KR0118207B1 - Cleaning apparatus and wafer cassette - Google Patents

Abstract

A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A product insertion section for inserting the wafer from the product cassette; A cleaning unit for cleaning the wafer; A water washing part for washing the wafer cleaned in the washing part; A drying unit for drying the wafer washed in the water washing unit; A semiconductor cleaning apparatus having a wafer hand for directly supporting a wafer brought out from a product cassette of a product insertion section and having a conveying section for sequentially conveying a wafer supported by the wafer hand to a cleaning section, a water washing section, and a drying section.

Description

Semiconductor Cleaner and Wafer Cassette

1 is a block diagram showing the overall configuration of a cleaning apparatus according to a first embodiment of the present invention.

2 is a perspective view showing the structure of the product insertion unit according to the first embodiment of the present invention.

3 and 4 are cross-sectional views showing a washing tank and a drying tank according to the first embodiment of the present invention.

5 is a block diagram showing the overall structure of a cleaning apparatus according to a second embodiment of the present invention.

6 is a perspective view showing a wafer cassette for use of the second embodiment;

FIG. 7 is a perspective view showing a state in which the wafer cassette shown in FIG. 6 is supported by a cassette hand. FIG.

8 is an enlarged view showing the main part of FIG.

9 and 10 are cross sectional views each showing a state in which the wafer cassette shown in FIG. 6 is set in a washing tank and a drying tank.

11 and 12 are block diagrams showing the overall structure of the cleaning apparatus according to the third and fourth embodiments.

13 and 14 are plan and front views showing a cleaning apparatus according to the fifth embodiment.

15 and 17 are plan views showing cleaning devices according to the sixth to eighth embodiments.

18 is a block diagram showing a cleaning device according to a ninth embodiment.

19 to 25 are block diagrams each showing a modification of the ninth embodiment.

26 is a block diagram showing a cleaning device according to a tenth embodiment.

27 to 29 are block diagrams showing modifications of the tenth embodiment.

30 is a block diagram showing the structure of the transportation control system according to the eleventh embodiment.

Fig. 31 is a plan view showing a cleaning device for explaining the operation of the eleventh embodiment.

32 is a cross sectional view of a washing tank and a washing tank according to the twelfth and thirteenth embodiments.

33 is a cross sectional view showing a washing tank and a washing tank according to the twelfth and thirteenth embodiments;

34 and 35 are cross sectional views showing a water washing tank according to the 14th and 15th embodiments.

36 is a cross-sectional view showing a drying tank according to the sixteenth embodiment.

FIG. 37 is a cross sectional view showing a state in which a wafer and a wafer hand are dried in a drying tank shown in FIG.

38 shows a robot used as a cleaning apparatus according to the eighteenth embodiment.

FIG. 39 shows details of FIG. 38; FIG.

40 is a perspective view showing a wafer hand according to the nineteenth embodiment.

FIG. 41 is a front view showing the wafer support rod of the wafer hand shown in FIG. 40; FIG.

FIG. 42 is a cross sectional view taken along line A-A of FIG. 41;

43 and 44 are cross sectional views each showing a wafer support rod according to a modification.

45 and 46 are side and front views respectively showing a wafer cassette according to the twentieth embodiment.

Fig. 47 is a cross sectional view showing a state in which a wafer cassette according to a twentieth embodiment is set in a cleaning tank;

48 is a perspective view showing a wafer cassette according to a twenty-first embodiment;

49 is a perspective view showing a dedicated glove used in the cleaning apparatus according to the twenty-second embodiment.

FIG. 50 is a perspective view showing a cassette hand hung the dedicated globe shown in FIG. 49; FIG.

51 is a view showing a washing step when used in the washing apparatus according to the twenty-second embodiment;

Fig. 52 is a perspective view of a dedicated glove according to a modification of the twenty-second embodiment.

53 is a view showing another cleaning process in the case of using a dedicated glove according to the twenty-second embodiment;

54 and 55 are exploded perspective and perspective views respectively showing a cassette hand according to the twenty-third embodiment.

FIG. 56 shows a cleaning process when the cassette hand according to the twenty-third embodiment is used. FIG.

57 to 59 are a plan view, a front view and a side view respectively showing a semiconductor cleaning device according to a twenty-fourth embodiment.

60 is a cross sectional view showing a detailed internal structure of a cleaning apparatus associated with Example 24;

61 is a cross sectional view showing a cleaning apparatus according to a twenty-fifth embodiment;

62 is a view showing a control procedure for controlling the cleaning device according to the 25th embodiment;

FIG. 63 is a view showing the control procedure related to the modification in the 25th embodiment;

64 is a cross sectional view showing a portion including a cleaning tub according to the 26th embodiment;

65 is a cross sectional view showing a portion with a cleaning tank according to the 27th embodiment;

FIG. 66 is a graph showing the relationship between entropy in a wet state and entropy in a dry state.

FIG. 67 is a schematic view for explaining a state in which a chemical mist is trapped by the water mist of the 27th embodiment; FIG.

68 to 73 are cross sectional views each showing a structure of a part provided with a cleaning tank according to the 28th to 33rd embodiments.

74 to 76 are respective cross sectional views showing the interior of the cleaning apparatus according to the thirty-fourth to thirty-fourth embodiments.

77 is a perspective view showing a part provided with an insulating wall of the cleaning apparatus described in Embodiment 36;

78 is a cross sectional view showing the interior of the cleaning apparatus according to the 37th embodiment;

79 and 80 are cross-sectional and plan views, respectively, showing the cleaning apparatus according to the 38th embodiment.

81 is a cross sectional view showing the interior of a cleaning apparatus according to a 39th embodiment;

82 is a perspective view showing a window structure of the cleaning apparatus according to the 40th embodiment;

83 and 84 are a plan view and a front view, respectively, showing the cleaning apparatus according to the forty-first embodiment.

85 and 86 are a plan view and a front view, respectively, shown by the cleaning apparatus according to the 42nd embodiment.

FIG. 87 is a view showing a state in which a cleaning device according to a forty-second embodiment is used;

88 is a perspective view showing a rod locking tank of the cleaning apparatus according to the 43rd embodiment;

89 is a cross sectional view showing the interior of a cleaning apparatus according to a 44th embodiment;

90 is a block diagram showing the overall structure of a conventional semiconductor cleaning apparatus.

91 is a perspective view showing a conventional wafer cassette and cassette hand.

FIG. 92 shows a cleaning process suitable for the cleaning apparatus shown in FIG. 90;

93 is a cross sectional view showing a cleaning portion of the cleaning apparatus shown in FIG. 90;

The present invention relates to a semiconductor cleaning apparatus for cleaning a semiconductor wafer and a wafer cassette for containing the semiconductor wafer.

The structure of the conventional semiconductor cleaning apparatus is shown in FIG. In the loader / unloader section 1, a product cassette containing wafers before cleaning is put.

The product cassette is moved to the movement replacement part 12 by a transfer robot (not shown).

In this movement replacement portion 12, the wafer is moved from the product cassette to the cleaning cassette. The cleaning cassette in which the wafer 1 is accommodated is supported by the cassette hand of the cleaning product conveying unit 19 and sequentially moved to the cleaning unit 14, the water washing unit 15, and the drying unit 16. Thereby, the washing | cleaning process of the wafer 1 is performed.

FIG. 91 shows the cleaning cassette 2 supported by the cassette hand of the cleaning product conveyance unit 19. As shown in FIG. The cleaning cassette 2 is configured to receive and obtain a plurality of wafers 1. The cassette hand is a chuck 19c supported by a chuck support arm 19b connected to a moving arm 19a, and the chuck 19c supports the cassette 2 by supporting the flange 2a of the cleaning cassette 2. ) Is held in the cassette hand.

With reference to FIG. 92, the cleaning process of the wafer 1 is demonstrated. First, the movable arm 19a is contracted while the cassette 2 is held by the chuck 19c, and the movable arm 19a is moved along the support rod 19d to move the cassette 2 into the washing portion 14. It is located just above the bath 14a. Next, the cassette 2 is lowered by increasing the movable arm 19a, and the cassette 2 is immersed in the cleaning liquid 14b of the cleaning tank 14a. At this time, the upper end of the cassette 2 has almost the same height as the upper end of the wafer 1 accommodated in the cassette 2, so that the chuck 19c also cleans the wafer 1 in order to completely immerse the wafer 1 in the cleaning liquid 14b. It is immersed in 14b. The chuck 19c is then opened by the support arm 19b and stands by above the cleaning portion 14 by contracting the movable arm 19a.

When the wafer 1 is processed by the cleaning liquid 14b, the secondary moving arm 19a is extended to hold the cassette 2 in the cleaning liquid 14b, and the cassette 2 is taken out of the cleaning tank 14a to wash the water 15b. It is immersed in the washing liquid 15b of the washing tank 15b.

While the wafer 1 is being washed in the washing liquid 15b, the chuck 19c stands by above the washing tank 15a. When the washing process is completed, the cassette 2 in the washing tank 15a is taken out by the chuck 19c and the cassette 2 is set in the drying unit 16. The chuck 19c moves to the hand washing unit 13 by the moving arm 19a while the wafer 1 is dried in the drying unit 16 at the same time as the cassette 2. In this hand washing unit 13, the chuck 19c is washed and dried. Thereafter, the chuck 19c holds the cleaning cassette 2 in the drying section 16 and moves to the standby section 17. The cleaning cassette 2 in which the wafer 1 completed in the cleaning process is accommodated is moved from the standby section 17 to the transfer section 12 by the cleaning cassette transport section 18. In this transfer part 12, the wafer 1 is moved from the cleaning cassette 2 to the product cassette, and comes out of the road / undo part 11. The product cassette also has the same structure as the cleaning cassette 2. However, in such a conventional cleaning apparatus, as described above, whenever the cleaning cassette 2 is taken in and out of the cleaning tank 14a and the water washing tank 15a, the chuck 19c causes the cleaning liquid 14b and the washing liquid 15b to be removed. Is immersed in Therefore, in order to take out the dried wafer 1 and the cassette 2 from the drying unit 16, it is necessary to clean and dry the chuck 19c with the dedicated hand washing unit 13. or. In order to take out the cassette 2 from the drying part 16, it is necessary to provide the exclusive conveyance part which has a chuck previously dried. For this reason, there existed a problem that a washing | cleaning apparatus enlarged. In addition, the cleaning product conveying unit 19 carries out the conveying operation of the cleaning cassette 2 in which the wafer is stored, and the cleaning and drying operation of the cassette hand, thereby increasing the workload of the cleaning product conveying unit 19. The working time becomes long. Therefore, another problem occurs that the processing capacity of the cleaning device is lowered. In the washing tank 14a of the washing | cleaning part 14, the washing | cleaning chemical | medical solution 14b is heated and it is hold | maintained by the heater etc. so that a temperature which rose may perform a process. When light etching is performed, for example, SCI (NH ₄ OH + H ₂ O ₂ + H ₂ O) is heated from 40 ° C. to 50 ° C. to maintain this level. If the resist is removed, for example, sulfuric acid water peroxide (H ₂ SO ₄ + H ₂ O ₂ + H ₂ O) is heated from 140 ° C. to 150 ° C. to maintain this level to perform the desired process. .

When the semiconductor cleaner is located in a clean room, the air temperature is controlled to 25 ° C, for example. Therefore, the cleaning liquid 14b is formed of a mist-like substance by evaporation from the surface thereof, that is, when floating thereafter in an upflow 14d which is a natural convection generated on the surface of the cleaning liquid 14b. The liquid mist 14c shown in FIG. 93 diffuses. In order to prevent this, the local discharge pipe 14e is disposed locally on the washing tank 14a so that the chemical liquid mist 14c is absorbed with the discharge flow in the upflow 14d which is natural convection. Meanwhile, the transfer robot of the transfer unit 19 is vertically moved while the washing cassette 2 is supported by the cassette hand, the cleaning cassette 2 is immersed in the washing liquid 14, and the washing cassette is taken out from the washing liquid 14b. Let's do it. However, since the local discharge pipe 14e cannot fully absorb the chemical convection mist 14c throughout the upper surface of the natural convection upflow 14d and the cleaning tank 14a, part of the chemical liquid mist 14c diffuses outward. Done. When removing the washing | cleaning cassette 2 from the washing | cleaning liquid 14b. The cleaning cassette 2 soaked in the cleaning liquid 14b is pulled up to the top which is not affected by the local discharge. Therefore, the chemical liquid mist 14c is newly generated in the wet washing cassette 2. The chemical liquid mist 14c thus generated is diffused. Thus, the chemical liquid mist 14c is attracted to the transport robot in the transport section in the semiconductor cleaning device. As a result, the transport robot is corroded, so that the adsorption of the chemical mist 14c to the product wafer causes a defect. As the chemical mist 14c floats and spreads over the circulation flow in the clean room, the apparatus is corroded or the product wafer is excessively defective. SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and an object thereof is to provide a semiconductor cleaning apparatus which is compact and has a high processing capacity. Another object of the present invention is to provide a semiconductor cleaning apparatus which can prevent the diffusion of chemical liquid mist generated in the cleaning section and the vapor generated inside the drying section into the semiconductor cleaning device or the clean room. Another object of the present invention is to provide a wafer cassette in which dry wafers are taken out of the drying unit without being wetted again without providing a dedicated hand washing machine. According to a first aspect of the present invention, there is provided a semiconductor cleaning apparatus comprising: a loader / unloader portion for inserting and removing a product cassette in which a wafer is stored; A product insertion section for taking out a wafer from the product cassette; A cleaning unit for cleaning the wafer; A washing unit for washing the wafer which has been cleaned in the cleaning unit; A drying unit for drying the wafer which has been washed with water in the water washing unit; In addition to having a wafer hand that directly supports the wafers drawn out from the product cassette in the product insertion section, the wafers supported by the wafer hand are provided with a sequential transfer section in the washing section, the water washing section and the drying section.

A semiconductor cleaning apparatus according to a second aspect of the present invention, comprising: a loader / under-ro portion for inserting and removing a product cassette for storing a wafer; A cleaning cassette having a handle for storing the wafer and forming the received wafer thereon; A transfer part for moving the wafer between the product cassette and the cleaning cassette received by the loader / unloader part; A cleaning unit for cleaning the wafer stored in the cleaning cassette with a cleaning liquid; A washing unit which washes the wafer cleaned in the cleaning unit while storing the wafer in the cleaning cassette; A drying unit for drying the wafer, which has been cleaned with water at the water washing unit, while storing the wafer in the cleaning cassette; With a conveying part for supporting the handle of the cleaning cassette to sequentially convey the cleaning cassette to the dodo / underloader part and the cleaning part, the washing part, and the drying part, the received wafer is completely immersed in the cleaning liquid in the cleaning part and the cleaning water in the washing part. In this case, the handle of the cleaning cassette is positioned above the level of the cleaning liquid and the cleaning water.

In the semiconductor cleaning device according to the third aspect of the present invention, the loader / unloader part and the transfer part are arranged in the width direction of the cleaning device, and the conveying part is arranged in the longitudinal direction of the cleaning device at the central part of the cleaning device. And the drying section is arranged on both sides of the conveying section.

The semiconductor cleaning apparatus according to the fourth aspect of the present invention is arranged such that the loader / unloader section, the transfer section, the cleaning section, the washing section and the drying section form two lines, and the conveying section has an arrangement arranged in two rows.

The semiconductor cleaning apparatus according to the fifth aspect of the present invention has an arrangement in which a loader / unloader portion, a transfer portion, a washing portion, a water washing unit, and a drying portion are disposed around the conveying portion.

In accordance with a sixth aspect of the present invention, a semiconductor cleaning device includes: a first air supplying clean air to a cleaning unit, a washing unit, and a drying unit to form a downflow at a position above the cleaning unit, the washing unit, and the drying unit; Conditioning filters; A first discharge portion disposed adjacent to each chamber of the washing portion, the water washing portion, and the drying portion; A temperature detecting device for detecting the temperature of the washing liquid and / or the temperature of the steam in the washing unit; And an air supply pressure converting device for changing the air supply pressure of the first air conditioning filter in accordance with the temperature detected by the temperature detecting means.

A semiconductor cleaning apparatus according to a seventh embodiment of the present invention includes: a first air conditioning unit for supplying clean air to a cleaning unit, a washing unit, and a drying unit to form a downflow at a position above the cleaning unit, the washing unit, and the drying unit; A filter; A first discharge part disposed adjacent to each room of the washing part, the water washing part, and the drying part; A panel located on top of the seal having a periphery comprising a plurality of small openings immediately connected to the first outlet and having an opening immediately above the seal, enclosing the upper portion of the washing, flushing and drying sections. and; A drain receiver is disposed below the opening of the plurality of small panels located above the seal.

A semiconductor cleaning device according to an eighth aspect of the present invention includes: a first air conditioning filter for supplying clean air to a cleaning unit, a washing unit, and a drying unit to form a downflow at a position above the cleaning unit, the washing unit, and the drying unit. Wow; A first discharge part disposed adjacent to each chamber of the washing part, the water washing part, and the drying part; A first heat exchanger through which cooling air is supplied from the first air conditioning filter to the washing unit, the washing unit, and the drying unit; In the first refrigerating device receiving refrigerant from the first heat exchanger, the upflow of natural convection of steam generated in the washing tank of the washing unit or the steam tank of the drying unit and the air cooled in the first heat exchanger are They collide with each other at positions adjacent to the ends of the steam bath, causing the steam in the cooled air to condense and create water mist.

A semiconductor cleaning device according to a ninth aspect of the present invention includes: a first air conditioning filter for supplying clean air to a cleaning part, a washing part, and a drying part to form a downflow at a position above the cleaning part, the washing part, and the drying part; Wow; A first discharge part disposed adjacent to each chamber of the washing part, the water washing part, and the drying part; It is equipped with a double-fluid nozzle for injecting pure water while using clear air or activating gas as the second fluid to generate pure water fog that mixes into the downflow.

