KR100473517B1 - An aluminium plate having a film and an electronic device member using the same - Google Patents

An aluminium plate having a film and an electronic device member using the same Download PDF

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Publication number
KR100473517B1
KR100473517B1 KR20030025799A KR20030025799A KR100473517B1 KR 100473517 B1 KR100473517 B1 KR 100473517B1 KR 20030025799 A KR20030025799 A KR 20030025799A KR 20030025799 A KR20030025799 A KR 20030025799A KR 100473517 B1 KR100473517 B1 KR 100473517B1
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South Korea
Prior art keywords
film
aluminum
resin film
aluminum plate
resin
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KR20030025799A
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Korean (ko)
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KR20030084710A (en
Inventor
하토리노부오
후쿠이마사노부
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가부시키가이샤 고베 세이코쇼
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Priority to JP2002122495A priority Critical patent/JP4237975B2/en
Priority to JPJP-P-2002-00122495 priority
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D

Abstract

An aluminum plate having a film in which a corrosion resistant film 3 and a resin film 4 are sequentially formed from at least one surface of the aluminum platen 2 having a centerline average roughness Ra of 0.2 to 0.6 µm. The corrosion resistant film 3 contains Cr or Zr and has an adhesion amount of 10 to 50 mg / m 2 in terms of Cr or Zr, and the resin film 4 has an average film thickness of 0.05 to 0.3 µm. 1 to 25% by mass relative to the total resin film amount, and the surface of the aluminum platelet 2 or the corrosion resistant film 3 formed thereon has its fine convex portions exposed to the surface of the resin film 4 The surface resistance value between the spherical terminal and the aluminum platen 2 when the spherical terminal having a radius of 10 mm is pressed with a load of 0.4 N on the surface on the side where the resin film 4 is formed is 1 Ω or less. Such a structure provides an aluminum plate having a film and an electronic device member using the same that are excellent in conductivity, heat dissipation, and formability, and are excellent in anti-fingerprint and scratch resistance.

Description

An aluminum plate having a film and an electronic device member using the same {AN ALUMINIUM PLATE HAVING A FILM AND AN ELECTRONIC DEVICE MEMBER USING THE SAME}

The present invention relates to an aluminum plate having a coating. The aluminum plate having the coating of the present invention is particularly excellent in conductivity, heat dissipation, moldability, anti-fingerprint and scratch resistance, and is a housing for electronic devices such as cases and chassis of various external recording devices, rear covers of liquid crystal panels, and fixing frames. (筐 体) or the raw material for the structural member. Moreover, this invention relates to the electronic device member using the aluminum plate which has the film.

In the raw material for electronic devices, electroconductivity is often required. For example, in order to prevent a malfunction of the disk drive apparatus, the case is required to have conductivity necessary for taking (earthing) earth. In addition, the liquid crystal panel fixing jig for fixing the liquid crystal panel to the rear cover is required to have electroconductivity for removing static electricity that causes image noise.

In addition, the heat generated by the electronic device may cause the internal wiring of the electronic device to be disconnected, or the performance deterioration of various electronic components included in the electronic device may be caused. For this reason, in the said raw material for electronic devices, the heat dissipation for discharging the heat which generate | occur | produced from the electronic device to the outside efficiently is calculated | required.

In addition, the material for an electronic device may have a moldability that can be molded to a predetermined shape relatively easily, or may have fingerprints and scratches that can easily be handled by maintaining a good appearance even when transporting or installing an electronic device. It is required to have a surname and the like. Therefore, in order to satisfy these various characteristics required for the electronic device material, various metal materials such as stainless steel (SUS), steel material or aluminum material have been applied to the electronic device material.

In addition, in recent years, a tendency to use a relatively lightweight aluminum material, such as a notebook computer, among metal materials for the electronic device material has increased.

However, when an aluminum material is used for the electronic device material, it is difficult to satisfy the above various characteristics alone, and various surface treatment methods have been proposed to improve the above characteristics.

For example, Japanese Patent Application Laid-Open No. 92-330683 discloses a surface treatment having excellent anti-fingerprint and scratch resistance that makes a fingerprint attached to a surface and a fine wound on the surface inconspicuous by coating a resin containing a lubricant on an aluminum plate. An aluminum plate has been proposed.

According to this method, the rubbing resistance and the scratch resistance of the aluminum sheet are improved to some extent, but in order to make the surface of the aluminum plate coated with the resin, which is an insulating material, insulated from the housing or the structural member of the electronic device, In order to reliably take the earth, a post-process such as removing a part of the resin film and providing a conductive portion exposing aluminum metal is required.

Thus, as a means for solving the problem of securing the conductivity on the surface of the aluminum plate, Japanese Patent Laid-Open Publication No. 95-313930 and Japanese Patent Laid-Open Publication No. 95-314601 are coated with a resin containing a conductive material. The technique to make is proposed.

However, in the method of coating the resin containing the conductive material on the surface of the aluminum plate, it is necessary to uniformly disperse the particles of the conductive material in the resin, so that the particles of the conductive material in the resin film formed on the surface of the aluminum plate. If the contact between the two is not sufficiently secured, a problem arises in that a predetermined conductivity cannot be obtained. Therefore, in order to obtain desired electroconductivity, it was necessary to increase the addition amount of the said electroconductive substance.

