KR100337708B1 - 인쇄회로기판 - Google Patents
인쇄회로기판 Download PDFInfo
- Publication number
- KR100337708B1 KR100337708B1 KR1020000045881A KR20000045881A KR100337708B1 KR 100337708 B1 KR100337708 B1 KR 100337708B1 KR 1020000045881 A KR1020000045881 A KR 1020000045881A KR 20000045881 A KR20000045881 A KR 20000045881A KR 100337708 B1 KR100337708 B1 KR 100337708B1
- Authority
- KR
- South Korea
- Prior art keywords
- printed circuit
- circuit board
- via hole
- blind via
- outer layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (2)
- 단면 인쇄회로기판 또는 양면 인쇄회로기판이 다수개 적층된 다층 인쇄회로기판에 있어서, 다층 인쇄회로기판의 외층 및 레이저 가공층이 레진과 블랙타입의 유리섬유로 이루어진 프리프레그에 의해 형성된 것을 특징으로 하는 인쇄회로기판.
- 양면에 회로가 형성된 적어도 하나의 동박적층판을 포함하는 내층과, 상기 내층의 외각에 적층되는 외층을 포함하여 구성되는 한편, 상기 외층은 레진과 블랙타입의 유리섬유로 이루어진 프리프레그로 이루어진 것을 특징으로 하는 인쇄회로기판.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000045881A KR100337708B1 (ko) | 2000-08-08 | 2000-08-08 | 인쇄회로기판 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000045881A KR100337708B1 (ko) | 2000-08-08 | 2000-08-08 | 인쇄회로기판 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020012705A KR20020012705A (ko) | 2002-02-20 |
KR100337708B1 true KR100337708B1 (ko) | 2002-05-22 |
Family
ID=19682252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000045881A KR100337708B1 (ko) | 2000-08-08 | 2000-08-08 | 인쇄회로기판 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100337708B1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100648968B1 (ko) * | 2005-09-14 | 2006-11-27 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
CN116723640B (zh) * | 2023-08-10 | 2023-12-12 | 四川超声印制板有限公司 | 一种多层pcb板盲孔打孔方法 |
-
2000
- 2000-08-08 KR KR1020000045881A patent/KR100337708B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20020012705A (ko) | 2002-02-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9900978B2 (en) | Printed circuit boards and methods for manufacturing same | |
US6548767B1 (en) | Multi-layer printed circuit board having via holes formed from both sides thereof | |
EP0960725A3 (en) | Resin-coated composite foil, production and use thereof | |
CN202310279U (zh) | 一种二阶阶梯槽底部图形化印制板 | |
JP2007049004A (ja) | プリント配線板とその製造方法 | |
KR100674321B1 (ko) | 방열특성이 향상된 인쇄회로기판 및 그 제조방법 | |
JP2008016482A (ja) | 多層プリント配線板の製造方法 | |
US20080209718A1 (en) | Method of manufacturing multi-layered printed circuit board | |
KR100674316B1 (ko) | 레이저드릴을 이용한 비아홀 형성방법 | |
WO2003004262A1 (fr) | Stratifie et son procede de production | |
JP2007227420A (ja) | 多層プリント配線板 | |
KR101494090B1 (ko) | 동박적층판, 인쇄회로기판 및 그 제조 방법 | |
EP1392092A4 (en) | A COPPERED CIRCUIT BAY SUPPORTING COPPER-COATED LAMINATED LEAF AND METHOD FOR PRODUCING A CIRCUIT BOARD WIRING THEREWITH | |
KR100337708B1 (ko) | 인쇄회로기판 | |
JP2006294666A (ja) | フレックスリジッド配線基板及びその製造方法 | |
KR102442389B1 (ko) | 인쇄회로기판 및 그 제조방법 | |
KR100744994B1 (ko) | 다층 인쇄회로기판 및 그 제조방법 | |
US20180279481A1 (en) | Method of Manufacturing Circuit Boards | |
KR20030037738A (ko) | 인쇄회로기판의 블라인드 비아 홀 형성방법 | |
WO2004105453A1 (ja) | 可撓性多層回路基板のスルーホール導通構造及びその形成法 | |
JP2007095910A (ja) | 配線基板の製造方法 | |
JPH05327227A (ja) | ブラインドホール及びその形成方法 | |
JP2019029559A (ja) | 多層配線板及びその製造方法 | |
KR100815318B1 (ko) | 다층 회로기판용 워킹판넬 | |
KR20030071112A (ko) | 빌드업 인쇄회로기판 및 이의 제조공정 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130513 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20140430 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20150430 Year of fee payment: 14 |
|
FPAY | Annual fee payment |
Payment date: 20160421 Year of fee payment: 15 |
|
FPAY | Annual fee payment |
Payment date: 20170421 Year of fee payment: 16 |
|
FPAY | Annual fee payment |
Payment date: 20180503 Year of fee payment: 17 |
|
FPAY | Annual fee payment |
Payment date: 20190502 Year of fee payment: 18 |