According to a tenth aspect of the present invention, a semiconductor cleaning device includes: a steam tank of a drying unit along one side of a seal and a cleaning tank of the washing unit, and a blowing out port and width toward the other side of the seal; An air curtain blowing device having a blowing out port arranged to blow out a constant air curtain in a horizontal direction; An air curtain discharge device having a suction port uniformly formed in the width direction of the steam tank of the drying unit and the other side of the cleaning tank of the cleaning unit to discharge the air curtain sucked through the suction port; Disposed in the blowout port of the air curtain blowing device, arranged to blow out the air curtain to form a layer flow, the speed at which the flow rate is gradually increased in inverse proportion to the distance from the yarn And a stop having a length in a passage direction that is gradually reduced in proportion to the distance from the scrubbing tank and the steam bath to form a distribution.

According to an eleventh aspect of the present invention, a semiconductor cleaning device includes: an air curtain formed on a steam tank of a drying unit and a cleaning tank of a cleaning unit along one side of the chamber, and having a blowing out port and a width direction constant toward the other side of the chamber. An air curtain blowing device having a blowing out port arranged to blow out in a horizontal direction; An air curtain discharge device having a suction port that is formed uniformly in the width direction of the steam tank of the drying unit and the other side of the cleaning tank of the cleaning unit to discharge the air curtain sucked through the suction port; A temperature detecting device for detecting the temperature of the washing liquid in the washing unit and / or the steam temperature in the drying unit; And an air conditioning filter supply pressure changing device for changing the pressure of air supplied from the first air conditioning filter in accordance with the temperature detected by the temperature detecting device.

A semiconductor cleaning device according to a twelfth aspect of the present invention; Blowing outs formed above the steam bath of the drying section and the cleaning bath of the washing section along one side of the seal, and arranged to blow out the blowout port in the other side direction of the seal and a constant air curtain in the width direction in the horizontal direction. An air curtain blowing device having a port; An air curtain discharge device having a suction port that is formed uniformly in the width direction of the steam tank of the drying unit and the other side of the cleaning tank of the cleaning unit to discharge the air curtain sucked through the suction port; A second heat converter for cooling the air blown out from the air curtain blowing device; A second refrigeration apparatus for supplying a cooling medium to the second heat converter, wherein the upflow of natural convection of steam generated in the steam tank of the drying unit or the cleaning tank of the washing unit and the air cooled in the second heat exchanger They collide with each other at positions adjacent to the ends of the steam or scrubbers to condense the vapors of the cooled air and produce water mist.

Semiconductor cleaning apparatus according to the thirteenth aspect of the present invention; Blowing out ports which are formed above the steam tank of the drying section and the washing section of the cleaning section along one side of the seal and are arranged to blow out the blowout port in the direction of the other side of the seal and the constant air curtain in the width direction in the horizontal direction. An air curtain blowing device having a; An air curtain discharge device having a suction port that is formed uniformly in the width direction of the steam tank of the drying unit and the other side of the cleaning tank of the cleaning unit to discharge the air curtain sucked through the suction port; And a two-fluid nozzle that dispenses pure water while using clear air or an inert gas as the second fluid to produce pure water mist mixed from the air curtain blowing device into the blown out air curtain.

According to a fourteenth aspect of the present invention, there is provided a semiconductor cleaning device comprising: a second air conditioning filter for supplying clean air to a conveying unit; It is provided with the 2nd discharge part which discharges air from a conveyance part.

A semiconductor cleaning device according to a fifteenth aspect of the present invention comprises: supplying a fluid of gas into a conveying part through an interval between any one of a washing part, a washing part, a drying part, and a conveying part such that the pressure of the conveying part becomes positive A gas supply unit; A fourth discharge part which discharges a part of gas supplied from the gas supply part from the bottom part of a conveyance part is provided.

A semiconductor cleaning apparatus according to a sixteenth aspect of the present invention includes: a fifth discharge portion for discharging air from the end of the position of the transfer portion.

According to a seventeenth aspect of the present invention, there is provided a semiconductor cleaning apparatus comprising: an outer wall of a cleaning apparatus for sealing each part; And a sixth discharge portion for discharging air between any one of the washing portion, the water washing portion, and the drying portion and the outer wall.

According to an eighteenth aspect of the present invention, there is provided a semiconductor cleaning apparatus comprising: a shielding chamber for shielding a washing unit, a washing unit, a drying unit, and a conveying unit; A window structure is provided for inserting and removing a wafer taken out of a product cassette in a transfer portion back and forth to the shielding chamber.

A semiconductor cleaning apparatus according to a nineteenth embodiment of the present invention includes: a first air conditioning filter for supplying clean air to a cleaning unit, a water washing unit, and a drying unit; A first discharge portion disposed adjacent to each chamber of the washing portion, the water washing portion, and the drying portion; And a demister arranged to remove dried vapor and chemical liquid mist mixed in the discharged air connected to the first discharge portion.

The wafer cassette according to the present invention is a cleaning wafer cassette for storing a plurality of wafers to immerse the wafer into each chemical chamber of the cleaning apparatus, the wafer cassette comprising: an accommodating portion for accommodating a plurality of wafers; The chemical liquid chamber has a handle portion formed at a position higher than the liquid level when the cleaning wafer cassette is set in each chemical liquid chamber.

Embodiments of the present invention will now be described with reference to the drawings.

[First Embodiment]

1 schematically shows the structure of a semiconductor cleaning apparatus 5A according to a first embodiment of the present invention. A loader / unloader portion 11A along the longitudinal direction of the cleaning transfer portion 35; A product insertion section 31A; Washing section 32A; The water washing part 33A and the drying part 34A are sequentially arranged. As shown in FIG. 2, the product insertion portion 31A has a support 31a for supporting the product cassette 4 and a wafer insertion jig 31b provided on the vertical moving material. The product cassette 4 has a plurality of grooves 4a for holding the wafer 1 and has an open lower portion. The structure is arranged such that the wafer insertion section jig 31b of the product insertion section 31A is inserted in the vertical direction through the opening. A plurality of grooves 31c for supporting the wafer 1 are formed on the upper surface of the wafer insertion unit jig 31b. The structure of the washing | cleaning part 32A is shown in FIG. The wafer receiver 32b formed in the cleaning tank 32A is formed. A plurality of grooves (not shown) are formed in the wafer receiver 32b, and the wafer 1 is supported by inserting the end portions of the wafer 1 into the grooves. The water washing portion 33A also has the same structure as the washing portion 32A in FIG. The structure of the drying part 34A is shown in FIG. The drying tank 34a includes an isopropyl alcohol (hereinafter referred to as IPA) recovery tank 34b to form a double structure. A condenser coil 34c is disposed along the upper inner wall of the drying tank 34a and a heater 34e for heating and vaporizing the IPA 34d housed in the drying tank 34a below the drying tank 34a. Is arranged. In addition, a discharge pipe 34f for discharging the IPA recovered therein is connected to the IPA recovery tank 34b. The operation of the first embodiment will be described next. First, the product cassette 4 in which the plurality of wafers 1 before cleaning are accommodated is loaded into the loader / unloader section 11. The product cassette 4 is moved to the product insertion portion 31 by a transfer robot (not shown) and is disposed on the support 31a as shown in FIG. When the wafer insertion jig 31b rises in this state, the end of each wafer 1 is inserted into the groove 31c of the wafer insertion jig 31b. As a result, the plurality of wafers 1 are supported, and the wafers 1 are pushed upward from the product cassette 4. Next, the plurality of wafers 1 are supported by the wafer hand 35a of the cleaning product conveying unit 35 and moved from the product insertion section 31A to the cleaning section 32A. Thus, the plurality of wafers 1 are sent to the wafer receiver 32b in the cleaning tank 32a of FIG. When the wafer 1 finishes cleaning in the cleaning section 32A, the wafer 1 is sent from the cleaning section 32A to the wafer receiver of the water washing section 33A by the wafer hand 34a, and the washing section 33A Is washed in). Thereafter, the wafer 1 is sent from the water washing part 33A to the drying part 34A, and is heated and evaporated to the IPA 34d stored in the bottom of the drying tank 34a by the heater 34e of FIG. At the same time, the refrigerant is supplied into the condensation coil 34c to cool the atmosphere above the drying tank 34a. As a result, the vapor of the IPA 34d in which the drying tank 34a rises from the bottom is cooled and condensed at the portion adjacent to the condensing coil 34c, and returned to the bottom of the drying tank 34a again. In this way, the divergence of the IPA 34d to the outside of the drying tank 34a is prevented, and the inside of the drying tank 34a is filled with vaporized IPA 34d. The wafer 1 washed with water in the water washing part 33A and still remaining on the surface thereof is supported inside the recovery tank 34 as supported by the wafer hand 35a. As a result, the vapor of the IPA 34d in contact with the surface of the wafer 1 is cooled by the wafer 1 to liquefy and mix with the moisture remaining on the surface of the wafer 1. As a result, the surface of the wafer 1 becomes larger, including a large amount of IPA, and falls along the surface of the wafer 1 and falls into the recovery tank 34b. At this time, foreign matter and the like adhering to the surface of the wafer 1 also fall like drops of water. The water droplets dropped into the recovery tank 34b are discharged to the outside of the drying tank 34a through the discharge pipe 34f. In this manner, the moisture on the surface of the wafer 1 is gradually replaced with the IPA. The temperature of the surface of the wafer 1 gradually rises and becomes equal to the temperature of the vapor of the IPA 34d. For this reason, IPA which adhered to the surface of the wafer 1 instead of water evaporates. When the drying is completed, the cleaning component conveying unit 35 moves the wafer 1 from the drying unit 34A to the product inserting unit 31A by the wafer hand 35a, and the product cassette placed on the support 31a. (4) Insert it. Thereafter, the product cassette 4 is discharged to the loader / unloader portion 11A by a transfer robot (not shown). Also, at the time of washing the wafer 1 in the washing part 33A, the washing of the wafer hand 35a is performed in the washing tank at the same time. On the other hand, in the cleaning section 32A, the wafer hand 5a is simultaneously cleaned at the time of cleaning the wafer 1. However, the wafer hand 35a may not be cleaned. According to Example 1 described above, washing, washing, and drying are performed without using the cleaning cassette. It became short by%. Further, since the cleaning cassette atmospheric portion becomes unnecessary as compared with the conventional semiconductor cleaning apparatus, it is possible to shorten the length by about 30% as the overall length of the cleaning apparatus.

Second Embodiment

The structure of the cassette semiconductor cleaning device 5B according to the second embodiment of the present invention is shown in FIG. A loader / unloader section 11B in the longitudinal direction of the cleaning cassette conveying section 25; Transfer part 31B; Washing section 32B; The water washing part 33B and the drying part 34B are sequentially arranged. Unlike the first embodiment, the cassetteless cleaning apparatus is structured by the direct support of the wafer 1 and the conveyance by the wafer hand 35a, so that the cleaning cassette 20 structured as shown in FIG. A method is arranged in the second embodiment in which the wafer 1 is set in the washing tank and the washing tank while the chuck of the cassette hand is not wetted with the washing liquid and the washing water. Since the cleaning cassette 20 has a height H of the wafer 1, that is, a height H sufficiently higher than the diameter, it is stored in the cleaning cassette 2. A plurality of wafers 1 are moved from the product cassette to the cleaning cassette 20 in the transfer portion 31B, and as shown in FIG. 7, the wafer 1 is a cassette hand of the cleaning cassette conveying portion 25. As shown in FIG. It is supported by and is moved to the washing | cleaning part 32B, the water washing part 33B, and the drying part 34B in order. The cassette hand of the cleaning cassette conveyance part 25 is provided with the movable stand 25a supported by the chuck support 25b, and the chuck support 25b connected to the chuck 25c. As shown in FIG. 8, with the recesses 25d in the chuck 25c, the insertion of the handle 20a of the cleaning cassette 20 into the recess 25d causes the cleaning cassette 20 to be inserted. To be supported by the cassette hand. Since the cleaning cassette 20 has a height H which is sufficiently higher than that of the wafer 1, the cleaning cassette 20 in the cleaning tank 32k of the cleaning section 32B is used by using the cassette hand of the cleaning cassette conveying section 25. Is set to completely immerse the wafer 1 in the cleaning liquid 32m, the handle 20a disposed at the end of the cleaning cassette 20 is positioned higher than the liquid level of the cleaning liquid 32m in FIG. Therefore, it is not soaked with the cleaning liquid 32m of the chuck 25c of the cassette hand that supports the handle 20a of the cleaning cassette 20. When the cleaning cassette 20 is similarly set in the cleaning section 33B, even if the wafer 1 is completely immersed in the cleaning water, wetting of the chuck 25c with the cleaning water is prevented. When the washing process is completed, the wafer 1 together with the cleaning cassette 20 is dried in the drying section 34B of FIG. The drying section 34B has a double structure consisting of an IPA recovery tank 34q and a drying tank 34k, such as the drying section 34A in FIG. In addition, the condensation coil 34m is disposed along the inner wall at the top of the drying tank 34k, and a heater 34r for heating the stored IPA 34n is disposed under the drying tank 34k. Moreover, a discharge pipe for discharging the IPA stored in the IPA recovery tank 34q is connected to the IPA recovery tank 34q. As described above, the chuck 25c of the cassette hand is not wetted with the washing liquid 32m or the washing water, and the chuck 25 is used to take out the dried washing cassette 20 of the drying unit 34B. That is, since a dedicated hand washing unit for the washing and drying cassette hand is unnecessary in its structure, a washing apparatus of a small size is realized.

Third Embodiment

In FIG. 11, the structure of the semiconductor cleaning apparatus according to the third embodiment will be described. A loader / unloader section 11A, a product insertion section 31A, and a wafer mounting table 200A in the longitudinal direction of the cleaning product conveying section 35; Washing section 32A; The water washing part 33A and the drying part 34A are arranged in this order. The cleaning product conveying unit 35 includes a product extracting unit 31A; Washing section 32A; Wafers are sequentially conveyed in the order of the water washing part 33A and the drying part 34A. In order to carry in order, the part which receives a wafer then does not need to have a wafer. That is, only the wafer can be conveyed when at least one of the product insertion section 31A, the cleaning section 32A, and the drying section 34A does not have a wafer. However, the process performed in the washing section 32A does not have an arrangement that confirms that the empty state in the water washing section 33A which starts with the strict adjustment of the processing time starts the cleaning process so as to improve the processing execution. Therefore, in the third embodiment, the wafer mounting table to overcome the problem that increases when the wafers cannot be transported in order for some reason or another, such as a trouble occurring in the product insertion section 31A or the drying section 34A. 200 A is provided. If the wafer cannot be conveyed in order, the wafer set in the cleaning section 33A is preferentially placed close to the upper side of the wafer mounting table 200A, and the wafer subjected to the cleaning process in the cleaning section 32A is moved to the water washing section. send. When the wafer mounting table 200A is provided with the water washing function, the wafer immersed in the cleaning liquid from the cleaning unit 32A to the wafer holding frame 200A can be placed directly on the side when the wafer cannot be conveyed in sequence. For example, the water washing tank function is realized by a structure in which the purified water is sprayed against the wafer or a structure in which the wafer is immersed in the water washing tank arranged similarly to the cleaning section 33A. By providing the water washing function as described above, the wafer to which the cleaning liquid adheres can be washed on the wafer mounting table. As a result, the progress of the cleaning process can be prevented.

Fourth Embodiment

A cassette type cleaning device having a cassette holder 200B similar to the third embodiment is shown in FIG. When trouble occurs in the transfer part 31B, the drying part 34B, or the like, which occurs as a result of the wafer being unable to carry the wafer in order, the cleaning cassette set in the water washing part 33B is placed close to the upper side of the cassette mounting stand 200B. Thereafter, like the cleaning cassette, the wafer received in the cleaning process in the cleaning section 32B is transferred to the wafer cleaner 33B. When the cassette mounting table 200B is provided for the washing function, the wafer immersed in the cleaning liquid from the cleaning section 32B to the wafer mounting table 200B can be placed directly aside when the wafer cannot be conveyed in sequence.

[Example 5]

The overall structure of the cleaning apparatus is arranged to clean the wafer 1 by handling and shown in FIG. 13 according to the fifth embodiment. The cleaning apparatus includes a main processing section 50 which performs the cleaning process and the process of the loader / unloader section 51. The conveying section 58 is arranged at the center of the main processing section 50 in the longitudinal direction of the cleaning apparatus. The conveying unit 58 is installed in the conveying robot having a rotating shaft which rotates the moving shaft and the wafer hand in the longitudinal direction of the cleaning apparatus. On both sides of the conveyance section 58, the wafer mounting table 52, the cleaning tank 53a of the cleaning section 53, the washing tanks 54a and 55a of the wafer cleaning sections 54 and 55, and the drying section 56. Drying tank 56a is arranged in the longitudinal direction of the washing apparatus so as to form two lines. The loader / unloader unit 51 having six product cassette mounts and one wafer mount stand is disposed at the end of the conveying unit in the width direction of the cleaning apparatus so as to have a long distance, and the six batches of wafers 1 taken out from the product cassettes are placed in a batch. The product cassette is placed in the loader / unloader section 51. Further, a robot 57 for moving the wafer 1 between the loader / unloader section 51 and the product cassette 22 disposed on the wafer mounting table 51a is disposed adjacent to the loader / unloader section 51. Let's do it. FIG. 14 is a front view of the cleaning apparatus, with reference numeral 58a showing a wafer hand of the conveying section 58. As shown in FIG. The operation of the cleaning apparatus according to the fifth embodiment will now be described. The product cassette 22 for adjusting the wafer 1 is placed in the product cassette mounting table of the loader / unloader section 51. The robot 57 takes out the wafer 1 from the product cassette 22 to move the wafer 1 to the wafer mounting table 51a. After that, the moved wafer 1 is supported by the wafer hand 58a of the transfer section 5 and moved to the wafer mounting table 55, and the wafer 1 waits. Thereafter, the transfer section 58 sets the wafer 1 into the cleaning tank 53a of the cleaning section 53. After the wafer 1 has undergone a predetermined cleaning process, the conveying unit 58 sets the wafer 1 into the washing tank 54a of the washing unit 54. After the predetermined washing tank process is completed, the conveying unit 2 58 sends the wafer 1 into the washing tank 55a of the washing unit 55 to wash the wafer 1. The washing process is successively performed in the two washing tanks 54a and 55a, and the time required for completing the washing process is shortened, so that a certain washing effect is expected. The transfer section 58 sets the wafer 1 subjected to the water washing process to receive the wafer 1 in a drying process into the drying tank 56a of the drying section 56. After the drying is completed, the transfer section 58 takes the wafer out of the drying tank 56a and moves the wafer 1 onto the wafer mounting table 51 of the loader / unloader section 51. The robot 57 supports the wafer 1 placed on the wafer mounting stand 51a and moves the wafer 1 to the empty product cassette placed on the product cassette mounting stand. The fifth embodiment conveys a cassette resin cleaning device for directly handling the wafer 1, a cassette type cleaning device formed to have a layout and similar layout of the wafer cassette mounting table in place of the respective wafer mounting tables 51a and 52. It is arranged in the section 58 to configure the use of the cassette hand dashed to the wafer hand.

