KR100253664B1 - Operating system of polyimide dryer - Google Patents
Operating system of polyimide dryer Download PDFInfo
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- KR100253664B1 KR100253664B1 KR1019970040138A KR19970040138A KR100253664B1 KR 100253664 B1 KR100253664 B1 KR 100253664B1 KR 1019970040138 A KR1019970040138 A KR 1019970040138A KR 19970040138 A KR19970040138 A KR 19970040138A KR 100253664 B1 KR100253664 B1 KR 100253664B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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Abstract
Description
본 발명은 폴리이미드 건조기의 작동 시스템에 관한 것으로서, 더 상세하게는 웨이퍼의 표면에 백그라인딩을 하기 전에 폴리이미드(polymide)액을 도포한 후 일정한 온도로 가열하여 고온을 유지한 다음 다시 냉각시키는 폴리이미드 건조기를 자동으로 작동시킬 수 있는 폴리이미드 건조기의 작동 시스템에 관한 것이다.The present invention relates to an operating system of a polyimide dryer, and more particularly, to apply a polyimide liquid before backgrinding the surface of a wafer, and then to maintain a high temperature by heating the polyimide liquid to maintain a high temperature and then to cool the polyimide dryer. An operating system of a polyimide dryer that can automatically operate a mid dryer.
일반적으로 폴리이미드 건조기는 반도체 제조 공정시 웨이퍼의 표면에 백그라이인딩을 하기 전에 폴리이미드액을 도포하여 일정한 온도로 가열하여 굽는 장치이다.In general, a polyimide dryer is a device that bakes a polyimide liquid and heats it to a constant temperature before backgrinding the surface of a wafer during a semiconductor manufacturing process.
종래에는 이러한 폴리이미드 건조기의 챔버에 수동으로 도어를 열어 웨이퍼를 수납한 석영 캐리어를 수납한 후 가동하여 고온(약 350℃)으로 일정 시간 유지한 다음 도어를 개방하여 석영 캐리어를 빼어낸 상태에서 챔버 내부를 자연 냉각시켜 대기 공정 온도(약 200℃)로 복귀시켰다.Conventionally, the door of the polyimide dryer is manually opened to store the quartz carrier containing the wafer, and then operated to maintain a high temperature (about 350 ° C.) for a predetermined time, and then the door is opened to remove the quartz carrier. The interior was naturally cooled to return to ambient process temperature (about 200 ° C.).
그러나 종래의 폴리이미드 건조기는 웨이퍼를 정렬시키고 이를 폴리이미드 건조기의 챔버 내부에 투입하기 위해 석영 캐리어에 이송한 다음 웨이퍼가 수납된 석영 캐리어를 직접 수동으로 도어를 열어 챔버 내부에 투입하고 꺼내야 하는 번거로움이 있으며 웨이퍼의 표면에 스크래치가 발생하고 챔버 내부를 자연 냉각시키기 때문에 강제 냉각 기능이 없어 대기 공정 온도로의 복귀 시간이 장시간 소요되어 생산 효율이 낮은 문제점이 있었다.Conventional polyimide dryers, however, have the hassle of aligning the wafers and transferring them to the quartz carrier to feed them into the chamber of the polyimide dryer, and then manually opening the door to manually insert the quartz carrier containing the wafer into and out of the chamber. In addition, since scratches occur on the surface of the wafer and naturally cool the inside of the chamber, there is no forced cooling function, and thus, a long time for returning to the standby process temperature has a problem of low production efficiency.
이러한 문제점을 해결하기 위하여 트랜스퍼 테이블단의 석영 캐리어에 웨이퍼가 올려진 후에 도어를 여닫는 동작이나 석영 캐리어를 챔버 내부에 투입하고 빼내는 동작이나 가열하고 냉각하는 공정이 일정한 흐름을 따라 자동으로 작동되게 하여 수작업으로 하는 공정이 줄어들어 인건비가 줄어들고 챔버 내부를 강제 냉각시킴으로써 냉각 시간을 최대한 단축하여 생산 효율을 높일 수 있으며 웨이퍼 표면의 손상을 방지할 수 있는 폴리이미드 건조기가 개발되었다.In order to solve this problem, the door is opened and closed after the wafer is placed on the quartz carrier of the transfer table, the operation of putting the quartz carrier in and out of the chamber or the process of heating and cooling are automatically operated along a certain flow. By reducing the cost of labor, labor costs are reduced, and the inside of the chamber is forcedly cooled to shorten the cooling time as much as possible to increase the production efficiency and to prevent damage to the wafer surface.
