KR100539214B1 - 테이프 반송장치 - Google Patents

테이프 반송장치 Download PDF

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Publication number
KR100539214B1
KR100539214B1 KR10-2003-0078613A KR20030078613A KR100539214B1 KR 100539214 B1 KR100539214 B1 KR 100539214B1 KR 20030078613 A KR20030078613 A KR 20030078613A KR 100539214 B1 KR100539214 B1 KR 100539214B1
Authority
KR
South Korea
Prior art keywords
clamper
tape
opening
closing mechanism
closing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-2003-0078613A
Other languages
English (en)
Korean (ko)
Other versions
KR20040050839A (ko
Inventor
와타나베히로시
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20040050839A publication Critical patent/KR20040050839A/ko
Application granted granted Critical
Publication of KR100539214B1 publication Critical patent/KR100539214B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames

Landscapes

  • Advancing Webs (AREA)
  • Wire Bonding (AREA)
KR10-2003-0078613A 2002-12-09 2003-11-07 테이프 반송장치 Expired - Fee Related KR100539214B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002356113A JP3768472B2 (ja) 2002-12-09 2002-12-09 テープ搬送装置
JPJP-P-2002-00356113 2002-12-09

Publications (2)

Publication Number Publication Date
KR20040050839A KR20040050839A (ko) 2004-06-17
KR100539214B1 true KR100539214B1 (ko) 2005-12-27

Family

ID=32756535

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-0078613A Expired - Fee Related KR100539214B1 (ko) 2002-12-09 2003-11-07 테이프 반송장치

Country Status (3)

Country Link
JP (1) JP3768472B2 (https=)
KR (1) KR100539214B1 (https=)
TW (1) TW200416907A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100700618B1 (ko) * 2005-12-02 2007-03-28 합명회사 서우테크 티씨피/씨오에프 외관검사기의 필름규격에 의한 폭조절구조
JP4648257B2 (ja) * 2006-06-28 2011-03-09 芝浦メカトロニクス株式会社 被搬送部材の搬送装置及び電子部品の実装装置
CN112147145A (zh) * 2020-10-10 2020-12-29 昆山晋基精密机械模具有限公司 一种基于视觉检测的料带检测设备
KR102731954B1 (ko) * 2022-11-21 2024-11-18 스테코 주식회사 Cof 패키지 용 필름 이송 장치

Also Published As

Publication number Publication date
KR20040050839A (ko) 2004-06-17
JP2004193182A (ja) 2004-07-08
JP3768472B2 (ja) 2006-04-19
TW200416907A (en) 2004-09-01
TWI298184B (https=) 2008-06-21

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