Sixth Embodiment

16 illustrates the overall structure of the cleaning apparatus according to the sixth embodiment. The wafer mounting table 52 and the cleaning tank 53a are disposed on one side surface of the transfer section 58. In addition, the second washing tank 55a and the drying tank 56a are disposed on the remaining side surface of the conveying unit 58. In addition, the first washing tank 54a is disposed above the rotational position of the wafer hand of the transfer section 58. As described above, the cleaning apparatus according to the fifth embodiment shown in FIGS. 13 and 14 by arranging one of the plurality of units forming the cleaning apparatus on the rotational position of the wafer hand of the conveying unit 58 Small size cleaning devices having the same number of units can be realized. Also in the sixth embodiment, the placement of the wafer cassette mounts in place of the respective wafer mounts 51a and 52 and the use of the cassette hand dashed to the wafer hand in the transfer section 58 form a cassette type cleaning apparatus to have a similar layout. Make it possible.

[Example 7]

16 illustrates the overall structure of the cleaning apparatus according to the sixth embodiment. The wafer mounting table 52, the second washing tank 55a, and the first washing tank 54a are disposed on one side surface of the conveying unit 58. Moreover, the washing tank 53a and the drying tank 56a are arrange | positioned on the remaining side surface of the conveyance part 58. As shown in FIG. The conveying section 58 passes through the semicircular position R1 of the rotation of the wafer hand passing through the wafer mounting table 51a of the loader / unloader section 51, the cleaning tank 53a, and the first water washing tank 54a. It has a semi-circular position R2 of the rotation of the wafer hand facing the loader / unloader section 51. After the rotational positions R1 and R2 of the wafer hand of the transfer section 58 are set to face the loader / unloader section 51, a washing apparatus of a small size is realized. Also in the seventh embodiment, the arrangement of the wafer cassette mounts in place of the respective wafer mounts 51a and 52 and the use of the cassette hand in place of the wafer hand in the transfer section 58 are provided so that the cassette type cleaning apparatus has a similar layout. Make it formable.

[Example 8]

17 illustrates the overall configuration of the cleaning apparatus according to the eighth embodiment. The cleaning apparatus according to this embodiment uses three chemical liquids to clean the wafer 1. On both sides of the conveyance part 78 of the main body processing part 70, the wafer mounting base 72, the 1st washing tank 73a, the 1st washing tank 74a, the 2nd washing tank 73b, and the 2nd washing tank ( 74b), the 3rd washing tank 73c, the 3rd washing tank 74c, the washing tank 75, and the drying tank 76 are arranged in two rows along the longitudinal direction. In addition, the mobile replacement robot 77 is disposed at the end of the transfer unit 78, and the loader / unloader unit 71 is disposed adjacent to the mobile replacement robot 77. Different chemical liquids are accommodated in the first to third cleaning tanks 73a to 73c, respectively. Next, the operation of the eighth embodiment will be described. The product cassette 22 containing the wafer 1 is disposed on the product mounting table of the loader / unloader section 71. The mobile replacement robot 77 removes the wafer 1 from the product cassette 22 and transfers the wafer 1 to the wafer replacement portion 71a of the loader / unloader portion 71. The wafer 1 thus moved is supported by the wafer hand of the transfer section 78 and moved to the wafer mounting table 72, where the wafer 1 is placed. Thereafter, the transfer section 78 sets the wafer 1 into the first cleaning tank 73a. After the wafer 1 has been subjected to the predetermined cleaning process, the transfer unit 78 sets the wafer 1 into the first washing tank 74a. After the predetermined washing tank treatment is completed, the conveying unit 78 is moved to the second washing tank 73b to clean the wafer 1 by predetermined washing. In addition, the transfer section 78 moves and replaces the wafer 1 with the second washing tank 74b. Similarly, the wafer 1 moves to the third washing tank 73c and the third washing tank 74c in order, and the cleaning process using the third chemical liquid is completed in order. Then, the conveyance part 78 takes out the wafer 1 of the 3rd washing tank 74c, sets the wafer 1 in the last washing tank 75, and performs the predetermined washing process. The conveying unit 78 sets the washed wafer in the drying tank 76 in a predetermined manner. Therefore, a drying process is performed. After the drying is completed, the conveying unit 78 takes out the wafer 1 of the drying tank 76 and moves the wafer 1 to the wafer mounting table 71a of the loader / unloader unit 71. The mobile replacement robot 77 supports the wafer 1 arranged on the wafer mounting table 71a and moves the wafer 1 to the empty product cassette placed on the product cassette mounting table. In the above description of the structure, only one lot of wafers 1 are present in the cleaning apparatus, but a plurality of wafers 1 are present in the cleaning apparatus and each unit processes a corresponding wafer. . Also in the eighth embodiment, the arrangement of the wafer cassette mounts in place of the respective wafer mounts 71a and 72 and the use of the cassette hand in place of the wafer hand in the transfer section 78 form the cassette type cleaning apparatus to have a similar layout. Make it possible.

[Example 9]

A semiconductor cleaning apparatus according to this embodiment includes a loader / undoor unit 11; A product insertion section 31A; Washing section 32A; It is not necessary to arrange each unit of the water washing part 33A and the drying part 34A in a straight line. For example, in the washing apparatus shown in FIG. 18, the product conveying unit 351 is connected to the product extracting unit 311A arranged in parallel in the loader / unloader unit 111 and the water washing tank 331, and the washing unit is connected to the washing unit. 321 are arranged to face each other by sandwiching the product conveying portion 351. Similarly, the water washing part 332 and the washing part 322 are disposed to face each other, and the water washing part 333 and the dry part 341 are disposed to face each other. As described above, a plurality of washing portions and a plurality of washing parts may sometimes be required depending on the washing step. By the structure shown in FIG. 18, the length of the whole semiconductor cleaning apparatus can be shortened. In particular, since the washing part in which the chemical liquid is used and the washing part in which the water washing is performed are disposed to face each other, the vapor of the chemical liquid generated in the washing part is prevented from adversely affecting other units. Another configuration shown in FIG. 19 is to insert the product carrying section 351, the loader / unloader section 112 and the product insertion section 311A is facing the drying section 341, the water washing section 331 The washing part 321 may be faced, and the water washing part 332 may be disposed to face the washing part 322. As a result of the configuration thus made, the overall length of the cleaning apparatus can be shortened.

In other structures shown in FIGS. 20 and 21, the product conveying portion 351 is arranged in either of two rows of units in place of the central portion.

Each cleaning apparatus shown in FIGS. 18 and 21 is a cassetteless cleaning apparatus for directly handling the wafer 1 by the wafer hand. Another structure shown in FIG. 22 to FIG. 25 is for a cleaning device, and the transfer part 311B is disposed in place of the product insertion part 311A, and the cleaning cassette conveying part 251 replaces the product conveying part 351. Are arranged. In each case, a cassette type cleaning device having a similar layout is structured.

[Example 10]

In another configuration, the loader / unloader section 111, the product insertion section 311A, the washing section 321, the water washing section 331, and the drying section 341, as shown in FIG. 352). The product conveying unit 352 has a conical arm that moves the wafer to each unit around it. In the structure shown in FIG. 26, four units are arranged around the product carrying part 352, but the present invention is not limited thereto. For example, in the configuration shown in FIG. 27, five units including the second water washing unit 332 may be arranged around the product transport unit 352. According to the structure shown in FIG. 26 or FIG. 27, the area of the product conveyance part 352 is made small and the overall length of a washing | cleaning apparatus can be shortened. Each cleaning apparatus according to the tenth embodiment is a cassetteless type cleaning apparatus which directly handles the wafer 1 by its wafer hand. Other structures shown in FIG. 28 and FIG. 29 are for the cleaning apparatus, and the transfer part 311B is disposed in place of the product insertion unit 311A and the cleaning cassette transfer unit 252 is disposed in place of the product transfer unit 352. do. In each case, a cassette type cleaning device having a similar layout is structured.

[Example 11]

30 illustrates the structure of a system for producing conveyances carried out by a conveying robot according to the eleventh embodiment. The transfer robot control unit 67 is connected to the transfer robot 58b, and the transfer control CPU 65 is connected to the transfer robot control unit 67. The cleaning tank control unit 68 is connected to the transfer control CPU 65 via the processing time control CPU 66. Next, the operation of the eleventh embodiment will be described with reference to FIG. As shown in FIG. 31, the loader / unloader unit 51, the wafer cassette mounting tables 51b and 52b for cleaning the main body processing unit 50, the first and second washing tanks 54a and 55a and the drying tank. It is assumed that the wafer cassette 21 displayed by attaching diagonal lines to each of the 56a is being processed. That is, FIG. 31 shows a state in which only the cleaning tank 53a in the cleaning apparatus does not have the wafer cassette 21 being processed. By the instruction from the transfer robot control CPU 65, the transfer robot control unit 67 controls the transfer robot 58b to perform the following operations: The transfer robot 58b is a cleaning wafer for the main body processing unit 50. After being placed in the cleaning tank 53a on the cassette mounting table 52b, the wafer cassette mounting table 51b of the loader / unloader 51 moves to the wafer cassette 21, and the loader / unloader 51 The wafer cassette 21 in the drying tank 56a is moved to the wafer cassette mounting table 51b, the wafer cassette 21 in the second washing tank 55a is moved into the drying tank 56a, and the first washing tank ( The wafer cassette 21 in 54a) is moved into the second washing tank 55a. After the predetermined processing time has elapsed, the wafer cassette 21 is moved around the empty place where the wafer cassette 21 does not exist, that is, the first water washing tank 54a. In the wafer cassette mounting table 51b of the loader / unloader section 51, the mobile replacement robot 57 takes out the cleaned wafer 1 from the wafer cassette 21 and is stored in the product cassette 22. In addition, the wafer 1 not cleaned in the other product cassette 22 is moved to the wafer cassette 21. The predetermined control time is determined by the control timing in the time processing control CPU 66 connected to the cleaning tank control unit 68. When the timing at which the transfer robot 58 moves the wafer cassette 21 is determined according to the predetermined processing time of the main body processing section 50, the wafer cassette mounting table 51b in the loader / unloader section 51 In some cases, the wafer 1 is not fed into the wafer cassette 21 from above. In this case, the empty wafer cassette 21 is not held at another place, but is moved to the conveyance path in the main body processing section 50 as it is. As shown in FIG. 32, the cleaning tank group control part 69 is connected to the processing type control CPU 66 instead of the cleaning tank control part 68 of the system shown in FIG. The washing tank group control unit 69 includes a washing tank control unit 69a for controlling the washing tank 53a and a washing tank control unit 69b for controlling the washing tanks 54a and 55a. As a result, an effect can be obtained when two units in the cleaning apparatus are in an empty state without the wafer cassette 21. The cleaning tank 53a and the first wafer cleaning tank 54a do not have the wafer cassette 21 being processed, and the loader / unloader unit 51, the main body processing unit 50, and the second washing tank 55a are disposed. And each of the drying baths 56a has a wafer cassette 21 being processed. By the instruction from the transfer robot control CPU 65, the transfer robot control unit 67 controls the transfer robot 54b and operates in the following order: The transfer robot 58b is cleaned by the main body processing unit 50. After the wafer cassette 21 placed on the wafer cassette mounting table 52b for moving is moved into the cleaning tank 53a, the transfer robot 58b passes a predetermined time and then the wafer cassette 21 in the cleaning tank 53a. ) Is moved into the first washing tank 54a. At this time, since the first washing tank 54a is empty, the wafer cassette 21 is moved to the first washing tank 54a immediately after a predetermined time has elapsed in the cleaning unit 53. Thereafter, the transfer robot 58b moves the wafer cassette 21 on the wafer cassette mounting table 51b of the loader / unloader section 51 to the wafer cassette mounting table 52b of the main body processing section 50, thereby drying the drying tank ( It moves to the wafer cassette of the loader / unloader part 51 of the wafer cassette 21 in 56a, and moves the wafer cassette 21 in the 2nd washing tank 55a into the drying tank 56a. The wafer cassette 21 moved from the washing tank 53a to the first washing tank 54a is moved by the transfer robot 58b to the second washing tank 55a after a predetermined time has elapsed. As described above, the empty portion is moved while not having the wafer cassette 21 at the center. In the wafer cassette replacement part 51b of the loader / unloader part 51, the mobile replacement robot 57 takes the cleaned wafer 1 out of the wafer cassette 21 and stores it in the product cassette 22. The wafer 1 before cleaning in the cassette 22 is moved to the wafer cassette 21. The processing time in the washing tank 53a and the processing time in the washing tanks 54a and 55a in the control timing commanded by the washing tank management unit 69a and the washing tank management unit 69b connected to the water cooling tank control unit 69b. This is determined. When the wafer cassette 21 is moved timing when the wafer 1 has not yet been put into the wafer cassette 21 on the wafer cassette mounting table 51b of the loader / unloader section 51, the empty wafer cassette 21 ), The empty wafer cassette 21 is moved into the conveyance path in the main body processing section 50, instead of waiting at another place.

[Twelfth Example]

In the cleaning apparatus according to the above embodiments, after setting the wafer cassette 21 in the cleaning tank 85, the handle 21g of the wafer cassette 21 is exposed to expose the insulating plate 86 having the opening 86a. In the case of the above, the mist is prevented from adhering to the handle 21g of the wafer cassette 21 by the cleaning process. In other words, it is possible to prevent contamination of the cassette hand 88 which occurs when the handle 21g of the cleaned wafer cassette 21 is supported by the cassette hand 88 of the transfer robot.

[Thirteenth Embodiment]

The wafer cassette 21 immersed in the cleaning liquid 87 by the cleaning process by making the washing liquid 90 in the washing tank 89 higher than the liquid level of the cleaning liquid in the cleaning tank 85 shown in FIG. It is to wash the support plate 21a of water completely.

[Example 14]

As shown in FIG. 34, when the structure is arranged in such a manner, the handle 21g of the wafer cassette 21 exposed to the outside with the wafer cassette 21 set in the water tank 89 and By spraying pure water and dry gas from the nozzle 91 to a part of the support plate 21a, it is possible to remove the mist adhered by the washing process.

[Example 15]

By soaking the wafer hand 35a of the conveying unit 35 in the pure water 93 in the water washing tank 92 as shown in FIG. 35, the water washing tank 92, the cleaning liquid and the wafer hand while removing the cleaning treatment. The wafer 1 is set in the mist attached to 35a.

[Example 16]

The structure of the drying part is shown in FIG. The IPA recovery tank 44b of the wafer hand is stored in the drying tank 44a, and the IPA recovery tank 44c of the wafer is placed in the recovery tank 44b. The IPA recovery tank 44c of the wafer has a wafer receiver. The wafer receiver 44d has a plurality of grooves to receive the end of the inserted wafer 1 to support the wafer 1. In order to recover the IPA containing water, the discharge pipes 44e and 44f are connected to the bottoms of the IPA recovery tanks 44b and 44c, respectively. The shaft coil 44g is disposed along the inner wall of the upper part of the drying tank 44a, and the heater 44h is disposed below the drying tank 44a. Next, operations performed in the drying unit according to the sixteenth embodiment will be described. The wafer 1 washed in the washing tank 33A shown in FIG. 1 is supported by the wafer hand 35a of the product conveying unit 35 and is supported by the wafer receiver 44d of the drying unit shown in FIG. Receive. Thereafter, only the wafer hand 35a is disposed between the two recovery tanks 44b and 44c. The IPA 44i stored in the bottom of the drying tank 44a is heated and evaporated by the heater 44h to condense on the surface of the wafer 1 and the surface of the wafer hand 35a. Before the water is discharged to the outside through the discharge pipes 44f and 44e, the droplets fall from the surface of the wafer 1 to the recovery tank 44c and the droplets fall from the surface of the wafer hand 35a to the recovery tank 44b. Therefore, water and foreign matter on the surface of the wafer 1 and the surface of the wafer hand 35a can be removed. In the sixteenth embodiment, each droplet is recovered from the wafer 1 and the wafer hand 35a, and the wafer is treated with an IPA that processes the wafer hand 35a while simultaneously drying and processing the wafer 1 and the wafer 35a. It prevents to pollute (1).

[Example 17]

In the cleaning apparatus according to the fifteenth embodiment shown in FIG. 13, the wafer 1 of a plurality of lots exists in the cleaning apparatus, and the washing tanks 54 and 55 and the drying tank 56 simultaneously correspond to wafers of the lot. Process (1). Since the product conveying unit 58 has the wafer mounting table 52 on the side and the wafer mounting table 51a of the loader / unloader section 51, 6 lots of wafers 1 are simultaneously set in the cleaning apparatus. The placement of six or more product cassette mounts in the unloader section 51 effectively maximizes the operation of the cleaning apparatus. In each product cassette 22, the product identification table is always fixed and can be arranged adjacent to the side of the washing apparatus by giving a function of controlling the direction of each product mounting table.

[Example 18]

Detailed structures of the robot 57 according to the fifteenth embodiment shown in FIG. 13 are shown in FIG. 38 and FIG. The robot 57 is arranged to move the wafer 1 between the loader / unloader section 51 and the product cassette 22 disposed on the wafer mounting table 51a. The robot 57 is an orientation flat matching device for matching the orientation flat of the hand 57a holding the wafer 1 with the orientation flat of the wafer 1 housed in the product cassette 22. aligning device) and a protruding member 57c for protruding the wafer 1 in the product cassette 22 above the product cassette 22. The robot 57 is moved along the rails 57 to the position of the product cassette 22 arranged on the product cassette retainer of the loader / unloader section 51. The robot 57 aligns in the orientation flat direction of the plurality of wafers 1 housed in the product cassette 22 using the orientation flat matching device 57b, and then the protruding member 57c is a product cassette. The wafer 1 is projected from the 22 toward the product cassette 22. In this state, the robot 57 supports the wafer with its hand 57a, moves the protruding member 57c downward, and then moves it to the position of the wafer mounting table 51a of the loader / unloader portion 51. . At this time, the protruding member 57c is moved upward from the position under the wafer cassette 21 to support the wafer 1 supported by the hand 57a. After releasing the wafer 1, the hand 57a moves the protruding member 57c downward to move the wafer 1 to the wafer mounting table 51a. The robot 57 is a robot provided in a cassetteless cleaning apparatus that directly handles the wafer 1 and moves the wafer 1 between the product cassette 22 and the wafer mounting table 51a. A robot for moving the wafer 1 between the product cassette disposed on the loader / unloader section and the wafer cassette disposed on the wafer cassette mounting table is similarly configured and used in the cassette type cleaning apparatus.

