JPWO2025022960A5 - - Google Patents

Info

Publication number
JPWO2025022960A5
JPWO2025022960A5 JP2025535676A JP2025535676A JPWO2025022960A5 JP WO2025022960 A5 JPWO2025022960 A5 JP WO2025022960A5 JP 2025535676 A JP2025535676 A JP 2025535676A JP 2025535676 A JP2025535676 A JP 2025535676A JP WO2025022960 A5 JPWO2025022960 A5 JP WO2025022960A5
Authority
JP
Japan
Prior art keywords
detection device
view
human body
sectional
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025535676A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025022960A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/024109 external-priority patent/WO2025022960A1/ja
Publication of JPWO2025022960A1 publication Critical patent/JPWO2025022960A1/ja
Publication of JPWO2025022960A5 publication Critical patent/JPWO2025022960A5/ja
Pending legal-status Critical Current

Links

JP2025535676A 2023-07-24 2024-07-03 Pending JPWO2025022960A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023120200 2023-07-24
PCT/JP2024/024109 WO2025022960A1 (ja) 2023-07-24 2024-07-03 検出装置及び検出装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2025022960A1 JPWO2025022960A1 (https=) 2025-01-30
JPWO2025022960A5 true JPWO2025022960A5 (https=) 2026-04-21

Family

ID=94374955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025535676A Pending JPWO2025022960A1 (https=) 2023-07-24 2024-07-03

Country Status (2)

Country Link
JP (1) JPWO2025022960A1 (https=)
WO (1) WO2025022960A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006186032A (ja) * 2004-12-27 2006-07-13 Canon Inc 放射線撮像装置
JP2017228599A (ja) * 2016-06-21 2017-12-28 ソニー株式会社 半導体装置、及び半導体装置の製造方法
JP2018149280A (ja) * 2017-03-13 2018-09-27 ヤマハ株式会社 生体振動センサー
EP3876682A4 (en) * 2018-10-31 2022-12-07 Dai Nippon Printing Co., Ltd. CIRCUIT BOARD AND PROCESS OF MAKING THE CIRCUIT BOARD
JP7557728B2 (ja) * 2019-06-27 2024-09-30 パナソニックＩｐマネジメント株式会社 伸縮性回路基板、及び伸縮性回路実装品
JP7480489B2 (ja) * 2019-10-11 2024-05-10 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP2022024636A (ja) * 2020-07-28 2022-02-09 株式会社ジャパンディスプレイ 検出装置
JP7751416B2 (ja) * 2021-08-23 2025-10-08 株式会社ジャパンディスプレイ 検出装置

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