When a large amount of such conductive material is added to the resin, the resin film becomes hard and vulnerable. Therefore, when the press work is performed on the aluminum plate on which the resin film is formed, there is a problem that cracking (peeling) of the resin film is likely to occur. there was.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to improve the conductivity and heat dissipation required for a housing of an electronic device such as a case and chassis of a drive device, a frame and a rear cover for fixing a liquid crystal panel, and such structural members. Even if press molding is carried out, the film is excellent in moldability in which cracking (peeling) of the resin film is suppressed, and also excellent in fingerprint resistance and scratch resistance, which can significantly reduce the appearance defects caused by the adhesion of fingerprints and the occurrence of scratches. It is to provide an aluminum plate having a and an electronic device member using the same.

The present invention was configured as follows in order to achieve the above object.

That is, the present invention is an aluminum plate having a coating, comprising: an aluminum platelet having a center line average roughness (Ra) of 0.2 to 0.6 μm, and a corrosion resistant film and a resin film formed on at least one surface of the aluminum platen sequentially from the platelet side. The corrosion resistant film contains Cr or Zr, and the adhesion amount to the aluminum platelets is 10 to 50 mg / m 2 in terms of Cr or Zr, and the resin film has an average film thickness of 0.05 to 0.3 µm and a total resin. 1-25 mass% of lubricant with respect to the film amount, and the surface where the said anticorrosive film was formed on the said aluminum platen or on it, the fine convex part is exposed to the surface of the said resin film, and the surface of the side in which the said resin film was formed, Surface resistance value between the spherical terminal and the aluminum platen when the spherical terminal having a radius of 10 mm is pressed under a load of 0.4 N. Is 1 Ω or less.

Here, center line average roughness Ra is an index of surface roughness based on JIS B0601, and is represented by the following formula (1).

In the above formula, Z (x) represents the height from the average line (center line) of the outline of a section, x is the coordinate in the average line direction, and the x coordinate of this section is 0 to L.

When comprised in this way, since the center line average roughness (Ra) of the said aluminum platelet and each average film thickness of a corrosion-resistant film and a resin film were regulated in the predetermined range, respectively, the base material of the said aluminum platen or the corrosion-resistant film of Fine convex portions are exposed to the surface of the resin film. As a result, an aluminum plate having a film having a desired conductivity and heat dissipation property is ensured and moldability, fingerprint resistance and scratch resistance are high.

In addition, the resin film is preferably composed of at least one selected from polyester resins, urethane resins, epoxy resins, and vinyl resins.

When comprised in this way, when carrying out the shaping | molding process to the aluminum plate which has the said film, since the said resin film becomes easy to follow the deformation | transformation of an aluminum platen, the aluminum plate which has a film which is further excellent in moldability is implemented.

In addition, the lubricant is preferably composed of one or more selected from polyethylene wax, polyalkylene wax, microcrystalline wax, fluorine wax, lanolin wax, carnauba wax, paraffin wax, and graphite.

In such a configuration, since an appropriate lubricity can be imparted to the surface of the aluminum plate having the coating, an aluminum plate having the coating is further improved.

Moreover, it is preferable that the said resin film contains 1-30 mass% colloidal silica with respect to the quantity of all the resin films.

If comprised in this way, since colloidal silica which has comparatively high hardness is added to the said resin film, the said resin film can be hardened further and a scratch resistance can be improved. As a result, an aluminum plate having a film having improved scratch resistance is realized.

And this invention comprised the electronic device member shape | molded using the aluminum plate which has the said film.

In this configuration, an electronic device member having excellent conductivity, heat dissipation, moldability, fingerprint resistance, and scratch resistance is realized.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment which concerns on this invention is described in detail. BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows typically the structure of the aluminum plate which has a film concerning this invention. As shown in Fig. 1, the aluminum plate 1 having the film according to the present invention has sufficient corrosion resistance on the surface of the aluminum platen 2 whose surface roughness (center line average roughness Ra) is adjusted within the scope of the present invention. The corrosion-resistant film 3 for ensuring is coat | covered, and the resin film 4 containing a lubricant is formed on this corrosion-resistant film 3. Hereinafter, the reason for numerical limitation in each element which comprises the aluminum plate 1 with a film which concerns on this invention is demonstrated.

[Aluminum Platen]

The aluminum platen 2 used in the present invention is not particularly limited, and may be made of aluminum or an aluminum alloy having various components, qualities, and plate thicknesses as necessary.

(Centerline Average Roughness Ra of Aluminum Platelet: 0.2 to 0.6 µm)

The centerline average roughness Ra of the aluminum platelets included in the present invention, together with the average film thickness of the corrosion resistant film and the resin film, is conductive, moldable, anti-fingerprint and scratch resistance in an aluminum plate for use in electronic devices. And an important parameter contributing to the expression of various properties such as heat dissipation.

That is, when the centerline average roughness Ra of the aluminum platelets is less than 0.2 µm, the glossiness of the surface of the aluminum plate having the film using the same becomes excessively large, so that the fingerprints attached to the surface and the minute scratches on the surface are easily visible. , Anti-fingerprint and scratch resistance become poor. In this case, since the convex portion of the base plate of the aluminum plate having the fine unevenness or the corrosion resistant film formed according to the fine unevenness thereon becomes difficult to be exposed to the surface of the resin film, it is difficult to secure predetermined conductivity and heat dissipation. Lose.

