JPWO2024166718A1 - - Google Patents
Info
- Publication number
- JPWO2024166718A1 JPWO2024166718A1 JP2024576240A JP2024576240A JPWO2024166718A1 JP WO2024166718 A1 JPWO2024166718 A1 JP WO2024166718A1 JP 2024576240 A JP2024576240 A JP 2024576240A JP 2024576240 A JP2024576240 A JP 2024576240A JP WO2024166718 A1 JPWO2024166718 A1 JP WO2024166718A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2819—Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023018609 | 2023-02-09 | ||
| PCT/JP2024/002553 WO2024166718A1 (ja) | 2023-02-09 | 2024-01-29 | トランスチップ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024166718A1 true JPWO2024166718A1 (https=) | 2024-08-15 |
| JPWO2024166718A5 JPWO2024166718A5 (https=) | 2025-10-23 |
Family
ID=92262403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024576240A Pending JPWO2024166718A1 (https=) | 2023-02-09 | 2024-01-29 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250357040A1 (https=) |
| JP (1) | JPWO2024166718A1 (https=) |
| WO (1) | WO2024166718A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3441082B2 (ja) * | 1990-05-31 | 2003-08-25 | 株式会社東芝 | 平面型磁気素子 |
| JP6235353B2 (ja) * | 2014-01-22 | 2017-11-22 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP6897924B2 (ja) * | 2016-06-01 | 2021-07-07 | 住友電工プリントサーキット株式会社 | プリント配線板及びその製造方法 |
| DE112018004478B4 (de) * | 2017-10-13 | 2025-03-27 | Rohm Co., Ltd. | Elektronikkomponente |
| DE112019002216T5 (de) * | 2019-03-08 | 2021-02-18 | Rohm Co., Ltd. | Elektronikkomponente |
| JP7189172B2 (ja) * | 2020-03-19 | 2022-12-13 | 株式会社東芝 | アイソレータ |
-
2024
- 2024-01-29 JP JP2024576240A patent/JPWO2024166718A1/ja active Pending
- 2024-01-29 WO PCT/JP2024/002553 patent/WO2024166718A1/ja not_active Ceased
-
2025
- 2025-07-31 US US19/286,504 patent/US20250357040A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20250357040A1 (en) | 2025-11-20 |
| WO2024166718A1 (ja) | 2024-08-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250801 |