[Example 19]

As shown in FIG. 40, the structured wafer hand 45a can be used as the wafer hand of the product carrying part. Wafer support rods 45f and 45g which are connected between the arm 45b of the two arm pairs 46b to 45c and 45d to 45e and the arm 45d are arranged, and furthermore, between the arm 45c and the arm 45e. Wafer support rods 45h and 45i are connected to each other. In the wafer support rods 45f to 45i, the wafer support rods 45f to 45i are arranged in parallel with the other side, while having the plurality of wafer receiving grooves 45j shown in FIGS. 41 and 42, respectively. The wafer receiving groove 45j is condensed on the wafer guide portion 45k having a taped cross-sectional shape, the wafer support portion 45m for supporting the wafer 1, the surface of the wafer 1, and the surface of the wafer receiving groove 45j. It consists of a discharge part (45n) for discharging the IPA. For example, for an 8-inch wafer having a thickness of 725 µm, the groove width in the wafer support portion 45m is set to 900 µm, and the groove width in the discharge portion 45n is set to 200 to 700 µm. By using the wafer hand 45a according to the nineteenth embodiment, since the plurality of wafers 1 can be reliably supported, the processing capacity is improved. Since each wafer receiving groove 45j has a discharge portion 45n, drying of the wafer 1 supported by the wafer hand 45a is in this manner arranged in the drying portion 34 as shown in FIG. It can be performed in the inside, and the surface of the wafer end portion 45a and the surface of the wafer 1 are cleaned to flow into the discharge portion 45n of each wafer receiving groove 45j so that the dirty IPA falls in the recovery tank 34b. As a result, reattachment of water and foreign matter from the soiled IPA to the wafer 1 can be prevented, so that the wafer 1 can be cleaned and dried in a short time. The discharge portion 45n of each wafer receiving groove 45j becomes unnecessary. In the case of using the drying units arranged as shown in FIG. 36 provided with the IPA recovery tank 44c of the wafer and the IPA recovery tank 44b of the wafer hand, respectively, the wafer hand 45a is separated from the wafer 1 If deployed, it will come in contact with the vapor of the IPA. Therefore, the discharge portion 45n becomes unnecessary from the wafer receiving groove 45j. Wafer support rods 45p arranged as shown in FIG. 43 can be used. The wafer support rod 45p has a cut portion 45q in the vertical direction in the longitudinal direction thereof. The cut portion 45q is formed so that the dirty IPA cleaning the surface of the wafer 1 and the surface of the wafer hand 45a easily falls into the drying portion. Thus, the wafer 1 can be cleaned and dried in a short time. As shown in FIG. 44, if the wafer support rod 45r having the protruding arc portion is used to support the wafer 1, the contact surface between the wafer 1 and the wafer receiving groove 45s can be minimized. Therefore, since the remaining amount of IPA in the contact portion can be reduced, the wafer 1 can be cleaned and dried in a short time.

[Example 20]

A cleaning wafer cassette 21 according to the twentieth embodiment is shown in FIGS. 45 and 46. FIG. The wafer cassette 21 is composed of a pair of support flats 21a and 21b and wafer support bars 21c and 21f which are arranged to be parallel to each other and connected to each other between the support flats 21a and 21b. Each wafer support rod 21c to 21f has a plurality of wafer receiving grooves (not shown in the description) for supporting the wafer 1. Each of the support flats 21a and 21b has a height of the wafer 1 accommodated in the wafer cassette 21, that is, a height at which the wafer 1 is sufficiently higher than the diameter. In addition, each of the support flats 21a and 21b has a handle 21g at its upper end to support the wafer cassette 21. 47 shows the state in which the wafer 1 is accommodated in the wafer cassette 21 and the wafer cassette 21 is set in the cleaning tank 14a. Since each of the support flats 21a and 21b has a height sufficiently higher than that of the wafer 1, when the wafer 1 is completely immersed in the cleaning liquid 14, the handle 21g of the wafer cassette 21 is the cleaning liquid 14b. Is placed above the liquid level. Thus, the chuck of the cassette hand supporting the handle 21g does not get wet with the cleaning liquid 14b. That is, a dedicated hand washing unit for cleaning and drying the cassette is unnecessary in the structure. As an alternative to this, the operation of changing the wet cassette hand to the dry cassette hand can be omitted. Since the wafer cassette 21 has a surface area smaller than that of the conventional box-shaped wafer cassette and the wafer 1 is considerably exposed compared with the above, the cleaning effect is improved. In addition, since the width of the wafer cassette 21 is small, the jaw size of each unit is made small as in the cassetteless cleaning apparatus according to the first embodiment. In addition, since the width of the wafer cassette 21 is small, the jaw size of each unit is made small as in the cassetteless cleaning apparatus according to the first embodiment. Moreover, the following advantages obtained from the cassette type device can be realized: the wafer 1 prevents scratches during transportation as compared to the cassetteless type; Adjustment in maintenance can be completed easily.

[Example 21]

When the cleaning liquid 14b or the washing water 15b is a foaming chemical liquid, it is concerned that the upper end of the wafer cassette 21 is wetted with droplets of the chemical liquid due to foaming. Therefore, as shown in FIG. 48, the arrangement of the chemical liquid block 21h along the outer surface of the wafer cassette 21 results in blocking of small droplets due to foaming. Therefore, the upper end of the wafer cassette 21 does not get wet with droplets. As a result, the chuck 25c of the cassette hand can be prevented from getting wet efficiently.

[Example 22]

The conventional wafer cassette 2 is a dedicated glove as shown in FIG. 49 in order to prevent the cassette chuck 19c from being wetted by the cleaning liquid 14b or the washing water 15b which performs the cleaning treatment and the water washing treatment. 19e is provided with the chuck 19c fixed. The cassette hand provided with the chuck 19c to which the dedicated glove 19e is fixed is shown in FIG. As shown in FIG. 51, the chuck 19c to which the dedicated glove 19e is fixed sets the wafer cassette 2 in the cleaning tank 14a in this manner so that the wafer 1 is completely immersed in the cleaning liquid 14b. To be. When a part of the dedicated glove 19e is immersed in the cleaning liquid 14b at this time, the chuck 19c is not wetted with the cleaning liquid 14b. When the wafer cassette 2 is set in the washing water 15b in the washing tank 15a, the chuck 19c is held in the washing water 15b even though a portion of the dedicated glove 19e is immersed in the washing water 15b. You can prevent soaking. After the water washing process is completed, the wafer cassette 2 on which the dedicated glove 19e is fixed is set in the drying unit 16 to perform the drying process. After the drying treatment is completed, the dedicated glove 19e is removed from the chuck 19c, and the chuck 19c is used directly to take out the dried wafer cassette 2 from the drying unit 16. As a result, a dedicated hand washing machine for cleaning and drying the cassette hand becomes unnecessary. When the cleaning liquid 14b or the washing water 15b is a foaming chemical liquid, it is feared that the chuck 19c is wet with water droplets of the chemical liquid. Therefore, as shown in FIG. 52, since the chemical liquid block 19j is formed along the outer end of the dedicated glove 19e, water droplets of the chemical liquid are blocked by the chemical liquid block 19j. As a result, the upper end of the dedicated glove 19e is prevented from getting wet with the droplets of the chemical liquid. Therefore, the chuck 19c of the cassette hand can be prevented from getting wet efficiently. As shown in FIG. 53, the dedicated glove 19e is used only when the chuck 19c is used directly from the cleaning process to the drying process to handle the wafer cassette 2 and the dry wafer cassette 2 is removed from the drying unit 16. As shown in FIG. Is fixed to the chuck 19c. Even when the chuck 19c is wet, the dedicated glove 19e moves the dry wafer 1 and the wafer cassette 2 to the drying unit 16 while the dry wafer 1 and the wafer cassette 2 are prevented from getting wet. I can take it out from.

[Example 23]

54 illustrates a cassette hand according to the twenty-third embodiment. The cassette hand is composed of a variable chuck connecting jig 19 connected to the moving arm 19a with the chuck support 19b inserted therein, and a moving chuck 19g provided by separating the connecting jig 19f. When the variable chuck 19g is formed of a magnetic body, the connecting jig 19f is formed of an electromagnet. As shown in FIG. 55 to provide a portion of the cassette hand by inserting the tip of the connecting jig 19f into the rigid hole 19h formed of the variable chuck 19g to allow current to pass through the electromagnet of the connecting jig 19f. Similarly, the fixed chuck 19g is connected to the connecting jig 19f. As shown in FIG. 56, the first variable chuck 19g is fixed to the connecting jig 19f, and in this manner, the first variable chuck 19g is set to set the wafer cassette 2 in the cleaning tank 14a. To completely immerse the wafer 1 in the cleaning liquid 14b. At this time, a portion of the variable chuck 19g is immersed in the cleaning liquid 14b. Similarly, the first variable chuck 19g is used to set the wafer cassette 2 in the washing water 15b in the washing tank 15a. At this time, a part of the variable chuck 19g is immersed in the washing water 15b. After the washing process is completed, the drying process is performed by using the first variable chuck 19g to set the wafer cassette 2 into the drying unit 16. After the drying process is completed, the first variable chuck 19g and the washing water 15b wetted with the cleaning liquid 14b are removed to fix the second dry variable chuck 19i to the connecting jig 19f. By using the variable chuck 19i to take out the dried wafer cassette 2 from the drying unit 16, a dedicated hand cleaner for cleaning and drying the cassette hand becomes unnecessary in its structure.

[Example 24]

Fig. 57 is an overall structure diagram explaining the semiconductor cleaning device according to the twenty-fourth embodiment. The semiconductor cleaning apparatus includes a cleaning apparatus main body 101 and a loader / unloader section 102 that perform each step of the cleaning process. The cleaning device main body 101 has, at its center, a product conveying part 110 arranged along the longitudinal direction of the cleaning device. The product conveying unit 110 has a conveying robot having a moving shaft in the longitudinal direction of the cleaning device and a rotating shaft for rotating the cassette hand 110h. On both sides of the product conveying unit 110, the cleaning wafer cassette support 123, the cleaning tank 114 of the cleaning unit 105, the washing tanks 120a and 120b of the washing units 106a and 106b, and the drying unit ( The drying tank 121 of 107 is arranged to form two lines extending in the longitudinal direction of the cleaning apparatus. At the end of the product conveying unit 110 in the width direction of the cleaning apparatus so as to have a long length, a loader / unloader section 102 having six product cassette supports and one cleaning cassette support 124 is disposed. As a result, six product cassettes 22 and one cleaning cassette 21 can be arranged at the same time. In addition, a mobile replacement robot for moving the wafer between the loader / unloader section 102 and the product cassette 22 disposed in the cleaning cassette 21 is disposed in the loader / unloader section 102 in human. FIG. 58 is a front view for explaining the semiconductor cleaning device shown in FIG. Reference numeral 126 denotes an air conditioning filter disposed in the cleaning unit 105, the water washing units 106a and 106b, and the drying unit 107 of the semiconductor cleaning apparatus, and the air conditioning filter 126 is a clean air. ) Is arranged to feed. FIG. 59 is a side view illustrating the semiconductor cleaning device shown in FIG. 57. FIG. Reference numeral 127 denotes an air conditioning filter for supplying clean air to the loader / unloader section 102. Reference numeral 128 denotes a cleaning section 105, a water washing section 106a, 106b and drying of the semiconductor cleaning device. An exhaust part for discharging air from the part 107 is shown, and reference numeral 129 denotes an exhaust part for discharging air from the loader / unloader part 102. The following describes the operation. The product cassette 22 containing the wafer is placed on the product cassette support of the loader / unloader section 102. The mobile replacement robot 125 removes the wafer from the product cassette 22 and moves the wafer to the cleaning cassette 21 disposed on the cleaning wafer cassette support 124. Therefore, the cleaning cassette 21 for accommodating the wafer is supported by the cassette hand 110h of the product conveying unit 110 and moved to the cleaning wafer cassette support 123 so that the cleaning cassette 21 stands by. Thereafter, the product conveying unit 110 sets the cleaning cassette 21 in the cleaning tank 114 of the cleaning unit 105. After the wafer in the cleaning cassette 21 is cleaned by a predetermined method, the product conveying unit 110 sets the cleaning cassette 21 into the washing tank 120a of the first water washing unit 106a. After washing the wafer by a predetermined method, the product conveying unit 110 sets the cleaning cassette 21 into the washing tank 120b of the second washing unit 106b so as to wash with water. By cleaning the wafers in the two washing tanks 120a and 120b sequentially, the tact time required to complete the washing process is shortened and reliable washing process is expected. The product conveying unit 110 sets the washed cassette 21 in the drying tank 121 of the drying unit 107. After the drying is completed, the product conveying unit 110 removes the cleaning cassette 21 from the drying tank 121 and moves the cleaning cassette 21 onto the cleaning wafer cassette support 124. The mobile replacement robot 125 removes the wafer from the cleaning cassette 21 disposed on the cleaning wafer cassette support 124 and moves the wafer to the empty product cassette disposed on the product cassette support. Clean air from the air conditioning filter 126 passes through the semiconductor cleaner 101 and is discharged through the exhaust unit 128. On the other hand, clean air from the air conditioning filter 127 passes through the loader / unloader unit 102 and is discharged through the exhaust unit 129. Next, the air flow in the semiconductor cleaning apparatus 101 will be described. 60 is a front view and a cross-sectional view illustrating the detailed structure of the interior of the semiconductor cleaning apparatus shown in FIG. Reference numerals 126a and 126b denote air conditioning filters disposed on the washing tank 114 of the washing unit 105 and the washing tanks 120a and 120b of the washing units 106a and 106b, and the air conditioning filters 126a, 126b) is arranged to supply clean air. Reference numerals 130a and 130b denote exhaust ports for sucking and discharging air around the cleaning tank 114 and the water washing tanks 120a and 120b. Reference numerals 131a to 131g denote exhaust pipes connected to the exhaust ports 130a and 130b. Reference numerals 132a and 132b denote exhaust pipes connected to the exhaust ducts 131a to 131g and arranged to finally discharge air to the outside of the semiconductor cleaning apparatus 1. Reference numeral A1 denotes the downflow sent from the air conditioning filters 126a and 126b, reference numerals A2a to A2d denote the air flow sucked into the exhaust pipes 127a and 127b, and reference numerals A3a to A3d denote the exhaust duct 128a. Exhaust gas discharged to the exhaust pipes 132a and 132b instead of ˜128g). Down flow A1 from the air conditioning filters 126a and 126b passes through the product conveying sections 110 and 110a, the cassette hand 110h and the cleaning cassette 21, as indicated by A2a to A2d. It is suctioned through the exhaust port 130a formed around the cleaning tank 114 of the government part 105 and the exhaust port 130b formed around the water washing tank 120b of the water washing part 106b. Thereafter, the sucked air is discharged from the exhaust ducts 131a to 131f indicated by the exhaust streams A3a to A3d to the exhaust pipes 132a and 132b. As a result, the downflow A1 collides equally with the upper part of the washing tank 114 and the washing tank 120 so as to trap the chemical liquid mist generated in the washing tank 114, and then the exhaust pipe ( The air flows A2a to A2d sucked into 130a and 130b are equally sucked. Therefore, diffusion of the chemical liquid mist on the cleaning tank 114 can be prevented. In addition, the cleaning hand 110h and the cleaning cassette 21 immersed in the cleaning liquid in the cleaning tank 114 are taken out, and the cassette hand 110h and the cleaning cassette 21 are moved by the product conveying unit 110a. The chemical mist generated in the trap can be trapped by the downflow (A1). Accordingly, the chemical liquid mist is discharged to the exhaust pipes 132a and 132b together with the suctioned air flows A2a to A2d. As a result, the diffusion of the chemical liquid mist generated at the time of conveyance can be prevented. Although the cleaning apparatus related to this embodiment is a cassette type apparatus using a cleaning cassette, this embodiment is of course applied to a cassetteless cleaning apparatus which directly handles paper without using the cleaning cassette.