On the other hand, when the centerline average roughness Ra of the aluminum platen exceeds 0.6 µm, when the aluminum platen is subjected to bending, cracks are likely to occur in the aluminum platen, so that the resin coating of the portion where the bending is performed is performed. In this case, the core shape becomes noticeable or the resin film is easily peeled off. Therefore, in the present invention, by controlling the center line average roughness Ra of the aluminum platelets in the range of 0.2 to 0.6 mu m, an aluminum plate having a film having high conductivity, moldability, fingerprint resistance, scratch resistance, heat dissipation, and the like is obtained. .

Moreover, as a method of adjusting the centerline average roughness Ra of the aluminum platen to the range regulated by the said invention, for example, in the rolling process of an aluminum platen, the method of finishing-rolling using the rolling roll with a suitable surface roughness, and The method of performing an etching process on suitable conditions on the aluminum platen surface after rolling is mentioned.

In the present invention, the corrosion resistance film and the resin film are sequentially formed on the aluminum platelets on which the center line average roughness Ra is adjusted so that fine unevenness is formed. Here, by setting the film thickness of such a corrosion-resistant film and a resin film to the predetermined film thickness regulated by this invention, the base material of the said aluminum platen or the fine convex part of a corrosion-resistant film is exposed to the surface of a resin film, and the desired electroconductivity and An aluminum plate having a film is obtained, in which heat dissipation is ensured and moldability, fingerprint resistance and scratch resistance are increased.

[Corrosion-resistant film]

The corrosion resistant film contained in this invention is provided in order to provide the corrosion resistance required for an aluminum platen. In the present invention, as the corrosion resistant film, a phosphate clomate film, a chromic acid clomate film, a zirconium phosphate film, a coated clomate film, or a coated zirconium film, which is a conventionally known corrosion resistant film containing Cr or Zr as a main component, can be suitably used. Can be used.

In addition, in the present invention, since the amount of Cr or Zr deposition (calculated in terms of Cr or Zr) can be measured relatively simply and quantitatively using, for example, a conventionally known fluorescence X-ray method, it is possible to have the coating without inhibiting productivity. Quality control of aluminum plate is possible.

(Adhesion amount of corrosion resistant film: 10-50 mg / m 2)

When the adhesion amount of the corrosion-resistant film contained in this invention is less than 10 mg / m <2> in Cr or Zr conversion, the whole surface of an aluminum platen cannot be coat | covered uniformly, and securing of corrosion resistance becomes difficult. For this reason, it is an aluminum plate which has a film for use in electronic devices, and cannot endure long-term use. In addition, since Cr or Zr, which is a main component of the corrosion resistant film, is a metal element, when such a metal element is exposed to the surface of the resin film included in the present invention, the conductivity and heat dissipation of the aluminum plate having the film according to the present invention can be improved. It can be raised further.

Moreover, when it exceeds 50 mg / m <2>, although electroconductivity and heat dissipation are ensured, in press molding etc., a crack (peeling) arises in a corrosion resistant film itself, and the problem that it becomes difficult to maintain high corrosion resistance over a long period of time arises. For this reason, in this invention, the adhesion amount of the said corrosion-resistant film is regulated in the range of 10-50 mg / m <2> in Cr or Zr conversion value.

[Resin film]

The resin film contained in this invention is provided in order to provide predetermined | prescribed anti-fingerprint and scratch resistance to the aluminum plate which has a film for use for an electronic device. And in this invention, the average film thickness of the said resin film is regulated to a predetermined range so that predetermined | prescribed anti-fingerprint and scratch resistance may be expressed.

(Average film thickness of resin film: 0.05-0.3 μm)

That is, when the average film thickness of the said resin film is less than 0.05 micrometer, since it is poor in fingerprint resistance, scratch resistance, and lubricity is not enough, molding process becomes difficult. And if the average film thickness of the said resin film exceeds 0.3 micrometer, even if the surface roughness of an aluminum platen is rough, since the resin film covers almost all the base material or corrosion-resistant film of an aluminum platen, surface resistance becomes very high and electroconductivity is ensured appropriately. Will not be. In this case, the generated heat is accumulated in the resin film, whereby the heat dissipation is not properly ensured. For this reason, in this invention, the average film thickness of a resin film is regulated in the range of 0.05-0.3 micrometer.

Moreover, it is preferable that the said resin film is resin which is comparatively easy to follow the deformation | transformation of an aluminum platen from a moldability viewpoint. Especially, it is more preferable to consist of 1 or more types selected from polyester resin, urethane resin, epoxy resin, and vinyl resin. In addition, this invention is not specifically limited about the formation method of the said resin film, For example, from the viewpoint of productivity, the roll coating method which can apply | coat liquid resin continuously to the coil-shaped aluminum platen in which the corrosion resistant film was formed is used. It is desirable to. In this case, the liquid resin applied by the roll coater is baked when passing through the continuous oven to form a resin film.

At this time, since the resin film is initially in a liquid phase applied on the corrosion resistant film, firstly, the main portion of the surface of the corrosion resistant film reflecting the surface roughness of the aluminum platelets is preferentially filled, followed by the subsequent baking treatment. It is formed into a harder film.

In the present invention, the performance of anti-fingerprint and scratch resistance, the average film thickness of the resin film, the surface roughness (center line average roughness Ra) of the aluminum platelets, and the adhesion amount of the corrosion resistant film (calculated in terms of Cr or Zr) The relationship with each parameter of is required, and each said parameter can be set suitably so that predetermined | prescribed fingerprint and abrasion resistance can be obtained according to this relationship.

