KR100401265B1 - 박막 트랜지스터형 광 감지소자 - Google Patents
박막 트랜지스터형 광 감지소자 Download PDFInfo
- Publication number
- KR100401265B1 KR100401265B1 KR10-1998-0053122A KR19980053122A KR100401265B1 KR 100401265 B1 KR100401265 B1 KR 100401265B1 KR 19980053122 A KR19980053122 A KR 19980053122A KR 100401265 B1 KR100401265 B1 KR 100401265B1
- Authority
- KR
- South Korea
- Prior art keywords
- thin film
- film transistor
- light
- sensor
- storage capacitor
- Prior art date
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 126
- 238000003860 storage Methods 0.000 claims abstract description 93
- 239000003990 capacitor Substances 0.000 claims abstract description 64
- 239000004020 conductor Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 8
- 230000003287 optical effect Effects 0.000 claims abstract description 6
- 239000004065 semiconductor Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 13
- 229910006404 SnO 2 Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 41
- 229910021417 amorphous silicon Inorganic materials 0.000 description 17
- 239000010408 film Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 239000011651 chromium Substances 0.000 description 6
- 238000009825 accumulation Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium(II) oxide Chemical compound [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14678—Contact-type imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78633—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with a light shield
Abstract
Description
Claims (8)
- 피사체에 반사된 빛에 의해 피사체의 영상을 판독하는 광 감지소자로서,빛을 발산하는 광원과,상기 피사체에 반사된 빛을 감지하여 광전류를 생성하는 센서 박막 트랜지스터와,상기 광원의 빛을 상기 피사체로 투과시키고, 상기 센서 박막 트랜지스터에 의해 생성된 광전류를 전하의 형태로 저장하는 스토리지 캐패시터와,상기 스토리지 캐패시터에 저장된 전하의 방출을 제어하는 스위칭 박막 트랜지스터를 포함하는 박막 트랜지스터형 광 감지소자.
- 청구항 1에 있어서,상기 스토리지 캐패시터의 모든 전극이 투명한 도전성 물질인 것을 특징으로 하는 박막 트랜지스터형 광 감지소자.
- 청구항 2에 있어서,상기 투명한 도전물질은 ITO와 TiO, SnO2로 구성된 집단에서 선택된 물질인 것을 특징으로 하는 박막 트랜지스터형 광 감지소자.
- 청구항 1에 있어서,상기 센서 박막 트랜지스터는 상기 스토리지 캐패시터의 중앙에 위치하는 것을 특징으로 하는 박막 트랜지스터형 광 감지소자.
- 청구항 1에 있어서,상기 센서 박막 트랜지스터의 배선은 투명한 도전성 전극인 것을 특징으로 하는 박막 트랜지스터형 광 감지소자.
- 4변을 가진 실질적으로 사각형 형상의 픽셀단위의 광 감지소자로서,제 1 변에서 내측 방향으로 돌출된 위치에 형성되고, 피사체에 반사된 빛의 세기에 따라 광전류를 발생시키는 센서 박막 트랜지스터와,상기 제 1 변에 인접한 한 변을 따라 형성된 스위칭 박막 트랜지스터와,상기 센서 박막 트랜지스터 및 상기 스위칭 박막 트랜지스터를 제외한 부분의 상기 픽셀 상에 형성되고, 상기 센서 박막 트랜지스터에 의해 발생된 광전류를 전하의 형태로 저장하고, 빛을 피사체로 투과시키는 스토리지 캐패시터를 포함하는 박막 트랜지스터형 광 감지소자.
- 기판과,상기 기판 상에 형성된 센서 게이트 전극과, 센서 반도체층과, 센서 드레인전극 및 센서 소스 전극을 포함하는 센서 박막 트랜지스터와;상기 기판 상에 형성되고 투명의 제 1 스토리지 전극과, 상기 제 1 스토리지 전극과 대응하는 위치에 형성된 투명인 제 2 스토리지 전극과, 상기 제 1, 2 스토리지 전극 사이에 위치한 유전층을 포함하는 스토리지 캐패시터와;상기 기판 상에 형성된 스위치 게이트 전극과, 스위치 반도체층과 상기 제 2 스토리지 전극과 연결된 스위치 드레인 전극과, 스위치 소스 전극을 포함하는 스위치 박막 트랜지스터를 포함하는 박막 트랜지스터형 광 감지소자.
