KR100196455B1 - 반도체웨이퍼를 시트에 고정시키는 압력-감지성 점착제 - Google Patents

반도체웨이퍼를 시트에 고정시키는 압력-감지성 점착제 Download PDF

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Publication number
KR100196455B1
KR100196455B1 KR1019960003291A KR19960003291A KR100196455B1 KR 100196455 B1 KR100196455 B1 KR 100196455B1 KR 1019960003291 A KR1019960003291 A KR 1019960003291A KR 19960003291 A KR19960003291 A KR 19960003291A KR 100196455 B1 KR100196455 B1 KR 100196455B1
Authority
KR
South Korea
Prior art keywords
pressure
sensitive adhesive
rubber
styrene
chips
Prior art date
Application number
KR1019960003291A
Other languages
English (en)
Korean (ko)
Other versions
KR960032689A (ko
Inventor
기시오 니와야마
시게루 와다
히로유키 가와베
세이지 사이타
Original Assignee
모리야마 쥰고
도요 가가쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 모리야마 쥰고, 도요 가가쿠 가부시키가이샤 filed Critical 모리야마 쥰고
Publication of KR960032689A publication Critical patent/KR960032689A/ko
Application granted granted Critical
Publication of KR100196455B1 publication Critical patent/KR100196455B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tapes (AREA)
KR1019960003291A 1995-02-14 1996-02-12 반도체웨이퍼를 시트에 고정시키는 압력-감지성 점착제 KR100196455B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-49174 1995-02-14
JP4917495 1995-02-14

Publications (2)

Publication Number Publication Date
KR960032689A KR960032689A (ko) 1996-09-17
KR100196455B1 true KR100196455B1 (ko) 1999-06-15

Family

ID=12823703

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960003291A KR100196455B1 (ko) 1995-02-14 1996-02-12 반도체웨이퍼를 시트에 고정시키는 압력-감지성 점착제

Country Status (3)

Country Link
JP (1) JP4040706B2 (zh)
KR (1) KR100196455B1 (zh)
TW (1) TW383332B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11199841A (ja) * 1998-01-19 1999-07-27 Nitto Denko Corp 半導体装置用接着シ―ト類と面実装型半導体装置
JP4651767B2 (ja) * 1999-12-27 2011-03-16 日東電工株式会社 固形タイプの粘着剤組成物とその粘着シ―ト類
JP4780828B2 (ja) 2000-11-22 2011-09-28 三井化学株式会社 ウエハ加工用粘着テープ及びその製造方法並びに使用方法
JP5010800B2 (ja) * 2004-03-26 2012-08-29 リンテック株式会社 半導体デバイスの製造方法及びダイシング用粘着テープ
US8268449B2 (en) * 2006-02-06 2012-09-18 Brewer Science Inc. Thermal- and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive
JP4920400B2 (ja) * 2006-12-26 2012-04-18 日東電工株式会社 防水気密用粘着シート
JP2008098669A (ja) * 2007-12-21 2008-04-24 Denki Kagaku Kogyo Kk 半導体ウエハ・ダイシング方法
JP5378484B2 (ja) * 2011-11-14 2013-12-25 日東電工株式会社 架橋された固形タイプの粘着剤組成物とその粘着シートおよび防水気密用粘着シートの製造方法
JP7072735B1 (ja) * 2021-03-31 2022-05-20 株式会社寺岡製作所 粘着組成物及び粘着テープ

Also Published As

Publication number Publication date
JPH0912991A (ja) 1997-01-14
TW383332B (en) 2000-03-01
KR960032689A (ko) 1996-09-17
JP4040706B2 (ja) 2008-01-30

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