triazine-containing multisilane coupling agents for coating glass fibers, for adhesives, and for protective coatings |
US6391948B1 (en) | 1999-12-14 | 2002-05-21 | 3M Innovative Properties Company | Triazine compounds and use thereof |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9534075B2 (en) | 2011-11-01 | 2017-01-03 | Korea Institute Of Industrial Technology | Isocyanurate epoxy compound having alkoxysilyl group, method of preparing same, composition including same, cured product of the composition, and use of the composition |
US11840601B2 (en) | 2019-11-15 | 2023-12-12 | Korea Institute Of Industrial Technology | Composition of alkoxysilyl-functionalized epoxy resin and composite thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2004074344A1 (ja) | エポキシ樹脂組成物及び半導体装置 | |
KR100673630B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 | |
KR101845147B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자 | |
KR101266536B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 | |
KR100673629B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 | |
KR100673626B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 | |
KR100655131B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 | |
KR100678683B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 | |
KR101340545B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 장치 | |
KR100655129B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 | |
KR100616213B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 | |
KR101266534B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 | |
KR100826105B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 | |
KR100836571B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한반도체 소자 | |
KR100779903B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한반도체 소자 | |
KR100614409B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 | |
KR100826107B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 | |
JP4581456B2 (ja) | エポキシ樹脂組成物及び半導体装置 | |
KR102052197B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자 | |
KR100923443B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한반도체 소자 | |
KR100953822B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한반도체 소자 | |
KR101943698B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자 | |
KR101309818B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 | |
KR100834069B1 (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한반도체 소자 | |
KR20080062440A (ko) | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한반도체 소자 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130103 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20131217 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20141223 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20151218 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20161223 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20171219 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20181220 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20200103 Year of fee payment: 14 |