25th Example

61 is a front view and a cross sectional view for explaining the interior of the semiconductor cleaning apparatus according to the 25th embodiment. FIG. 62 explains the control procedure used in the semiconductor cleaning apparatus shown in FIG. Referring to the drawings, reference numeral 133 denotes the pure water contained in the washing tank 120, and reference numerals A5a and A5b denote the down flow immediately above the washing tank 114 and the washing tank 120. Reference numeral 134 denotes means for detecting the temperature of the cleaning liquid for detecting the temperature T1 of the cleaning liquid contained in the cleaning tank 114. Reference numeral 135 denotes a temperature detecting means for detecting the temperature Ta in the washing apparatus, and reference numeral 16 denotes an output T1 from the means 134 for detecting the temperature of the washing liquid and an output Ta from the temperature detecting means. The calculating part which calculates the control output N1 from the means 137 which changes the air pressure supplied from the air conditioning filter is shown. If the processing contents such as light etching and resist removal are different, the cleaning liquid 115 in the cleaning tank 114 and the drying vapor in the drying tank 121 are set at different temperatures. The increase in the temperature of the natural convection upflows A4a and A4b generated on the washing tank 114 and the drying tank 121 is caused by the temperature of the cleaning liquid T1, the temperature of the dry steam T2 and the temperature Ta in the cleaning apparatus. Proportional to the difference between) and for the rise in temperature expressed by the following equation (1):

V1 = f1 (T1-Ta) ‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥ (1)

Where V1 is the speed of upward movement of natural convection and f1 is a function. When moving the chemical mist 118 and dry steam upward while floating in natural convection (A4a, A4b), the speed V1 rises in proportion to the rise in the temperature of the cleaning liquid (T1) and the temperature of the dry steam. In addition, the pressure supplying air from the air conditioning filter needs to be changed according to the temperature T1 of the cleaning liquid and the temperature T2 of the dry steam so as to limit the speed V1. The air supply speed (supply pressure) V2 of the air blower and the rotational speed N1 of the air supply motor always maintain a proportional relationship. Therefore, the rotational speed N1 of the air supply motor must be controlled to fit equation (2):

N1 = f2 (T1-Ta) ‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥‥ (2)

Where f2 is a function. In order to achieve the above control sequence, the means 134 and the temperature detecting means 135 for detecting the temperature of the cleaning liquid are used to detect the temperature T1 of the cleaning liquid and the temperature Ta in the cleaning apparatus. In addition, a signal indicating the detection result is supplied to the calculating section 36, like the input signal, to execute the calculation according to equation (3). Then, the rotational speed N1 of the air supply motor is transmitted. The rotational speed N1 of the air supply motor is supplied to the means 137 for changing the pressure of the air supplied from the air conditioning filter like the input signal to change the rotational speed of the air supply motor. When a plurality of temperatures are set in the washing apparatus, the air supply pressure needs to be controlled to adapt to the highest temperature among the plurality of temperatures. 63 illustrates a control sequence of the semiconductor cleaning apparatus used when there are a plurality of temperatures. Referring to FIG. 63, reference numerals 136a and 136b denote calculation units, reference numeral 138 denotes means for detecting a temperature of dry steam for detecting the temperature T2 of dry steam, and reference numeral 139 denotes a comparison means. Indicates. The calculating means 136a calculates the rotational speed N1 of the air supply in response to the temperature T1 of the cleaning liquid, and furthermore, the calculating section 136b corresponds to the rotational speed N2 of the air supply motor in response to the temperature T2 of the dry steam. Calculate The comparison means 139 receives two rotation speeds N1 and N2 as compared to sending a larger rotation speed Nmax. The rotational speed Nmax is supplied to the means 137 for changing the pressure of the air supplied from the air conditioning filter, like the input signal, to change the rotational speed of the air supply motor. The means for changing the pressure of the air supplied from the air conditioning filter 137 is a means for controlling the power frequency of the air supply motor. Means for controlling the supply voltage of the air supply motor may, of course, also be used to achieve a similar effect. When the air supply pressure from the air conditioning filter is changed, the exhaust flow is changed so that the pressure of the semiconductor cleaning apparatus main body 101 and the pressure at the outside of the apparatus are balanced with each other or lower than the pressure at the outside of the apparatus. When it loses, the diffusion of the chemical liquid mist out of the semiconductor cleaning apparatus main body 101 is prevented. In this embodiment, the air supply pressure from the air conditioning filters 126a and 126b is changed in correspondence with the temperature of the cleaning liquid in the cleaning section 105 and the steam temperature in the drying section 107 as described above. If the temperature of the cleaning liquid in the 105 or the temperature of the steam in the drying unit 107 is too high, the air supply pressure may be increased. Therefore, when the steam temperature in the cleaning section 105 and the drying section 107 is too high, the air supply pressure can be increased. Therefore, the effect of limiting the downflow in response to the rising force of the natural convection generated in the washing section 105 and the drying section 107 can be obtained. As a result, it is possible to prevent the adhesion of the chemical liquid mist generated in the cleaning unit 105 and the adhesion of the vapor in the drying unit 107 to the composition unit of the cleaning device, which causes corrosion of the composition unit, and causes bonding. Adhesion to the wafer, external diffusion causing similar corrosion and bonding can be prevented. In this embodiment, the present invention is applied to a cassette type cleaning device using a cleaning cassette or a cassetteless type cleaning device for directly handling a wafer.

[Example 26]

64 is a front view and a cross-sectional view illustrating a detailed peripheral structure adjacent to the cleaning tank of the semiconductor cleaning device according to the 26th embodiment. Referring to FIG. 64, reference numerals 130a to 130d denote discharge pipes for discharging air around the washing tank 114, reference numeral 140 denotes a panel above the washing tank 114, and the channel 140 Is opened above the cleaning bath 114 and has small pores formed as a portion covering the remaining area. Reference numeral 141 denotes a drain panel which is received by the panel 140 above the cleaning tank 114 and receives the droplets 143 falling through the pores. Reference numeral 142 denotes a drain discharge pipe of the discharge drain 144 received by the drain panel 141. Reference numeral 145 denotes a discharge liquid discharged through the drain discharge pipe 142. Reference numerals A2a to A2d represent suction flows sucked into the discharge pipes 130a to 130d, reference numbers A3a to A3b represent discharge flows discharged through the discharge ducts 131a to 130b, and reference numbers A5a and A5b denote cleaning tanks. Denoting the downflow on the cleaning tank 114 reaching the position above 114, reference numeral A6 indicates the downflow on the panel on the cleaning tank 114 reaching the panel 14 on the cleaning tank 114. Indicates. After the wafer in the cleaning cassette 21 set in the cleaning tank 114 is cleaned by a predetermined method, the cleaning cassette 21 is lifted by the product conveying unit 110 and moved to the water cleaning tank 120a. do. At this time, the cleaning liquid 115 attached to the cleaning cassette 12 is covered by covering the drain receiving panel 14, the cleaning tank, the washing tanks 120a and 120b and the drying tank 121 on the cleaning tank 114. The panel 140 is opened to the tide side by preventing the device from corroding by falling to portions except the bath 114. The droplets of the cleaning liquid received by the panel 140 pass through the pores of the panel 140 to become the drain 144 so as to become the cleaning slime 143 collected by the drain panel 141. The drain 144 then causes the discharge stream 145 to be discharged out of the opening through the drain discharge pipe 142. Since the panel 14 above the bath becomes a porous plate excluding the opening above the bath, the downflow A1 can be formed uniformly over the entire surface of the semiconductor cleaning apparatus main body 101 without stagnation. In addition, downflows A5a and A5b above the bath are formed above the cleaning bath 114, and downflow A6 above the bath passing through the openings of the panel 14 above the bath is formed. Downflow A6 of the panel above the bath and downflow A5a, A5b above the bath are sucked into the discharge pipes 130a and 130d and discharged through the discharge ducts 131a and 131b. By changing the diameter and aperture ratio of the small opening formed by the panel 14 above the bath, the ratio of down flow A6 on the panel above the bath and down flow A5a, A5b above the bath can be changed. have. In this embodiment, the panel 140 at the top of the bath is opened only at the top of the bath, and the remaining part of the panel covering the other part is a perforated plate, so that the opening is connected to the discharge pipe. Therefore, congestion of the air flow can be prevented due to the suppression of the down flow by the panel 140 above the bath, and all the air flows can be made down flow. Furthermore, since the lower portion of the porous plate becomes a drain receiver, the chemical liquid separated from the wafer being conveyed can be received. Although a cassette type cleaning apparatus is described using a cleaning cassette, this embodiment also applies to a cassetteless cleaning apparatus which directly handles a wafer, of course.

[Example 27]

65 is a front view and a cross-sectional view illustrating a detailed structure of a part including a cleaning tank of the semiconductor cleaning apparatus according to the 27th embodiment. FIG. 66 is a graph showing the relationship between the entropy of wet air and the entropy of a dry state. 67 is a schematic diagram illustrating a state where the chemical liquid mist is trapped by the water mist. Referring to FIG. 65, reference numerals 146a and 146b denote cooling heat exchangers respectively disposed at rear ends of the air conditioning filters 126a and 126b and arranged to cool down flow A1, respectively. Reference numerals 147a and 147b denote refrigerators for supplying a cooling medium to the cooling heat exchangers 146a and 146b, and reference numerals 148a and 148b denote between the cooled down flows A1 and hot upflows A4a and A4b. Represents the condensed water mist at the boundary of the collision. Referring to FIG. 66, symbol C denotes a saturated steam line, P1 denotes a state of the washing apparatus, P2 denotes a position state when the downflow and upflow of natural convection collide with each other, and Ta denotes a state P1. Represents the temperature at and T3 represents the temperature at state P2. Referring to FIG. 67, reference numeral 118 denotes a chemical mist, 148 denotes a water mist, 118a denotes a chemical mist dissolved in the water mist, 118b denotes a vapor of the chemical solution, and 118c dissolved in a water mist. Indicates the vapor of the chemical liquid. The chemical mist 118 that moves while floating over the natural convection upflows A4a and A4b performs the behavior of finite-sized particles with inertial forces, and furthermore the chemical vapor 118b exhibits a diffusion column. Therefore, when the chemical mist 118 and the chemical vapor 118b are trapped by the downflows A5a to A5d of the bath, the chemical mist 118 sometimes has the inertia force because the chemical mist 118 has an inertial force. Out of the lines of the downflows A5a to A5d. On the other hand, the chemical vapor 118b diffuses widely depending on the chemical species as compared with the diffusion of the air flow. Therefore, it is difficult to completely block the chemical liquid mist 118 and the chemical liquid vapor 118b only by the down flow of the air flow. Accordingly, the temperature of the downflow A1 is lower than the temperature of the cooling heat exchanger and forms the downflows A5a to A5d of the lower temperature baths, so that the hot upflow of the natural convection generated in the cleaning tank 114 ( A4a and A4b) collide with each other. The change in humidity during the air flow will be described next with reference to the graph of the wet air flow shown in FIG. Assuming that the state of natural convection upflow (A4a, A4b) is P1 at a temperature T3 higher than the ambient temperature, between the downflow (A5a-A5d) of the convection and the upflow (A4a, A4b) of natural convection. The collision of causes the downflows A5a to A5d to lower the temperatures of the natural convection upflows A4a and A4b, resulting in the saturated steam line C in which state condensation of the water contained in the airflow starts. It is moved to the left parallel to the abscissa of the graph until it is reached. As a result, water mists 148a and 148b are generated. If the temperature at this time is T4, the temperature of the downflows A5a to A5b of the bath is determined after the collision occurs to generate the water mists 148a and 148b so that the temperature of the natural convection upflows A4a and A4b is increased. Lower than T4. The chemical mist 118 and the chemical vapor 118b are trapped by water mist, such as the chemical mist 118a dissolved in the water mist 148 and dissolved into the water mist, and the chemical vapor 118c dissolved into the water mist. do. Together with the suction flow, the water mist may pass through the discharge pipes 130a to 130d and the discharge ducts 131a to 131d, and are discharged through the discharge pipes 132a and 132b. As described above, in this embodiment, the heat exchangers 146a and 146b for cooling the supplied air and the freezers 147a and 147b for supplying the cooling medium to the heat exchangers 14a and 146b clean the clean air. And before or after the first and second air conditioning filters 126a and 126b to feed the flush and drying sections. As a result, the upflow of natural convection of steam generated in the cooling air supplied from the air conditioning filters 126a and 126b and the washing tank of the washing section or the upstream of the steam generated in the steam tank of the drying section is They collide at the top of the scrubbing tank or in a portion adjacent to the steam bath to condense the vapor in the cooling air to produce a water mist. The water mist traps the chemical mist or dry vapor to prevent the spread of the chemical mist or vapor out of the apparatus or into the cleaning apparatus, resulting in erosion of the apparatus or defect of the wafer. Although a cassette type cleaning apparatus using a cleaning cassette is described, this embodiment can, of course, be applied to a cassetteless cleaning apparatus that directly handles a wafer without using the cleaning cassette.

[Example 28]

68 is a front view and a cross sectional view for explaining a detailed structure of a portion including a cleaning tank of the semiconductor cleaning device according to the 28th embodiment. Referring to FIG. 68, reference numeral 149 denotes a two-fluid nozzle, reference numeral 150 denotes a pure nozzle, reference numeral 151 denotes a gas pipe, reference numeral 152 denotes a chemical liquid pipe, and reference numeral 153 under pressure A gas pipe for chemical liquid supply is shown, reference numeral 154 denotes an inert gas or clean air, and reference numeral 155 denotes an atomized pure mist. The inert gas or clean air 154 is distributed into the gas pipe 151 and the hydraulic pressure supply gas pipe 153 connected to the two-fluid nozzle 149. The pure water accumulated in the pure water tank 150 is sent to the chemical liquid pipe 152 under the pressure of the inert gas supplied to the hydraulic pressure supply gas pipe 153 or under the pressure of the pure air 154. Inert gas or clean air 154 is supplied to the two-fluid nozzle 149 through the gas pipe 151 and pure water is supplied from the chemical liquid pipe 152. As a result, atomized pure mist 155 is produced. The atomized pure water mist 155 reaches the position on the cleaning tank 114 together with the downflow A1 and the downflow A5a and A5b of the trough and as shown in FIG. 67, the chemical mist 118 and the chemical liquid. Steam 118b is dissolved and trapped. The pure mist 155 is discharged through the discharge pipe 132 after passing through the discharge pipes 130a and 130b and the discharge ducts 131a and 131b together with the suction flow. In this embodiment, the pure water is refined using a two-fluid nozzle 149, and similar effects of pure atomization using methods such as ultrasonic, rotating disks, transparent wet films, and heating Get In this embodiment, the blow of the two-fluid nozzle 149 for injecting clean air or an inert gas behind the first air conditioning filter 126 for supplying clean air to the washing part, the water washing part and the drying part as described above. The outlet is formed to mix pure mist 155 into the downflow. Accordingly, the pure mist 155 traps the chemical liquid mist generated in the cleaning tank 114 of the cleaning unit or the steam generated from the steam tank of the drying unit, and diffuses the vapor or the chemical liquid mist into or out of the cleaning apparatus. Do not cause corrosion or wafer defects. This embodiment can be applied to a cassette type cleaning apparatus using a cassetteless cleaning apparatus and a thinner cassette which do not use a cleaning cassette and directly handle a wafer.

[Example 29]

69 is a front view and a cross-sectional view illustrating a detailed structure of a portion provided with a cleaning tank of the semiconductor cleaning apparatus according to the 29th embodiment. Referring to FIG. 69, reference numeral 156 denotes an air curtain blower, reference numeral 158 denotes an air curtain blowout disposed on one side of the cleaning tank 114 and having the same width, and reference numeral 157 denotes an air curtain blower. An air curtain air supply duct making a connection between the curtain blower 156 and the air curtain blowout port 158 is shown, reference numeral 159 denotes a distribution of air curtain blowout speeds, and reference numeral 160 denotes a cleaning tank 114. An air curtain formed on the upper side, reference numeral 161 denotes an air curtain suction tube formed on one side of the cleaning tank 114 to face the air curtain blow-out port 158, and reference numeral 162 denotes an air curtain suction tube 161 and Represents an air curtain discharge duct making a connection between discharge pipes. The air curtain 160 supplied from the air curtain blower 156 and blown out through the air curtain air supply duct 157 to the air curtain blow-out port 158 is formed to cover a portion above the cleaning tank 114. Then, it is sucked through the air curtain suction pipe 161. Thereafter, it is discharged into the discharge pipe through the air curtain discharge duct 162. As a result, the portion above the cleaning tank 114 is shielded by the air curtain 160, so that the chemical liquid mist created in the cleaning tank 114 is trapped by the air curtain 160, so that the air curtain discharge pipe 161 is closed. Is inhaled. Therefore, the diffusion of the chemical liquid mist into the portion above the cleaning tank 114 can be prevented. Air curtains 160 formed on one side of the bath and having a constant thickness in the width direction of the bath are blown out horizontally through the openings above the washing tank of the washing unit and the steam tank of the drying unit, and formed equally in the width direction. An air curtain suction pipe 161 is formed on the opposite side. Therefore, the rise of steam generated in the drying tank of the drying section due to natural convection and the rise of the chemical liquid mist generated from the cleaning tank 114 of the washing section are shielded by the air curtain 160 and recovered into the discharge duct 162. do. Therefore, the diffusion of the chemical liquid mist or the vapor mist into or out of the cleaning tank can be prevented. This embodiment can be applied to a cassette type cleaning apparatus using a cassetteless cleaning apparatus and a cleaning cassette which directly handle a wafer without using a cleaning cassette.

30th Example

70 is a front view and a cross sectional view for explaining a detailed structure of a portion provided with a cleaning tank of the semiconductor cleaning device according to the thirtieth embodiment. Referring to FIG. 70, reference numeral 156 denotes an air curtain blower, 158 denotes an air curtain blow-out port disposed on one side of the cleaning tank 114 and having a constant width, and 157 denotes an air curtain blower 156 ) Represents an air curtain air supply duct making a connection between the air curtain blowout port 158, 160 represents an air curtain formed above the cleaning bath 114, and 161 represents an air curtain blowout above the cleaning bath 114. An air curtain suction tube formed of a sphere 158, 162 represents an air curtain discharge duct making a connection between the air curtain suction tube 161 and the discharge tube, and 163 is in front of the air curtain blowout opening 158 and the air curtain air The rectifying plate is arranged along the direction of the supply duct 157 and has a short length in the flow path direction in proportion to the distance from the cleaning tank 114. The air curtain 160 supplied from the air curtain blower 156 and blown out through the air curtain air supply duct 157 to the air curtain blowout opening 158 is formed to cover a portion above the cleaning tank 114. It is suctioned through the air curtain suction pipe 161. Thereafter, the sucked air is discharged into the discharge pipe through the air curtain discharge duct 162. At this time, as the rate of change of the front layer of the air curtain is reduced at the top of the air curtain 160, air introduction is reduced from the space above the cleaning tank 114. Since the rate of change in the front layer of the air curtain increases at the bottom of the air curtain 160, the chemical mist formed from the cleaning tank 114 is effectively reduced and trapped by the air curtain 160. As a result, since the upper part of the cleaning tank 114 is effectively insulated by the air curtain, the chemical mist generated from the cleaning tank 114 is trapped by the air curtain 160 and then sucked into the air curtain discharge pipe 161. Therefore, the diffusion of the chemical liquid mist in the upper portion of the cleaning tank 114 can be prevented. As described above, in this embodiment, the rectifying grid or rectifying plate 163 having a length shortened in the flow direction in proportion to the distance from the cleaning tank 114 or the steam tank is used to blow out the air curtain. Placed in the curtain blowout opening 158 to form a layer flow, the velocity distribution is such that the velocity is gradually increased in inverse proportion to the bath. Therefore, the rate of change in the front layer of the air curtain close to the generation source of the vapor of the chemical liquid mist is increased. As a result, as the chemical liquid mist and the steam increase the insulation effect, it is possible to prevent the diffusion of the chemical liquid mist and the vapor into or out of the cleaning tank 114. This embodiment can be applied to a cassette type cleaning apparatus using a cleaning cassette and a cassetteless cleaning apparatus using no cleaning cassette and not directly handling a wafer.

