JPWO2024070919A1 - - Google Patents
Info
- Publication number
- JPWO2024070919A1 JPWO2024070919A1 JP2024549300A JP2024549300A JPWO2024070919A1 JP WO2024070919 A1 JPWO2024070919 A1 JP WO2024070919A1 JP 2024549300 A JP2024549300 A JP 2024549300A JP 2024549300 A JP2024549300 A JP 2024549300A JP WO2024070919 A1 JPWO2024070919 A1 JP WO2024070919A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022154175 | 2022-09-27 | ||
| PCT/JP2023/034420 WO2024070919A1 (ja) | 2022-09-27 | 2023-09-22 | 配線基板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024070919A1 true JPWO2024070919A1 (https=) | 2024-04-04 |
| JPWO2024070919A5 JPWO2024070919A5 (https=) | 2025-05-30 |
Family
ID=90477731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024549300A Pending JPWO2024070919A1 (https=) | 2022-09-27 | 2023-09-22 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20260101438A1 (https=) |
| JP (1) | JPWO2024070919A1 (https=) |
| WO (1) | WO2024070919A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000345119A (ja) * | 1999-06-02 | 2000-12-12 | Ajinomoto Co Inc | 接着フィルム及びこれを用いた多層プリント配線板の製造法 |
| JP2001257465A (ja) * | 2000-03-13 | 2001-09-21 | Ibiden Co Ltd | プリント配線板およびその製造方法 |
| JP2010251688A (ja) * | 2009-03-25 | 2010-11-04 | Nec Toppan Circuit Solutions Inc | 部品内蔵印刷配線板及びその製造方法 |
| JP6878794B2 (ja) * | 2016-08-31 | 2021-06-02 | 大日本印刷株式会社 | 有孔基板の製造方法及び有孔基板 |
-
2023
- 2023-09-22 US US19/111,799 patent/US20260101438A1/en active Pending
- 2023-09-22 WO PCT/JP2023/034420 patent/WO2024070919A1/ja not_active Ceased
- 2023-09-22 JP JP2024549300A patent/JPWO2024070919A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20260101438A1 (en) | 2026-04-09 |
| WO2024070919A1 (ja) | 2024-04-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250312 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250312 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20250521 |