In addition, in this invention, the average film thickness of the said resin film can be calculated | required relatively easily from the area of the part in which this resin film was formed, and its resin amount.

(Content of lubricant relative to the total resin coating amount: 1 to 25% by mass)

The lubricant contained in this invention improves the moldability of the aluminum plate which has a film. If the quantity of the said lubricant is less than 1 mass% with respect to the total resin film amount, sufficient lubricity will not be obtained. Insufficient lubrication causes a part of the molded article to be locally deformed when the press working is performed, resulting in the resin film being cut off or cracking.

On the other hand, when the amount of the lubricant exceeds 25% by mass relative to the total resin film amount, the effect of improving the lubricity is saturated, while the film forming property of the resin film is lowered, which causes a decrease in scratch resistance. Or, the peeling material (dross) of the resin film peeled off in part at the time of press work deposits in the inside of the metal mold | die of press work. As a result, it adversely affects the molding process of the aluminum plate which has this film. Therefore, in this invention, content of a lubrication agent with respect to the total resin film amount is regulated to 1-25 mass%.

The lubricant may be at least one selected from polyethylene waxes, polyalkylene waxes, microcrystalline waxes, fluorine waxes, lanolin waxes, carnauba waxes, paraffin waxes, and graphite, from the viewpoint of appropriately improving moldability and economical efficiency. It is preferred to be configured.

In the present invention, polyalkylene oxide wax can be used as the polyalkylene wax, and polytetrafluoroethylene wax can be used as the fluorine wax.

(Exposure to the resin film surface of the convex portion of the base plate of the aluminum plate or the corrosion resistant film)

As the aluminum plate having the film according to the present invention, when applied to a member of an electronic device, the base plate or the corrosion resistant film of the aluminum plate having the fine concavo-convex included in the present invention so as to ensure the conductivity at the contact point of the aluminum plate and the earth appropriately. It is necessary to expose the convex portion of the resin film to the surface of the resin film. The degree (dispersion degree) of exposing the convex portion of the aluminum platelet or the corrosion resistant film to the surface of the resin film is basically the centerline average roughness Ra of the aluminum platen and the average film thickness of the resin film. By appropriately adjusting the relationship.

(Surface resistance: 1Ω or less)

Moreover, as an aluminum plate which has a film which concerns on this invention, it is necessary to make surface resistance value measured by the method mentioned later into 1 ohm or less. That is, when the aluminum plate having the film whose surface resistance value exceeds 1 ohm is applied to an electronic device, it is difficult to completely eliminate noise due to electromagnetic waves and the like. In particular, when the electronic device is a drive device, a recording or reproducing error tends to be caused, and when the electronic device is a liquid crystal display, image noise tends to occur. For this reason, in this invention, the said surface resistance value is regulated to 1 ohm or less.

In order to make the said surface resistance value 1 or less in this invention, the range (0.2-0.6 micrometer) of the center line average roughness Ra of the said aluminum platelet regulated by this invention, and the range (0.05-0.3 0.3) of the average film thickness of the said resin film (Micrometer), It is preferable to adjust suitably the center line average roughness Ra of the said aluminum platen, and the average film thickness of the said resin film. In addition, in the aluminum plate having the coating according to the present invention, the resin coating is formed in a uniform uniformity with respect to the aluminum platelet having the centerline average roughness Ra, so that the convex of the corrosion resistant coating formed according to the fine irregularities of the aluminum platelet. In addition, the surface of the resin film is exposed to a desired degree (dispersity). In such an exposed state, the surface resistance of 1 Ω or less is obtained at a predetermined portion of this surface.

Moreover, as a parameter which contributes greatly to the said surface resistance value, the kind of resin, the kind and quantity of a lubricant, etc. are mentioned besides the centerline average roughness Ra of the said aluminum platen, and the average film thickness of the said resin film. For this reason, it is difficult to specify this invention only by the correlation between the centerline average roughness Ra of the said aluminum platen, and the average film thickness of the said resin film. Therefore, this invention is specified including the limitation condition as "the aluminum plate which has a film whose surface resistance value is 1 ohm or less" as mentioned above.

As described above, the surface resistance value specifying the aluminum plate having the coating according to the present invention can be measured by the following method. It is a figure which shows typically an example of the measuring method of the said surface resistance value. This method of measuring the surface resistance is characterized by corrosion of one terminal of the testing machine 11 by polishing with sand paper or the like on the back surface or the end face of the aluminum plate 10 having the film, where a corrosion resistant film and a resin film are formed on the surface of the aluminum platen. The aluminum plate which has a film is connected to the part from which the film | membrane and the resin film were removed, and the other terminal of the tester 11 was connected to the other terminal through the metal measuring rod 12 which has a spherical terminal formed in a substantially spherical shape with a tip radius of 10 mm. It can carry out by connecting to the measurement location of the resin film of (10).

In addition, the measuring rod 12 made of metal can be made of brass or the like having excellent conductivity. And the spherical terminal provided in the front-end | tip part of the metal rod 12 was pressed to the measurement location of the resin film of the aluminum plate 10 which has a film by the load of 0.4N (40gf), and aluminum which has each film in this state. The surface resistance of the plate 10 is measured. In addition, since the natural oxide film on the surface of the metal measuring rod 12 causes a gap in the measured value of the surface resistance, the surface of the metal measuring rod 12 is polished with sand paper or the like before the measurement of the surface resistance. It is desirable to sufficiently remove this natural oxide film.

