JPWO2024202709A5 - - Google Patents

Info

Publication number
JPWO2024202709A5
JPWO2024202709A5 JP2025509931A JP2025509931A JPWO2024202709A5 JP WO2024202709 A5 JPWO2024202709 A5 JP WO2024202709A5 JP 2025509931 A JP2025509931 A JP 2025509931A JP 2025509931 A JP2025509931 A JP 2025509931A JP WO2024202709 A5 JPWO2024202709 A5 JP WO2024202709A5
Authority
JP
Japan
Prior art keywords
peak
resin film
conductive resin
height
external electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025509931A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024202709A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/006007 external-priority patent/WO2024202709A1/ja
Publication of JPWO2024202709A1 publication Critical patent/JPWO2024202709A1/ja
Publication of JPWO2024202709A5 publication Critical patent/JPWO2024202709A5/ja
Pending legal-status Critical Current

Links

JP2025509931A 2023-03-31 2024-02-20 Pending JPWO2024202709A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023058510 2023-03-31
PCT/JP2024/006007 WO2024202709A1 (ja) 2023-03-31 2024-02-20 セラミック電子部品およびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2024202709A1 JPWO2024202709A1 (https=) 2024-10-03
JPWO2024202709A5 true JPWO2024202709A5 (https=) 2025-12-15

Family

ID=92905083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025509931A Pending JPWO2024202709A1 (https=) 2023-03-31 2024-02-20

Country Status (3)

Country Link
US (1) US20260024704A1 (https=)
JP (1) JPWO2024202709A1 (https=)
WO (1) WO2024202709A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3760770B2 (ja) * 2001-01-05 2006-03-29 株式会社村田製作所 積層セラミック電子部品及びその製造方法
JP7175095B2 (ja) * 2018-03-28 2022-11-18 三菱電機株式会社 半導体装置
JP7651263B2 (ja) * 2019-03-28 2025-03-26 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
KR102946083B1 (ko) * 2020-12-18 2026-04-01 삼성전기주식회사 적층형 전자 부품 및 그 제조방법

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