JPWO2025022960A1 - - Google Patents

Info

Publication number
JPWO2025022960A1
JPWO2025022960A1 JP2025535676A JP2025535676A JPWO2025022960A1 JP WO2025022960 A1 JPWO2025022960 A1 JP WO2025022960A1 JP 2025535676 A JP2025535676 A JP 2025535676A JP 2025535676 A JP2025535676 A JP 2025535676A JP WO2025022960 A1 JPWO2025022960 A1 JP WO2025022960A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025535676A
Other languages
Japanese (ja)
Other versions
JPWO2025022960A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025022960A1 publication Critical patent/JPWO2025022960A1/ja
Publication of JPWO2025022960A5 publication Critical patent/JPWO2025022960A5/ja
Pending legal-status Critical Current

Links

JP2025535676A 2023-07-24 2024-07-03 Pending JPWO2025022960A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023120200 2023-07-24
PCT/JP2024/024109 WO2025022960A1 (ja) 2023-07-24 2024-07-03 検出装置及び検出装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2025022960A1 true JPWO2025022960A1 (https=) 2025-01-30
JPWO2025022960A5 JPWO2025022960A5 (https=) 2026-04-21

Family

ID=94374955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025535676A Pending JPWO2025022960A1 (https=) 2023-07-24 2024-07-03

Country Status (2)

Country Link
JP (1) JPWO2025022960A1 (https=)
WO (1) WO2025022960A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006186032A (ja) * 2004-12-27 2006-07-13 Canon Inc 放射線撮像装置
JP2017228599A (ja) * 2016-06-21 2017-12-28 ソニー株式会社 半導体装置、及び半導体装置の製造方法
JP2018149280A (ja) * 2017-03-13 2018-09-27 ヤマハ株式会社 生体振動センサー
EP3876682A4 (en) * 2018-10-31 2022-12-07 Dai Nippon Printing Co., Ltd. CIRCUIT BOARD AND PROCESS OF MAKING THE CIRCUIT BOARD
JP7557728B2 (ja) * 2019-06-27 2024-09-30 パナソニックIpマネジメント株式会社 伸縮性回路基板、及び伸縮性回路実装品
JP7480489B2 (ja) * 2019-10-11 2024-05-10 大日本印刷株式会社 配線基板及び配線基板の製造方法
JP2022024636A (ja) * 2020-07-28 2022-02-09 株式会社ジャパンディスプレイ 検出装置
JP7751416B2 (ja) * 2021-08-23 2025-10-08 株式会社ジャパンディスプレイ 検出装置

Also Published As

Publication number Publication date
WO2025022960A1 (ja) 2025-01-30

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Legal Events

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