본 발명은 상술한 폴리이미드 건조기를 작동시키기 위하여 안출된 것으로서, 수작업으로 하는 공정이 줄어들어 인건비가 줄어들고 챔버 내부를 강제 냉각시킴으로써 냉각 시간을 단축하여 생산 효율이 높으며 웨이퍼의 손상을 적극 방지할 수 있는 폴리이미드 건조기의 작동 시스템을 제공하는 데 그 목적이 있다.The present invention is designed to operate the above-described polyimide dryer, the process of manual labor is reduced, labor costs are reduced, and the cooling time is reduced by forcibly cooling the inside of the chamber to reduce the cooling time, the production efficiency is high, and the poly which can prevent damage to the wafer The purpose is to provide an operating system for the mid dryer.
상술한 목적을 달성하기 위하여 본 발명은 주 전원에서 들어오는 전류를 차단하는 배선용 차단기와; 온도 제어기의 시그널에 의해 전력이 조절되어 온도가 상승되는 히터와, 스피드 컨트롤러에 의해 도어를 수평 이동시켜 개폐시키는 모터로 구성되는 상ㆍ하부 챔버와; 스피드 컨트롤러에 의해 웨이퍼가 수납된 석영 캐리어를 승강시키는 모터와, 석영 캐리어를 파지하거나 개방하는 실린더로 구성되는 암과; 키 패널의 입력과 컨트롤 패널의 입력에 의해 상기 스피드 컨트롤러, 온도 제어기 및 실린더를 제어하는 PLC를; 포함하는 폴리이미드 건조기의 작동 시스템을 제공하고자 한다.In order to achieve the above object, the present invention provides a circuit breaker for blocking a current coming from the main power source; Upper and lower chambers each including a heater whose power is adjusted by a signal of a temperature controller, and a temperature of which is raised, and a motor which horizontally moves and opens and closes the door by a speed controller; An arm comprising a motor for lifting and lowering the quartz carrier containing the wafer by a speed controller, and a cylinder for holding or opening the quartz carrier; A PLC for controlling the speed controller, the temperature controller and the cylinder by input of a key panel and input of a control panel; It is to provide an operating system of a polyimide dryer comprising.
제1도는 폴리이미드 건조기 도어의 구조를 나타낸 좌측단면도.1 is a left side cross-sectional view showing the structure of a polyimide dryer door.
제2도는 폴리이미드 건조기 암의 구조를 나타낸 우측단면도.2 is a right sectional view showing the structure of the polyimide dryer arm.
제3도는 본 발명에 따른 시스템의 계통도.3 is a schematic diagram of a system according to the invention.
제4도는 제3도의 플로우 차트.4 is a flow chart of FIG.
제5도는 제4도에서 가열 및 냉각 공정의 일예를 보여주는 공정 시간 다이어그램.5 is a process time diagram showing an example of a heating and cooling process in FIG.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10 : 배선용 차단기 20 : 상부 챔버10: circuit breaker 20: upper chamber
22, 32 : 온도 제어기 24, 34 : 전력 조절기22, 32:
26, 36 : 히터 27, 37, 41 : 스피드 컨트롤러26, 36:
28, 38, 42 : 모터 30 : 하부 챔버28, 38, 42: motor 30: lower chamber
40 : 암 44 : 실린더40: arm 44: cylinder
50 : PLC 52 : 컨트롤 패널50: PLC 52: control panel
54 : 키 패널 60 : 도어54: key panel 60: door
62 : 안착단 90 : 주 전원62: seating end 90: main power
이하 본 발명을 첨부된 도면 제3도 내지 제5도를 참고로 하여 상세히 설명하되, 먼저 본 발명의 이해를 돕기 위하여 상기한 폴리이미드 건조기의 도어의 개폐 동작과 암의 승강 동작을 첨부된 도면 제1도 내지 제2도를 참고로 하여 살펴본다.Hereinafter, the present invention will be described in detail with reference to FIGS. 3 to 5, but first, the opening and closing operation of the door of the polyimide dryer and the lifting and lowering operation of the arm are provided in order to aid the understanding of the present invention. It looks at with reference to 1 to 2 degrees.