In the present invention, in the case of using the analog tester 11 at the time of measuring the surface resistance, a measuring rod made of metal before the measurement of the surface resistance is performed so as to exclude the influence of the internal resistance of the tester 11. It is preferable to perform a zero point correction in the state which contacted the measuring part comprised from the spherical terminal provided with the front-end | tip part of (12), and the opposite electrode. In the present invention, the surface resistance value is measured by using the most sensitive range in the analog tester 11, and when the display needle of the tester 11 stops, the value indicated by the display needle is taken as the measured value.

In the case of using the digital tester in the present invention, zero-point correction is performed in the same manner as the analog tester 11 before the surface resistance value is measured, and the measurement is performed using the most sensitive range with the tester. . The value when the digital display of this digital tester is stabilized is taken as a measured value.

In addition, in this invention, in order to ensure the reliability of the measurement value of the said surface resistance, the measurement of this surface resistance value is performed at least 10 places at random positions with respect to the aluminum plate 10 which has each film, and the average value is seen. It is preferable to employ | adopt as said surface resistance value regulated by this invention.

The aluminum as a conductor is formed on an aluminum platelet having a surface roughness in the range regulated by the present invention when a corrosion resistant film having an adhesion amount in the range regulated by the present invention and a resin film having a film thickness in the range regulated by the present invention are formed. The surface resistance value can be reduced by forming the base plate or the corrosion resistant coating so as to properly expose the surface of the resin coating. At this time, when the surface resistance value is 1 Ω or less, when the earth wire is provided on the aluminum plate on which the corrosion resistant film and the resin film are sequentially formed on the aluminum platen, an aluminum plate having a film, which is suitably secured at the contact point between the earth wire and the aluminum plate, is obtained. do.

However, when the surface roughness of the aluminum platelet, that is, its centerline average roughness Ra is smaller than the range regulated by the present invention, and the average film thickness of the resin film is thicker than the range regulated by the present invention, that is, the resin film is Under the conditions configured to completely cover the aluminum platelets, the surface resistance is extremely high, and when the present invention is applied to an electronic device, it is difficult to sufficiently remove external electromagnetic noise. For this reason, for example, recording and reproducing errors are caused in the drive device, or image noise and the like are generated in the liquid crystal display.

In addition, when the aluminum plate having the film according to the present invention configured to appropriately expose the base of the aluminum platelet having the fine unevenness or the convex portion of the corrosion resistant film to the surface of the resin film, heat generated from the electronic device Since the heat is efficiently emitted to the atmosphere through the exposed portion, the heat dissipation characteristics of the electronic device can be improved.

(Colloidal silica content of resin film: 1-30 mass% with respect to the total resin film amount)

In the present invention, scratch resistance can be improved by further hardening the resin film included in the present invention. For this reason, adding colloidal silica having a relatively high hardness into the resin film advantageously works to improve the scratch resistance. In the case where the colloidal silica is added in an amount of less than 1% by mass based on the total amount of resin film in the resin film, the effect of improving the scratch resistance is not sufficiently obtained. In addition, when the amount of the colloidal silica is added to exceed 30% by mass relative to the total resin film amount, the hardness of the resin film becomes excessively high, so that cracking (peeling) of the resin film occurs during press molding. It becomes easy to be. For this reason, in this invention, it is preferable to add 1-30 mass% of said colloidal silicas with respect to the total resin film amount.

Example

Hereinafter, the present invention will be described in detail using examples according to the present invention and comparative examples which do not satisfy the requirements of the present invention. First, the aluminum platelets included in the Examples and Comparative Examples were produced as follows. That is, the predetermined aluminum alloy was melt | dissolved first, and the ingot of an aluminum alloy was produced through the process of casting and homogenization treatment. Subsequently, aluminum platelets (plate thickness: 0.5 mm, alloy species: AA5052-H34) were produced through each step of hot rolling, cold rolling, and heat treatment. In addition, in the final (finishing) step of the cold rolling, an aluminum platelet having various surface roughness (center line average roughness) was obtained by appropriately changing the surface roughness of the rolling roll.

Subsequently, alkali degreasing was performed on the aluminum platen, a corrosion resistant film was formed on the surface of the aluminum platen, and a resin film was formed thereon to obtain the aluminum plate of the Examples and Comparative Examples. Table 1 shows the main configuration of aluminum having the films of these Examples and Comparative Examples.

In this example, polyethylene wax was used as a lubricant.

