JPWO2024195374A5 - - Google Patents

Info

Publication number
JPWO2024195374A5
JPWO2024195374A5 JP2025508224A JP2025508224A JPWO2024195374A5 JP WO2024195374 A5 JPWO2024195374 A5 JP WO2024195374A5 JP 2025508224 A JP2025508224 A JP 2025508224A JP 2025508224 A JP2025508224 A JP 2025508224A JP WO2024195374 A5 JPWO2024195374 A5 JP WO2024195374A5
Authority
JP
Japan
Prior art keywords
axis
powder
cr2o3
base substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025508224A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024195374A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/005221 external-priority patent/WO2024195374A1/ja
Publication of JPWO2024195374A1 publication Critical patent/JPWO2024195374A1/ja
Publication of JPWO2024195374A5 publication Critical patent/JPWO2024195374A5/ja
Pending legal-status Critical Current

Links

JP2025508224A 2023-03-23 2024-02-15 Pending JPWO2024195374A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023046186 2023-03-23
PCT/JP2024/005221 WO2024195374A1 (ja) 2023-03-23 2024-02-15 下地基板

Publications (2)

Publication Number Publication Date
JPWO2024195374A1 JPWO2024195374A1 (https=) 2024-09-26
JPWO2024195374A5 true JPWO2024195374A5 (https=) 2025-11-05

Family

ID=92841307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025508224A Pending JPWO2024195374A1 (https=) 2023-03-23 2024-02-15

Country Status (4)

Country Link
US (1) US20250391657A1 (https=)
JP (1) JPWO2024195374A1 (https=)
CN (1) CN120882918A (https=)
WO (1) WO2024195374A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113614293B (zh) * 2019-03-28 2024-08-02 日本碍子株式会社 基底基板
WO2020194802A1 (ja) * 2019-03-28 2020-10-01 日本碍子株式会社 下地基板及びその製造方法
WO2021048950A1 (ja) * 2019-09-11 2021-03-18 日本碍子株式会社 半導体膜
WO2021064817A1 (ja) * 2019-09-30 2021-04-08 日本碍子株式会社 下地基板及びその製造方法

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