제1도는 폴리이미드 건조기 도어의 구조를 나타낸 좌측단면도이고, 제2도는 폴리이미드 건조기 암의 구조를 나타낸 우측단면도이다.1 is a left sectional view showing the structure of the polyimide dryer door, and FIG. 2 is a right sectional view showing the structure of the polyimide dryer arm.
제1도에서, 건조기 케이스(78)의 일측에 형성된 공간부에 삽입되어 길이 방향으로 체결을 이룬 베이스 플레이트(76a)와, 상기 베이스 플레이트(76a)의 중앙에 장방향으로 양측의 베어링 하우징(66a)에 지지된 볼 스크류(64a)와, 상기 볼 스크류(64a) 부근에 양측이 고정되어 볼 스크류(64a)와 동일한 장방향으로 설치된 LM 샤프트(68)와, 상기 볼 스크류(64a)의 양측면에 형성되며 일단에 상기 베이스 플레이트(76a)상에 고정된 LM 가이드(70a)와, 상기 볼 스크류(64a)에 슬라이딩 삽입되고 동시에 상기 양측에 LM 가이드(70a)에 슬라이딩 삽입된 씨포트 바(72a)와, 상기 씨포트 바(72a)에 고정되며 도어(60)의 일측에 체결된 중공축(74)으로 이루어진다.In FIG. 1, a
이때 상기 베어링 하우징(66a)에 지지된 볼 스크류(64a)를 구동하기 위해 모터(28,38)가 형성된다.At this time,
제2도에서 상기 케이스(78)의 타측 공간부 내측면에 체결을 이룬 베이스 플레이트(76b)와, 상기 베이스 플레이트(76b)의 양단에 고정된 베어링 하우징(66b)에 지지된 볼 스크류(64b)와, 상기 볼 스크류(64b)와 동일 방향으로 양측에 형성된 LM 가이드(70b)와, 상기 볼 스크류(64b)에 LM 블록(86)에 의해서 슬라이딩 삽입을 이룸과 동시에 상기 LM 가이드(70b)에 슬라이딩 삽입을 이룬 써포트 바(72b)와, 상기 써포트 바(72b)의 일단에 볼트 체결되어 연장된 홀더 브라켓(80)에 의해서 고정된 트원 로드 방식의 실린더(44)가 내장된 암(40)과, 상기 볼 스크류(64b)의 일단에 베어링 하우징(66b)에 연결된 커플링(84)을 통해서 구동을 인가하는 모터(42)로 이루어진다.2, a
제3도는 본 발명에 따른 시스템의 계통도이고, 제4도는 제3도의 플로우 차트이며, 제5도는 제4도에서 가열 및 냉각 공정의 일예를 보여주는 공정 시간 다이어그램이다.3 is a schematic diagram of a system according to the present invention, FIG. 4 is a flow chart of FIG. 3, and FIG. 5 is a process time diagram showing an example of a heating and cooling process in FIG.
본 발명의 구성을 살펴보면, 주 전원(90)에서 들어오는 전류를 차단하는 배선용 차단기(10)와; 온도 제어기(22,32)의 시그널에 의해 전력이 조절되어 온도가 상승되는 히터(26,36)와, 스피드 컨트롤러(27,37)에 의해 도어(60)를 수평 이동시켜 개폐시키는 모터(28,38)로 구성되는 상ㆍ하부 챔버(20,30)와; 스피드 컨트롤러(41)에 의해 웨이퍼가 수납된 석영 캐리어를 승강시키는 모터(42)와, 석영 캐리어를 파지하거나 개방하는 실린더(44)로 구성되는 암(40)과; 키 패널(54)의 입력과 컨트롤 패널(52)의 입력에 의해 상기 스피드 컨트롤러(27,37,41), 온도 제어기(22,32) 및 실린더(44)를 제어하는 PLC(50)를; 포함하여 구성된다.Looking at the configuration of the present invention, the
이하, 폴리이미드 건조기의 작동을 설명하면 키 패널(54)과 컨트롤 패널(52)을 조작하여 PLC(50)에 프로그램을 입력시킨다.Hereinafter, the operation of the polyimide dryer will be described so that the program is input to the
로딩(loading) 시그널이 발생하여 트랜스퍼 테이블단의 석영 캐리어에 웨이퍼가 수납되면 상측에 위치되었던 모터(42)에 의해 암(40)이 하강하여 상기 석영 캐리어의 일단에 까지 이동하고 암(40)의 내부에 장착된 트윈 로드 방식의 유압에 의해 작동하는 실린더(44)에 의해서 석영 캐리어를 파지한다.When a loading signal is generated and the wafer is accommodated in the quartz carrier of the transfer table, the