In addition, the surface roughness (center line average roughness Ra) of the aluminum platelets of the said Example and the comparative example was perpendicular to the rolling direction using the surface roughness measuring instrument (The Kosaka Research Institute make, Sufkoda SE-30D) with respect to each of these aluminum platelets. It measured by scanning in the phosphorus direction and obtaining center line average roughness Ra (JIS B0601).

division number 1. Surface roughness (Ra) of Al platelets Corrosion resistant film Resin film Remarks 2. Cr amount (mg / ㎡) 3. Class 1) 4. Average film thickness (µm) 5. Lubricant amount (mass%) 6. Amount of colloidal silica (mass%) Example One 0.5 20 A 0.1 5 0 6. This 0 2 0.5 20 A 0.1 5 0 Same as above 3 0.5 20 A 0.1 5 0 Same as above 4 0.5 20 A 0.1 2 0 Same as above 5 0.5 20 A 0.1 20 0 Same as above 6 0.5 20 A 0.1 5 One 6. Contain 7 0.5 20 A 0.1 5 5 Same as above 8 0.5 20 B 0.1 5 0 6. This 0 9 0.5 20 C 0.1 5 0 Same as above 10 0.5 20 D 0.1 5 0 Same as above Comparative example One 0.05 20 A 0.1 5 0 1. Outside this standard 2 2.0 20 A 0.1 5 0 Same as above 3 0.5 5 A 0.1 5 0 2. Outside this standard 4 0.5 100 A 0.1 5 0 Same as above 5 0.5 20 A 0.005 5 0 4. Outside this standard 6 0.5 20 A 0.01 5 0 Same as above 7 0.5 20 A One 5 0 Same as above 8 0.5 20 A 0.1 0 0 5. Outside this standard 9 0.5 20 A 0.1 50 0 Same as above 10 0.5 20 A 0.1 5 50 6. Outside this standard Note 1) Types of resin film A: Polyester resin B: Urethane resin C: Epoxy resin D: Vinyl resin

Moreover, evaluation was performed by the method shown below about the aluminum plate which has each film of the said Example and comparative example produced in this way. The evaluation results are shown in Table 2.

(Assessment Methods)

<Conductivity>

Electroconductivity measured the surface resistance value of each aluminum plate using the analog tester (MODEL CP-70 by SANWA ELECTRON INSTRUMENT Co., Ltd.) by the said measuring method.

<Heat dissipation>

The heat dissipation of the said Example and the comparative example was measured as follows. First, since the aluminum plate having each film was used as a cover (cover) of the HDD, it was cut into a 3.5-inch type HDD cover shape. Then, with these, the surface in which the said resin film was formed was made to the outside, the cover was covered with the HDD, heat was generated by operating the HDD, and the temperature change on the surface of the aluminum plate was measured by an electronic thermometer. And each heat dissipation property is judged on the basis of the temperature change in the case of using the bare board of an aluminum platen, and it is called "(good)" that the highest achieved temperature is substantially the same as the bare board of the said aluminum platen, and said aluminum What was higher than the bare wood of a platen was evaluated as "(defect)."

<Plasticity>

The molding processability of the said Example and a comparative example first evaluates the crack (peeling) property of the resin film after a bending process, and shows the crack (peeling) state of the resin film in each process part at the time of bending each such aluminum plate. It evaluated by visual observation. Moreover, as a test of bending process, it evaluated by the 180 degree bending test according to the bending test prescribed | regulated in Clause 6.4 of JIS H4001. However, the inner radius was the same as the plate thickness (1T bending).

And the criterion of the crack (peel) state of the said resin film is that "(good)" shows that a crack (peeling) is not seen in a resin film, and very slight cracking generate | occur | produces in a part of resin film, but quality control The moldability of each Example and the comparative example was evaluated as what made no problem in particular as "(delta) (approximately good)", and as having "x (defect)" which has a clear crack (peeling) in the resin film.

Moreover, in order to evaluate the lubricity of the aluminum plate surface which affects moldability, the friction coefficient was measured with the aluminum plate which has each film of the said Example and a comparative example.

Here, if the friction coefficient of the said aluminum plate is 0.2 or less, it can be evaluated that there is no problem in particular as a shaping | molding process normally performed with various electronic devices. The measurement of this friction coefficient measured the three places which were randomly selected on the surface of each aluminum plate by the Bauden method, and employ | adopted the average value.

Fingerprint resistance

Each rubbing property was evaluated by measuring the color difference ((DELTA) E) before and after a fingerprint was attached by touching the surface of the aluminum plate which has each film of the said Example and a comparative example with bare hands. The color difference (ΔE) was measured using a color chromometer (CR-300) manufactured by Minolta.

Moreover, when the color difference (DELTA) E value was 0.5 or less, the fingerprint attached to the surface of the said aluminum plate was hardly confirmed visually.

<Scratch resistance>

Pencil hardness was used as an index of the scratch resistance of the resin film in the said Example and a comparative example. That is, this pencil hardness was measured by the pencil scratch test prescribed | regulated to 8.4 of JISK5400 Clause. This pencil scratch test was performed by the test method prescribed | regulated in 8.4.1 of JIS K5400, and load was implemented as 9.8 N (lkgf).

division number Evaluation item Remarks Conductivity Heat dissipation Formability Anti-fingerprint Scratch resistance Surface resistance (Ω) Surface temperature change Film cracks after peeling (peeling) Friction coefficient ΔE Pencil strength Example One 0.2 0.06 0.16 5H Effect of Surface Roughness (Ra) of Al Plates Comparative example One 2 × 0.06 0.60 3H Comparative example 2 0.1 × 0.26 0.05 4H Example 2 0.2 0.06 0.16 5H Influence of adhesion amount of corrosion resistant film Comparative example 3 0.2 0.06 0.21 4H Comparative example 4 0.2 0.06 0.23 3H Example 3 0.2 0.06 0.16 5H Effect of Average Film Thickness of Resin Film Comparative example 5 0.0 × 0.92 0.88 2H Comparative example 6 0.0 0.48 0.35 3H Comparative example 7 5 × 0.05 0.19 5H Example 4 0.2 0.10 0.18 5H Influence of lubricant amount Example 5 0.2 0.05 0.18 5H Comparative example 8 0.2 × 0.77 0.35 4H Comparative example 9 0.2 0.05 0.14 3H Example 6 0.2 0.06 0.18 5H Influence of Colloidal Silica Addition Example 7 0.2 0.08 0.17 6H Comparative example 10 0.2 0.08 0.23 6H Example 8 0.2 0.07 0.13 5H Influence of kind of resin Example 9 0.2 0.07 0.22 5H Example 10 0.2 0.07 0.28 4H

The following matters are clear from each said evaluation result shown in Table 2.