- 청구항 7에 있어서,상기 스토리지 캐패시터의 제 1 스토리지 전극 및 제 2 스토리지 전극은 ITO와 TiO, SnO2로 구성된 집단에서 선택된 물질인 것을특징으로 하는 박막 트랜지스터형 광 감지소자.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-1998-0053122A KR100401265B1 (ko) | 1998-12-04 | 1998-12-04 | 박막 트랜지스터형 광 감지소자 |
US09/453,299 US6242769B1 (en) | 1998-12-04 | 1999-12-03 | Thin film transistor type photo sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-1998-0053122A KR100401265B1 (ko) | 1998-12-04 | 1998-12-04 | 박막 트랜지스터형 광 감지소자 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20000038215A KR20000038215A (ko) | 2000-07-05 |
KR100401265B1 true KR100401265B1 (ko) | 2004-03-20 |
Family
ID=19561415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-1998-0053122A KR100401265B1 (ko) | 1998-12-04 | 1998-12-04 | 박막 트랜지스터형 광 감지소자 |
Country Status (2)
Country | Link |
---|---|
US (1) | US6242769B1 (ko) |
KR (1) | KR100401265B1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100923025B1 (ko) | 2003-10-23 | 2009-10-22 | 삼성전자주식회사 | 광감지 소자와, 이를 갖는 어레이 기판 및 액정 표시 장치 |
KR101001969B1 (ko) | 2003-12-26 | 2010-12-17 | 삼성전자주식회사 | 광감지 패널과, 이를 갖는 액정 표시 장치 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100684581B1 (ko) * | 2000-10-04 | 2007-02-20 | 엘지.필립스 엘시디 주식회사 | 포인팅 장치 |
KR100338978B1 (ko) * | 2001-01-30 | 2002-06-03 | 안준영 | 광감지부에 광차폐층이 형성된 박막트랜지스터 지문입력기 |
KR100437825B1 (ko) * | 2001-07-06 | 2004-06-26 | 엘지.필립스 엘시디 주식회사 | 액정표시장치용 어레이기판 |
US6838715B1 (en) * | 2002-04-30 | 2005-01-04 | Ess Technology, Inc. | CMOS image sensor arrangement with reduced pixel light shadowing |
US7432491B2 (en) * | 2005-05-06 | 2008-10-07 | Micron Technology, Inc. | Pixel with spatially varying sensor positions |
JP2010251995A (ja) * | 2009-04-14 | 2010-11-04 | Sony Corp | 電子機器 |
KR101688057B1 (ko) | 2010-08-09 | 2016-12-21 | 삼성디스플레이 주식회사 | 가시광선 감지 센서 및 이를 포함하는 광 센서 |
TWI555217B (zh) * | 2014-05-29 | 2016-10-21 | 友達光電股份有限公司 | 光偵測器及其操作方式 |
WO2018135380A1 (ja) * | 2017-01-19 | 2018-07-26 | シャープ株式会社 | 薄膜トランジスタ基板、表示パネル及び表示装置 |
KR102599536B1 (ko) * | 2017-01-26 | 2023-11-08 | 삼성전자 주식회사 | 생체 센서를 갖는 전자 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01120079A (ja) * | 1987-11-02 | 1989-05-12 | Ricoh Co Ltd | 半導体装置 |
US4982079A (en) * | 1987-06-12 | 1991-01-01 | Canon Kabushiki Kaisha | Photo-sensor having plural transparent layers and a conductive layer to reduce electrostaslic charges |
JPH0399467A (ja) * | 1989-09-12 | 1991-04-24 | Ricoh Co Ltd | イメージセンサ |
JPH06216360A (ja) * | 1983-04-04 | 1994-08-05 | Seiko Epson Corp | イメージセンサ |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3312083B2 (ja) * | 1994-06-13 | 2002-08-05 | 株式会社半導体エネルギー研究所 | 表示装置 |
-
1998
- 1998-12-04 KR KR10-1998-0053122A patent/KR100401265B1/ko not_active IP Right Cessation
-
1999
- 1999-12-03 US US09/453,299 patent/US6242769B1/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06216360A (ja) * | 1983-04-04 | 1994-08-05 | Seiko Epson Corp | イメージセンサ |
US4982079A (en) * | 1987-06-12 | 1991-01-01 | Canon Kabushiki Kaisha | Photo-sensor having plural transparent layers and a conductive layer to reduce electrostaslic charges |
JPH01120079A (ja) * | 1987-11-02 | 1989-05-12 | Ricoh Co Ltd | 半導体装置 |
JPH0399467A (ja) * | 1989-09-12 | 1991-04-24 | Ricoh Co Ltd | イメージセンサ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100923025B1 (ko) | 2003-10-23 | 2009-10-22 | 삼성전자주식회사 | 광감지 소자와, 이를 갖는 어레이 기판 및 액정 표시 장치 |
KR101001969B1 (ko) | 2003-12-26 | 2010-12-17 | 삼성전자주식회사 | 광감지 패널과, 이를 갖는 액정 표시 장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20000038215A (ko) | 2000-07-05 |
US6242769B1 (en) | 2001-06-05 |
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