[Example 31]

71 is a front view and a cross-sectional view illustrating a portion including a cleaning tank of the semiconductor cleaning apparatus according to the 31st embodiment. Referring to FIG. 71, reference numeral 134 denotes a cleaning liquid temperature detecting means for detecting the temperature T1 of the cleaning liquid in the cleaning tank 114, and reference numeral 156 is formed along one side of the cleaning tank 114. And an air curtain blowout port having the same width, reference numeral 157 denotes an air curtain supply duct making a connection between the air curtain blower 156 and the air curtain blowout outlet 158, and reference numeral 159. Denotes a distribution for blowing out the speed of the air curtain 160, reference numeral 160 denotes an air curtain formed above the cleaning tank 114, reference numeral 161 denotes an air curtain blow along one side of the cleaning tank 114 An air curtain intake port formed to face the outlet 158 is shown, and reference numeral 165 denotes an air curtain flow temperature detection means for detecting the air flow temperature Ta of the air curtain. , Reference numeral 136 denotes an output T1 from the cleaning liquid temperature detection means 134 and an output Ta from the air curtain air flow temperature detection means 165, thereby providing an air curtain air supply pressure change means 166. The calculating part for calculating the control output N1 is shown. Since the speed V1 of the rise of the chemical mist 118 and the dry steam floating in the natural convection A4 increases in proportion to the rise of the washing liquid temperature T1 and the drying steam temperature, the air curtain 160 blows out. The pressure is changed corresponding to the washing liquid temperature T1 and the dry steam temperature T2. The cleaning liquid temperature detecting means 134 and the air curtain flow temperature detecting means 165 detect the cleaning liquid temperature T1 and the air curtain air temperature Ta to supply a signal representing the result of the calculation unit 136 as an output signal. use. Using the input signal, after performing calculation according to equation (2) described in Embodiment 25, the rotational speed N1 of the air curtain blower is transmitted. The air curtain air supply pressure changing means 166 changes the rotation speed of the air curtain blower 156 according to the rotation speed N1 calculated by the calculation unit 136. The air curtain air supply pressure changing means 166 may be means for controlling the power frequency of the air curtain blower 156 or means for controlling the power voltage used in the air curtain blower 156. As described above, this embodiment shows that the pressure for supplying the air curtain is changed depending on the temperature of the cleaning liquid in the cleaning part and the steam temperature in the drying part, so that the air supply pressure is too high in the cleaning liquid temperature in the cleaning part or in the drying part. High can rise. As a result, the insulation effect of the air curtain can be obtained corresponding to the upflow force of the natural convection generated in the washing section and the drying section. Therefore, it is possible to prevent vapor condensation in the drying unit of the composition unit of the cleaning unit which causes the composition unit to corrode and condensation of the chemical liquid mist generated in the cleaning unit, and to cause external erosion and defects similar to the condensation of the wafer causing bonding. Diffusion can be prevented. This embodiment is applied to a cassette type cleaning apparatus using a cleaning cassette and a cassetteless cleaning apparatus for directly handling a wafer without using a cleaning cassette.

[Example 32]

72 is a front view and a cross-sectional view illustrating a detailed structure of a portion including a cleaning tank of the semiconductor cleaning apparatus according to the thirty-second embodiment. Referring to Fig. 72, reference numeral 118 denotes a chemical liquid mist, reference numeral 156 denotes an air curtain blower, reference numeral 158 denotes an air curtain blow-out port formed on one side of the cleaning tank and having the same width. , Reference numeral 157 denotes an air curtain air supply duct making a connection between the air curtain blower 156 and the air curtain blowout port 158, reference numeral 159 denotes an air curtain blowout velocity distribution, and reference numeral 160 Denotes an air curtain formed above the cleaning tank 114, reference numeral 161 denotes an air curtain inlet formed to face the air curtain blowout port 158 along one side of the cleaning tank 114, and reference numeral 167 Represents a cooling heat exchanger disposed in the air curtain air supply duct 157 and arranged to cool the air curtain flow, reference numeral 168 Denotes a cooler for supplying a cooling medium to the cooling heat exchanger 167, and reference numeral 148 denotes water condensed at the boundary where a collision occurs between the cooled air curtain flow and the hot upflow A4 of natural convection. It shows mist. The temperature of the blowout air curtain is lowered by the cooling heat exchanger 167 so that the low temperature air curtain 16 is formed and intersects with the natural convection hot upflow A4 generated in the cleaning tank 114. Next, the humidity change of the air flow will be described with reference to the wet air shown in FIG. If the state of the natural convection upflow A4 at a temperature T3 higher than the ambient temperature is P1, between the natural convection upflow A4 with the low temperature air curtain 160 on the cleaning tank 114. The intersection of causes the air curtain 160 to be lower than the low temperature T3 of the natural convection upflow A4, resulting in reaching the saturated vapor line C at the condensation of the water contained in the air flow. Is moved to the left parallel to the abscissa in state P2. As a result, water mist 148 is produced. If the temperature at this time is T4, the temperature of the upflow A4 of natural convection after collision becomes lower than T4 and blows out by determining the temperature of the air curtain. As a result, water mist 148 can be produced. The chemical mist 118 and the chemical vapor 118b are trapped by the water mist as the chemical mist 118a dissolved in the water mist 148 and dissolved in the water mist and the chemical vapor 118c dissolved in the water mist. The water mist passes through the air curtain outlet 161 and the air curtain discharge duct 162 together with the suction flow and is discharged through the discharge pipe.

In this embodiment, as described above, a heat exchanger 167 for cooling the supplied air and a cooler 168 for supplying a cooling medium to the heat exchanger 167 are disposed at the front or the rear of the air curtain blower 156. The upstream of the natural convection of the steam generated in the steam of the drying section or the upflow of the natural convection of the steam generated in the detail information 114 of the washing section and the cooling air supplied from the air curtain blower 156 may be used. Causing them to collide with each other near the top of the jaw. As a result, vapors in the cooling air condense to produce water mist. The water mist traps the chemical mist or dry steam to prevent the diffusion of chemical mist or vapor into or out of the cleaning apparatus, resulting in erosion of the apparatus or defect of the wafer. This embodiment can be applied to a cassette type cleaning apparatus using a cleaning cassette and a cassetteless cleaning apparatus that directly handles a wafer without using a cleaning cassette.

[Example 33]

73 is a front view and a cross-sectional view illustrating a detailed structure of a portion including a cleaning tank of the semiconductor cleaning apparatus according to the 33rd embodiment. Referring to FIG. 73, reference numeral 149 denotes a two-fluid nozzle, 150 denotes a pure water tank, 151 denotes a gas pipe, 152 denotes a liquid pipe, and 153 denotes a gas pipe for sending a chemical liquid under pressure. 154 represents an inert gas or clean air, 155 represents an atomized pure mist, 156 represents an air curtain blower, 158 is formed along one side of the cleaning bath 114 and has the same width as the air curtain blow 157 represents the air curtain air supply duct making a connection between the air curtain blower 156 and the air curtain blow out port 158, 159 represents the distribution of the blowing speed of the air curtain, and 160 represents three An air curtain inlet formed above the tub 114, 161 being opposed to the air curtain blowout 158 along one side of the cleaning tub 114; The formed air curtain inlet port 162 represents an air curtain outlet duct making a connection between the air curtain inlet port 161 and the exhaust pipe. The inert gas or the clean air 154 is distributed into the chemical liquid supply gas pipe 151 and the gas pipe 153 under pressure and connected to the two-fluid nozzle 149. The pure water accumulated in the pure water tank 150 is sent to the chemical liquid pipe 152 under the pressure of the inert gas supplied from the chemical liquid supply gas pipe 153 under pressure or under the pressure of the pure air 154. Inert gas or clean air 154 is supplied to the two-fluid nozzle 149 through the gas pipe 151 and pure water is supplied from the chemical liquid pipe 152. As a result, atomized pure mist 155 is produced. The atomized pure mist 155 is mixed with the airflow in the air curtain air supply duct 157 and with the air curtain 160 to reach the position above the cleaning tank 144. Blows out and traps by dissolving the chemical mist 118 and the chemical vapor 118b as shown in FIG. The pure mist 155 is discharged through the discharge pipe after passing through the outlet 161 of the air curtain and the discharge duct 162 of the air curtain, together with the suction flow into the air curtain. In this embodiment, even though pure water is refined using the two-fluid nozzle 149, pure water can be refined using ultrasonic waves, a rotating disk or a transparent wet film, and similar effects can be obtained. The inert gas or clean air 154 is distributed to the chemical liquid supply gas pipe 151 and the gas pipe 153 under pressure connected to the two-fluid nozzle 149. The pure water accumulated in the pure water tank 150 is sent to the chemical liquid pipe 152 under the pressure of the inert gas supplied from the chemical liquid supply gas pipe 153 under pressure or under the pressure of the pure air 154. Inert gas or clean air 154 is supplied to the two-fluid nozzle 149 through the gas pipe 151 and pure water is supplied from the chemical liquid pipe 152. As a result, atomized pure mist 155 is produced. The atomized pure mist 155 is mixed with the air flow in the air curtain air supply duct 157 to bring the air curtain blow out 158 together with the air curtain 160 to reach a position above the cleaning bath 144. Blow out through trapping the chemical mist 118 and the chemical vapor 118b shown in FIG. The pure mist 155 is discharged through the discharge pipe after passing through the outlet 161 of the air curtain and the discharge duct 162 of the air curtain together with the suction flow into the air curtain. In this embodiment, although the pure water is refined using the two-fluid nozzle 149, the pure water can be refined by using ultrasonic or rotating disk or transparent wet film or heated and similar effects can be obtained. In this embodiment, as described above, the blowout port of the two-fluid nozzle 149 for injecting the clean air or the active gas 154 as the second liquid mixes the pure mist 155 into the air curtain 160. It is formed in close proximity to the curtain blowout openings 158. Accordingly, the water mist 155 traps the chemical liquid mist generated in the washing section 114 of the cleaning unit or the steam generated from the steam tank of the drying unit so that the diffusion of the chemical liquid mist or vapor into or out of the cleaning unit is performed. To prevent corrosion or wafer defects. This embodiment can be applied to a cassette type cleaning apparatus using a cleaning cassette and a cassetteless cleaning apparatus which directly handles a wafer without using a cleaning cassette.

[Example 34]

74 is a front view and a cross sectional view illustrating a detailed structure of a portion in the semiconductor cleaning apparatus according to the 34th embodiment. Referring to FIG. 74, reference numerals 126a and 126b are arranged above the cleaning tank 114 of the cleaning unit 105 of the washing tanks 120a and 120b of the washing units 106a and 106b to supply clean air. Indicates an air conditioning filter. Reference numerals 130a and 130b denote first outlets formed to suck and discharge air around the cleaning tank 114 and the water washing tanks 120a and 120b. Reference numerals 131a to 131g denote first discharge ducts connected to the first discharge ports 130a and 130b. Reference numerals 132a and 132b denote first discharge pipes connected to the first discharge ducts 131a to 131g to discharge air to the outside of the semiconductor cleaning apparatus 101. Reference numeral 169 denotes a second air conditioning filter disposed on the conveying unit 110 and arranged to supply clean air. Reference numeral 170 denotes a second discharge port arranged to suck and discharge around the conveying unit 110b. Reference numerals 171a and 171b denote second discharge ducts connected to the second discharge ports 170, and 172 denotes second discharge ducts 171a and 171b connected to the second discharge ducts 171a and 171b to discharge air to the outside of the semiconductor cleaning apparatus 101. Two discharge pipes are shown. Reference numeral A1 denotes a first downflow sent from the first air conditioning filters 126a and 126b, and A2a to A2d denote first suction flows sucked through the first outlets 127a and 127b, and A3a to A3d represents a first discharge flow discharged into the first discharge pipes 132a and 132b by the first discharge ducts 128a to 128g, and A7 denotes a second downflow sent from the second air conditioning filter 169. A8 represents a second suction flow sucked into the second discharge port 170, and A9 represents a second discharge flow discharged into the second discharge pipe 172 by the second discharge ducts 171a and 171b. The downflow A1 blown out from the first air conditioning filters 126a and 126b passes through the product conveying unit 110a, the cassette hand 110h and the cleaning cassette 21 to clean the cleaning tank 114 of the cleaning unit 105. The suction is performed as A2a to A2d through the first discharge port 130b formed around the first discharge port 130a and the water washing tank 106b formed around the first discharge port 130b. Thereafter, the downflow A1 is discharged into the first discharge pipes 132a and 132b from the first discharge ducts 131a to 131f as the first discharge flows A3a to A3d. The second down flow A6 blown out of the air conditioning filter 169 passes through the product conveying unit 110 and is sucked through the second outlet 170 formed as A8 around the product conveying unit 110b. The second down flow A7 is discharged from the second discharge ducts 171a and 117b into the second discharge pipe 172 as the second discharge flow A9. As a result, the second down flow A1 collides with the upper portion of the washing tank 114 and the washing tank 120 to trap the chemical mist generated in the washing tank 114, and then the suction flows A2a to A2d. Is equally sucked into the first outlets 130a and 130b. In addition, the second down flow A7 may be equally formed around the conveyer 110 so that the first down flow A1 and the second down flow A8 may be separated from each other. While floating on natural convection, diffusion of the vapor in the drying section and the chemical liquid mist formed in the cleaning tank can be prevented and insulated by the first downflow A1. As a result, generation of defects in the wafer can be prevented. Moreover, the suppression of the second downflow A2 is insulated so that the chemical liquid mist from the cleaning tank and the vapor of the drying part are attached to the conveying apparatus so as not to corrode the conveying apparatus. In addition, it is possible to prevent foreign substances in the apparatus generated in the conveying unit from adhering to the wafer under cleaning.

Furthermore, when the cassette land 110h immersed in the cleaning liquid in the cleaning tank 114 and the cleaning cassette 21 is lifted by the product conveying unit 110a, it is generated from the cassette land 10h and the cleaning cassette 21. The chemical liquid mist is trapped by the first down flow A1 and discharged into the first discharge pipes 132a and 132b together with the first suction flows A2a to A2d. Therefore, the diffusion of the chemical liquid mist generated during the conveyance can also be prevented. In this embodiment, the first air conditioning filters 126a and 126b for supplying clean air to the washing unit, the washing unit and the drying unit, and the first discharge pipe 132a disposed adjacent to the tub of the washing unit, the washing unit and the drying unit are provided. 132b), the downflow is formed above the washing, washing and drying parts. In addition, a second air conditioning filter 169 for supplying clean air to the conveying unit and a second discharge pipe for discharging air from the conveying unit are disposed. Therefore, the diffusion of the chemical liquid mist generated in the washing unit floating on the natural convection and the steam in the drying unit and the upward movement are restricted and insulated by the downflow. As a result, generation of defects in the wafer is prevented. In addition, it is possible to prevent the vapor in the drying part of the chemical liquid mist generated in the cleaning tank from adhering to the conveying part and causing corrosion. Moreover, foreign matters in the apparatus generated in the conveying section can be prevented from adhering to the wafer under cleaning. Although there is a description of a cassette type cleaning apparatus using a cleaning cassette, this embodiment can be applied to a cassetteless type cleaning apparatus that directly handles a wafer, without using a cleaning cassette.

[Example 35]

75 is a front view and a cross-sectional view illustrating a detailed structure of a portion in the semiconductor cleaning apparatus according to the 35th embodiment. Referring to FIG. 75, A1 represents a first downflow blown out from the first air conditioning filters 126a and 126b, and A7 represents a second downflow blown out from the second air conditioning filter 169. Referring to FIG. A10 shows the downflow which flows from the conveyance part 110 to the washing | cleaning part 105, the water washing part 106, and the drying part 107. As shown to FIG. A second down blown out of the second air conditioning filter 169 is referred to as a speed (air supply pressure) of the first down flow A1 blown out from the first air conditioning filters 126a and 126b. The speed (air supply pressure) of the flow A7 is referred to as V3, and V3 is always controlled to be faster than V2 so that the second downflow A7 moves from the carrying section 110 to the washing section 105 and the water washing section 106. ) And the air supply pressure of the air flow A10 and the second down flow A7 that flow toward the drying unit 107 is greater than the air supply pressure of the first down flow A1, so that it is sucked into the second outlet 170. Divided into a second suction flow A8. Therefore, it is also possible to completely prevent the chemical liquid mist from the cleaning tank 114 and the vapor of the drying part from invading into the conveying part. In this embodiment, the air supply pressure of the second air conditioning filter 169 is higher than the air supply pressure of the first air conditioning filter 126a which supplies clean air to the washing section, the water washing section and the drying section as described above. Since it is large, the chemical liquid mist from the washing | cleaning information 114 and the steam of a drying part can also be completely prevented from invading into a conveyance part. Although there is a description of a cassette type cleaning apparatus using a cleaning cassette, this embodiment can of course be applied to a cassetteless cleaning apparatus that directly handles a wafer without using the cleaning cassette.