(Influence of surface roughness (center line average roughness (Ra)) of aluminum platen)

Comparative Example 1, in which the centerline average roughness Ra is less than the lower limit of the range regulated by the present invention, was deteriorated in fingerprint resistance, scratch resistance, conductivity, and heat dissipation. In addition, in Comparative Example 2 in which this centerline average roughness Ra exceeded the upper limit regulated by the present invention, the friction coefficient was increased to 0.26, and a clear crack (peeling) was observed on the resin film during molding.

(Influence of adhesion amount of corrosion resistant film)

In Comparative Example 3, in which the adhesion amount of Cr in the corrosion resistant film was less than the lower limit of the range regulated by the present invention, the corrosion resistant film was not covered with the entire aluminum platen, and the corrosion resistance was inferior. Moreover, since the adhesiveness of the resin film was inferior in the comparative example 3, the extremely slight crack was seen in the resin film after a baking test. In addition, in Comparative Example 4 in which the adhesion amount of Cr in the corrosion resistant coating was over the upper limit, extremely slight cracking was observed in the resin coating after the baking test.

(Influence of Average Film Thickness of Resin Film)

In Comparative Examples 5 and 6, in which the average film thickness of the resin film was less than the lower limit of the range regulated by the present invention, the coefficient of friction increased because the resin film did not completely cover the entire aluminum platen (0.92, 0.48, respectively) and the burning test. Thereafter, cracks were observed in the resin film, and scratch resistance was also deteriorated in addition to it. And in Comparative Example 5, the rubbing resistance was also deteriorated in addition to them. In Comparative Example 7 in which the film thickness of the resin film exceeds the upper limit, since the base of the aluminum platelet having fine unevenness or the convex portion of the corrosion resistant film is not exposed on the surface of the resin film, the surface resistance is high and the heat dissipation property is increased. It was also lagging behind.

(Influence of lubricant amount)

Comparative Example 8, in which the amount of the lubricant was below the lower limit regulated by the present invention, had a high coefficient of friction (0.77), and apparent cracks (peeling) were observed in the resin film after the baking test. That is, moldability was deteriorating. Moreover, the scratch resistance deteriorated in the comparative example 9 in which the quantity of lubricant exceeds the upper limit.

(Influence of colloidal silica addition amount)

In Comparative Example 10, in which the amount of colloidal silica added exceeded the upper limit of the range regulated by the present invention, extremely slight cracking was observed in the resin film because the bending workability was deteriorated.

On the other hand, the surface roughness (center line average roughness Ra) of an aluminum platelet, the adhesion amount of a corrosion-resistant film, the kind of resin film, the film thickness, and the quantity of the lubricant contained in a resin film all satisfy the range regulated by this invention. In Examples 1-10, it was confirmed that there is no problem in all of electroconductivity, heat dissipation property, moldability, fingerprint resistance, and scratch resistance.

In addition, this invention is not limited only to this implementation, As long as it is based on the technical idea of this invention, it can change suitably. For example, in this embodiment, a resin containing a lubricant composed of polyethylene wax is used. However, the present invention includes other lubricants, that is, polyalkylene wax, microcrystalline wax, fluorine wax, lanolin wax, carnauba wax, Even if a lubricant composed of at least one selected from paraffin wax and graphite is contained in the resin film, the same effect as in this embodiment is obtained.

In addition, the inventors clearly show that by applying the embodiments 1 to 10 according to the present invention to electronic devices, an electronic device member excellent in the above characteristics, that is, conductivity, heat dissipation, moldability, fingerprint resistance and scratch resistance, can be realized. It was.

As described above, according to the present invention, the surface can be appropriately provided with the conductivity and heat dissipation required in the housing and structural members of various electronic devices such as a case and chassis of a conventionally known drive device, a frame for fixing a liquid crystal panel and a back cover. The defects in appearance due to the fingerprint attached to the surface and the minute scratches on the surface are greatly reduced, and the surface lubricity is excellent, and even if press molding is performed, cracks (peeling) of the resin film formed on the surface do not occur. An aluminum plate having a coating and an electronic device member using the same can be provided.

Moreover, since this invention uses the aluminum plate which has the film | membrane which was excellent in moldability in the process of manufacturing an electronic device member, the occurrence rate of the quality defect in press molding can be reduced and a yield of a product can be improved. Accordingly, the present invention can reduce the overall cost of the electronic device member, and consequently contribute greatly to the cost reduction of the electronic device product.

1 is a cross-sectional view schematically showing the configuration of one embodiment according to the present invention.

It is a figure which shows typically a method of measuring the surface resistance value of the aluminum plate which has a film which concerns on this invention.

