KR100243049B1 - 반도체 디바이스 테스트용 핸들러 시스템의 픽 앤 플레이스 및 이를 사용하여 반도체 디바이스를 프리사이징하는 방법 - Google Patents

반도체 디바이스 테스트용 핸들러 시스템의 픽 앤 플레이스 및 이를 사용하여 반도체 디바이스를 프리사이징하는 방법 Download PDF

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Publication number
KR100243049B1
KR100243049B1 KR1019970012445A KR19970012445A KR100243049B1 KR 100243049 B1 KR100243049 B1 KR 100243049B1 KR 1019970012445 A KR1019970012445 A KR 1019970012445A KR 19970012445 A KR19970012445 A KR 19970012445A KR 100243049 B1 KR100243049 B1 KR 100243049B1
Authority
KR
South Korea
Prior art keywords
semiconductor device
vacuum adsorber
pick
presizing
vacuum
Prior art date
Application number
KR1019970012445A
Other languages
English (en)
Korean (ko)
Other versions
KR19980076000A (ko
Inventor
구태흥
Original Assignee
윤종용
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윤종용, 삼성전자주식회사 filed Critical 윤종용
Priority to KR1019970012445A priority Critical patent/KR100243049B1/ko
Priority to TW087103979A priority patent/TW419776B/zh
Priority to JP08419698A priority patent/JP3281313B2/ja
Priority to CN98106212A priority patent/CN1112590C/zh
Publication of KR19980076000A publication Critical patent/KR19980076000A/ko
Application granted granted Critical
Publication of KR100243049B1 publication Critical patent/KR100243049B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1019970012445A 1997-04-04 1997-04-04 반도체 디바이스 테스트용 핸들러 시스템의 픽 앤 플레이스 및 이를 사용하여 반도체 디바이스를 프리사이징하는 방법 KR100243049B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019970012445A KR100243049B1 (ko) 1997-04-04 1997-04-04 반도체 디바이스 테스트용 핸들러 시스템의 픽 앤 플레이스 및 이를 사용하여 반도체 디바이스를 프리사이징하는 방법
TW087103979A TW419776B (en) 1997-04-04 1998-03-18 Pick-and-place apparatus of a handler system for testing semiconductor devices
JP08419698A JP3281313B2 (ja) 1997-04-04 1998-03-30 半導体デバイステスト用ハンドラシステムのピックアンドプレース装置
CN98106212A CN1112590C (zh) 1997-04-04 1998-04-03 用于测试半导体装置的机械手系统的取放装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970012445A KR100243049B1 (ko) 1997-04-04 1997-04-04 반도체 디바이스 테스트용 핸들러 시스템의 픽 앤 플레이스 및 이를 사용하여 반도체 디바이스를 프리사이징하는 방법

Publications (2)

Publication Number Publication Date
KR19980076000A KR19980076000A (ko) 1998-11-16
KR100243049B1 true KR100243049B1 (ko) 2000-03-02

Family

ID=19501951

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970012445A KR100243049B1 (ko) 1997-04-04 1997-04-04 반도체 디바이스 테스트용 핸들러 시스템의 픽 앤 플레이스 및 이를 사용하여 반도체 디바이스를 프리사이징하는 방법

Country Status (4)

Country Link
JP (1) JP3281313B2 (zh)
KR (1) KR100243049B1 (zh)
CN (1) CN1112590C (zh)
TW (1) TW419776B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100924573B1 (ko) * 2007-09-14 2009-11-02 (주)알티에스 반도체 패키지 검사장치

Families Citing this family (22)

* Cited by examiner, † Cited by third party
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KR100594748B1 (ko) * 1999-10-22 2006-07-03 삼성전자주식회사 반도체 디바이스 테스트 장치
KR100349942B1 (ko) * 1999-12-06 2002-08-24 삼성전자 주식회사 램버스 핸들러
KR100363569B1 (ko) * 2000-12-26 2002-12-05 메카텍스 (주) 반도체소자 검사기의 소자 이송장치
JP2002207065A (ja) * 2001-01-11 2002-07-26 Advantest Corp 部品保持装置
KR100443039B1 (ko) * 2001-06-12 2004-08-04 이근우 반도체 장치의 픽업 장치
KR100395925B1 (ko) * 2001-08-01 2003-08-27 삼성전자주식회사 테스트 핸들러의 반도체 디바이스 로딩장치
KR100454763B1 (ko) * 2002-04-26 2004-11-05 (주)제이티 픽커 구동용 공압실린더
KR100433454B1 (ko) * 2002-08-30 2004-05-31 학교법인 인하학원 반도체 패키지의 다중정렬을 위한 픽 앤드 플레이스 장치
CN100390560C (zh) * 2005-12-09 2008-05-28 上海大学 单体太阳电池在线测试用防碎移栽吸盘
KR100881212B1 (ko) * 2007-04-28 2009-02-05 (주)테크윙 테스트핸들러용 픽앤플레이스장치
CN101352852B (zh) * 2007-07-26 2011-11-30 鸿富锦精密工业（深圳）有限公司 镜片拾取装置
KR100890816B1 (ko) * 2007-09-12 2009-03-30 주식회사 프로텍 디바이스 오토 피치 모듈
CN101782384B (zh) * 2009-12-11 2012-05-09 南京熊猫电子股份有限公司 Smd器件自动搬运定位测试机构
KR20130054787A (ko) * 2011-11-17 2013-05-27 삼성전자주식회사 반도체 테스트 장비
KR101919087B1 (ko) * 2012-10-05 2018-11-19 (주)테크윙 반도체소자 테스트용 테스트핸들러
CN103063181A (zh) * 2012-12-06 2013-04-24 芜湖杰锋汽车动力系统有限公司 一种相位器定子或转子测量及分类装置
KR102187839B1 (ko) * 2014-11-28 2020-12-08 (주)테크윙 테스트핸들러
CN105173727B (zh) * 2015-10-12 2017-07-11 苏州达恩克精密机械有限公司 芯片组装机的上料机械手
CN105499147A (zh) * 2015-12-31 2016-04-20 桂林斯壮微电子有限责任公司 一种测试分选机用的器件定位座
CN109720872B (zh) * 2017-10-30 2021-03-19 宁波舜宇光电信息有限公司 上下料机构及物料传输方法
CN110696023B (zh) * 2019-09-30 2023-03-07 苏州企赢自动化科技有限公司 一种变间距圆柱形电池抓取机械手
CN117214483B (zh) * 2023-11-09 2024-01-26 河南溪亭电力设备有限公司 一种互感器检测固定装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100924573B1 (ko) * 2007-09-14 2009-11-02 (주)알티에스 반도체 패키지 검사장치

Also Published As

Publication number Publication date
KR19980076000A (ko) 1998-11-16
CN1112590C (zh) 2003-06-25
CN1198534A (zh) 1998-11-11
JP3281313B2 (ja) 2002-05-13
JPH115629A (ja) 1999-01-12
TW419776B (en) 2001-01-21

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