상기 모터(42)에 의해 구동되어 볼 스크류(64b)와 동일 방향으로 양측으로 형성된 양측의 LM 가이드(70b)에 지지된 체로 슬라이딩을 하는 써포트 바(72b)에 체결된 상태에서 상승하여 상부 챔버(10)와 하부 챔버(20)중에 선택적으로 위치하게 되며 모터(28,38)의 회전에 의해 도어(60)가 개방을 이룬다.The upper chamber is driven in the state in which it is driven by the
개방된 도어(60)의 내측면 석영 캐리어를 안착할 수 있는 안착단(62)의 위치까지 모터(42)에 의해 암(40)이 하강하여 실린더(44)의 복원에 의해 석영 캐리어를 개방하여 안착단(62)에 안착시키고, 모터(42)에 의해 다시 원래의 위치인 상측으로 암(40)의 상승에 의해 복원되며, 그후 도어(60)는 도어(60)의 내측면에 체결된 중공측(74)에 지지된 상태로 상기 볼 스크류(64a)를 타고 슬라이딩 되어 후측으로 이동하게 되면서 챔버(20,30)는 밀폐된다.The
이상에서의 공정이 제5도의 로딩 공정으로 약 3분 정도 소요된다.The above process takes about 3 minutes to the loading process of FIG.
다음은 온도 제어기(22,32)의 프로그램 진행에 의해 대기 공정 온도인 200℃에서 약 1시간 정도 대기 시간을 거친 후(대기 공정), 히터(26,36)가 동작하기 시작하여 45분간에 걸쳐 서서히 챔버(20,30) 내부의 온도를 350℃까지 가열시킨다(가열 공정).Next, after the program of the
다음 챔버 내부(20,30)의 온도를 350℃에서 1~2시간 유지한다(유지 공정).Next, the temperature inside the
언로딩(unloading) 시그널이 발생하여 모터(28,38)에 의해 도어(60)가 개방되고 암(40)이 하강하여 실린더(44)에 의해 석영 캐리어를 파지한 상태에서 암(40)이 원래의 위치인 상측으로 복원된다.An unloading signal is generated to open the
석여 캐리어를 트랜스퍼의 테이블단에 안착시키기 위하여 도어(60)는 닫히게 되며 암(40)이 하강하여 실린더(44)에 의해 석영 캐리어가 트랜스퍼의 테이블단에 안착되고 암(40)이 원래의 위치로 복원되어 다음 동작을 대기하게 된다.The
다음 트랜스퍼의 테이블단에 웨이퍼가 언로딩된 상태가 된다.The wafer is then unloaded at the table end of the transfer.
이상에서의 공정이 제5도의 언로딩 공정으로 약 3분 정도 소요된다.The above process takes about 3 minutes with the unloading process of FIG.
도어(60)의 개방과 동시에 챔버(20,30) 내부에는 차가운 질소(N2) 가스가 투입되어 챔버(20,30) 내부가 급냉되고 이러한 급냉에 의해 일정 시간을 두고 대기 공정 온도인 200℃ 온도를 유지하게 되어 폴리이미드 건조기의 작동이 완료된다.At the same time as the
이상에서 살펴본 바와 같이, 본 발명은 수작업으로 하는 공정이 줄어들어 인건비가 줄어들고 챔버 내부를 강제 냉각시킴으로써 냉각 시간을 단축하여 생산 효율이 높으며 웨이퍼의 손상을 적극 방지할 수 있는 유용한 발명인 것이다.As described above, the present invention is a useful invention that can reduce the labor cost to reduce the labor cost and by reducing the cooling time by forcibly cooling the inside of the chamber to increase the production efficiency and to actively prevent damage to the wafer.
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KR100637978B1 (en) * | 1999-12-31 | 2006-10-23 | 동부일렉트로닉스 주식회사 | a method of rapid thermal process |
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