Explanation of symbols for the main parts of the drawings

1, 10: aluminum plate 2: aluminum platen

3: corrosion-resistant film 4: resin film

11 tester 12 measuring rod

Claims (5)

  1. An aluminum plate having a film comprising an aluminum platelet having a center line average roughness Ra of 0.2 to 0.6 µm, and a corrosion resistant film and a resin film sequentially formed on at least one surface of the aluminum platen.
    The corrosion resistant film contains Cr or Zr and the adhesion amount to the aluminum platelets is 10 to 50 mg / m 2 in terms of Cr or Zr,
    The said resin film has an average film thickness of 0.05-0.3 micrometer, and contains 1-25 mass% of lubricant with respect to the total resin film amount,
    In the aluminum platelet or the surface on which the corrosion resistant film is formed, the fine convex portions are exposed to the surface of the resin film,
    The aluminum plate which has a film | membrane whose surface resistance value between the said spherical terminal and the said aluminum platelets is 1 ohm or less, when the front-end | tip presses the spherical terminal of 10 mm in radius on the surface of the side where the said resin film was formed.
  2. The method of claim 1,
    An aluminum plate having a film, wherein the resin film is composed of at least one selected from polyester resins, urethane resins, epoxy resins, and vinyl resins.
  3. The method of claim 1,
    An aluminum plate having a film, wherein the lubricant is composed of at least one selected from polyethylene wax, polyalkylene wax, microcrystalline wax, fluorine wax, lanolin wax, carnauba wax, paraffin wax, and graphite.
  4. The method of claim 1,
    The aluminum plate with a film in which the said resin film contains 1-30 mass% colloidal silica with respect to the total resin film amount.
  5. The electronic device member shape | molded using the aluminum plate which has a film in any one of Claims 1-4.
KR20030025799A 2002-04-24 2003-04-23 An aluminium plate having a film and an electronic device member using the same KR100473517B1 (en)

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JP4634747B2 (en) * 2004-03-25 2011-02-23 古河スカイ株式会社 High-performance resin-coated aluminum material with excellent heat dissipation
JP4482364B2 (en) * 2004-04-08 2010-06-16 株式会社神戸製鋼所 Aluminum plate for electronic equipment and molded product for electronic equipment using the same
KR100712837B1 (en) 2004-04-29 2007-05-02 엘지전자 주식회사 Heat Sink and the Finishing Method for the Same
JP2007006692A (en) * 2005-05-24 2007-01-11 Nippon Densan Corp Motor unit equipped with spindle motor for recording disk drive, and recording disk driving device equipped with the same
JP2008171628A (en) * 2007-01-10 2008-07-24 Furukawa Sky Kk Partitioning plate for heat dissipation of battery case
JP4221039B2 (en) * 2007-06-27 2009-02-12 古河スカイ株式会社 Pre-coated metal plate for drive case
JP2009034973A (en) * 2007-07-09 2009-02-19 Sumitomo Light Metal Ind Ltd Electroconductive precoated aluminum-alloy sheet
JP5028178B2 (en) * 2007-07-26 2012-09-19 住友軽金属工業株式会社 Conductive pre-coated aluminum alloy plate
JP5105483B2 (en) * 2008-09-19 2012-12-26 古河スカイ株式会社 Resin coated aluminum plate
JP5060460B2 (en) * 2008-12-12 2012-10-31 古河スカイ株式会社 Resin-coated aluminum plate with excellent resin adhesion
JP5237080B2 (en) * 2008-12-19 2013-07-17 古河スカイ株式会社 Pre-coated metal sheet for electronic and electrical equipment
JP5563274B2 (en) * 2009-10-23 2014-07-30 関西ペイント株式会社 Coating composition for aluminum alloy
TWI415741B (en) * 2009-12-11 2013-11-21
JP5555008B2 (en) * 2010-02-23 2014-07-23 株式会社神戸製鋼所 Pre-coated aluminum plate for electronic equipment
JP5079037B2 (en) * 2010-02-26 2012-11-21 住友軽金属工業株式会社 Conductive pre-coated aluminum alloy plate for electrical or electronic equipment housing
JP5827789B2 (en) * 2010-03-26 2015-12-02 東洋鋼鈑株式会社 Resin-coated Al plate for squeezed iron cans with excellent luster and method for producing squeezed iron cans
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JP5671402B2 (en) * 2011-04-18 2015-02-18 株式会社神戸製鋼所 Pre-coated aluminum plate for electronic equipment
JP5975661B2 (en) * 2012-02-03 2016-08-23 株式会社神戸製鋼所 Aluminum plate for forming
JP5950757B2 (en) * 2012-08-22 2016-07-13 古河電気工業株式会社 Metal plate material, resin coating method on metal plate surface and use thereof
JP6296662B2 (en) * 2013-01-25 2018-03-20 株式会社Uacj Lubricating aluminum paint
TWI621314B (en) * 2013-05-29 2018-04-11 Nippon Light Metal Co Conductive member
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JP6270767B2 (en) * 2015-03-30 2018-01-31 ニチハ株式会社 Building materials
CN107557785A (en) * 2017-09-13 2018-01-09 广东宝冠板材科技有限公司 Resistance and fingerprint resistance household electrical appliances sheet material and preparation method thereof

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JP2003313684A (en) 2003-11-06
CN1209952C (en) 2005-07-06

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