[Example 36]

76 is a front view and a cross-sectional view illustrating a detailed structure in the semiconductor cleaning apparatus according to the 36th embodiment. 77 is a perspective view illustrating an insulating wall of the semiconductor cleaning apparatus according to this embodiment. Referring to Figs. 76 and 77, reference numeral 110c denotes a conveyance arm, 173a and 173b denote an insulating wall that insulates the conveying portion from the washing section, the water washing section and the drying section, and 174 the conveying arm 110c. Represents a cut portion through which the carrier arm 110c passes when it moves vertically, and A2b and A2c are blown out from the first air conditioning filters 126a and 126b by the insulating walls 173a and 173b. A first suction flow formed by separating A1 is shown and is sucked into the first discharge ports 130a and 130b. Symbol A8 represents a second suction flow formed by separating the second down flow A7 blown out of the second air conditioning filter 169 by the insulating walls 173a and 173b, and into the second outlet 170. Is inhaled. The symbol M1 indicates that the conveying unit 110 moves vertically, M2 indicates that the conveying unit 110c moves vertically, and M3 indicates that the conveying arm 110c moves horizontally. The first down flow A1 and the second down flow A2 may be completely separated in a physical manner. In this embodiment, the space of the conveying part 110 and the space above the cleaning tank 114 and the drying tank 121 are insulated from each other by the insulating walls 173a and 173b. At this time, the cleaning cassette 21 is supported by the cassette hand 110h of the conveying unit and moved to the washing tank 114, the washing tank 120, and the drying tank 121 for processing. In order to achieve this, the arm 110c of the conveying part may perform the vertical movement M2 while the conveying part 110 passes through the cut portions 174 of the insulating walls 173a and 173b when the conveying part 110 makes the vertical movement M1. Can be. The horizontal movement M3 of the arm 110c of the conveyance part is performed in the space above the upper end of the insulating wall 173. This embodiment provides the insulating wall 173 which insulates a conveyance part from a washing | cleaning part, a water washing part, and a drying part as mentioned above. Further, the downflow sent from the second air conditioning filter 169 supplying clean air to the conveying part is sent to the second discharge pipe 172 at the bottom of the conveying part, while the clean air to the washing part, the washing part and the drying part. The downflow sent from the first air conditioning filters 126a and 126b for supplying the water is set to the first outlets 130a and 130b disposed around the bath in the washing section, the water washing section and the drying section. Since the down flow is completely separated into each down flow, it is possible to completely prevent erosion of the wafer due to adhesion of the chemical liquid mist and contamination of the wafer due to foreign matter of the apparatus created in the conveying part. Although there is a description of a cassette type cleaning apparatus using a cleaning cassette, this embodiment can of course be applied to a cassetteless type cleaning apparatus that does not use a cleaning cassette and directly handles a wafer.

[Example 37]

78 is a front view and a cross-sectional view illustrating a detailed structure of the semiconductor cleaning apparatus according to the 37th embodiment. Referring to FIG. 78, reference numeral 189 denotes a gas for supplying a gaseous substance to a gap between at least one of the washing units 105a and 105b, the washing units 106a to 106c, or the drying unit 107 and the conveying unit 110. Indicates a supply part. Reference numeral 189a denotes a gas, and 172 denotes a fourth discharge portion for discharging air from the bottom of the transfer unit 110. First, the amount of gas supplied from the gas supply part 189 is determined in advance larger than the amount discharged from the fourth discharge part 172. Since the gas 189a is supplied from the gas supply part 189 to the space | interval in the washing | cleaning parts 105a and 105b, the water washing parts 106a-106c, the drying part 107, and the conveyance part 110, the washing | cleaning parts 105a and 105b ), The mists from the water washing parts 106a to 16c and the drying part 107 do not reach the conveying part 110. Therefore, the device portion of the conveying part 110 can be prevented from being eroded by mist. In addition, the foreign matter generated in the apparatus portion of the conveying part 110 is introduced into the fourth discharge part 172 together with a part of the gas 189a. Therefore, it is possible to prevent the adhesion of mist to the wafer being cleaned. This embodiment can be applied to a cassette type cleaning apparatus using a cleaning cassette and can be applied to a cassetteless type cleaning apparatus that directly handles a wafer without using a cleaning cassette.

38th Example

79 is a front view and a cross-sectional view illustrating a detailed internal structure of the semiconductor cleaning apparatus according to the 38th embodiment. 80 is a plan view illustrating a cleaning device according to this embodiment. Referring to Figs. 79 and 80, reference numeral 126 denotes an air conditioning filter for supplying clean air into the cleaning apparatus, 131a denotes an exhaust duct through the discharge pipe 132, and 130a denotes an exhaust duct ( 131a) shows an opening that passes through, 190 denotes a fifth discharge portion for discharging air from the end of the position of the transfer unit 110, and 300b denotes stagnant air. The amount of air supplied from the air conditioning filter 126 and the amount of air discharged from the discharge pipe 132 are set in advance. Air supplied from the air conditioning filter 126 is discharged to the discharge duct 131a through the openings 130a formed in the cleaning units 105a and 105b, the water washing units 106a to 106c, and the drying unit 107. . A portion of the air is undesirably stagnated at the end of the position of the conveying section 110. The stagnant air 300b contains mist at the time of raising a wafer from each part. When the transfer robot 110a of the conveying unit 110 is attached to the wafer washed with water or to the wafer being cleaned with water at any time, the introduction of the stagnant air 300b into the water washing units 106a and 106b is prevented. The fifth discharge unit 190 discharges the stagnant air 300b from the end of the position of the transfer unit 110. As a result, trouble caused by mist in the cleaning apparatus can be prevented. This embodiment can be applied to a cassette type cleaning apparatus using a cleaning cassette and can be applied to a cassetteless type cleaning apparatus that directly handles a wafer without using a cassette for a cassette.

[Example 39]

FIG. 81 is a front view and a cross-sectional view illustrating a detailed internal structure of the semiconductor cleaning apparatus according to the 39th embodiment. Referring to FIG. 81, reference numeral 191 denotes at least one of the cleaning parts 105a and 105b, the washing parts 106a and 106, and the drying part 107 and the outer wall 101 of the cleaning device body 101. Represents a sixth discharge portion for discharging air. Reference numeral 300c denotes a stagnant air. The amount of air supplied from the air conditioning filter and the amount of air discharged from the discharge pipe 132 are set in advance. Air supplied from the air conditioning filter 126 is formed in the cleaning parts 105a and 105b, the water washing parts 106a to 106c, and the drying part 107 and is discharged to the discharge pipe 132 through the discharge duct 131a. It passes through the opening 130a. However, the presence of the outer wall 101a of the cleaning apparatus main body 101 indicates that a portion of the air is disposed between the cleaning portions 105a and 105b, the water washing portions 106a to 106c, and the drying portion 107 and the outer wall 101a. Make it congested. The stagnant air 300c contains mist when raising a wafer from each part. The sixth discharge portion 191 discharges the stagnant air 300c to prevent the adhesion of mist and introduction of the stagnant air 300c into each portion of the wafer being washed or washed. As a result, trouble caused by mist in the cleaning apparatus can be prevented. This embodiment can be applied to a cassette type cleaning apparatus using a cleaning cassette and can be applied to a cassetteless type cleaning apparatus that directly handles a wafer without using a cleaning cassette.

[Example 40]

82 is a perspective view illustrating the window structure of the semiconductor cleaning apparatus according to the forty-second embodiment. Referring to FIG. 82, reference numeral 180 denotes an opening formed in a partition plate for sealing the cleaning unit, the wafer cleaning unit, and the drying unit in the airtight chamber, and 181 denotes an outer frame formed around the opening 180 ( frame, 182 denotes a door opened along the outer frame 181 as desired, and 183 denotes a guide member for guiding opening / closing operation of the door 182. The window structure 177 shown in FIG. 82 is disposed in order to seal the cleaning portion, the water washing portion and the drying portion in the airtight vessel and to be inserted as desired with the product cassette 22 or the cleaning wafer cassette 21. The door 182 slides along the guide member 183 to open and close the opening 180 while preventing contact with the outer frame 181. The outer frame 181 has a plurality of outlets 184 for discharging air through the outlets 184 when at least the door 182 is opened or closed. As a result, it is possible to prevent the introduction of foreign matter generated due to the opening and closing of the door 182 and the mist from the cleaning device. This embodiment is applied to a cassette type cleaning apparatus using a cleaning cassette and to a cassetteless type cleaning apparatus that directly handles a wafer without using a cleaning cassette.

[Example 41]

83 is a plan view for explaining the semiconductor cleaning apparatus according to the forty-first embodiment. 84 is a front view illustrating this embodiment. Referring to FIGS. 83 and 84, reference numeral 175 denotes a load locking set formed adjacent to the window structure 177 formed between the cleaning apparatus main body 101 and the loader / unloader portion 102. FIG. , 176a and 176b represent the doors of the support rod locking jaw 175 of the inserted product cassette 22 which are located around the load locking jaw 175. As the initial state of the load locking tank 175, the doors 176a and 176b of the support rod locking tank 175 and the window structure 177 are closed. The product cassette 22 containing the wafer is disposed on the product cassette holding the frame of the loader / unloader section 102. The transfer part robot 125 removes the wafer from the product cassette 22 and introduces the wafer into the support rod locking tank 175 to move it to the cleaning cassette 21 disposed on the cleaning wafer cassette holder 124. The doors 176a and 176b of the king jaw 175 are opened. Thereafter, the doors 176a and 176b of the load locking tank 175 are closed. Therefore, the cleaning cassette 21 for accommodating the wafer is supported by the cassette hand 110h of the product carrying unit 110 after the window structure 177 of the support rod locking tank 175 is opened. As a result, it is moved above the cleaning wafer cassette holder 123 to be in the standby state on the cleaning wafer cassette holder 123. Thereafter, the window structure 177 of the support rod locking jaw 175 is closed. After the cleaning process is completed, the product conveying unit 110 takes out the cleaning cassette 21 from the drying tank 121, introduces the cleaning cassette 21 into the support rod locking tank 175, and loads and unloads the 102. The window structure 177 of the support rod locking tank 175 is opened to move on the cleaning wafer cassette holder 124 of the < RTI ID = 0.0 > Thereafter, the window structure 177 of the support rod locking jaw 175 is closed. Subsequently, the mobile replacement robot 125 opens the doors 176a and 176b of the support rod locking tank 175 and then moves the cleaning wafer cassette holder 124 to move to the empty product cassette 22 disposed on the product cassette holder. The wafer is taken out from the cleaning cassette 21 disposed above. Thereafter, the doors 176a and 176b of the support rod locking jaw 175 are closed. Therefore, even if there is a pressure difference between the static pressure in the cleaning apparatus main body 101 and the external static pressure, the chemical mist generated in the washing unit and the vapor of the drying unit by the air flow generated due to the pressure difference. Attaches to the constituent units in the enclosure and the constituent units are corroded. In addition, it can be prevented from adhering to the wafer causing defects and external diffusion causing similar corrosion and generation of defects. As described above, this embodiment is provided with a washing section, a water washing section, a drying section, and a conveying section in a sealed structure. In addition, the support rod locking jaw 175 is formed on the side of the window structure 177 to support the cleaning cassette 21 for receiving the wafer moved from the product cassette 22 in the loader / unloader section 102 or The wafer can be opened and closed by an insertion wafer hand that directly supports the wafer from the product cassette 22. Therefore, the chemical liquid mist generated in the cleaning part and the vapor of the drying part generated by the air flow generated due to the pressure between the static pressure in the sealed tank and the external static pressure insulated by the window structure when the window is opened. Attached to the constituent unit in the sealed tank, the constituent unit is corroded. It can also be prevented from adhering to the wafer causing defects and external diffusion causing similar corrosion and generation of defects. Although there is a description of a cassette type cleaning apparatus using a cleaning cassette, this embodiment can of course also be applied to a cassetteless type cleaning apparatus that does not use a cleaning cassette and directly handles a wafer.

[Example 42]

85 and 86 are plan and side views, respectively, of the semiconductor cleaning apparatus according to the forty-second embodiment. The product cassette containing the uncleaned wafer is inserted into the loader / unloader section 102. The wafer in the product cassette is removed from the product cassette moved to the transfer part by the mobile replacement robot 125, and the wafer is moved to the cleaning cassette 21 in the transfer part. After the mobile replacement robot 125 is removed from the transfer part, the window 177 is opened when the shielding plate 187b is closed. The cleaning cassette 21 containing the wafer is supported by the cassette hand of the transfer robot 110a of the transfer section 110 inserted into the cleaning section 105a. Thereafter, the window 177 is closed and the insulating plate 187b is opened. The cleaning cassette 21 inserted into the cleaning section 105a is moved in the order of the cleaning section 105b, the water washing sections 106a to 106c, and the drying section 107. As a result, the wafer cleaning process is completed. The insulating plate 187b is closed, the window 177 is opened, and the cleaning cassette 21 for accommodating the cleaned wafer is moved to the transfer part by the transfer robot 110a. Thereafter, the window 177 is closed and the insulating plate 187b is opened. The mobile replacement robot 125 takes out the wafer from the cleaning cassette 21 to be moved to the loader / unloader section 102. The wafer is moved to a product cassette in the loader / unloader section 102 before being discharged. Thereafter, the state in which the cleaning apparatus according to this embodiment is used in the semiconductor manufacturing plant is shown in FIG. Creating FIG. 87, reference numeral 132 designates an exhaust duct connected to the duct of the plant, 301 designates another manufacturing apparatus, 201 designates a dry zone which represents the exceptional cleanliness of other manufacturing apparatus, and 118 The mist represents mist scattering from the washing apparatus. In the cleaning apparatus 101 according to this embodiment, the sealing portion insulates the washing portion, the water washing portion, and the drying portion from the dry zone 201. In addition, the window 177 and the insulating plate 187b are not opened at the same time even when cleaning the wafer in the product cassette. Therefore, the fear of mist 118 flying from the cleaning apparatus 101 to the dry zone 201 can be completely eliminated. Thus, the necessity of dividing the air conditioning equipment with other manufacturing apparatus can be eliminated. In addition, the air flow in the dry zone 201 can prevent the mist 118 from scattering and disordering into the dry zone 201 due to the movement of the device and the article and the worker's movement. Therefore, it is possible to prevent product defects and deterioration of properties due to mist. Although this embodiment has been described for a cassette type cleaning device using a cleaning cassette, this embodiment can of course be applied to a cassetteless type cleaning device that does not use a cleaning cassette and directly handles a wafer.

[Example 43]

88 is a perspective view for explaining a support rod locking tank of the semiconductor cleaning apparatus according to the 43rd embodiment. Referring to FIG. 88, reference numeral 175 denotes a support rod locking group disposed adjacent to a window structure formed between the cleaning apparatus main body 101 and the loader / unloader unit 102, and 176a and 176b denote support rod locking groups ( 175 shows a door of the support rod locking jaw 175 that can be opened and closed to insert the product cassette 22 around the 175, and 178 is disposed at the top of the support rod locking jaw 175 to the support rod locking jaw 175. An air conditioning filter arranged to supply clean air, 179 represents a discharge portion for discharging air from the support rod locking tank 175, and 184 a discharge pipe connected to the discharge portion 179, and finally a support rod locking tank And a discharge pipe arranged to discharge air to the outside of 175. After all the downflow blown out of the air conditioning filter 178 passes through the support rod locking tank 175, it is discharged to the outside of the support rod locking tank 175 through the discharge pipe 184 through the discharge unit 179. do. Therefore, the inside of the support rod locking tank 175 can be always in a clean state. In addition, the static pressure in the supporting rod locking tank 175 becomes equal to the pressure of the open portion during the pretreatment. That is, even in the case where the doors 176a and 176b of the supporting rod locking jaw are closed after being opened, the internal pressure of the supporting rod locking jaw 175 is equal to the pressure of an external stagnation state. Therefore, when the window structure 177 of the supporting rod locking tank is then opened, the pressure difference exists between the pressure of the internal stagnation state of the supporting rod locking tank 175 and the pressure of the internal stagnation state of the cleaning apparatus main body 101. The air flow generated by the pressure difference needs to be completely prevented even though it is very small in comparison with the case where the supporting rod locking tank 175 does not exist because the capacity in the supporting rod locking tank 175 is small. Therefore, the air supply pressure of the air conditioning filter 178 and the air discharge pressure from the discharge pipe 184 are changed, and the static pressure in the support rod locking tank 175 and the static state of the space delivered in the next process. The pressure of is detected and the pressure of the static state in the space delivered in the next step becomes equal in response to the signal indicating the detected pressure of the static state. In this embodiment, as described above, the support rod locking tank 175 is provided to the third air conditioning filter 178 for supplying the clean air, and the third discharge pipe for discharging air from the support rod locking tank 175 ( 184), the inside of the support rod locking jaw 175 can be cleaned. In addition, it is possible to prevent dust from scattering due to the air flow generated by the pressure difference with the pressure level in the tank when the door of the supporting rod locking tank 175 is opened. Although there is a description of a cassette type cleaning apparatus using a cleaning cassette, this embodiment can of course also be applied to a cassette lens cleaning apparatus that does not use a cleaning cassette and directly handles a wafer.

[Example 44]

89 is a front view and a cross-sectional view illustrating a detailed internal structure of the semiconductor cleaning apparatus according to the 44th embodiment. Referring to FIG. 89, reference numeral 126 denotes an air conditioning filter disposed above the cleaning tank 114 and arranged to supply clean air, and 130a and 130b suction and discharge air around the cleaning tank 114. 131a and 131b represent discharge ducts connected to the discharge ports 130a and 130b, and 132 are connected to the discharge ducts 131a and 131g to finally discharge the air to the outside of the semiconductor cleaning apparatus 101. The arranged discharge pipe is shown, and 185 represents a demister generated in the cleaning tank 114 to remove the chemical liquid mist mixed with the suction flows A5a and A5b and the discharge flows A3a and A3b. Symbol A1 represents the down flow sent from the air conditioning filter 126, A5a and A5b represent the suction flow sucked into the discharge ports 130a and 130b, and A3a and A3b discharge through the discharge ducts 131a and 131b. A discharge flow discharged into the pipe 132 is shown. The down flow A1 blown out of the air conditioning filter 126 passes through the space above the cleaning tank 114 to trap the chemical mist generated in the cleaning tank 114, and the air flows A5a and A5b. As shown by the suction port through the discharge port (130a, 130b) formed around the cleaning tank 114, and discharge port (130a, 130b) formed around the cleaning tank 114 as shown by the discharge flow (A3a, A3b) It is sucked in through and discharged from the discharge ducts 131a and 131b to the discharge pipe 132 as shown by the discharge flows A4a and A4b. At this time, the demister 185 formed by filling a net shape sheet (ner-shape sheet) into the discharge pipe 132 is used to remove the chemical mist. As a result, undesired return of the chemical mist invading into the discharge pipe and undesired re-transmission to the clean room is prevented so that the diffusion of chemical mist and dry vapor in the entire clean room or into the cleaning apparatus is prevented in the wafer. Corrosion of the device and the creation of defects can be prevented. Demister 185 is a structure or porous body that foams the discharge flow in the pure water, even if the net shape sheet is injected into the discharge pipe and can achieve a similar effect. In this embodiment, as described above, the first filter 126 for supplying clean air to the washing unit, the washing unit and the drying unit, and the first discharge pipe 132 disposed adjacent to the tank of the washing unit, the washing unit and the drying unit. Use In addition, a demister 185 made of a porous body or a net shape filter is disposed at an intermediate position of the discharge pipe 132. Therefore, the chemical liquid mist and the dry steam mixed in the discharged air can be removed, thereby preventing corrosion of the device and defects of the wafer due to the diffusion of the dry steam or the chemical liquid mist floating on the circulating air into or out of the apparatus. Although there is a description of a cassette type cleaning apparatus using a cleaning cassette, this embodiment can of course also be applied to a cassetteless cleaning apparatus that does not use a cleaning cassette and directly handles a wafer.

