JPWO2025075180A1 - - Google Patents
Info
- Publication number
- JPWO2025075180A1 JPWO2025075180A1 JP2025523107A JP2025523107A JPWO2025075180A1 JP WO2025075180 A1 JPWO2025075180 A1 JP WO2025075180A1 JP 2025523107 A JP2025523107 A JP 2025523107A JP 2025523107 A JP2025523107 A JP 2025523107A JP WO2025075180 A1 JPWO2025075180 A1 JP WO2025075180A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023174717 | 2023-10-06 | ||
| PCT/JP2024/035695 WO2025075180A1 (ja) | 2023-10-06 | 2024-10-04 | 半導体基板接合体及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025075180A1 true JPWO2025075180A1 (https=) | 2025-04-10 |
Family
ID=95283530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025523107A Pending JPWO2025075180A1 (https=) | 2023-10-06 | 2024-10-04 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025075180A1 (https=) |
| WO (1) | WO2025075180A1 (https=) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012026335A1 (ja) * | 2010-08-25 | 2012-03-01 | 東京エレクトロン株式会社 | 接合システム、接合方法及びコンピュータ記憶媒体 |
| WO2012161044A1 (ja) * | 2011-05-24 | 2012-11-29 | ソニー株式会社 | 半導体装置 |
| US20200126948A1 (en) * | 2018-10-19 | 2020-04-23 | Semes Co., Ltd. | Die bonding apparatus and mehod and substrate bonding apparatus and mehod |
| WO2022255286A1 (ja) * | 2021-05-30 | 2022-12-08 | 唯知 須賀 | 半導体基板接合体及びその製造方法 |
| JP2023512776A (ja) * | 2020-02-05 | 2023-03-29 | インヴェンサス ボンディング テクノロジーズ インコーポレイテッド | 直接接合のための相互接続パッドの選択的変更 |
| US20230137581A1 (en) * | 2021-10-29 | 2023-05-04 | Volvo Construction Equipment Ab | Construction equipment |
| JP2023137581A (ja) * | 2022-03-18 | 2023-09-29 | キオクシア株式会社 | 半導体装置、半導体装置の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5953087B2 (ja) * | 2012-01-17 | 2016-07-13 | オリンパス株式会社 | 固体撮像装置、撮像装置および固体撮像装置の製造方法 |
| US10818624B2 (en) * | 2017-10-24 | 2020-10-27 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and method for manufacturing the same |
| JP7353729B2 (ja) * | 2018-02-09 | 2023-10-02 | キヤノン株式会社 | 半導体装置、半導体装置の製造方法 |
| TWI808292B (zh) * | 2019-12-30 | 2023-07-11 | 聯華電子股份有限公司 | 半導體元件封裝結構 |
-
2024
- 2024-10-04 JP JP2025523107A patent/JPWO2025075180A1/ja active Pending
- 2024-10-04 WO PCT/JP2024/035695 patent/WO2025075180A1/ja active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012026335A1 (ja) * | 2010-08-25 | 2012-03-01 | 東京エレクトロン株式会社 | 接合システム、接合方法及びコンピュータ記憶媒体 |
| WO2012161044A1 (ja) * | 2011-05-24 | 2012-11-29 | ソニー株式会社 | 半導体装置 |
| US20200126948A1 (en) * | 2018-10-19 | 2020-04-23 | Semes Co., Ltd. | Die bonding apparatus and mehod and substrate bonding apparatus and mehod |
| JP2023512776A (ja) * | 2020-02-05 | 2023-03-29 | インヴェンサス ボンディング テクノロジーズ インコーポレイテッド | 直接接合のための相互接続パッドの選択的変更 |
| WO2022255286A1 (ja) * | 2021-05-30 | 2022-12-08 | 唯知 須賀 | 半導体基板接合体及びその製造方法 |
| US20230137581A1 (en) * | 2021-10-29 | 2023-05-04 | Volvo Construction Equipment Ab | Construction equipment |
| JP2023137581A (ja) * | 2022-03-18 | 2023-09-29 | キオクシア株式会社 | 半導体装置、半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025075180A1 (ja) | 2025-04-10 |
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