JPWO2024204310A1 - - Google Patents
Info
- Publication number
- JPWO2024204310A1 JPWO2024204310A1 JP2025511004A JP2025511004A JPWO2024204310A1 JP WO2024204310 A1 JPWO2024204310 A1 JP WO2024204310A1 JP 2025511004 A JP2025511004 A JP 2025511004A JP 2025511004 A JP2025511004 A JP 2025511004A JP WO2024204310 A1 JPWO2024204310 A1 JP WO2024204310A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023057288 | 2023-03-31 | ||
| PCT/JP2024/012183 WO2024204310A1 (ja) | 2023-03-31 | 2024-03-27 | 半導体装置、電力変換装置、インバータ基板、および放熱フィン |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024204310A1 true JPWO2024204310A1 (https=) | 2024-10-03 |
Family
ID=92906548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025511004A Pending JPWO2024204310A1 (https=) | 2023-03-31 | 2024-03-27 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024204310A1 (https=) |
| WO (1) | WO2024204310A1 (https=) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56112945U (https=) * | 1980-01-31 | 1981-08-31 | ||
| JPH0463464A (ja) * | 1990-07-03 | 1992-02-28 | Mitsubishi Electric Corp | 半導体装置 |
| JPH09139449A (ja) * | 1995-11-13 | 1997-05-27 | Fujitsu Denso Ltd | 半導体の取付装置 |
| US20040250990A1 (en) * | 2003-06-12 | 2004-12-16 | Phoenix Contact Gmbh & Co. Kg | Cooling element for heat dissipation in electronic components |
| WO2006022005A1 (ja) * | 2004-08-26 | 2006-03-02 | Mitsubishi Denki Kabushiki Kaisha | 交流発電機の電圧制御装置 |
| JP2009152427A (ja) * | 2007-12-21 | 2009-07-09 | Sumitomo Electric Ind Ltd | 光トランシーバの放熱装置 |
| WO2015173862A1 (ja) * | 2014-05-12 | 2015-11-19 | 三菱電機株式会社 | 電力用半導体装置及びその製造方法 |
| JP2016034003A (ja) * | 2014-07-31 | 2016-03-10 | トヨタ自動車株式会社 | 電力変換装置 |
| JP2017063066A (ja) * | 2014-01-30 | 2017-03-30 | パナソニックＩｐマネジメント株式会社 | 半導体装置及び半導体パッケージ |
| JP2018037604A (ja) * | 2016-09-02 | 2018-03-08 | 三菱電機株式会社 | 電力変換装置 |
| WO2020131188A2 (en) * | 2018-09-27 | 2020-06-25 | Henkel IP & Holding GmbH | Abrasion-resistant coatings for thermal interfaces |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008198835A (ja) * | 2007-02-14 | 2008-08-28 | Nippo Ltd | 放熱装置 |
| US10141249B2 (en) * | 2016-10-16 | 2018-11-27 | Alpha And Omega Semiconductor (Cayman) Ltd. | Molded intelligent power module and method of making the same |
-
2024
- 2024-03-27 WO PCT/JP2024/012183 patent/WO2024204310A1/ja not_active Ceased
- 2024-03-27 JP JP2025511004A patent/JPWO2024204310A1/ja active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56112945U (https=) * | 1980-01-31 | 1981-08-31 | ||
| JPH0463464A (ja) * | 1990-07-03 | 1992-02-28 | Mitsubishi Electric Corp | 半導体装置 |
| JPH09139449A (ja) * | 1995-11-13 | 1997-05-27 | Fujitsu Denso Ltd | 半導体の取付装置 |
| US20040250990A1 (en) * | 2003-06-12 | 2004-12-16 | Phoenix Contact Gmbh & Co. Kg | Cooling element for heat dissipation in electronic components |
| WO2006022005A1 (ja) * | 2004-08-26 | 2006-03-02 | Mitsubishi Denki Kabushiki Kaisha | 交流発電機の電圧制御装置 |
| JP2009152427A (ja) * | 2007-12-21 | 2009-07-09 | Sumitomo Electric Ind Ltd | 光トランシーバの放熱装置 |
| JP2017063066A (ja) * | 2014-01-30 | 2017-03-30 | パナソニックＩｐマネジメント株式会社 | 半導体装置及び半導体パッケージ |
| WO2015173862A1 (ja) * | 2014-05-12 | 2015-11-19 | 三菱電機株式会社 | 電力用半導体装置及びその製造方法 |
| JP2016034003A (ja) * | 2014-07-31 | 2016-03-10 | トヨタ自動車株式会社 | 電力変換装置 |
| JP2018037604A (ja) * | 2016-09-02 | 2018-03-08 | 三菱電機株式会社 | 電力変換装置 |
| WO2020131188A2 (en) * | 2018-09-27 | 2020-06-25 | Henkel IP & Holding GmbH | Abrasion-resistant coatings for thermal interfaces |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024204310A1 (ja) | 2024-10-03 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250312 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20251202 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260130 |