Claims (49)

A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A product extracting section which inserts the wafer from the product cassette; A cleaning unit for cleaning the wafer; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with water in the washing unit; And a conveying part which has a wafer hand for directly supporting the wafer drawn out from the product cassette of the product extracting part and sequentially conveys the wafer supported by the wafer to the cleaning part, the water washing part and the drying part. A semiconductor cleaning device, characterized in that. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A cleaning cassette for storing the wafer and a handle formed on the accommodated wafer; A transfer part for moving the wafer between the product cassette and the cleaning cassette received by the loader / unloader part; A cleaning unit for cleaning the wafer accommodated in the cleaning cassette with a cleaning liquid; A washing unit washing the wafer cleaned by the washing unit with a washing liquid while storing the wafer in the cleaning cassette; A drying unit for drying the wafer washed in the water washing unit while storing the wafer in the cleaning cassette; And a conveying part for supporting the handle of the cleaning cassette and sequentially conveying the cleaning cassette from the loader / unloader part to the cleaning part, the water washing part, and the drying part, wherein the handle of the cleaning cassette And a wafer placed above the liquid level of the cleaning liquid and the washing liquid when the contained wafer is completely immersed in the cleaning liquid of the cleaning portion and the washing liquid of the water washing portion. 2. The semiconductor cleaning apparatus according to claim 1, further comprising a wafer holder for temporarily evacuating the wafer. The semiconductor cleaning apparatus according to claim 2, further comprising a cassette holder for temporarily evacuating the cleaning cassette in which the wafer is stored. 4. The semiconductor cleaning apparatus according to claim 3, further comprising washing means for washing the wafer evacuated to the wafer holding means. 5. The semiconductor cleaning apparatus according to claim 4, further comprising washing means for searching the wafer in the cleaning cassette evacuated to the cassette holder. The cleaning cassette according to claim 2, further comprising a conveying control section for controlling the conveying section to sequentially convey the number of the cleaning cassettes smaller than the total number of the installation places. The semiconductor cleaning device characterized by the above-mentioned. The cleaning part according to claim 2, wherein the cleaning part further includes a cleaning tank accommodating the cleaning liquid and an opening exposed by the handle of the cleaning cassette set in the cleaning tank, the shielding plate shielding the cleaning tank. A semiconductor cleaning device, characterized in that the. 3. The semiconductor cleaning apparatus according to claim 2, wherein the constant water washing unit has a washing tank containing a washing liquid having a liquid level higher than that of the cleaning liquid of the cleaning unit and lower than a handle of the cleaning cassette. 3. The semiconductor cleaning apparatus according to claim 2, wherein the water washing portion has a nozzle for spraying pure water toward the handle of the cleaning cassette. The semiconductor cleaning apparatus according to claim 1, wherein the constant water washing unit washes the wafer held by the wafer hand of the transfer unit together with the wafer hand. The semiconductor cleaning apparatus according to claim 1, wherein the drying unit separates the wafer hand from the wafer and the transfer unit with steam, and separates the vapor drying the wafer from the vapor drying the wafer hand. 2. The semiconductor cleaning apparatus according to claim 1, wherein said loader / unloader section has at least one product cassette holder and at least one wafer holder for a total number of wafers simultaneously inserted into said cleaning section, said water washing section and said drying section. . 3. The apparatus of claim 2, wherein the loader / unloader portion has at least one product cassette holder and at least one cleaning cassette holder of the cleaning cassette inserted simultaneously into the cleaning section, the flushing section and the drying section. A semiconductor cleaning device. The apparatus of claim 1, wherein the product insertion unit is configured to align a rail moving along the loader / unloader unit, a hand for holding the wafer, and an orientation flat of the wafer housed in the product cassette; And a protruding member protruding the wafer in the product cassette upwards of the product cassette. The apparatus of claim 2, wherein the transfer part includes an rail for moving along the loader / unloader part, a hand supporting the wafer, an orientation flat matching device for matching an orientation flat of the wafer housed in the product cassette, and the product. And a protruding member projecting the wafer in the cassette above the product cassette. The wafer support portion of claim 1, wherein the wafer has a plurality of wafer support rods arranged in parallel with each other, and each wafer support rod has a wafer guide portion having a tapered end portion and a wafer support portion formed to be connected to the wafer guide portion, respectively. And a plurality of wafer storage grooves provided. The semiconductor cleaning device according to claim 2, further comprising a dedicated glove selectively worn on the cassette hand of the conveying unit and preventing the cassette hand from being wetted by the cleaning liquid of the cleaning unit and the washing liquid of the washing unit. Device. The semiconductor cleaning device according to claim 2, wherein the cassette hand of the conveying unit has an exchange chuck connecting jig and an exchange chuck detachably attached to the connecting jig. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette at the moving replacement section; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with the water washing unit; A conveying section for sequentially conveying the wafers from the product cassette of the transfer section to the cleaning section, the water washing section and the drying section, wherein the loader / unloader section and the transfer section are arranged in the width direction of the cleaning apparatus And the conveying portion is disposed in the center portion of the washing apparatus in the longitudinal direction of the washing apparatus, and the washing portion, the water washing portion, and the drying portion are disposed on both sides of the conveying portion. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette of the transfer section; A water washing unit for washing the wafer cleaned in the cleaning unit; A drying unit for drying the wafer washed with the water washing unit; And a conveying section for sequentially conveying the wafers from the product cassette of the transfer section to the cleaning section, the water washing section, and the drying section, wherein the loader / unloader section, the transfer section, the cleaning section, the water washing section, and the And a drying part is arranged to form a double row structure, and the conveying part is disposed in accordance with the double row shape. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette of the transfer section; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with the water washing unit; And a conveying section for sequentially conveying the wafers from the product cassette of the transfer section to the cleaning section, the water washing section, and the drying section, wherein the loader / unloader section, the transfer section, the cleaning section, the water washing section, and the And a drying unit is disposed around the conveying unit. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette of the transfer section; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with the water washing unit; A conveying section for sequentially conveying the wafers from the cleaning cassette, the water washing section and the drying section from the product cassette of the transfer section; A first air conditioning filter for supplying clean air to the cleaning part, the water washing part and the drying part so as to form a downflow at an upper position of the cleaning part, the water washing part and the drying part; A first discharge part disposed adjacent to each tank of the washing part, the water washing part, and the drying part; Temperature detecting means for detecting a temperature of a cleaning liquid of the cleaning part and / or a vapor temperature of the drying part; And an air supply pressure changing means for changing an air supply pressure of said first air conditioning filter in accordance with the temperature detected by said temperature detecting means. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette of the transfer section; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with the water washing unit; A conveying section for sequentially conveying the wafers from the cleaning cassette, the water washing section and the drying section from the product cassette of the transfer section; A first air conditioning filter for supplying clean air to the cleaning part, the water washing part and the drying part so as to form a downflow at an upper position of the cleaning part, the water washing part and the drying part; A first discharge part disposed adjacent to each tank of the washing part, the water washing part, and the drying part; A panel upper jaw covering an upper portion of said washing section, said water washing section and said drying section, said panel upper jaw having an opening directly adjacent to said jaws and having a plurality of small openings connected to said first discharge section; And a drain receiver disposed under said plurality of small openings of said panel upper jaw. 25. The apparatus of claim 24, further comprising: detection means for detecting a temperature of the cleaning liquid in the cleaning part and a vapor temperature of the drying part; And an air conditioning filter supply pressure changing means for changing a pressure of air supplied from said first air conditioning filter in accordance with the temperature detected by said temperature detecting means. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette of the transfer section; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with the water washing unit; A conveying section for sequentially conveying the wafers from the cleaning cassette, the water washing section and the drying section from the product cassette of the transfer section; A first air conditioning filter for supplying clean air to the cleaning part, the water washing part and the drying part so as to form a downflow at an upper position of the cleaning part, the water washing part and the drying part; A first discharge portion disposed adjacent to each of the tubs of the washing portion, the water washing portion, and the drying portion; A first heat exchanger for cooling the air supplied from the first air conditioning filter to the cleaning unit, the water washing unit, and the drying unit; A first chiller for supplying a cooling medium to the first heat exchanger, the upflow of natural convection of steam generated in a washing tank of the washing unit or a steam tank of the drying unit and air cooled in the first heat exchanger And impinge on each other at a position adjacent to the cleaning tank or the top of the steam tank to condense vapor in the cooled air to produce a water mist. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette of the transfer section; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with the water washing unit; A conveying section for sequentially conveying the wafers from the cleaning cassette, the water washing section and the drying section from the product cassette of the transfer section; A first air conditioning filter for supplying clean air to the cleaning part, the water washing part and the drying part so as to form a downflow at an upper position of the cleaning part, the water washing part and the drying part; A first discharge portion disposed adjacent to each of the tubs of the washing portion, the water washing portion, and the drying portion; And a two-fluid nozzle for injecting pure water while using clear air or an inert gas as the second fluid to produce pure water mist mixed in the downflow. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette of the transfer section; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with the water washing unit; A conveying section for sequentially conveying the wafers from the cleaning cassette, the water washing section and the drying section from the product cassette of the transfer section; A blow formed in the cleaning tank of the cleaning unit and the steam tank of the drying unit according to one side of the bath and arranged to horizontally blow out the same air curtain in the width direction from the blow out port that is the other side of the bath. Air curtain blowing means having an outlet; An air curtain discharging means having a suction port formed in the width direction of the cleaning tank of the cleaning unit and the other side of the steam tank of the drying unit to discharge the air curtain sucked through the suction port; Disposed at the blowing out opening of the air curtain blowing means, arranged to blow out the air curtain to form a layer flow, the blowing speed being to form a velocity distribution that gradually increases inversely proportional to the distance away from the jaws And a rectifying means having a length in a passage direction gradually decreasing in proportion to a distance away from the cleaning tank and the distance from the steam tank. 29. The air conditioner according to claim 28, further comprising: a first air conditioning filter for supplying clean air to the washing unit, the washing unit, and the drying unit to form a downflow at an upper position of the washing unit, the washing unit, and the drying unit; And a first discharge part disposed adjacent to each tank of the cleaning part, the water washing part, and the drying part. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette of the transfer section; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with the water washing unit; A conveying section for sequentially conveying the wafers placed in the cleaning section, the water washing section, and the drying section from the product cassette of the transfer section; Blowing which is formed above the cleaning tank of the cleaning section and the steam tank of the drying section and arranged to horizontally blow out the same air curtain in the width direction from the blowing out port that is the other side of the tank according to one side of the bath. Air curtain blowing means having an outlet; An air curtain discharging means having a suction port formed in the width direction of the cleaning tank of the cleaning unit and the other side of the steam tank of the drying unit to discharge the air curtain sucked through the suction port; Temperature detecting means for detecting a temperature of a cleaning liquid of the cleaning part and / or a vapor temperature of the drying part; And an air conditioning filter supply pressure changing means for changing a pressure of air supplied from said first air conditioning filter in accordance with the temperature detected by said temperature detecting means. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette of the transfer section; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with the water washing unit; A conveying section for sequentially conveying the wafers placed in the cleaning section, the water washing section, and the drying section from the product cassette of the transfer section; Blowing outs formed on the cleaning tanks of the cleaning section and the steam tank of the drying section according to one side of the bath and arranged to horizontally blow out the same air curtain in the width direction from the blowing out port which is the other side of the tank. Air curtain blowing means having a sphere; Air curtain discharge means having a suction port formed in the width direction of the cleaning tank of the cleaning unit and the other side of the steam tank of the drying unit to discharge the air curtain sucked through the suction port; A second heat exchanger for cooling the air blown out from said air curtain blowing means; A second cooler for supplying a cooling medium to the second heat exchanger, the upflow of natural convection of steam generated in the washing tank of the washing unit or the steam tank of the drying unit, and the air cooled in the second heat exchanger And impinge on each other at a position adjacent to the scrubber or the top of the scrubber to condense vapor in the cooled air to produce a water mist. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette of the transfer section; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with the water washing unit; A conveying section for sequentially conveying the wafers placed in the cleaning section, the water washing section, and the drying section from the product cassette of the transfer section; Blowing which is formed above the cleaning tank of the cleaning section and the steam tank of the drying section according to one side of the bath and arranged to horizontally blow out the same air curtain in the width direction from the blowing out opening that is the other side of the bath. Air curtain blowing means having an outlet; An air curtain discharging means having a suction port formed in the width direction of the cleaning tank of the cleaning unit and the other side of the steam tank of the drying unit to discharge the air curtain sucked through the suction port; And a second fluid nozzle for injecting pure water while using clear air or an inert gas as a second fluid to produce pure mist mixed into the air curtain blown out of the air curtain blowing means. Device. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette of the transfer section; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with the water washing unit; A conveying section for sequentially conveying the wafers placed in the cleaning section, the water washing section, and the drying section from the product cassette of the transfer section; A second air conditioning filter for supplying clean air to the conveying unit; And a second discharge portion for discharging air from the transfer portion. 34. The apparatus of claim 33, further comprising: a first air conditioning filter for supplying clean air to the cleaning part, the water washing part, and the drying part so as to form a downflow on the cleaning part, the water washing part, and the drying part; And a first discharge part disposed adjacent to each tank of the cleaning part, the water washing part, and the drying part. 35. The semiconductor cleaning apparatus according to claim 34, wherein the second air conditioning filter supplies air at an air supply pressure higher than the air supply pressure of the first air conditioning filter. 34. The air curtain according to claim 33, wherein an air curtain is formed above the cleaning tank of the cleaning section and the steam tank of the drying section along one side of the tank, and horizontally the same air curtain from the blowing out port on the other side of the tank in the width direction. Air curtain blowing means having a blowout outlet arranged to blow out; And an air curtain discharging means having a suction port formed in the width direction of the cleaning tank of the cleaning unit and the other side of the steam tank of the drying unit to discharge the air curtain sucked through the suction port. Semiconductor cleaning device. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette of the transfer section; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with the water washing unit; A conveying section for sequentially conveying the wafers from the cleaning cassette, the water washing section and the drying section from the product cassette of the transfer section; A gas supply part for supplying a gas liquid into the conveying part through a gap between any one of the washing part, the water washing part, or the drying part and the conveying part such that the pressure of the conveying part becomes positive; And a fourth discharge portion for discharging a part of the gas supplied from the gas supply portion at the bottom of the transfer portion. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette of the transfer section; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with the water washing unit; A conveying section for sequentially conveying the wafers placed in the cleaning section, the water washing section, and the drying section from the product cassette of the transfer section; And a fifth discharge portion for discharging air from an end portion of the position of the transfer portion. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette of the transfer section; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with the water washing unit; A conveying section for sequentially conveying the wafers from the cleaning cassette, the water washing section and the drying section from the product cassette of the transfer section; An outer wall of the cleaning device covering the respective portions; And a sixth discharge portion for discharging the controllator between any one of the cleaning portion, the water washing portion, and the drying portion and the outer wall. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette of the transfer section; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with the water washing unit; A conveying section for sequentially conveying the wafers from the cleaning cassette, the water washing section and the drying section from the product cassette of the transfer section; A hermetic tank for sealing the cleaning section, the water washing section, the drying section, and the conveying section; And a window structure for inserting the wafer released from / to the hermetic tank from the product cassette of the transfer part. 41. The guide member of claim 40, wherein the window structure slides the door while preventing the contact between the opening formed in the closure tank, the door slipped on the outer frame, and the outer frame and the door. And an outer frame for partitioning an outlet formed in the outer frame. 41. The semiconductor cleaning apparatus according to claim 40, further comprising a load locking tank which is formed on an outer side of said window structure and can be opened and closed. 41. The semiconductor cleaning apparatus according to claim 40, further comprising a shielding plate that can be opened and closed surrounding the window structure from a portion adjacent to the loader / unloader portion. 43. The semiconductor cleaning apparatus according to claim 42, further comprising a third air conditioning filter for supplying clean air to the support rod locking tank, and a third discharge portion for discharging air from the support rod locking tank. 45. The air supply pressure of claim 44 wherein the third air conditioning filter is balanced with the atmosphere of the enclosure when the window structure is opened and is set at an air supply pressure that is balanced with the atmosphere outside of the enclosure. A semiconductor cleaning apparatus, characterized in that the set. A loader / unloader section which inserts and removes a product cassette in which a wafer is stored; A transfer part for inserting the wafer from the product cassette; A cleaning section for cleaning the wafer from the product cassette of the transfer section; A washing unit washing the wafer cleaned in the washing unit; A drying unit for drying the wafer washed with the water washing unit; A conveying section for sequentially conveying the wafers from the cleaning cassette, the water washing section and the drying section from the product cassette of the transfer section; A first air conditioning filter for supplying clean air to the cleaning unit, the water washing unit, and the drying unit; A first discharge portion disposed adjacent to each of the tubs of the washing portion, the water washing portion, and the drying portion; And a demister connected to said first discharge portion and arranged to remove dry vapor and chemical liquid mist mixed in the discharged air. A cleaning wafer cassette for storing a plurality of wafers to immerse a plurality of wafers in each chemical tank of a cleaning apparatus, comprising: an accommodating portion for storing a plurality of wafers; And a handle portion formed at a position higher than the liquid surface of the chemical liquid tank when the cleaning wafer cassette is set in each of the chemical liquid tanks. 48. The apparatus of claim 47, wherein the housing portion has a plurality of wafer supports having a receiving groove for supporting the plurality of wafers while being connected between the pair of support plates and the ends of the support plates, and the handle portion of the pair of support plates. And a wafer cassette formed at the remaining end. 49. The wafer cassette of claim 48, wherein each pair of support plates has a chemical liquid block.