JPWO2025009015A1 - - Google Patents
Info
- Publication number
- JPWO2025009015A1 JPWO2025009015A1 JP2025530815A JP2025530815A JPWO2025009015A1 JP WO2025009015 A1 JPWO2025009015 A1 JP WO2025009015A1 JP 2025530815 A JP2025530815 A JP 2025530815A JP 2025530815 A JP2025530815 A JP 2025530815A JP WO2025009015 A1 JPWO2025009015 A1 JP WO2025009015A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/024607 WO2025009015A1 (ja) | 2023-07-03 | 2023-07-03 | パワーモジュール及びその製造方法並びに電力変換装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025009015A1 true JPWO2025009015A1 (https=) | 2025-01-09 |
| JPWO2025009015A5 JPWO2025009015A5 (https=) | 2026-03-06 |
Family
ID=94171879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025530815A Pending JPWO2025009015A1 (https=) | 2023-07-03 | 2023-07-03 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2025009015A1 (https=) |
| CN (1) | CN121444663A (https=) |
| DE (1) | DE112023006608T5 (https=) |
| WO (1) | WO2025009015A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3469840B2 (ja) | 2000-02-22 | 2003-11-25 | 株式会社三社電機製作所 | 半導体装置 |
| JP5204744B2 (ja) * | 2009-11-26 | 2013-06-05 | 三菱電機株式会社 | 電力用半導体装置 |
| JP4870204B2 (ja) * | 2009-12-17 | 2012-02-08 | 三菱電機株式会社 | パワー半導体モジュール |
| JP2020178003A (ja) * | 2019-04-17 | 2020-10-29 | 三菱電機株式会社 | パワー半導体モジュールおよびパワー半導体モジュールの製造方法 |
| JP7574753B2 (ja) * | 2021-07-05 | 2024-10-29 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
-
2023
- 2023-07-03 JP JP2025530815A patent/JPWO2025009015A1/ja active Pending
- 2023-07-03 CN CN202380099867.4A patent/CN121444663A/zh active Pending
- 2023-07-03 WO PCT/JP2023/024607 patent/WO2025009015A1/ja active Pending
- 2023-07-03 DE DE112023006608.6T patent/DE112023006608T5/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE112023006608T5 (de) | 2026-04-23 |
| WO2025009015A1 (ja) | 2025-01-09 |
| CN121444663A (zh) | 2026-01-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251202 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251202 |