KR100477055B1 - 화학적 처리장치와 도금처리장치 및 화학적 처리방법 - Google Patents

화학적 처리장치와 도금처리장치 및 화학적 처리방법 Download PDF

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Publication number
KR100477055B1
KR100477055B1 KR10-2002-0016429A KR20020016429A KR100477055B1 KR 100477055 B1 KR100477055 B1 KR 100477055B1 KR 20020016429 A KR20020016429 A KR 20020016429A KR 100477055 B1 KR100477055 B1 KR 100477055B1
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KR
South Korea
Prior art keywords
plating
liquid
cup
processing
closed
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KR10-2002-0016429A
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English (en)
Korean (ko)
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KR20020077811A (ko
Inventor
코사키카쓰야
나카모토타케오
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미쓰비시덴키 가부시키가이샤
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

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  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Sustainable Development (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR10-2002-0016429A 2001-04-02 2002-03-26 화학적 처리장치와 도금처리장치 및 화학적 처리방법 Expired - Lifetime KR100477055B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001103431 2001-04-02
JPJP-P-2001-00103431 2001-04-02
JPJP-P-2001-00363086 2001-11-28
JP2001363086A JP2002363788A (ja) 2001-04-02 2001-11-28 化学的処理装置とメッキ処理装置および化学的処理方法とメッキ処理方法と残渣除去処理方法ならびにそれを用いた半導体装置の製造方法およびプリント基板の製造方法

Publications (2)

Publication Number Publication Date
KR20020077811A KR20020077811A (ko) 2002-10-14
KR100477055B1 true KR100477055B1 (ko) 2005-03-17

Family

ID=18956495

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2002-0016429A Expired - Lifetime KR100477055B1 (ko) 2001-04-02 2002-03-26 화학적 처리장치와 도금처리장치 및 화학적 처리방법

Country Status (4)

Country Link
US (3) US20020139684A1 (https=)
JP (1) JP2002363788A (https=)
KR (1) KR100477055B1 (https=)
TW (1) TWI237070B (https=)

Families Citing this family (19)

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US6860944B2 (en) * 2003-06-16 2005-03-01 Blue29 Llc Microelectronic fabrication system components and method for processing a wafer using such components
WO2004114386A2 (en) * 2003-06-16 2004-12-29 Blue29 Corporation Methods and system for processing a microelectronic topography
US7883739B2 (en) * 2003-06-16 2011-02-08 Lam Research Corporation Method for strengthening adhesion between dielectric layers formed adjacent to metal layers
US6881437B2 (en) 2003-06-16 2005-04-19 Blue29 Llc Methods and system for processing a microelectronic topography
CN100393917C (zh) * 2003-12-26 2008-06-11 台湾积体电路制造股份有限公司 化学电镀方法和装置
KR100832705B1 (ko) * 2006-12-23 2008-05-28 동부일렉트로닉스 주식회사 시스템 인 패키지의 비아 도금방법 및 그 시스템
US7776741B2 (en) * 2008-08-18 2010-08-17 Novellus Systems, Inc. Process for through silicon via filing
US10472730B2 (en) 2009-10-12 2019-11-12 Novellus Systems, Inc. Electrolyte concentration control system for high rate electroplating
US9109295B2 (en) 2009-10-12 2015-08-18 Novellus Systems, Inc. Electrolyte concentration control system for high rate electroplating
CN103880127A (zh) * 2012-12-21 2014-06-25 陈晓波 一种等离子管式液体表面放电水处理装置
JP2015178661A (ja) * 2014-03-19 2015-10-08 株式会社荏原製作所 無電解めっき方法
CN104328465B (zh) * 2014-11-10 2017-05-24 浙江振有电子股份有限公司 Hdi印制线路板高均匀性通孔电镀装置
US20200303748A1 (en) * 2017-04-24 2020-09-24 University Of North Texas Nanomanufacturing of metallic glasses for energy conversion and storage
TWI887558B (zh) 2017-07-10 2025-06-21 美商應用材料股份有限公司 具有減少的夾帶空氣的電鍍系統
US10692735B2 (en) 2017-07-28 2020-06-23 Lam Research Corporation Electro-oxidative metal removal in through mask interconnect fabrication
CN111560638B (zh) * 2020-07-06 2021-06-29 苏州清飙科技有限公司 晶圆电镀设备
CN112813482B (zh) * 2020-12-30 2021-11-02 泉芯集成电路制造(济南)有限公司 芯片电镀系统及芯片电镀控制方法
CN113873774B (zh) * 2021-09-15 2023-08-29 江苏贺鸿电子有限公司 一种印刷电路板制作的水平沉铜装置
CN113930813B (zh) * 2021-11-17 2022-04-08 珠海市创智芯科技有限公司 一种应用于晶圆级封装的电镀铜溶液及其电镀工艺

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609129A (ja) * 1983-06-29 1985-01-18 Fujitsu Ltd ウエツト処理装置
KR970059847U (ko) * 1996-04-10 1997-11-10 반도체 웨이퍼 처리액 공급장치
KR980012052A (ko) * 1996-07-18 1998-04-30 문정환 반도체 웨이퍼 습식 처리장치
KR20010003515A (ko) * 1999-06-23 2001-01-15 김무 반도체 기질 도금장치 및 방법

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US5290423A (en) * 1992-04-27 1994-03-01 Hughes Aircraft Company Electrochemical interconnection
US5520205A (en) * 1994-07-01 1996-05-28 Texas Instruments Incorporated Apparatus for wafer cleaning with rotation
DE19534521C1 (de) * 1995-09-06 1996-11-21 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Behandeln von sich in Werkstücke erstreckende Löcher oder Vertiefungen mit flüssigen Behandlungsmitteln und Anwendung des Verfahrens zur Behandlung von Leiterplatten
JP3490238B2 (ja) * 1997-02-17 2004-01-26 三菱電機株式会社 メッキ処理装置およびメッキ処理方法
JP3462970B2 (ja) * 1997-04-28 2003-11-05 三菱電機株式会社 メッキ処理装置およびメッキ処理方法
TW405158B (en) * 1997-09-17 2000-09-11 Ebara Corp Plating apparatus for semiconductor wafer processing
US6616774B2 (en) * 1997-12-26 2003-09-09 Spc Electronics Wafer cleaning device and tray for use in wafer cleaning device
CA2320278C (en) * 1998-02-12 2006-01-03 Acm Research, Inc. Plating apparatus and method
US6395152B1 (en) * 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
AU765242B2 (en) * 1998-10-14 2003-09-11 Faraday Technology, Inc. Electrodeposition of metals in small recesses using modulated electric fields
US6454918B1 (en) * 1999-03-23 2002-09-24 Electroplating Engineers Of Japan Limited Cup type plating apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609129A (ja) * 1983-06-29 1985-01-18 Fujitsu Ltd ウエツト処理装置
KR970059847U (ko) * 1996-04-10 1997-11-10 반도체 웨이퍼 처리액 공급장치
KR980012052A (ko) * 1996-07-18 1998-04-30 문정환 반도체 웨이퍼 습식 처리장치
KR20010003515A (ko) * 1999-06-23 2001-01-15 김무 반도체 기질 도금장치 및 방법

Also Published As

Publication number Publication date
JP2002363788A (ja) 2002-12-18
TWI237070B (en) 2005-08-01
US20040060824A1 (en) 2004-04-01
US20020139684A1 (en) 2002-10-03
KR20020077811A (ko) 2002-10-14
US20020139663A1 (en) 2002-10-03

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